BSP19AT1 ONSEMI | Alldatasheet

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1Motorola Small–Signal Transistors, FETs and Diodes Device Data /C0078/C0080/C0078 /C0083/C0105/C0108/C0105/C0099/C0111/C0110 /C0069/C0112/C0105/C0116/C0097/C0120/C0105/C0097/C0108 /C0084/C0114/C0097/C0110/C0115/C0105/C0115/C0116/C0111/C0114 This family of NPN Silicon Epitaxial transistors is designed for use as a general purpose amplifier and in switching applications. The device is housed in the SOT-223 package which is designed for medium power surface mount applications.

  • High Voltage: V(BR)CEO of 250 and 350 Volts.
  • The SOT-223 package can be soldered using wave or reflow.
  • SOT-223 package ensures level mounting, resulting in improved thermal conduction, and allows visual inspection of soldered joints. The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die
  • Available in 12 mm Tape and Reel T1 Configuration – 7 inch/1000 unit reel T3 Configuration – 13 inch/4000 unit reel
  • PNP Complement is BSP16T1 MAXIMUM RATINGS (TC = 25°C unless otherwise noted) Rating Symbol Value Unit Collector-Emitter Voltage (Open Base) VCEO 350 Vdc Collector-Base Voltage (Open Emitter) VCBO 400 Vdc Emitter-Base Voltage (Open Collector) VEBO 5.0 Vdc Collector Current (DC) IC 1000 mAdc Total Power Dissipation @ TA = 25°C (1) Derate above 25°C PD 0.8 6.4 Watts mW/ °C Storage Temperature Range Tstg –65 to 150 °C Junction Temperature TJ 150 °C DEVICE MARKING SP19A THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Thermal Resistance from Junction-to-Ambient R θJA 156 °C/W Maximum Temperature for Soldering Purposes Time in Solder Bath TL 260 Sec 1. Device mounted on a FR-4 glass epoxy printed circuit board using minimum recommended footprint. Thermal Clad is a trademark of the Bergquist Company Preferred devices are Motorola recommended choices for future use and best overall value. Order this document by BSP19AT1/D /C0077/C0079/C0084/C0079/C0082/C0079/C0076/C0065 SEMICONDUCTOR TECHNICAL DATA  Motorola, Inc. 1997 /C0066/C0083/C0080/C0049/C0057/C0065/C0084/C0049 SOT–223 PACKAGE NPN SILICON HIGH VOLTAGE TRANSISTOR SURFACE MOUNT Motorola Preferred Device CASE 318E-04, STYLE 1 TO-261AA 4COLLECTOR 2,4 BASE EMITTER 3 REV 2

/C0066/C0083/C0080/C0049/C0057/C0065/C0084/C0049

2 Motorola Small–Signal Transistors, FETs and Diodes Device Data

ELECTRICAL CHARACTERISTICS (continued) (TA = 25°C unless otherwise noted) Characteristics Symbol Min Max Unit OFF CHARACTERISTICS Collector-Emitter Breakdown Voltage (IC = 1.0 mAdc, IB = 0) V(BR)CEO 350 — Vdc Collector-Base Cutoff Current (VCB = 400 Vdc, IE = 0) ICBO — 20 nAdc Emitter-Base Cutoff Current (VEB = 5.0 Vdc, IC = 0) IEBO — 10 µAdc ON CHARACTERISTICS (2) DC Current Gain (IC = 20 mAdc, VCE = 10 Vdc) hFE 40 — Current-Gain — Bandwidth Product (IC = 10 mAdc, VCE = 10 Vdc, f = 5.0 MHz) fT 70 — MHz Collector-Emitter Saturation Voltage (IC = 50 mAdc, IB = 4.0 mAdc) VCE(sat) — 0.5 Vdc Base-Emitter Saturation Voltage (IC = 50 mAdc, IB = 4.0 mAdc) VBE(sat) — 1.3 Vdc 2. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle = 2.0%

subjected to a solder reflow process. soldering to a pad size given for maximum power dissipation. versus collector pad area is shown in Figure 1.

0.8 Watts

Figure 1. Thermal Resistance versus Collector the power dissipation can be doubled using the same footprint.

4 Motorola Small–Signal Transistors, FETs and Diodes Device Data

or stainless steel with a typical thickness of 0.008 inches.

  • Always preheat the device.
  • The delta temperature between the preheat and soldering should be 100°C or less.*
  • When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10°C.
  • The soldering temperature and time should not exceed 260°C for more than 10 seconds.
  • When shifting from preheating to soldering, the maximum temperature gradient should be 5°C or less.
  • After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress.
  • Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. TYPICAL SOLDER HEATING PROFILE For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones, and a figure for belt speed. Taken together, these control settings make up a heating “profile” for that particular circuit board. On machines controlled by a computer, the computer remembers these profiles from one operating session to the next. Figure 2 shows a typical heating profile for use when soldering a surface mount device to a printed circuit board. This profile will vary among soldering systems but it is a good starting point. Factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. This profile shows temperature versus time. The line on the graph shows the actual temperature that might be experienced on the surface of a test board at or near a central solder joint. The two profiles are based on a high density and a low density board. The Vitronics SMD310 convection/infrared reflow soldering system was used to generate this profile. The type of solder used was 62/36/2 Tin Lead Silver with a melting point between 177–189°C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints. STEP 1 PREHEAT ZONE 1 “RAMP” STEP 2 VENT “SOAK” STEP 3 HEATING ZONES 2 & 5 “RAMP” STEP 4 HEATING ZONES 3 & 6 “SOAK” STEP 5 HEATING ZONES 4 & 7 “SPIKE” STEP 6 VENT STEP 7 COOLING 200°C 150°C 100°C 50°C TIME (3 TO 7 MINUTES TOTAL) TMAX SOLDER IS LIQUID FOR

40 TO 80 SECONDS

Figure 2. Typical Solder Heating Profile

/C0066/C0083/C0080/C0049/C0057/C0065/C0084/C0049 5Motorola Small–Signal Transistors, FETs and Diodes Device Data PACKAGE DIMENSIONS TO-261AA STYLE 1: PIN 1. BASE 2. COLLECTOR 3. EMITTER 4. COLLECTOR H S F A B D G L 12 3 0.08 (0003) C M K J DIM A MIN MAX MIN MAX MILLIMETERS 0.249 0.263 6.30 6.70 INCHES B 0.130 0.145 3.30 3.70 C 0.060 0.068 1.50 1.75 D 0.024 0.035 0.60 0.89 F 0.115 0.126 2.90 3.20 G 0.087 0.094 2.20 2.40 H 0.0008 0.0040 0.020 0.100 J 0.009 0.014 0.24 0.35 K 0.060 0.078 1.50 2.00 L 0.033 0.041 0.85 1.05 M 0 10 0 10 S 0.264 0.287 6.70 7.30 /C0095/C0095 /C0095 /C0095 CASE 318E–04 ISSUE H NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.

/C0066/C0083/C0080/C0049/C0057/C0065/C0084/C0049

6 Motorola Small–Signal Transistors, FETs and Diodes Device Data

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. Mfax is a trademark of Motorola, Inc. How to reach us: USA / EUROPE / Locations Not Listed: Motorola Literature Distribution;JAPAN : Nippon Motorola Ltd.: SPD, Strategic Planning Office, 4–32–1, P.O. Box 5405, Denver, Colorado 80217. 303–675–2140 or 1–800–441–2447 Nishi–Gotanda, Shinagawa–ku, Tokyo 141, Japan. 81–3–5487–8488 – US & Canada ONLY 1–800–774–1848 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 INTERNET : http://motorola.com/sps BSP19AT1/D◊