BSP52T1 MOTOROLA | Alldatasheet

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1Motorola Small–Signal Transistors, FETs and Diodes Device Data /C0078/C0080/C0078 /C0083/C0109/C0097/C0108/C0108/C0045/C0083/C0105/C0103/C0110/C0097/C0108 /C0068/C0097/C0114/C0108/C0105/C0110/C0103/C0116/C0111/C0110 /C0084/C0114/C0097/C0110/C0115/C0105/C0115/C0116/C0111/C0114 This NPN small signal darlington transistor is designed for use in switching applications, such as print hammer, relay, solenoid and lamp drivers. The device is housed in the SOT-223 package, which is designed for medium power surface mount applications.

  • The SOT-223 Package can be soldered using wave or reflow. The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die
  • Available in 12 mm T ape and Reel Use BSP52T1 to order the 7 inch/1000 unit reel Use BSP52T3 to order the 13 inch/4000 unit reel
  • PNP Complement is BSP62T1 MAXIMUM RATINGS (TC = 25°C unless otherwise noted) Rating Symbol Value Unit Collector-Emitter Voltage VCES 80 Vdc Collector-Base Voltage VCBO 90 Vdc Emitter-Base Voltage VEBO 5.0 Vdc Collector Current IC 500 mAdc Total Power Dissipation @ TA = 25°C (1) Derate above 25°C PD 0.8 6.4 Watts mW/ °C Operating and Storage T emperature Range TJ, Tstg –65 to 150 °C DEVICE MARKING AS3 THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Thermal Resistance – Junction-to-Ambient (surface mounted) R θJA 156 °C/W Maximum Temperature for Soldering Purposes Time in Solder Bath TL 260 Sec 1. Device mounted on a FR-4 glass epoxy printed circuit board using minimum recommended footprint. Thermal Clad is a trademark of the Bergquist Company Preferred devices are Motorola recommended choices for future use and best overall value. Order this document by BSP52T1/D /C0077/C0079/C0084/C0079/C0082/C0079/C0076/C0065 SEMICONDUCTOR TECHNICAL DATA  Motorola, Inc. 1996 /C0066/C0083/C0080/C0053/C0050/C0084/C0049 MEDIUM POWER NPN SILICON DARLINGTON TRANSISTOR SURFACE MOUNT Motorola Preferred Device CASE 318E-04, STYLE 1 TO-261AA 4COLLECTOR 2,4 BASE EMITTER 3 REV 1

/C0066/C0083/C0080/C0053/C0050/C0084/C0049

2 Motorola Small–Signal Transistors, FETs and Diodes Device Data

ELECTRICAL CHARACTERISTICS (continued) (TA = 25°C unless otherwise noted) Characteristics Symbol Min Max Unit OFF CHARACTERISTICS Collector-Base Breakdown Voltage (IC = 100 µAdc, IE = 0) V(BR)CBO 90 — Vdc Emitter-Base Breakdown Voltage (IE = 10 µAdc, IC = 0) V(BR)EBO 5.0 — Vdc Collector-Emitter Cutoff Current (VCE = 80 Vdc, VBE = 0) ICES — 10 µAdc Emitter-Base Cutoff Current (VEB = 4.0 Vdc, IC = 0) IEBO — 10 µAdc ON CHARACTERISTICS (2) DC Current Gain (IC = 150 mAdc, VCE = 10 Vdc) (IC = 500 mAdc, VCE = 10 Vdc) hFE 1000 2000 Collector-Emitter Saturation Voltage (IC = 500 mAdc, IB = 0.5 mAdc) VCE(sat) — 1.3 Vdc Base-Emitter On Voltage (IC = 500 mAdc, IB = 0.5 mAdc) VBE(on) — 1.9 Vdc 2. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0%

subjected to a solder reflow process. soldering to a pad size given for maximum power dissipation. versus collector pad area is shown in Figure 1.

0.8 Watts

Figure 1. Thermal Resistance versus Collector the power dissipation can be doubled using the same footprint.

4 Motorola Small–Signal Transistors, FETs and Diodes Device Data

or stainless steel with a typical thickness of 0.008 inches.

  • Always preheat the device.
  • The delta temperature between the preheat and soldering should be 100°C or less.*
  • When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10°C.
  • The soldering temperature and time should not exceed 260°C for more than 10 seconds.
  • When shifting from preheating to soldering, the maximum temperature gradient should be 5°C or less.
  • After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress.
  • Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. TYPICAL SOLDER HEATING PROFILE For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones, and a figure for belt speed. Taken together, these control settings make up a heating “profile” for that particular circuit board. On m achines controlled by a compute r, the computer remembers these profiles from one operating session to the next. Figure 7 shows a typical heating profile for use when soldering a surface mount device to a printed circuit board. This profile will vary among soldering systems but it is a good starting point. Factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. This profile shows temperature versus time. The line on the graph shows the actual temperature that might be experienced on the surface of a test board at or near a central solder joint. The two profiles are based on a high density and a low density board. The Vitronics SMD310 convection/infrared reflow soldering system was used to generate this profile. The type of solder used was 62/36/2 Tin Lead Silver with a melting point between 177–189°C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the therma l energy m ore efficiently, then distributes this energy to the components. Because of this effect, the m ain body of a componen t may be up to 30 degrees cooler than the adjacent solder joints. STEP 1 PREHEAT ZONE 1 “RAMP” STEP 2 VENT “SOAK” STEP 3 HEATING ZONES 2 & 5 “RAMP” STEP 4 HEATING ZONES 3 & 6 “SOAK” STEP 5 HEATING ZONES 4 & 7 “SPIKE” STEP 6 VENT STEP 7 COOLING 200°C 150°C 100°C 50°C TIME (3 TO 7 MINUTES TOTAL) TMAX SOLDER IS LIQUID FOR

40 TO 80 SECONDS

Figure 2. Typical Solder Heating Profile

/C0066/C0083/C0080/C0053/C0050/C0084/C0049 5Motorola Small–Signal Transistors, FETs and Diodes Device Data PACKAGE DIMENSIONS TO-261AA STYLE 1: PIN 1. BASE 2. COLLECTOR 3. EMITTER 4. COLLECTOR H S F A B D G L 1 2 3 0.08 (0003) C M K J DIM A MIN MAX MIN MAX MILLIMETERS 0.249 0.263 6.30 6.70 INCHES B 0.130 0.145 3.30 3.70 C 0.060 0.068 1.50 1.75 D 0.024 0.035 0.60 0.89 F 0.115 0.126 2.90 3.20 G 0.087 0.094 2.20 2.40 H 0.0008 0.0040 0.020 0.100 J 0.009 0.014 0.24 0.35 K 0.060 0.078 1.50 2.00 L 0.033 0.041 0.85 1.05 M 0 10 0 10 S 0.264 0.287 6.70 7.30 /C0095 /C0095 /C0095 /C0095 CASE 318E–04 ISSUE H NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.

/C0066/C0083/C0080/C0053/C0050/C0084/C0049

6 Motorola Small–Signal Transistors, FETs and Diodes Device Data

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters can and do vary in different applications. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. How to reach us: USA/EUROPE : Motorola Literature Distribution; JAPAN : Nippon Motorola Ltd.; T atsumi–SPD–JLDC, T oshikatsu Otsuki, P .O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 6F Seibu–Butsuryu–Center, 3–14–2 T atsumi Koto–Ku, T okyo 135, Japan. 03–3521–8315 INTERNET : http://Design–NET .com 51 Ting Kok Road, T ai Po, N.T ., Hong Kong. 852–26629298 BSP52T1/D /C0042/C0066/C0083/C0080/C0053/C0050/C0084/C0049/C0047/C0068/C0042