BSD03C_V01 FUTUREWAFER | Alldatasheet

Document overview

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Technical content

Document Number:F11835X 01-Apr-2021 V 2.0 www.futurewafer.com.tw Single Line TVS for ESD Protection Device in Portable Electronics SOD323 Device Characteristics

Applications

  • Personal Digital Assistance
  • Wireless System
  • Cellular Phones
  • Desktops and servers
  • Pagers Feature List
  • Uni-directional Configurations
  • ESD Protection:Level 4
  • Low Clamping Voltage
  • 350 Watts Peak Pulse Power Per Line (tp=8/20uS)
  • Working Voltages:3.3V,5V,8V,12V,15V,24V
  • Protection One Power Line or I/O Port IEC Compatibility
  • EN61000-4
  • 61000-4-2(ESD):Level 4,Contact:±30KV,Air:±30KV
  • 61000-4-5(Surge):30A(3.3V),8/20us Mechanical Characteristics
  • Molded JEDEC SOD-323 Package
  • Packing: Tape and Reel
  • Flammability Rating UL 94V-0
  • Halogen Free
  • JEDEC MSL Classification :Level 1 Maximum Ratings@25°C Unless Otherwise Specified Parameter Symbol Value Units Peak Pulse Power (tp=8/20us) see fig 1. P PP 350 Watts ESD Voltage (HBM Waveform Per IEC 61000-4-2) V ESD 30 KV Operating Temperature T J °C -55 ~ +150 Storage Temperature T STG

Document Number:F11835X 01-Apr-2021 V 2.0 www.futurewafer.com.tw Single Line TVS for ESD Protection Device in Portable Electronics Rating and Characteristic Curve Fig. 1 Non-Repetitive Peak Pulse Power V.S Pulse Time Peak Pulse Power(KW) td-Pulse Width(us) 350W,8/20µS Time (us) Percent of IPP Fig. 4 Pulse Waveform tt Peak Value IPP Td=TI IPP/2 Fig. 2 Power Derating Curve Ambient Temp,TA(°C) Peak Pulse Power-PPK ,(W) Electronical characteristics per line @25°C Unless Otherwise Specified Rated Stand-off Voltage Minimum Breakdown Voltage @1mA Maximum Clamping Voltage @ IPP = 1A Peak Pulse Current @ 8/20us Maximum Leakage Current @ V RWM Maximum Capacitance @0V,1MHZ Part No. V RWM V BR V C I PP I R C J V A uA ρF BSD03C 3.3 5.2 6.9 30 15 300 BSD05C 5.0 6.0 9.8 24 10 200 BSD08C 8.0 8.0 12.0 20 1 150 BSD12C 12.0 13.3 16.7 15 1 100 BSD15C 15.0 16.7 24.0 12 1 75 BSD24C 24.0 26.7 42.0 8 1 50

Electrical Characteristics

Document Number:F11835X 01-Apr-2021 V 2.0 www.futurewafer.com.tw Single Line TVS for ESD Protection Device in Portable Electronics Soldering Parameters

Document Number:F11835X 01-Apr-2021 V 2.0 www.futurewafer.com.tw Single Line TVS for ESD Protection Device in Portable Electronics Mounting Pad

Package Information

Body Length 1.60 1.90 Body Width 1.15 1.45 Lead span nominal 2.39 2.70 Height 0.80 1.10 Lead Width 0.25 0.40 Lead Height 0.10 0.20 Lead Length 0.20 0.40

Document Number:F11835X 01-Apr-2021 V 2.0 www.futurewafer.com.tw Single Line TVS for ESD Protection Device in Portable Electronics Tape&Reel information Reel Dia. Tape width A0 B0 K0 D E F W P0 P2 P tmax 178mm 8mm 1.55 ±0.1 2.9 ±0.1 1.35 ±0.1 1.5 ±0.1 1.75 ±0.1 3.5 ±0.05 8.0 ±0.3 4.0 ±0.1 2.0 ±0.05 4.0 ±0.1 0.25

Document Number:F11835X 01-Apr-2021 V 2.0 www.futurewafer.com.tw Single Line TVS for ESD Protection Device in Portable Electronics History Version Date File No. Recording Basis A 11-Aug-2018 F11835X New Create Market B 20-May-2019 F11835X Update Company Information System C 01-Aug-2020 F11835X Add New Item Engineer 2.0 01-Apr-2021 F11835X Update Version System Futurewafer Technology Co.,Ltd 台灣未來芯科技股份有限公司 Tel ：+886-3-3350161/FAX ：+886-3-3350172 cherry@futurewafer.com.tw No. 286-14, Sec. 3, Sanmin Rd., Taoyuan Dist., Taoyuan City 330, Taiwan

Ordering information

Part No. Package Shipping Reel Size BSD03C SOD-323 3,000pcs/ Tape@Reel 7” BSD05C BSD08C BSD12C BSD15C BSD24C Part No. BSD03C BSD05C BSD08C BSD12C BSD15C BSD24C Marking Marking code