BSS123 PANJIT | Alldatasheet
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RDS(ON) , VGS@10V, ID@170mA<6Ω RDS(ON) , VGS@4.5V, ID@130mA<10Ω Advanced Trench Process Technology Specially Designed for Switch Load, PWM Application, etc ESD Protected 2KV HBM Lead free in compliance with EU RoHS 2.0 Green molding compound as per IEC 61249 standard Mechanical Data Case: SOT-23 Package Terminals: Solderable per MIL-STD-750, Method 2026 PARAMETER SYMBOL LIMIT UNITS Drain-Source Voltage VDS 100 V Gate-Source Voltage VGS +20 V Continuous Drain Current ID 170 mA Pulsed Drain Current (Note 4) IDM 680 mA Power Dissipation Ta=25oC PD 500 mW Derate above 25oC 4 mW/ oC Operating Junction and Storage Temperature Range TJ,TSTG -55~150 oC Typical Thermal Resistance - Junction to Ambient (Note 3) RθJA 250 oC/W Maximum Ratings and Thermal Characteristics (TA=25 o C unless otherwise noted)
July 25,2019-REV.01 Page 2 Electrical Characteristics (TA=25 o C unless otherwise noted) PARAMETER SYMBOL TEST CONDITION MIN. TYP. MAX. UNITS Static Drain-Source Breakdown Voltage BVDSS VGS=0V, ID=250uA 100 - - V Gate Threshold Voltage VGS(th) VDS=VGS, ID=250uA 1 1.7 2.5 V Drain-Source On-State Resistance RDS(on) VGS=10V, ID=170mA - 4 6 Ω VGS=4.5V, ID=130mA - 4.5 10 Zero Gate Voltage Drain Current IDSS VDS=80V, VGS=0V - - 1 uA Gate-Source Leakage Current IGSS VGS=+20V, VDS=0V - - +10 uA Dynamic (Note 5) Total Gate Charge Qg VDS=30V, ID=170mA, VGS=10V (Note 1,2) - 1.8 - nC Gate-Source Charge Qgs - 0.4 - Gate-Drain Charge Qgd - 0.3 - Input Capacitance Ciss VDS=25V, VGS=0V, f=1.0MHZ - 45 - pF Output Capacitance Coss - 14 - Reverse Transfer Capacitance Crss - 7.8 - Turn-On Delay Time td(on) VDD=30V, ID=170mA, VGS=10V, RG=6Ω (Note 1,2) - 3.4 - ns Turn-On Rise Time tr - 19 - Turn-Off Delay Time td(off) - 8.2 - Turn-Off Fall Time tf - 20 - Drain-Source Diode Maximum Continuous Drain-Source Diode Forward Current IS --- - - 170 mA Diode Forward Voltage VSD IS=170mA, VGS=0V - 0.9 1.3 V NOTES : 1. Pulse width<300us, Duty cycle<2% 2. Essentially independent of operating temperature typical characteristics. 3. RJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins mounted on a 1 inch FR-4 with 2oz. square pad of copper. 4. The maximum current rating is package limited. 5. Guaranteed by design, not subject to production testing.
July 25,2019-REV.01 Page 3 TYPICAL CHARACTERISTIC CURVES Fig.1 On-Region Characteristics Fig.2 Transfer Characteristics Fig.3 On-Resistance vs. Drain Current Fig.4 On-Resistance vs. Junction temperature Fig.5 On-Resistance Variation with VGS. Fig.6 Body Diode Characteristics
July 25,2019-REV.01 Page 4 TYPICAL CHARACTERISTIC CURVES Fig.7 Gate-Charge Characteristics Fig.8 Threshold Voltage Variation with Temperature Fig.9 Capacitance vs. Drain-Source Voltage
July 25,2019-REV.01 Page 5 PART NO PACKING CODE VERSION MOUNTING PAD LAYOUT BSS123_R1_00001 SOT-23 3K pcs / 7” reel A76 Halogen free BSS123_R2_00001 SOT-23 12K pcs / 13” reel A76 Halogen free
July 25,2019-REV.01 Page 6 Disclaimer
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