BSP75G DIODES | Alldatasheet

Document overview

  • Manufacturer or author: Diodes Incorporated
  • PDF pages: 8

Technical content

Document number: DS33015 Rev. 5 - 2 1 of 8 www.diodes.com June 2018 © Diodes Incorporated BSP75G ADVANCE INFORMATION 60V SELF-PROTECTED LOW-SIDE INTELLIFET MOSFET SWITCH Product Summary  Continuous Drain Source Voltage: VDS = 60V  On-State Resistance: 550mΩ  Nominal Load Current (VIN = 5V) : 1.4A  Clamping Energy: 550mJ

Description

The BSP75G is a self-protected low -side MOSFET . It features monolithic over temperature, over current, over voltage (active clamp) and ESD protected logic level functionality. It is intended as a general purpose switch.

Applications

 Especially Suited for Loads with a High In-Rush Current such as Lamps and Motors  All Types of Resistive, Inductive and Capacitive Loads in Switching Applications  μC Compatible Power Switch for 12V and 24V DC Applications  Automotive Rated  Replaces Electromechanical Relays and Discrete Circuits  Linear Mode Capability - the current-limiting protection circuitry is designed to de-activate at low VDS to in order not to compromise the load current during normal operation . The maximum DC operating current is therefore determined by the thermal capability of the package/board combination, rather than by the protection circuitry. Features and Benefits  Short Circuit Protection with Auto Restart  Over Voltage Protection (Active Clamp)  Thermal Shutdown with Auto Restart  Over-Current Protection  Input Protection (ESD)  Load Dump Protection (Actively Protects Load)  Logic Level Input  High Continuous Current Rating  Lead-Free Finish; RoHS Compliant (Note 1 & 2)  Halogen and Antimony Free. “Green” Device (Note 3)  An Automotive-Compliant Part is Available Under Separate Datasheet (BSP75GQ) Mechanical Data  Case: SOT223 (Type DN)  Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0  Moisture Sensitivity: Level 1 per J-STD-020  Terminals: Matte Tin Finish  Weight: 0.112 grams (Approximate) Note: The tab is connected to the drain pin, and must be electrically isolated from the source pin. Connection of significant copp er to the tab is recommended for best thermal performance. Ordering Information (Note 4) Product Marking Reel Size (inches) Tape Width (mm) Quantity per Reel BSP75GTA BSP75G 7 12 1,000 Units BSP75GTC BSP75G 13 12 4,000 Units Notes: 1. EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. All applicable RoHS exemptions applied. 2. See http://www.diodes.com/quality/lead_free/ for more information about Diodes Incorporated’s definitions of Hal ogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes -packaging/. Top View SOT223 (Type DN) Top View Pin Out IntelliFET is a trademark of Diodes Incorporated.

Document number: DS33015 Rev. 5 - 2 2 of 8 www.diodes.com June 2018 © Diodes Incorporated BSP75G ADVANCE INFORMATION Marking Information Functional Block Diagram Over Voltage Protection Over Temperature Protection Human Body ESD Protection Over Current Protection Logic dV/dt Limitation (01 to 53)

Document number: DS33015 Rev. 5 - 2 3 of 8 www.diodes.com June 2018 © Diodes Incorporated BSP75G ADVANCE INFORMATION Absolute Maximum Ratings (@TA = +25°C, unless otherwise stated.) Parameter Symbol Limit Unit Continuous Drain-Source Voltage VDS 60 V Drain-Source Voltage for Short Circuit Protection VIN = 5V VDS(SC) 36 V Continuous Input Voltage VIN -0.2 to +10 V Peak Input Voltage VIN -0.2 to +20 V Operating Temperature Range TJ -40 to +150 °C Storage Temperature Range TSTG -55 to +150 °C Power Dissipation at TA = +25°C (Note 5) PD 2.5 W Continuous Drain Current @ VIN =10V; TA = +25°C (Note 5) ID 1.6 A Continuous Drain Current @ VIN =5V; TA = +25°C (Note 5) ID 1.4 A Pulsed Drain Current @ VIN = 10V IDM 5 A Continuous Source Current (Body Diode) (Note 5) IS 3 A Pulsed Source Current (Body Diode) IS 5 A Unclamped Single Pulse Inductive Energy EAS 550 mJ Load Dump Protection VLOAD_DUMP 80 V Electrostatic Discharge (Human Body Model) VESD 4000 V DIN Humidity Category, DIN 40 040 — E — IEC Climatic Category, DIN IEC 68-1 — 40/150/56 — Thermal Resistance Characteristic Symbol Limit Unit Junction to Ambient (Note 5) RθJA 50 °C/W Junction to Ambient (Note 6) RθJA 24 °C/W Junction to Ambient (Note 7) RθJA 208 °C/W Notes: 5. For a device surface mounted on 37mm x 37mm x 1.6mm FR -4 board with a high coverage of single sided 2oz weight copper. 6. For a device surface mounted on FR-4 board and measured at t<=10s. 7. For a device mounted on FR-4 board with the minimum copper required for electrical connections .

Document number: DS33015 Rev. 5 - 2 4 of 8 www.diodes.com June 2018 © Diodes Incorporated BSP75G ADVANCE INFORMATION Typical Characteristics TA = 25°C TA = 25°C TA = 25°C

Document number: DS33015 Rev. 5 - 2 5 of 8 www.diodes.com June 2018 © Diodes Incorporated BSP75G ADVANCE INFORMATION Electrical Characteristics (@TA = +25°C, unless otherwise stated.) Parameter Symbol Min. Typ. Max. Unit Conditions Static Characteristics Drain-Source Clamp Voltage VDS(AZ) 60 70 75 V ID=10mA Off state Drain Current IDSS — 0.1 3 μA VDS=12V, VIN=0V Off state Drain Current IDSS — 3 15 μA VDS=32V, VIN=0V Input Threshold Voltage (Note 8) VIN(TH) 1 2.1 — V VDS=VGS, ID=1mA Input Current IIN — 0.7 1.2 mA VIN=5V Input Current IIN — 1.5 2.7 mA VIN=7V Input Current IIN — 4 7 mA VIN=10V Static Drain-Source On-State Resistance RDS(ON) — 520 675 mΩ VIN=5V, ID=0.7A Static Drain-Source On-State Resistance RDS(ON) — 385 550 mΩ VIN=10V, ID=0.7A Current Limit (Note 9) ID(LIM) 0.7 1.1 1.75 A VIN=5V, VDS>5V Current Limit (Note 9) ID(LIM) 2 3 4 A VIN=10V, VDS>5V Dynamic Characteristics Turn-On Time (VIN to 90% ID) tON — 2.2 — μs RL=22Ω, VIN=0 to 10V, VDD=12V Turn-Off Time (VIN to 90% ID) tOFF — 13 — μs RL=22Ω, VIN=10V to 0V, VDD=12V Slew Rate On (70 to 50% VDD) -dVDS/dtON — 10 — V/μs RL=22Ω, VIN=0 to 10V, VDD=12V Slew Rate Off (50 to 70% VDD) dVDS/dtON — 3.2 — V/μs RL=22Ω, VIN=10V to 0V, VDD=12V Protection Functions (Note 10) Minimum Input Voltage for Over Temperature Protection VPROT 4.5 — — V — Thermal Overload Trip Temperature TJT +150 +175 — °C — Thermal Hysteresis — — +10 — °C — Unclamped Single Pulse Inductive Energy TJ = +25° C EAS 550 — — mJ ID(ISO)=0.7A, VDD=32V Unclamped Single Pulse Inductive Energy TJ = +150° C EAS 200 — — mJ ID(ISO)=0.7A, VDD=32V Inverse Diode Source Drain Voltage VSD — — 1 V VIN=0V, -ID=1.4A Notes: 8. Protection features may operate outside spec for V IN < 4.5V. 9. The drain current is limited to a reduced value when V DS exceeds a safe level. 10. Integrated protection functions are designed to prevent I C destruction under fault conditions described in the datasheet. Fault conditions are considered as ”outside" normal operating range. Protection functions are not designed for continuous, r epetitive operation.

Document number: DS33015 Rev. 5 - 2 6 of 8 www.diodes.com June 2018 © Diodes Incorporated BSP75G ADVANCE INFORMATION Characteristics RDS(ON) RDS(ON) VIN(TH)

Document number: DS33015 Rev. 5 - 2 7 of 8 www.diodes.com June 2018 © Diodes Incorporated BSP75G ADVANCE INFORMATION Package Outline Dimensions Please see http://www.diodes.com/package-outlines.html for the latest version. SOT223 (Type DN) SOT223 (Type DN) Dim Min Max Typ A -- 1.70 -- A1 0.01 0.15 -- A2 1.50 1.68 1.60 b 0.60 0.80 0.70 b2 2.90 3.10 -- c 0.20 0.32 -- D 6.30 6.70 -- E 6.70 7.30 -- E1 3.30 3.70 -- e -- -- 2.30 e1 -- -- 4.60 L 0.85 -- -- All Dimensions in mm Suggested Pad Layout Please see http://www.diodes.com/package-outlines.html for the latest version. SOT223 (Type DN) Dimensions Value (in mm) C 2.30 C1 6.40 X 1.20 X1 3.30 Y 1.60 Y1 1.60 Y2 8.00 A1A D b e C E L 0.25 Seating Plane Gauge Plane Y X C C1 Y2

Document number: DS33015 Rev. 5 - 2 8 of 8 www.diodes.com June 2018 © Diodes Incorporated BSP75G ADVANCE INFORMATION IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other c hanges without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license unde r its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products d escribed herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diod es Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising ou t of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product name s and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this docum ent is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided i n the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety -critical, life support devices or systems, notwithstanding any devices - or systems -related information or support that may be provided by Diodes Incorporated. Further, Cust omers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2018, Diodes Incorporated www.diodes.com