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Features

 High V oltage: V(BR)CEO of 250 and 350 V  The SOT-223 Package Can Be Soldered Using Wave or Reflow  SOT-223 Package Ensures Level Mounting, Resulting in Improved Thermal Conduction, and Allows Visual Inspection of Soldered Joints  The Formed Leads Absorb Thermal Stress During Soldering, Eliminating the Possibility of Damage to the Die  PNP Complement is BSP16T1  Moisture Sensitivity Level (MSL): 1  ESD: Human Body Model (HBM) = 4 KV Machine Model (MM) = 400 V  These Devices are Pb- -Free, Halogen Free/BFR Free and are RoHS Compliant MAXIMUM RATINGS(TC =2 5C unless otherwise noted) Rating Symbol Value Unit Collector-Emitter Voltage (Open Base) VCEO 350 Vdc Collector-Base Voltage (Open Emitter) VCBO 400 Vdc Emitter-Base Voltage (Open Collector) VEBO 5.0 Vdc Collector Current (DC) IC 100 mAdc THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Total Power Dissipation @ TA =2 5C (Note 1) Derate above 25C PD 0.8 6.4 W mW/C Thermal Resistance, Junction- -to- -AmbientRθJA 156 C/W Junction and Storage Temperature Range Tstg - -65 to +150 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Device mounted on a FR-4 glass epoxy printed circuit board using minimum recommended footprint. SOT- -223 PACKAGE NPN SILICON HIGH VOLTAGE TRANSISTOR SURFACE MOUNT Device Package Shipping †

ORDERING INFORMATION

COLLECTOR 2,4 BASE EMITTER 3 Base 2 Collector Emitter Collector BSP19AT1G SOT- -223 (Pb- -Free) 1000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com AYW SP19A G G A = Assembly Location Y = Year W = Work Week SP19A = Specific Device Code G = Pb- -Free Package (Note: Microdot may be in either location)

http://onsemi.com ELECTRICAL CHARACTERISTICS(TA =2 5C unless otherwise noted) Characteristics Symbol Min Max Unit OFF CHARACTERISTICS Collector-Emitter Breakdown Voltage (IC =1 . 0m A d c ,IB =0 ) V(BR)CEO 350 -- Vdc Collector-Base Cutoff Current (VCB = 400 Vdc, IE =0 ) ICBO -- 20 nAdc Emitter-Base Cutoff Current (VEB =5 . 0V d c ,IC =0 ) IEBO -- 10 mAdc ON CHARACTERISTICS(Note 2) DC Current Gain (IC =2 0m A d c ,VCE =1 0V d c ) hFE 40 -- Current-Gain — Bandwidth Product (IC =1 0m A d c ,VCE = 10 Vdc, f = 5.0 MHz) fT 70 -- MHz Collector-Emitter Saturation Voltage (IC =5 0m A d c ,IB =4 . 0m A d c ) VCE(sat) -- 0.5 Vdc Base-Emitter Saturation Voltage (IC =5 0m A d c ,IB =4 . 0m A d c ) VBE(sat) -- 1.3 Vdc 2. Pulse Test: Pulse Width 300 ms, Duty Cycle = 2.0%

http://onsemi.com PACKAGE DIMENSIONS SOT- -223 (TO- -261) CASE 318E- -04 ISSUE N STYLE 1: PIN 1. BASE 2. COLLECTOR 3. EMITTER 4. COLLECTOR D E b e 12 3 0.08 (0003) A C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 1.5 0.059  mm inchesSCALE 6:1 3.8 0.15 2.0 0.079 6.3 0.2482.3 0.091 2.3 0.091 2.0 0.079 SOLDERING FOOTPRINT* HE DIM A MIN NOM MAX MIN MILLIMETERS 1.50 1.63 1.75 0.060 INCHES A1 0.02 0.06 0.10 0.001 b 0.60 0.75 0.89 0.024 b1 2.90 3.06 3.20 0.115 c 0.24 0.29 0.35 0.009 D 6.30 6.50 6.70 0.249 E 3.30 3.50 3.70 0.130 e 2.20 2.30 2.40 0.087 0.85 0.94 1.05 0.033 0.064 0.068 0.002 0.004 0.030 0.035 0.121 0.126 0.012 0.014 0.256 0.263 0.138 0.145 0.091 0.094 0.037 0.041 NOM MAX L1 1.50 1.75 2.00 0.060 6.70 7.00 7.30 0.264 0.069 0.078 0.276 0.287 HE -- -- 0 10 0 10 θ θ L *For additional information on our Pb- -Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductorand are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose,nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are notdesigned, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorneyfees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim allegesthat SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800- -282- -9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center BSP19AT1/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P .O. Box 5163, Denver, Colorado 80217 USA Phone: 303- -675- -2175 or 800- -344- -3860 Toll Free USA/Canada Fax: 303- -675- -2176 or 800- -344- -3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative