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Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications www.bencent.com.cn Order Code: BS1100N-2A1 Version: A0 2014- 05-12 Thyristor Surge Suppresser Current Waveform 5/320μs* 10/1000μs Voltage Waveform 10/700μs* 10/1000μs Ipp 50A 35A Symbol Parameter Value Unit TJ Operating Junction Temperature Range -40 to +150 ℃ TS Storage Temperature Range -60 to +150 ℃ Parameters Definition VDRM Peak Off-state Voltage IDRM Off-state Current VS Switching Voltage IS Switching Current IH Holding Current VT On-state Voltage IT On-state Current VF Forward on-state voltage IF Forward current CO Off-state Capacitance BS 1100 N - 2 A 1 (1)Bencent Semiconductor Surge Arrester (2)Off state Voltage,e.g:1100=110×100=110V. (3) Package : SMB-T (4) 2 Lines Protection (5) Rating Surge Voltage: 2KV (10/700μS) (6) Polarity: Uni-directional Part Numbering System Mark Thermal Considerations B11N2A1: Part Number 1309 :Septempter,2013 Surge Ratings Lead Material Copper Alloy Body Material UL recognized epoxy meeting flammability classification 94V-0 Terminal Finish 100% Matte-Tin Plated Physical Characteristics B11N2A1 1309 -Peak pulse current rating (IPP) is repetitive and guaranteed for the life of the product; -Bencent only makes th e test for 5/320μs@50A* (10/700μs@2KV), but for other IPP value derived from experience is just for reference only. Bencent will not take any obligation for these parameters , so before applying our parts, please make sure to verify the parameters listed in the above table. V-I Curve IS VS IDRM IH IT VDRM VT + I IS VS IDRM IH IT VDRM VT + I IS VS IDRM IH IT VDRM VT + I IS VS IDRM IH IT VDRM VT + I IS VS IDRM IH IT VDRM VT + I IS VS IDRM IH IT VDRM VT + I VF IF

Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications www.bencent.com.cn Order Code: BS1100N-2A1 Version: A0 2014- 05-12 Thyristor Surge Suppresser Product Dimensions Environmental Characteristics Testing Items Technical Standards High Temperature Reverse Bias Test Temperature: 150±3℃, Bias=80%VDRM Time:168H High Temperature Life Test Temperature: 150℃ Time:168H High-low Temperature Cycle Test Temperature: From -40℃ to125℃ Dwell time: 30min, 10-100 cycles High Temperature &High Humidity Test Temperature: 85℃Humidity:85% Test time:168H Pressure Cooker Test Temperature: 121℃, 2atm. Humidity:100% Test time: 24H to 168H Resistance of Soldering Heat Temperature: 260±5℃ Time of dip soldering : 10s, 3times Note: The above testing items can be specified by customers by contacting Bencent service Side view I H REF mm inch Recommended Soldering Pad REF mm inch A 3.4 0.134 B 2.5 0.098 C 1.6 0.059 D 1.8 0.059 E 0.9 0.035 F 0.7 0.032 Bottom view

Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications www.bencent.com.cn Order Code: BS1100N-2A1 Version: A0 2014- 05-12 Thyristor Surge Suppresser Reflow Condition Pb-Free Assembly Pre Heat Temperature Min. +150°C Temperature Max. +200°C Time(Min to Max) 60 – 180 secs. Average ramp up rate(Liquidus Temp(TL) to peak) 3°C/sec. Max. TS(max) to TL - Ramp-up Rate 3°C/sec. Max. Reflow - Temperature (TL) (Liquidus) +217°C - Temperature (TL) 60 – 150 secs. Peak Temp (TP) +(260+0/-5 )°C Time within 5°C of actual Peak Temp (TP) 8 – 15 secs. Ramp-down Rate 6°C/sec. Max. Time 25°C to peak Temp (TP) 8 min. Max. Do not exceed +260°C REF mm inch D 330.0 13.0 Outline Reel (pcs) Per Carton (pcs) Reel Diameters (mm) Carton Size(mm) L W H Taping 3,000 24,000 330 360 360 380 Package R eel Information Reflow Profile Bottom view TP TL TS(max) time to peak temperature Time Temperature Critical Zone TL to TP TL TP Ramp-up TS(min) TS Preheat Ramp-down TL