BSR58LT1 ONSEMI | Alldatasheet

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  • Pb−Free Package is Available MAXIMUM RATINGS Rating Symbol Value Unit Drain−Gate Voltage VDG −40 Vdc Gate−Source Voltage VGS −35 Vdc Gate Current IG 50 mAdc Total Device Dissipation @ TA = 25°C Derate above 25°C PD 350 2.8 mW mW/° C Lead Temperature TL 300 °C Operating and Storage Junction Temperature Range TJ, Tstg −65 to +150 °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Symbol Min Max Unit OFF CHARACTERISTICS Gate−Source Breakdown Voltage (IG = −1.0 /C0109Adc) V(BR)GSS 40 − Vdc Gate Reverse Current (VGS = −15 Vdc) IGSS − −/hairline1.0 nAdc Gate Source Cutoff Voltage (VDS = 5.0 Vdc, ID = 1.0 /C0109Adc) VGS(off) −0.8 −4.0 Vdc Drain−Cutoff Current (VDS = 5.0 Vdc, VGS = −10 Vdc) ID(off) − 1.0 nAdc ON CHARACTERISTICS Zero−Gate−V oltage Drain Current (Note (VDS = 15 Vdc) IDSS 8.0 80 mAdc Static Drain−Source On Resistance (VDS = 0.1 Vdc) rDS(on) − 60 /C0087 Drain Gate and Source Gate On−Capacitance (VDS = VGS = 0, f = 1.0 MHz) Cdg(on) Csg(on) − 28 pF Drain Gate Off−Capacitance (VGS = −10 Vdc, f = 1.0 MHz) Cdg(off) − 5.0 pF Source Gate Off−Capacitance (VGS = −10 Vdc, f = 1.0 MHz) Csg(off) − 5.0 pF 1. Pulse Width = 300 /C0109s, Duty Cycle = 3.0%. Device Package Shipping †

ORDERING INFORMATION

BSR58LT1 SOT−23 SOT−23 CASE 318 STYLE 10 3000/Tape & Reel MARKING DIAGRAM M6M /C0071 /C0071 http://onsemi.com

1 DRAIN

2 SOURCE

BSR58LT1G SOT−23 (Pb−Free) 3000/Tape & Reel M6 = Device Code M = Date Code* /C0071 = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation and/or overbar may vary depending upon manufacturing location. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification s Brochure, BRD8011/D.

http://onsemi.com PACKAGE DIMENSIONS b CL D A E e 1 2 DIM A MIN NOM MAX MIN MILLIMETERS 0.89 1.00 1.11 0.035 INCHES A1 0.01 0.06 0.10 0.001 b 0.37 0.44 0.50 0.015 c 0.09 0.13 0.18 0.003 D 2.80 2.90 3.04 0.110 E 1.20 1.30 1.40 0.047 e 1.78 1.90 2.04 0.070 L 0.35 0.54 0.69 0.014 2.10 2.40 2.64 0.083 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. 318−01 THRU −07 AND −09 OBSOLETE, NEW STANDARD 318−08. HE 0.040 0.044 0.002 0.004 0.018 0.020 0.005 0.007 0.114 0.120 0.051 0.055 0.075 0.081 0.021 0.029 0.094 0.104 NOM MAX HE /C0466mm inches/C0467SCALE 10:1 0.8 0.031 0.9 0.035 0.95 0.0370.95 0.037 2.0 0.079 SOT−23 (TO−236) CASE 318−08 ISSUE AL *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* STYLE 10: PIN 1. DRAIN 2. SOURCE 3. GATE ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 BSR58LT1/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.