BSH-030-01-F-D-A SAMTEC | Alldatasheet
Document overview
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Technical content
(0.50 mm) .0197" BTH SERIES WWW.SAMTEC.COM Due to technical progress, all designs, specifications and components are subject to change without notice. Mates with: BSH Mates with: BSH BTH BTH NO. OF POSITIONS PER ROW NO. OF POSITIONS PER ROW D D WT PLATING OPTION PLATING OPTION –030, –050, –060, –090, –120, –150 –030, –060, –090 OTHER OPTION OTHER OPTION A RA = (7.00 mm) .276" DIA Polyimide Film Pick & Place Pad –TR = Tape & Reel (120 positions maximum) Polyimide Film Pick & Place Pad For complete specifications and recommended PCB layouts see www.samtec.com?BTH Insulator Material: Black LCP Contact Material: Phosphor Bronze Plating: Au or Sn over 50 µ" (1.27 µm) Ni Current Rating: 2.0 A per pin (1 pin powered per row) Flammability Rating: UL 94 VO Operating Temp Range: -55 °C to +125 °C Voltage Rating: 275 VAC Max Cycles: 100 RoHS Compliant: Ye s No. of Positions x (0.50) .01969 + (5.00) .197 (3.94) .155 (5.97) .235 (0.50) .01969 (0.20) .008 (0.76) .030 (4.27) .168 (0.89) .035 DIA *Note: –C Plating passes 10 year MFG testing Note: Some lengths, styles and options are non-standard, non-returnable. SPECIFICATIONS BASIC BLADE & BEAM HEADER = Gold Flash on contact, Matte Tin on tail = 10 µ" (0.25 µm) Gold on contact, Matte Tin on tail –C* = Electro-Polished Selective 50 µ" (1.27 µm) min Au over 150 µ" (3.81 µm) Ni on Signal Pins in contact area, Matte Tin over 50 µ" (1.27 µm) min Ni on all solder tails = Gold Flash on contact, Matte Tin on tail = 10 µ" (0.25 µm) Gold on contact, Matte Tin on tail
- Passes 10 year MFG (9.78) .385 (3.05) .120 (0.71) .028 (0.64) .025 SQ (1.32) .052 DIA x(1.32) (1.10) .052 .043 02 (0.50) .01969 (0.20) .008 (5.97) .235 For complete scope of recognitions see www.samtec.com/quality RECOGNITIONS ALSO AVAILABLE (MOQ Required)
- 30 µ" (0.76 µm) Gold
- Edge Mount Capability
- 8 mm, 11 mm, 16 mm, 19 mm and 22 mm Stack Height (Caution: Some automatic placement/ inspection machines may have component height restrictions. Please consult machinery specifications.) (11 mm, 16 mm, 19 mm and 22 mm not available with 50 positions) Contact Samtec. MATED HEIGHT LEAD STYLE MATED HEIGHT* –01 (5.00) .197 *Processing conditions will affect mated height. F-217 FILE NO. E111594 PROCESSING Lead-Free Solderable: Ye s SMT Lead Coplanarity: Vertical= Vertical= Right-angle= Board Stacking: For applications requiring more than two connectors per board or 90 positions or higher, contact ipg@samtec.com EXTENDED LIFE PRODUC T
10 YEAR MFG
WITH 50 µ" GOLD HIGH MATING CYCLES