BS108 ONSEMI | Alldatasheet

Document overview

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Technical content

Features

  • Low Drive Requirement, VGS = 3.0 V max
  • Inherent Current Sharing Capability Permits Easy Paralleling of many Devices
  • Pb−Free Packages are Available* MAXIMUM RATINGS Rating Symbol Value Unit Drain−Source Voltage VDSS 200 Vdc Gate−Source Voltage VGS ±20 Vdc Drain Current Continuous (Note 1) Pulsed (Note 2) ID IDM 250 500 mAdc Total Power Dissipation @ T A = 25°C Derate above TA = 25°C PD 350 6.4 mW mW/°C Operating and Storage Temperature Range TJ, Tstg −55 to +150 °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. The Power Dissipation of the package may result in a lower continuous drain current. 2. Pulse Test: Pulse Width /C0118 300 /C0109s, Duty Cycle /C0118 2.0%. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Device Package Shipping

ORDERING INFORMATION

BS108 TO−92 1000 Units/Box BS108 = Device Code A = Assembly Location Y = Year WW = Work Week /C0071 = Pb−Free Package MARKING DIAGRAM D G N−Channel S 250 mAMPS

200 VOLTS

RDS(on) = 8 /C0087 BS108ZL1 TO−92 2000/Ammo Pack Preferred devices are recommended choices for future use and best overall value. BS108G TO−92 (Pb−Free)

1000 Units/Box

BS108ZL1G TO−92 (Pb−Free) 2000/Ammo Pack (Note: Microdot may be in either location) http://onsemi.com TO−92 CASE 29−11 STYLE 301 2 3 BS108 AYWW /C0071 /C0071

  1. Pulse Test: Pulse Width ≤ 300 /C0109s, Duty Cycle = 2.0%.

Figure 1. Switching Test Circuit Figure 2. Switching Waveforms

1.0 M50

http://onsemi.com PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. R A P J L B K G H SECTION X−X CV D N N XX SEATING PLANE DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.175 0.205 4.45 5.20 B 0.170 0.210 4.32 5.33 C 0.125 0.165 3.18 4.19 D 0.016 0.021 0.407 0.533 G 0.045 0.055 1.15 1.39 H 0.095 0.105 2.42 2.66 J 0.015 0.020 0.39 0.50 N 0.080 0.105 2.04 2.66 TO−92 (TO−226) CASE 29−11 ISSUE AL STYLE 30: PIN 1. DRAIN 2. GATE 3. SOURCE ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 BS108/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.