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Figure 1. RDDRONE-BMS772 board
NXP Semiconductors UM11421 RDDRONE-BMS772 reference design User manual Rev. 1 — 12 June 2020 Important Notice NXP provides the enclosed product(s) under the following conditions: This reference design is intended for use of ENGINEERING DEVELOPMENT OR EVALUATION PURPOSES ONLY. It is provided as a sample IC pre-soldered to a printed circuit board to make it easier to access inputs, outputs, and supply terminals. This reference design may be used with any development system or other source of I/O signals by simply connecting it to the host MCU or computer board via off-the-shelf cables. Final device in an application will be heavily dependent on proper printed circuit board layout and heat sinking design as well as attention to supply filtering, transient suppression, and I/O signal quality. The goods provided may not be complete in terms of required design, marketing, and or manufacturing related protective considerations, including product safety measures typically found in the end product incorporating the goods. Due to the open construction of the product, it is the user's responsibility to take any and all appropriate precautions with regard to electrostatic discharge. In order to minimize risks associated with the customers applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. For any safety concerns, contact NXP sales and technical support services. Should this reference design not meet the specifications indicated in the kit, it may be returned within 30 days from the date of delivery and will be replaced by a new kit. NXP reserves the right to make changes without further notice to any products herein. NXP makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does NXP assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typical, must be validated for each customer application by customer’s technical experts. NXP does not convey any license under its patent rights nor the rights of others. NXP products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the NXP product could create a situation where personal injury or death may occur. Should the Buyer purchase or use NXP products for any such unintended or unauthorized application, the Buyer shall indemnify and hold NXP and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges NXP was negligent regarding the design or manufacture of the part.
NXP Semiconductors UM11421 RDDRONE-BMS772 reference design User manual Rev. 1 — 12 June 2020
1 Introduction
This document is the user guide for the RDDRONE-BMS772 reference design. This document is intended for the engineers involved in the evaluation, design, implementation, and validation of MC33772B, 6-channel Li-Ion battery cell controller, S32K1 MCU, A1007 Secure element, and NTAG5 NFC interface. The scope of this document is to provide the user with information that covers interfacing with the hardware, installing the GUI software, using other tools, and configuring the board for the application environment.
2 Finding kit resources and information on the NXP web site
NXP Semiconductors provides online resources for this reference design and its supported device(s) on http://www.nxp.com. The information page for RDDRONE-BMS772 reference design is at http://www.nxp.com/ RDDRONE-BMS772. The information page provides overview information, documentation, software and tools, parametrics, ordering information and a Getting Started tab. The Getting Started tab provides quick-reference information applicable to using the RDDRONE-BMS772 reference design, including the downloadable assets referenced in this document.
2.1 Collaborate in the NXP community
The NXP community is for sharing ideas and tips, ask and answer technical questions, and receive input on just about any embedded design topic. The NXP community is at http://community.nxp.com. The support for RDDRONE-BMS772 use with PX4 software is available in the opensource PX4.io community.
3 Getting ready
Working with the RDDRONE-BMS772 requires the kit contents, additional hardware and a Windows PC workstation with installed software.
3.1 Kit contents
- Assembled and tested RDDRONE-BMS772 in an anti-static bag
- CAN Bus Termination Resistor (DRONE-CAN-TERM)
- Unmounted cell balancing connectors for 3s, 4s and 6s
- 4-pin JST-GH to 4-pin JST-GH 300 MM cable
- Power input and power output connectors
- Quick start guide
3.2 Additional hardware
In addition to the kit contents, the following hardware is necessary or beneficial when working with this kit.
NXP Semiconductors UM11421 RDDRONE-BMS772 reference design User manual Rev. 1 — 12 June 2020
- Battery pack (3s to 6s with cell balancing connector), with a range of 6.0 V to 26 V and a current limit of 60 A DC
- Suitable charger for the battery Note: The RDDRONE-BMS772 board allows to open the charge circuit when the battery is overcharging. Therefore, the charger does not need to have a BMS connector.
- Soldering iron to configure the board
- PEMicro universal multilink or SEGGER J-Link Mini debugger or other suitable debugger Note: The DCD-LZ adapter and SEGGER J-Link Mini EDU are provided in the HoverGames Drone Kit (KIT-HGDRONEK66) and with the FMU (RDDRONE- FMUK66).
3.3 Software
Installing software is necessary to work with this reference design . All listed software is available on the reference design's information page at http://www.nxp.com/RDDRONE- BMS772.
- S32 Design Studio for ARM-based MCUs (recommended)
- PX4/NuttX board target example code (optional)
4 Getting to know the hardware
4.1 RDDRONE-BMS772 overview
The RDDRONE-BMS772 is a standalone BMS reference design suitable for mobile robotics such as drones and rovers, supporting 3 to 6 cells batteries. Other portable electronics and equipment, such as scooters, power tools, portable medical devices could also benefit from referencing this design. If higher cell counts are required, this could be redesigned to daisy chain multiple BCC chips or switch to a larger cell count BCC such as MC33771B. The device performs ADC conversion on the differential cell voltages and currents. It is capable of accurate battery charge coulomb counting and battery temperature measurements. Additionally, it communicates with a Flight Management Unit (FMU) through UAVCAN and/or an SMBus.
4.2 RDDRONE-BMS772 features
The RDDRONE-BMS772 integrates the following functions and features:
- Supports battery from 3s to 6s, with stack voltage ranging from 6.0 V to 26 V
- Supports ambient temperature range from −20 °C to 60 °C
- Measures battery stack and cell voltages with an accuracy of ± 5.0 mV, battery charge or discharge current up to 200 A peak and 90 A DC1
- Active cell balancing during charging
- Offers a deep sleep mode (for transportation and storage) with low leakage current, as well as an automatic sleep mode with low current consumption on the battery
- Allows authentication of the battery 1 This maximum current is obtained only when all MOSFETs and heat sinks are mounted. See Section 5.5 "Power MOSFETs and heat sinks".
- Allows diagnostics to verify the safe operation of the battery
- Allows CAN, I2C and NFC communication
- Implements SWD and JTAG debugging interfaces, works with standard J-Link and other debuggers
- Implements DCD-LZ combined debug console interface for use with PX4 DroneCode and HoverGames platforms
4.3 Block diagram
0 VPOWER IN
Figure 2. Block diagram
4.4 RDDRONE-BMS772 board characteristics
Table 1. Maximum ratings
4.5 Featured components
Figure 3 identifies important components on the board. Figure 3. Reference design featured component locations - top
Figure 4. Reference design featured component locations - bottom Table 2. Featured devices
4.5.1 MC33772B: 6-Channel Li-Ion battery cell controller
4.5.1.1 General description
such as energy storage systems (ESS) and uninterruptible power supply (UPS) systems.
(TPL) to a microcontroller for processing.
4.5.1.2 Features
- 5.0 V ≤ VPWR ≤ 30 V operation, 40 V transient
- 3 to 6 cells management
- 0.8 mV total cell voltage measurement error
- Isolated 2.0 Mbps differential communication or 4.0 Mbps SPI
- Synchronized cell voltage/current measurement with coulomb count
- Total stack voltage measurement
- Seven GPIO/temperature sensor inputs
- Automatic over/undervoltage and temperature detection routable to fault pin
- Integrated sleep mode over/undervoltage and temperature monitoring
- Onboard 300 mA passive cell balancing with diagnostics
- Detection of internal and external faults, as open lines, shorts, and leakages
- Designed to support ISO 26262 up to ASIL D safety system
- Qualified in compliance with AEC-Q100
4.5.2 Connectors
Figure 5. Connectors placements - top
Figure 6. Connectors placements - bottom Table 3. Reference design connector description Section 5.4 "External NFC antenna" for more details.
4.5.3 Communication with Flight Management Unit (FMU)
NXP Semiconductors UM11421 RDDRONE-BMS772 reference design User manual Rev. 1 — 12 June 2020 connector J18) or the UAVCAN bus (can also be used as a simple CAN-bus, connectors; J3 and J20). Note: For more information about UAVCAN, see enablement in PX4.io software and https://uavcan.org.
4.5.4 Programming and debug
There are two ways to program and debug the RDDRONE-BMS772 board:
- through the DCD-LZ connector (J19)
- through the JTAG connector (J2) Note: The DCD-LZ combines a debug interface with a debug serial console. It is used on RDDRONE-FMUK66 (HoverGames). For more information, see HoverGames gitbook.
4.5.5 LED
The RDDRONE-BMS772 implements a programmable RGB LED. Various color combinations and blink patterns are used to indicate the state of the battery and system.
4.5.6 External and additional components
4.5.6.1 External components
An optional external temperature sensor can be added onto the RDDRONE-BMS772 board using connector J1. An example of application for this external sensor is used to monitor the cells temperature inside the battery pack.
4.5.6.2 Additional components
Some components are included in the design but are not mounted on the RDDRONE- BMS772 original board. They are marked "DNP" on the schematics and the BOM. The following table provides the list of additional components that can be implemented in the design as well as their use: Table 4. Additional features
applications
C49, C54
4.5.7 Test points definition
Figure 7 shows the location of the test points on the board. Figure 7. Test points Table 5. Test points
4.6 CAN Bus Termination Resistor
Figure 8. DRONE-CAN-TERM
4.7 Schematic, board layout and bill of materials
available at http://www.nxp.com/RDDRONE-BMS772.
5 Configuring the hardware
5.1 Power connectors
to configure the board with the connector.
5.2 Cell terminal connection
The RDDRONE-BMS772 board is configurable to fit 3s to 6s battery packs.
- The correct cell terminal connector should be soldered as JP1 on the top side (3s, 4s, and 6s connectors are provided in the kit).
- The connection to the cell terminal circuit should be done by soldering the correct solder jumpers (see Table 6). All jumpers are open by default.
Table 6. Cell balancing circuit jumpers Section 5.3 "Shunt resistor" and Section 5.4 "External NFC antenna". Figure 9. RDDRONE-BMS772 configuration for 3s
Figure 12. RDDRONE-BMS772 configuration for 6s Note: The JP1 connector should be soldered on the top side of the board.
5.3 Shunt resistor
the BCC by unsoldering the SJ13 and SJ14 jumpers. Both jumpers are closed by default.
5.4 External NFC antenna
- remove both 0.75 Ω resistors R93 and R94
- solder close SJ15 and SJ16
- replace 82 pF and 680 pF capacitors C72 and C116 by a single 56 pF capacitor
5.5 Power MOSFETs and heat sinks
MOSFETs of the top side are mounted. helps to widen the maximum DC current limit as described in the following table. Table 7. Cell balancing circuit jumpers Note: Exceeding the given current limit can permanently damage the board.
5.6 Optional components
6 Start-up checklist
6.1 First start-up
Figure 13 presents a typical hardware configuration.
Figure 13. Typical initial configuration
- Solder your power in and power out connectors or wires on the J4 and J5 footprints.
- Solder the correct cell terminal connector at the JP1 location. Ensure it is correctly
- Configure the board for your application by soldering the corresponding SJxx
- Configure the board with additional and/or optional components as described in
Section 5 "Configuring the hardware" to fit the application requirements.
6.2 Powering the RDDRONE-BMS772 board
more details about configuration), connect the board. form internal damage due to hot plugging. should be disconnected first. The power input (J4) can then be disconnected.
7 References
NXP Semiconductors UM11421 RDDRONE-BMS772 reference design User manual Rev. 1 — 12 June 2020 [3] UJA1169 — product information on UJA1169TK, Mini High-Speed CAN System Basis Chip https://www.nxp.com/UJA1169TK [4] S32K — product information on S32K1 microcontrollers for general purpose https://www.nxp.com/S32K [5] NTAG — product information on NTAG® 5 boost, NFC Forum-compliant I2C bridge for tiny devices http://www.nxp.com/NTAG5-BOOST
8 Revision history
Revision history
v.1 20200612 Initial version
NXP Semiconductors UM11421 RDDRONE-BMS772 reference design User manual Rev. 1 — 12 June 2020
9 Legal information
9.1 Definitions
Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.
9.2 Disclaimers
Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Evaluation products — This product is provided on an “as is” and “with all faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates and their suppliers expressly disclaim all warranties, whether express, implied or statutory, including but not limited to the implied warranties of non-infringement, merchantability and fitness for a particular purpose. The entire risk as to the quality, or arising out of the use or performance, of this product remains with customer. In no event shall NXP Semiconductors, its affiliates or their suppliers be liable to customer for any special, indirect, consequential, punitive or incidental damages (including without limitation damages for loss of business, business interruption, loss of use, loss of data or information, and the like) arising out the use of or inability to use the product, whether or not based on tort (including negligence), strict liability, breach of contract, breach of warranty or any other theory, even if advised of the possibility of such damages. Notwithstanding any damages that customer might incur for any reason whatsoever (including without limitation, all damages referenced above and all direct or general damages), the entire liability of NXP Semiconductors, its affiliates and their suppliers and customer’s exclusive remedy for all of the foregoing shall be limited to actual damages incurred by customer based on reasonable reliance up to the greater of the amount actually paid by customer for the product or five dollars (US$5.00). The foregoing limitations, exclusions and disclaimers shall apply to the maximum extent permitted by applicable law, even if any remedy fails of its essential purpose. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.
9.3 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. NXP — is a trademark of NXP B.V. SMARTMOS — is a trademark of NXP B.V.
NXP Semiconductors UM11421 RDDRONE-BMS772 reference design User manual Rev. 1 — 12 June 2020 Tables Figures Fig. 1. RDDRONE-BMS772 board . Fig. 3. Reference design featured component Fig. 4. Reference design featured component locations - bottom .
NXP Semiconductors UM11421 RDDRONE-BMS772 reference design Please be aware that important notices concerning this document and the product(s) described herein, have been included in section 'Legal information'. © NXP B.V. 2020. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 12 June 2020 Document identifier: UM11421
Contents
2 Finding kit resources and information on
4.5.1 MC33772B: 6-Channel Li-Ion battery cell
controller .
4.5.3 Communication with Flight Management
Unit (FMU) . 4.7 Schematic, board layout and bill of materials ... 12