BS4200N-C-F

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Compliance with 2011/65/EU Compliance with IEC61249-2-21:2003 Ethernet 1 2 1 2 B42NC 1309

Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications www.bencent.com.cn Order Code: BS4200N-C-F Version: A0 2013- 11-19 Thyristor Surge Suppresser Current Waveform 2/10μs 8/20μs 10/160μs 5/320μs* 10/1000μs Voltage Waveform 2/10μs 1.2/50μs 10/160μs 10/700μs* 10/1000μs Ipp 500A 400A 200A 150A 100A Symbol Parameter Value Unit TJ Operating Junction Temperature Range -40 to +150 ℃ TS Storage Temperature Range -60 to +150 ℃ Parameters Definition VDRM Peak off-state voltage IDRM Off-state Current VS Switching Voltage IS Switching Current IH Holding Current VT On-state voltage IT On-state current CO Off-state capacitance V-I Curve BS 4200 N C F (1) Bencent Semiconductor Surge Arrester (2) Off-state Voltage, e.g.：4200=420×100=420V (3) Package : SMB-F (4) Rating Surge Voltage:6KV (10/700μs) (5)Flat Feet Part Numbering System Mark Thermal Considerations B42LC B42NC: Part Number 1309 :September,2013 Surge Ratings 0909 Lead Material Copper Alloy Body Material UL recognized epoxy meeting flammability classification 94V-0 Terminal Finish 100% Matte-Tin Plated Product Characteristics B006U2G 0909 B42NC 1309 IS VS IDRM IH IT VDRM VT - I -Peak pulse current rating(IPP)is repetitive and guaranteed for the life of the product; -Bencent only makes the test for 5/320μ s@150A*(10/700μs@6KV), but for other IPP value derived from experience is just for reference only. Bencent will not take any obligation for these parameters , so before applying our parts, please make sure to verify the parameters listed in the above table.

Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications www.bencent.com.cn Order Code: BS4200N-C-F Version: A0 2013- 11-19 Thyristor Surge Suppresser Typical Characteristics

Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications www.bencent.com.cn Order Code: BS4200N-C-F Version: A0 2013- 11-19 Thyristor Surge Suppresser Product Dimensions Environmental Characteristics Testing items Technical standards High temperature Reverse Bias Test Temperature: 150±3℃ Bias=80%VDRM Time:168H High Temperature Life Test Temperature: 150℃ Time:168H High-low Temperature Cycle test Temperature: From -40℃ to125℃ Dwell time ：30min ;10cycles High Temperature &High Humidity Test Temperature: 85℃Humidity:85% Test time:168H Pressure cooker Test Temperature: 121℃，2atm. Humidity:100% Test time:24H Resistance of soldering heat Temperature: 260±5℃ Time of dip soldering ：10s，3times REF mm inch Note: The above testing items can be specified by customer’s special request Recommended Soldering Pad REF mm inch A 6.4 0.252 B 3.4 0.134 C 2.75 0.108 Bottom view Side view A B C D E F G B C A

Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications www.bencent.com.cn Order Code: BS4200N-C-F Version: A0 2013- 11-19 Thyristor Surge Suppresser Reflow Condition Pb-Free assembly Pre Heat Temperature Min 150°C Temperature Max 200°C Time （min to max） 60 – 180 secs Average ramp up rate（Liquid）Tamp （TL 3°C/second max ） to peal TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL 217°C (Liquid) - Temperature (TL 60 – 150 seconds ) Peak Temperature (TP 260+0/-5 °C ) Time within 5°C of actual peak Temperature (TP 8 – 15 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP 8 minutes Max. ) Do not exceed 260°C REF mm inch D 330.0 13.0 OUTLINE REEL (PCS) PER CARTON (PCS) REEL DIAMETERS (mm) CARTON SIZE(mm) L W H TAPING 3,000 24,000 330 360 360 380 Package R eel Information Reflow Profile TP TL TS(max) time to peak temperature Time Temperature Critical Zone TL to TP TL TP Ramp-up TS(min) TS Preheat Ramp-down TL