BM83SM1

Microchip Technology

BM83 Bluetooth짰 Stereo Audio Module Data Sheet 2019

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Technical content

developers can use the Software Development Kit (SDK) to implement their embedded applications. Figure 1. BM83 Module Block Diagram

The BM83 module supports the following Bluetooth profiles and codecs:

Profiles: – Hands-free Profile (HFP) 1.7, Headset Profile (HSP) 1.2, Advanced Audio Distribution Profile (A2DP) 1.3, Serial Port Profile (SPP) 1.2, Audio/Video Remote Control Profile (AVRCP) 1.6, and Phone Book Access Profile (PBAP) 1.2
Codecs: – Advanced Audio Codec (AAC) and Sub-band Coding (SBC)

Features

Qualified for Bluetooth v5.0 Specification – Bluetooth classic (BR/EDR) and Bluetooth Low Energy – General Attribute Profile (GATT) and General Access Profile (GAP) – Bluetooth Low Energy Data Length Extension (DLE) and secure connection
SDK – 8051 MCU debugging – 24-bit program counter and data pointer modes
Multi-Link – A2DP (maximum 3 devices) – HFP (maximum 3 devices)
Concert Mode and Stereo Mode
Audio Interfaces – Stereo line input – Two analog microphones – One stereo digital microphone – Stereo audio Digital-to-Analog converter (DAC) – Inter-IC (I2S) Sound input/output – I2S Master Clock (MCLK)/reference clock
USB, UART, and Over-the-Air (OTA) firmware upgrade
Built-In Lithium-Ion and Lithium Polymer Battery Charger (up to 350 mA charging current)
Compact Surface Mount Module: – 32 mm x 15 mm x 2.5 mm – Castellated surface mount pads – Module shield
Integrated 3V and 1.8V Configurable Switching Regulator and Low-Dropout (LDO) RF/Analog
Frequency Spectrum: 2.402 GHz to 2.480 GHz
Receive Sensitivity: –90 dBm (2 Mbps EDR, at 0.01% BER)
Programmable Transmit Output Power: – Up to +11 dBm (typical) for Basic Data Rate (BDR) – Up to +9.5 dBm (typical) for Enhanced Data Rate (EDR) DSP Voice and Audio Processing
16/32-bit DSP Core with Enhanced 32-Bit Precision, Single Cycle Multiplier
64 Kbps A-Law, µ-Law Pulse Code Modulation (PCM), or Continuous Variable Slope Delta (CVSD) modulation for Synchronous Connection-Oriented (SCO) Channel Operation
8/16 kHz Noise Reduction (NR) BM83 © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 2

8/16 kHz Acoustic Echo Cancellation (AEC)
Modified Sub-Band Coding (mSBC) Decoder for Wideband Speech
Packet Loss Concealment (PLC) for SBC and AAC Codecs Only Audio Codec
SBC and AAC
20-bit Audio Stereo DAC with Signal-to-Noise Ratio (SNR) 95 dB
16-bit Audio Stereo Analog-to-Digital Converter (ADC) with SNR 90 dB
16-bit/24-bit I2S Digital Audio – 8 kHz, 16 kHz, 44.1 kHz, and 48 kHz sampling frequency for SBC and AAC Peripherals
Successive Approximation Register Analog-to-Digital Converter (SAR ADC) with Dedicated Channels: – Battery voltage monitoring and adapter detection – Charger thermal protection
UART (with hardware flow control)
USB (full-speed USB 1.1 interface)
Inter-Integrated Circuit (I2C ™) Master
One Pulse Width Modulation (PWM) Channel
Two LED Drivers
Up to 18 General Purpose Inputs/Outputs (GPIOs)
2-wire 8051 MCU Joint Test Action Group (JTAG) Debug Operating Conditions
Operating Voltage: 3.2V to 4.2V
Operating Temperature: –40°C to +85°C Compliance
Bluetooth Special Interest Group (SIG) QDID: 134083 (Class1) and 134099 (Class2)
Certified to the United States (FCC), Canada (ISED), Europe (CE), Korea (KCC), Taiwan (NCC), Japan (MIC),and China (SRRC) Radio Regulations.
RoHS Compliant

Applications

Portable Speaker
Multiple Speakers
Headphones BM83 © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 3

Quick References

1.1 Reference Documentation

For further study, refer to the following:

IS2083 Bluetooth® Stereo Audio SoC Data Sheet
BM83 Bluetooth® Audio Development Board User's Guide
IS2083 SDK User Guide
BM83 Host MCU Firmware Development Guide
IS2083 Bluetooth® Audio Application Design Guide
IS2083 SDK Debugger User’s Guide
IS2083 Reference Design Application Note
Introduction to DSP Configuration Tool and AEC Tuning Guide (AN2432)
AN233 Solder Reflow Recommendation Application Note (DS00233) Note: For a complete list of development support tools and documentation, visit http://www.microchip.com/BM83.

1.2 Design Packages

For reference schematics, refer to https://www.microchip.com/wwwproducts/en/BM83.

1.3 Acronyms/Abbreviations

Table 1-1. Acronyms/Abbreviations Acronyms/Abbreviations Description A2DP Advanced Audio Distribution Profile AAC Advanced Audio Codec ADC Analog-to-Digital Converter AEC Acoustic Echo Cancellation AFH Adaptive Frequency Hopping ANCS Apple Notification Center Service AVRCP Audio/Video Remote Control Profile AW Audio Widening BDR Basic Data Rate BER Bit Error Rate BLE Bluetooth Low Energy BOM Bill of Materials BPF Band Pass Filter BR Basic Rate CVSD Continuous Variable Slope Delta DAC Digital-to-Analog Converter DFU Device Firmware Upgrade DIS Device Information Service BM83 Quick References © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 6

Acronyms/Abbreviations Description DLE Data Length Extension DPSK Differential Phase Shift Keying DQPSK Differential Quadrature Phase Shift Keying DR Receive Data DSP Digital Signal Processor DT Transmit Data EDR Enhanced Data Rate EMC Electromagnetic Compatibility EVB Evaluation Board FET Field Effect Transistor GAP General Access Profile GATT General Attribute Profile GFSK Gaussian Frequency Shift Keying GPIO General Purpose Input Output GUI Graphical User Interface HFP Hands-free Profile HPF High Pass Filter HSP Headset Profile HW Hardware I2C/I2C Inter-Integrated Circuit I2S/I2S Inter-IC Sound IC Integrated Circuit ICSP In-Circuit Serial Programming IDE Integrated Development Environment IF Intermediate Frequency IPE Integrated Programming Environment JTAG Joint Test Action Group LDO Low-Dropout LED Light Emitting Diode LNA Low-Noise Amplifier LPA Linear Power Amplifier LSB Least Significant Bit MAC Medium Access Control MB DRC Multiband Dynamic Range Compression MCLK Master Clock MCU Microcontroller MEMS Micro-Electro-Mechanical Systems MFB Multi-function Button Modem Modulator-demodulator MPA Medium Power Amplifier BM83 Quick References © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 7

Acronyms/Abbreviations Description mSBC Modified Sub-band Coding MSPK Multi-speaker NR Noise Reduction OTA Over-the-Air PBAP Phone Book Access Profile PCB Printed Circuit Board PCM Pulse Code Modulation PDM Pulse Density Modulation PIM Plug-in Module PLC Packet Loss Concealment PMU Power Management Unit POR Power-on Reset PWM Pulse Width Modulation RF Radio Frequency RFS Receive Frame Sync RoHS Restriction of Hazardous Substances RSSI Received Signal Strength Indicator RX Receiver SAR Successive Approximation Register SBC Sub-band Coding SCO Synchronous Connection-oriented SDK Software Development Kit SIG Special Interest Group SNR Signal-to-Noise Ratio SoC System-on-Chip SPP Serial Port Profile SW Software TX Transmitter UART Universal Asynchronous Receiver-Transmitter UI User Interface USB Universal Serial Bus VB Virtual Bass Enhancement VCO Voltage-controlled Oscillator WDT Watchdog Timer BM83 Quick References © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 8

Device Overview The BM83 stereo audio module is built around the IS2083BM SoC, which integrates the dual-mode baseband, modem, radio transceiver, PMU, MCU, crystal, and a DSP dedicated for audio and voice applications. Users can configure the BM83 module by using the SDK or the IS208x_Config_GUI_Tool (Config Tool). There are two modes of operation:

Host mode: – Interfaces with an external MCU over UART for application specific system control. – The multi-speaker (MSPK) solution can reside on this MCU.
Embedded mode: – No external MCU involved. – BM83 acts as an MCU to control all peripherals to provide various speaker features. – Integrates the MSPK firmware on the module. – Simple system control can be implemented in the module MCU by using the SDK. – DSP parameters such as equalizer settings can be set using the Config Tool. Note: The SDK and Config Tool are available for download at: http://www.microchip.com/BM83. The following figure illustrates the Embedded mode and Host mode of the BM83 module. Figure 2-1. BM83 Module Application Modes Embedded Mode Microphone Line-In Smartphone Battery DC Adapter BM83 Host Mode Microphone Line-In Smartphone Battery DC Adapter BM83 Host MCU External DSP/Audio Amplifier UART MCLK I S I C I/O I S I C External DSP/Audio Amplifier MCLK BM83 Device Overview © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 9

The following table provides the features of the BM83 module. Table 2-1. BM83 Module Features Features BM83SM1 SoC IS2083BM Pin Count 50 Dimension 32 mm x 15 mm RF PCB Antenna Yes Tx Power (typical) +11 dBm (Class1) and +1 dBm (Class2) RX Sensitivity -90 dBm (2 Mbps EDR) Bluetooth Power Class Class 1 and Class 2 RF Shield Yes Audio Audio DAC Output 2-channel DAC (Single-ended) SNR -95 dB DAC (Capless) SNR -95 dB ADC SNR -90 dB I2S Audio (Input/Output) with Master Clock (MCLK) Output Yes Analog Auxiliary In Yes Analog Microphone 2 Stereo Digital Microphone 1 External Audio Amp Interface Yes Power Battery Input (BAT_IN) 3.8V (typ.) DC Adapter Input (ADAP_IN) 5.0V (typ.) Integrated BUCK Regulator Yes Battery Charger (350 mA charging current max) Yes Peripherals UART (with HW flow control) Yes I2C Master Yes USB (full speed USB v1.1 interface) Yes SAR ADC 2 PWM 1 LED Driver 2 GPIOs 18 JTAG Debug Port (8051 MCU) 2-wire BM83 Device Overview © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 10

2.1 BM83 Module Pin Diagram

The following figure illustrates the pin diagram of the BM83 module. Figure 2-2. BM83 Module Pin Diagram DMIC1_R DMIC_CLK GND MICBIAS MICP1 MICN1 AIL AIR MICP2 DMIC1_L MICN2 AOHPL AOHPM AOHPR MCLK1 DT1 SCLK1 RFS1 DR1 P3_2 P1_3/TCK_CPU/SDA P0_2 LED2 P0_6 DM DP P0_3 P2_7 P0_5 P1_6/PWM1 LED1 P2_3 RST_N P0_1 P0_7 P1_2/TDI_CPU/SCL P3_7/UART_CTS P0_0/UART_TX_IND GND P3_4/UART_RTS P8_6/UART_RXD SK2_KEY_AD SKI1_AMB_DET PWR (MFB) VDD_IO SYS_PWR BAT_IN ADAP_IN P2_6 P8_5/UART_TXD 30 26 29 27 252322 2824 21 BM83 BM83 Device Overview © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 11

2.2 BM83 Module Pin Description

The following table describes the pin description of the BM83 module. Table 2-2. BM83 Module Pin Description Pin Number Pin Name Pin Type

Description

1 DR1 I I2S interface: digital left/right data

2 RFS1 I/O I2S interface: digital left/right clock

3 SCLK1 I/ O I2S interface: bit clock

4 DT1 O I2S interface: digital left/right data

5 MCLK1 O I2S interface: master clock

6 AOHPR O R-channel analog headphone output

7 AOHPM O Headphone common mode output/sense input

8 AOHPL O L-channel analog headphone output

9 MICN2 I MIC 2 mono differential analog negative input

10 MICP2 I MIC 2 mono differential analog positive input

11 AIR I R-channel single-ended analog input

12 AIL I L-channel single-ended analog input

13 MICN1 I MIC 1 mono differential analog negative input

14 MICP1 I MIC 1 mono differential analog positive input

15 MICBIAS P Electric microphone biasing voltage

16 GND P Ground reference

17 DMIC_CLK O Digital MIC clock output

18 DMIC1_R I Digital MIC right input

19 DMxIC1_L I Digital MIC left input

20 P3_2 I/O GPIO port P3_2

21 P2_6 I/O GPIO port P2_6

22 ADAP_IN P • 5V power adapter input

To charge the battery in the Li-ion battery powered applications
To be used for USB Device Firmware Upgrade (DFU)
Otherwise it can be left floating 23 BAT_IN P • Power supply input; voltage range: 3.2V to 4.2V
Source can either be a Li-ion battery or any other power rail on the host board

24 SYS_PWR P System power output derived from BAT_IN or ADAP_IN power

25 VDD_IO P I/O power supply, do not connect, for internal use only (connected to

LDO31_VO)

26 PWR (MFB) I Multi-function push button and power on key

27 SK1_AMB_DET I Temperature sense channel 1

28 SK2_KEY_AD I Temperature sense channel 2

29 P8_6 / UART_RXD I/O • GPIO port P8_6

UART RX data

30 P8_5 / UART_TXD I/O • GPIO port P8_5

UART TX data

31 P3_4 / UART_RTS I/O • GPIO port P3_4

UART RTS

32 LED1 I LED driver 1

33 P0_2 I/O • GPIO port P0_2

By default, this is configured as play/pause button (user configurable button)

34 LED2 I LED driver 2

35 P0_6 I/O • GPIO port P0_6

36 DM I/O USB data minus data line

37 DP I/O USB data positive data line

38 P0_3 I/O • GPIO port P0_3

By default, this is configured as reverse button (user configurable button)

39 P2_7 I/O • GPIO port P2_7

By default, this is configured as volume up button (user configurable button)

40 P0_5 I/O • GPIO port P0_5

By default, this is configured as volume down button (user configurable button)

41 P1_6 / PWM1 I/O • GPIO port P1_6

PWM1 output

42 P2_3 I/O GPIO port P2_3

43 RST_N I System Reset pin (active-low)

44 P0_1 I/O • GPIO port P0_1

By default, this is configured as forward button (user configurable button)

45 P0_7 I/O GPIO port P0_7

46 P1_2 / TDI_CPU / SCL I/O • GPIO port P1_2

CPU 2-wire debug data
I2C SCL BM83 Device Overview © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 13

47 P1_3 / TCK_CPU /

I/O • GPIO port P1_3

CPU 2-wire debug clock
I2C SDA

48 P3_7 / UART_CTS I/O • GPIO port P3_7

UART CTS

49 P0_0 / UART_TX_IND I/O • GPIO port P0_0

UART_TX_IND (active-high) used by the Bluetooth system to wake-up the host MCU

50 GND P Ground reference

Note: The GPIOs mentioned can be configured using the SDK or the Config Tool. Refer to 6.5 General Purpose I/O Pins for default GPIO configurations as per turn-key solution. BM83 Device Overview © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 14

Audio Subsystem The input and output audios have different stages and each stage can be programmed to vary the gain response characteristics. For microphone, both single-ended inputs and differential inputs are supported. To maintain a high quality signal, a stable bias voltage source to the condenser microphone’s Field-Effect Transistor (FET) is provided. The DC blocking capacitors can be used at both positive and negative sides of an input. Internally, this analog signal is converted to 16-bit, 8 kHz/16 kHz/44.1 kHz/48 kHz linear PCM data. The following figure shows the audio subsystem. Figure 3-1. Audio Subsystem RSTGEN CLKGEN CPU DSP DT0 ADC_SDATA ADC_LRO DAC Controller ADC Controller DSP registers DMIC_CLK DMIC1_L DMIC1_R digmic_mclk_out digmic1_l_data_in digmic1_r_data_in Audio DAC Audio ADC VREF reset clk registers Analog Audio Codec AOHPL AOHPM AOHPR AIL AIR MICN1 MICP1 MICN2 MICP2 MICBIAS

3.1 Digital Signal Processor

The BM83 module integrates a high-performance DSP to provide excellent voice and audio user experience. The advanced speech features, such as AEC and NR are inbuilt. To reduce nonlinear distortion and echo cancellation, an BM83 Audio Subsystem © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 15

outgoing signal level to the speaker is monitored and adjusted to avoid saturation of speaker output or microphone input. Adaptive filtering is also applied to track the echo path impulse in response, to provide an echo free and full- duplex user experience. The embedded noise reduction algorithm helps to extract clean speech signals from the noisy inputs captured by the microphones and improves communication. In addition to NR/AEC function, audio effect functions such as Multiband Dynamic Range Compression (MB-DRC), virtual bass enhancement (VB), and audio widening (AW)), for A2DP audio streaming are also available to enhance the audio quality for various applications. For mono speaker/speakerphone and stereo headset applications, MB- DRC and VB can be enabled to have better audio clarity. For stereo speaker/speakerphone applications, in addition to MB-DRC and VB, AW can be enabled to provide better live audio effect for the users. The following figures illustrate the signal processing flow of speakerphone applications for speech and audio signal processing. Figure 3-2. Speech Signal Processing Antenna MCU CVSD/A-Law/ μ-Law/MSBC Decoders CVSD/A-Law/ μ-Law/MSBC Encoders Far-end NR HPF DAC Audio Amplifier Speaker Equaliser Near-end NR/AES AEC HPF ADC Microphones BM83 DSP Equaliser SRC SRC Digital MIC GainAdditive Background Noise Figure 3-3. Audio Signal Processing Antenna MCU SBC/AAC Decoders Audio Effect Equaliser Speaker DSP BM83 Amplifier Audio SRC DAC (Speaker Gain) Line-In ADC External Audio Source Note: 1. The DSP parameters can be configured using the Config Tool. 2. For more details on the DSP configuration and AEC tuning, refer to Introduction to DSP Configuration Tool and AEC Tuning Guide (AN2432).

3.2 Codec

The built-in codec has a high SNR performance and it consists of an ADC, a DAC and an additional analog circuitry. The internal codec supports 20-bit resolution for DAC and 16-bit resolution for ADC.

Interfaces – Two mono differential or single-ended MIC inputs BM83 Audio Subsystem © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 16

– One stereo single-ended line input – One stereo single-ended line output – One stereo single-ended headphone output (capacitor-less connection)

Built-in circuit – MIC bias – Reference and biasing circuitry
Optional digital High Pass Filter (HPF) on ADC path
Silence detection – To turn-off the DSP and audio codec subsystem, if there is no Line-In data after UI configured time stamp.
Anti-pop function (pop reduction system to reduce audible glitches)
Sampling rates: – ADC/DAC/I2S: 8 kHz, 16 kHz, 44.1 kHz, and 48 kHz Note: The sampling rates can be selected in the CODEC Setup tab of Config Tool.

3.2.1 DAC Performance

The audio graphs in this section are produced in the following conditions:

At room temperature
Using BM83 EVB platform with BM83 module mounted on BM83 Carrier Board
Input signal = 1KHz sine tone, level sweep across -100dBv to 6dBv, frequency sweep across 20Hz to 20KHz at 1Fs input level
Various termination loads (16Ω, 32Ω, 100KΩ)
Analog gain = -3dB; digital gain = 0dB
A-weighting applied, 22K bandwidth. The following figures illustrate the DAC performance. BM83 Audio Subsystem © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 17

Figure 3-19. THD+N Ratio (dB) Vs. Output Level at Various Loads (Single-ended mode)

3.2.2 ADC Performance

The audio graphs in this section were produced in the following conditions:

At room temperature
Using BM83 EVB platform with BM83 module mounted on BM83 Carrier Board
Input signal = 1KHz sine tone, level sweep across -100dBv to 6dBv, frequency sweep across 20Hz to 20KHz at 1Fs input level
Analog gain = -3dB; digital gain = 0dB
A-weighting applied, 22K bandwidth BM83 Audio Subsystem © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 28

3.3 Auxiliary Port

The BM83 module supports one analog (Line-In, also called as Aux-In) signal from the external audio source. The analog (Line-In) signal can be processed by the DSP to generate different sound effects (MB-DRC and AW), which can be configured by using the Config Tool.

3.4 Analog Speaker Output

The BM83 module supports the following analog speaker output modes:

Capless mode – recommended for headphone applications in which capless output connection helps to save the Bill of Materials (BOM) cost by avoiding a large DC blocking capacitor. The following figure illustrates the analog speaker output in Capless mode. Figure 3-30. Analog Speaker Output - Capless Mode AOHPR AOHPL AOHPM BM83 16/32 SpeakerΩ
Single-Ended mode – used for driving an external audio amplifier where a DC blocking capacitor is required. The following figure illustrates the analog speaker output in Single-Ended mode. Figure 3-31. Analog Speaker Output - Single-Ended Mode Audio Amplifier BM83 AOHPR AOHPL BM83 Audio Subsystem © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 34

3.5 Microphone Inputs

The BM83 module supports up to two analog microphone channels and one stereo digital microphone. The digital microphone interface should only be used for Pulse Density Modulation (PDM) digital microphones (typically, MEMS microphones) up to about 4 MHz of clock frequency. Note: An I2S based digital microphone should use the external I2S port. BM83 Audio Subsystem © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 35

Transceiver The BM83 module is designed and optimized for the Bluetooth 2.4 GHz system. It contains a complete RF Transmitter (TX)/Receiver (RX) section. An internal synthesizer generates a stable clock for synchronizing with another device.

4.1 Transmitter

The IS2083BM device has an internal Medium Power Amplifier (MPA) and a Low Power Amplifier (LPA). The MPA supports up to +11 dBm output power for Bluetooth Class1 applications, and the LPA supports +1 dBm output power for the Class 2 applications. The transmitter performs the I/Q conversion to minimize the frequency drift.

4.2 Receiver

The Low-Noise Amplifier (LNA) operates with TR-Combined mode with LPA for single port application. It removes the need for an external TX/RX switch.
The ADC is used to sample the input analog signal and convert it into a digital signal for demodulator analysis. A channel filter has been integrated into the receiver channel before the ADC, which is used to reduce the external component count and increase the anti-interference capability.
The image rejection filter is used to reject the image frequency for low-Intermediate Frequency (IF) architecture and to reduce external Band Pass Filter (BPF) component for a super heterodyne architecture.
Received Signal Strength Indicator (RSSI) signal feedback to the processor is used to control the RF output power to make a good trade-off for effective distance and current consumption.

4.3 Synthesizer

A synthesizer generates a clock for radio transceiver operation. There is a Voltage-Controlled Oscillator (VCO) inside with a tunable internal LC tank that can reduce variation for components. A crystal oscillator with an internal digital trimming circuit provides a stable clock for the synthesizer.

4.4 Modem

For Bluetooth 1.2 specification and below, 1 Mbps is the standard data rate based on the Gaussian Frequency Shift Keying (GFSK) modulation scheme. This BR modem meets BDR requirements of Bluetooth 2.0 with EDR specifications.
For Bluetooth 2.0 and above specifications, EDR is introduced to provide the data rates of 1/2/3 Mbps.
For baseband, both BDR and EDR utilize the same 1 MHz symbol rate and 1.6 kHz slot rate.
For BDR, symbol 1 represents 1-bit. However, each symbol in the payload part of EDR packet represents 2/3 bits. This is achieved by using two different modulations – π/4 Differential Quadrature Phase Shift Keying (DQPSK) and 8-Differential Phase Shift Keying (DPSK).

4.5 Adaptive Frequency Hopping

The BM83 module has an AFH function to avoid RF interference. It has an algorithm to check the nearby interference and to choose clear channel for transceiver Bluetooth signal. BM83 Transceiver © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 36

Power Management Unit The on-chip PMU integrates the battery (lithium-ion and lithium-polymer) charger, and voltage regulator. A power switch is used to switch over the power source between the battery (BAT_IN) and an adapter (ADAP_IN). The PMU provides current to drive two LEDs. The battery charger supports various modes with features listed below:

Charging control using current sensor
User-programmable current regulation
High accuracy voltage regulation
Reviving
Pre-charging
Constant current and constant voltage modes
Re-charging The following figure illustrates the charging curve of a battery. Figure 5-1. Battery Charging Curve Reviving Mode Pre charge Mode Constant Current (CC) Mode Constant Voltage (CV) Mode Recharge Mode CV Voltage 4.2V CC Current 0.5c CC Voltage 3.0V Pre charge Voltage 2.5V Pre charge Current 0.1c Reviving Current 2 mA Recharge Voltage 4.1V Recharge Current 0.25c

5.1 Power Supply

The BM83 module is powered through the BAT_IN input pin. The following figure illustrates the connection from the BAT_IN pin to various other voltage supply pins of the IS2083BM SoC on the BM83 module. The external 5V power adapter can be connected to ADAP_IN in order to charge the battery in battery powered applications or in USB applications. Otherwise the ADAP_IN pin can be left floating if there is no battery utilized at BAT_IN pin. BM83 Power Management Unit © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 37

Figure 5-2. Power Tree Diagram Power Switch BAT_IN Li-ion Battery ADAP_IN Adapter SYS_PWR(4.5 to 5.5V) 3V LDO LDO31_VIN LDO31_VO 1.5V Buck Switching Regulator BK_VDD VDD_IO BK_O BK_LX SAR_VDD 1.2V LDO PMIC_IN CLDO_O RFLDO_O VDD_CORE VCC_RF (1.2V) (1.28V) (1.5V) 1.8V Buck Switching Regulator BK_VDD BK_O BK_LX VDDA/ VDDAO (1.8V) (3.2 to 4.2V)

5.2 Battery Voltage Monitoring

The BM83 module has a 10-bit Successive Approximation Register (SAR) ADC with dedicated channels for battery voltage monitoring, adapter detection, multi-button detection and thermal protection. The warning level can be programmed by using the Config Tool. The ADC provides a granular resolution to enable the external MCU to take control over the charging process. The following figures show SK1 and SK2 channel behavior. Figure 5-3. SK1 Channel BM83 Power Management Unit © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 38

Figure 5-4. SK2 Channel

5.3 Ambient Detection

The BM83 module has a built-in ADC for charger thermal protection. The following figure illustrates the suggested circuit and thermistor, Murata NCP15WF104F. The charger thermal protection can avoid battery charge in restricted temperature range. The upper and lower limits for temperature values can be configured by using the Config Tool. Note: Thermistor must be placed close to the battery in the user application for accurate temperature measurements and to enable the thermal shutdown feature. BM83 Power Management Unit © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 39

Figure 5-5. Ambient Detection Circuit VDD_IO 1M/1% 86.6k/1% TR1 100k Thermistor: Murata NCP15WF104F

1 F, 16Vµ

AMB_DET

5.4 LED Drivers

The BM83 module has two LED drivers to control external LEDs. The LED drivers provide enough sink current (16- step control and 0.35 mA for each step) and the LED can be connected directly to the BM83 module. The LED settings can be configured by using the Config Tool. The following figure illustrates the LED drivers in the BM83 module. Figure 5-6. LED Drivers S Y S_PWR BM83 LED1 LED2 BM83 Power Management Unit © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 40

Application Information

6.1 Host MCU Interface Over UART

The BM83 module supports UART commands, which enable an external MCU to control the BM83 module. The following figure illustrates the UART interface between the BM83 module and an external MCU. An external MCU can control the BM83 module over the UART interface and wake up the module with the MFB and P0_0 pins. Refer to SPKcommandset tool to get a list of functions supported by the BM83 module and how to use the Config Tool for configuring UART and UART command set tool. Figure 6-1. Host MCU Interface Over UART MCU MCU_WAKE UP UART_RX UART_TX BT_WAKE UP P0_0 UART_TXD UART_RXD MFB BM83 Note: For the latest SPKcommandset tool, refer to http://www.microchip.com/BM83. The following figures illustrate the timing sequences of various UART control signals. Figure 6-2. Power ON/OFF Sequence BAT_IN SYS_PWR 1 ms ≈ ≈ Power- on/initial idle Power-on Power-on Power-off idle MCU state PWR (MFB) BK_OUT/LDO31_VO 400 ms ≈ RST_N MCU sends UART command (UART_RX) UART Command MCU sends power- off UART Command Power-on ACK ACK ACKBluetooth response UART state (UART_TX) any 10 ms 20 ms Keep all Bluetooth and MCU connection to low level > 1s BM83

Application Information

Figure 6-7. Timing Sequence of Power Drop Protection BAT_IN +4V RST_N from Reset IC Power BAT_IN BM83 Reset OUT VDD GND MCU Reset Reset IC 2.93V 2.7V Timing sequence of power drop protection:

It is recommended to use the battery to provide the power supply at BAT_IN in to the module.
If an external power source or a power adapter is utilized to provide power to the module (BAT_IN), it is recommended to use a voltage supervisor Integrated Circuit (IC).
The Reset IC output pin, RST_N, must be open drain type and threshold voltage as 2.93V.
The RST_N signal must be fully pulled low before BAT_IN power drop to 2.7V

6.2 I2S Interface

The BM83 module provides an I2S digital audio input, output or input/output interface to connect with the external codec or DSP. It provides 8, 16, 44.1, 48, 88.2, and 96 kHz sampling rates for 16-bit and 24-bit data formats. The following are the BM83 module interface signals:

MCLK1 – Master Clock (BM83 output)
SCLK1– Serial/Bit Clock (BM83 input/output)
DR1 – Receive Data (BM83 input)
RFS1 – Receive Frame Sync (BM83 input/output)
DT1 – Transmit Data (BM83 output) Note: The I2S parameters can be configured by using the Config Tool. I2S supports the following modes:
Master mode – The BM83 serves as a master to provide clock and frame synchronous signals for the master/slave data synchronizations, as illustrated in the following figures. The MCLK1 is the master clock output provided to an external I2S device to drive its system clock and save crystal cost. The MCLK is optional and is not required if the external I2S device can drive its system clock on its own. BM83

Figure 6-8. BM83 Module in I2S Master Mode External DSP/ Codec BCLK DACLRC ADCDAT DACDAT SCLK1 RFS1 DR1 DT1 BM83 MCLK MCLK1

Slave mode – The BM83 serves as a slave to receive clock and frame synchronous signals from the external codec or DSP devices, as illustrated in the following figure. Figure 6-9. BM83 Module in I2S Slave Mode External DSP/ Codec BM83 ADCDAT DR1 BCLK SCLK1 DACLRC RFS1 DACDAT DT1 Note: Use the Config Tool to configure the BM83 module as a master/slave.

6.3 Reset

The BM83 module provides a Watchdog Timer (WDT) to reset the chip. It has an integrated Power-on Reset (POR) circuit that resets all circuits to a known power-on state. This action can be driven by an external reset signal, which is used to control the device externally by forcing it into a POR state. The RST_N signal input is active-low and no connection is required in most applications.

6.4 Configuring and Programming

6.4.1 Test Mode

The BM83 module can be configured by using the Config Tool and the firmware is programmed by using the isUpdate tool. The following table provides the settings for configuring the BM83 module for Test mode or Application mode. BM83 © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 45

Table 6-1. BM83 Module - Test Mode Configuration Settings Pins Status Mode P3_4 Low Test mode Floating Application mode Note: The BM83 module provides Test mode, which allows customers to use existing module manufacturing and testing equipment and flow to test the BM83 modules without reinvesting in new test equipment. New customers are encouraged to use the new RF test modes defined for this device. Test mode allows an external UART host to communicate with the BM83 using Bluetooth vendor commands over the UART interface. The host can interface with the driver firmware on the BM83 module to perform TX/RX operations and to collect/report Bit Error Rate (BER) and other RF performance parameters. These values can then be used to accept/reject the device and/or calibrate the module. 6.4.2 2-wire JTAG Program and Debug The BM83 (IS2083BM) provides physical interface for connecting and programming the memory contents, see the following figure. For all the programming interfaces, the target device (IS2083BM) must be powered, and all required signals must be connected. In addition, the interface must be enabled through a special initialization sequence. Note: For more details on 2-wire prog/debug, refer to the IS2083 SDK User’s Guide and IS2083 SDK Debugger User’s Guide . Figure 6-10. 2-wire In-Circuit Serial Programming (ICSP) Interface IS283BM SoC BM83 (IS2083BM) Programmer/ Debugger 2-Wire ICSP TM The 2-wire ICSP port can be used to program the memory content. This interface uses the following two communication lines to transfer data to and from the BM83 (IS2083BM) device being programmed:

Serial Program Clock (TCK_CPU)
Serial Program Data (TDI_CPU) These signals are described in the following sections. The following table describes the signals required for the 2-wire ICSP interface. Table 6-2. 2-wire Interface Pin Description Pin Name Pin Type Description RST_N I Reset pin VDD_IO, ADAP_IN, BAT_IN P Power supply pins GND P Ground pin TCK_CPU I Primary programming pin pair: Serial Clock TDI_CPU I/O Primary programming pin pair: Serial Data

6.4.2.1 Serial Program Clock (TCK_CPU)

TCK_CPU is the clock that controls the TAP controller update and the shifting of data through the instruction or selected data registers. TCK_CPU is independent of the processor clock, with respect to both frequency and phase. BM83 © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 46

6.4.2.2 Serial Program Data (TDI_CPU)

TDI_CPU is the data input/output to the instruction or selected data registers and the control signal for the TAP controller. This signal is sampled on the falling edge of TDI_CPU for some TAP controller states.

6.5 General Purpose I/O Pins

The BM83 module provides up to 18 GPIOs that can be configured by using the Config Tool. The following table provides the default I/O functions of the BM83 module. Note: The MFB pin must be configured as the power-ON/OFF key and the remaining pins are user configurable pins. Table 6-3. GPIO Assigned Pins Function Pin Name Function Assigned P0_0 UART_TX_IND P0_1 Forward (FWD) button P0_2 Play or Pause (PLAY/PAUSE) button P0_3 Reverse (REV) button P0_5 Volume decrease (VOL_DN) button P0_6 Host MCU P0_7 - P1_2 I2C SCL (muxed with 2-wire CPU debug data) P1_3 I2C SDA (muxed with 2-wire CPU debug clock) P1_6 PWM P2_3 SW I2C SCL P2_6 SW I2C SDA P2_7 Volume increase (VOL_UP) button P3_2 Line-In detect P3_4 SYS_CFG (muxed with UART_RTS) P3_7 UART_CTS P8_5 UART_RXD P8_6 UART_TXD MFB MFB Note: 1. This table reflects the default IO assignment in the Config Tool. The GPIOs are user configurable. 2. It is recommended to reserve UART port (P8_5 and P8_6) for Flash download in Test mode during production. 3. GPIO Port 8 API (button detect driver) is currently not implemented like other GPIO APIs. 4. GPIO P3_4 is used to enter Test mode during reset. If the user wants to use this pin to control external peripherals, care must be taken to ensure this pin is not pulled LOW and accidentally enters Test mode. BM83 © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 47

PCB Antenna Information The BM83 module is integrated with a PCB antenna. This chapter provides the radiation pattern, its orientation, and characteristics.

7.1 Antenna Radiation Pattern

The following figure illustrates the 3D radiation pattern of the PCB antenna at 2438 MHz. Figure 7-1. PCB Antenna 3D Radiation Pattern At 2438 MHz(1) 1. The preceding figure illustrates the typical radiation pattern with BM83 module on the 45 mm x 45 mm BM83 Carrier Board. BM83 PCB Antenna Information © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 48

The following figure illustrates the module orientation for antenna radiation pattern. Figure 7-2. Module Orientation for Radiation Pattern BM83 PCB Antenna Information © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 49

Figure 7-3. Polar Plots(1) 1. The preceding figure illustrates the typical radiation pattern with BM83 module on the 45 mm x 45 mm BM83 Carrier Board. The following table provides the characteristics of PCB antenna with BM83 Module mounted on BM83 Carrier Board, plugged into BM83 EVB. Table 7-1. BM83 PCB Antenna Characteristics Parameter Value Frequency 2400 MHz to 2480 MHz Peak Gain 3.5 dBi Efficiency 80% BM83 PCB Antenna Information © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 50

7.2 Module Placement Guidelines

For a Bluetooth-enabled product, the antenna placement affects the overall performance of the system. The antenna requires free space to radiate RF signals and it must not be surrounded by the ground plane. It is recommended that the areas underneath the antenna on the host PCB must not contain copper on the top, inner, or bottom layers, as illustrated in the following figure. Figure 7-4. Recommended Keep-out Area for PCB Antenna A low-impedance ground plane ensures the best radio performance (best range, lowest noise). The ground plane can be extended beyond the minimum recommendation as required for the main Printed Circuit Board (PCB) Electromagnetic Compatibility (EMC) noise reduction. For the best range performance, keep all external metal at least 15 mm away from the on-board PCB trace antenna. The following figure illustrates the example of recommended placement of the BM83 module on a host board for the best RF performance. Figure 7-5. Recommended Module Placement The application board provides a continuous ground plane equal to or greater than the module dimension below the module PCB. Trace routing is not recommended on the application board top layer underneath the module. Bigger ground plane is recommended for better antenna range performance. The reference radiation pattern data provided above uses a BM83 Carrier Board with a dimension of 45 mm x 45 mm. The following figure illustrates the ground plane placement of BM83 module on the host board. The BM83 FCC/ISED certification requires the host board to provide a continuous ground plane with minimum size equal to the BM83 module dimension directly beneath the BM83 PCB Antenna Information © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 51

module (16mmx19mm ). Provide ground plane with distributed via stitching. Avoid trace routing directly under the module. A small cut out can be provided on the host PCB below the module RF test point in order to solder pig tail SMA cable and perform conducted RF measurements. Figure 7-6. Ground Plane on Host Application Board Bottom View No copper, No component, and Keep-out area Top View 3026 2927252322 282421 BM83 GND Module Antenna area GND RF Test Pad No PCB area BM83 PCB Antenna Information © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 52

Physical Dimensions The following figures illustrate the PCB dimension and the recommended PCB footprint of the BM83 module. Figure 8-1. BM83 Module PCB Dimension 0.60 1.20 0.50 Dimensions are in Millimeters Note: PCB dim en sion s: X: 15.0 m m , Y: 32.0 m m a n d tolera n ces: 0.25 m m . Tolerances: PCB Thickness:±0.6 mm Pins 51 - 59 are used only for testing purpose. 0.6 2.5 0.50 0.601 1.90 2.90 3.90 4.90 7.90 9.90 10.90 11.90 12.90 13.90 14.90 15.90 16.90 18.90 19.90 20.90 15 0 3.50 2.45 4.03 4.87 11.62 5.90 8.90 17.90 20.90 6.90 Sh ie ld Mou n tin g Hole 1.90 2.90 3.90 4.90 5.90 6.90 7.90 8.90 9.90 10.90 11.90 12.90 13.90 14.90 15.90 16.90 17.90 18.90 19.90 20.90 0.50 14.50 PCB ANT Bottom ViewSide ViewTopView 5 1 5 2 Sheid Mounting Hole Pad Details BM83 Physical Dimensions © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 53

Figure 8-2. Recommended PCB Footprint 2.79 0.76 1.78 1 0.60 0.50 1.50 1.90 2.90 3.90 4.90 5.90 6.90 7.90 8.90 9.90 10.90 11.90 12.90 13.90 14.90 15.90 16.90 17.90 18.90 19.90 20.90 4.21 8.90 13.90 10.47 20.58 12.27 BM83 Physical Dimensions © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 54

Electrical Characteristics This section provides an overview of the BM83 stereo audio module electrical characteristics. The following table provides the absolute maximum ratings for the BM83 module. Table 9-1. Absolute Maximum Ratings Parameter Min. Typ. Max. Unit Ambient temperature under bias -40 — +85 °C Storage temperature -40 — +150 °C Battery input voltage (BAT_IN) — — +4.3 V Adapter input voltage (ADAP_IN) — — +7 V Maximum output current sink by any I/O pin — — 12 mA Maximum output current sourced by any I/O pin — — 12 mA CAUTIONStresses listed in the preceding table cause permanent damage to the device. This is a stress rating only. The functional operation of the device at those or any other conditions and those indicated in the operation listings of this specification are not implied. Exposure to maximum rating conditions for extended periods affects device reliability. The following tables provide the recommended operating conditions and the electrical specifications of the BM83 module. Table 9-2. Recommended Operating Conditions (1) Parameter Min. Typ. Max. Unit Battery input voltage (BAT_IN) 3.2 3.8 4.2 V Adapter input voltage (ADAP_IN)(2) 4.5 5 5.5 V Operation temperature (TOPERATION) -40 +25 +85 ºC 1. The recommended operating condition tables reflect a typical voltage usage for the device. 2. ADAP_IN is recommended to be used to charge the battery in battery powered applications, and/or applications with USB functionality, else ADAP_IN can be left floating. Table 9-3. I/O and Reset Level (1) Parameter Min. Typ. Max. Unit I/O supply voltage (VDD_IO) 3.0 3.3 3.6 V I/O voltage levels VIL input logic levels low 0 — 0.8 V VIH input logic levels high 2.0 — 3.6 V VOL output logic levels low — — 0.4 V VOH output logic levels high 2.4 — — V RST_N Input low to high threshold point — — 1.87 V Input high to low threshold point 1.25 — — V BM83

Electrical Characteristics

Parameter Min. Typ. Max. Unit Threshold voltage — 1.6 — V 1. These parameters are characterized, but not tested on production device. Table 9-4. Battery Charger (1) Parameter Min. Typ. Max. Unit Adapter input voltage (ADAP_IN) 4.6(2) 5.0 5.5 V Supply current to charger only — 3 4.5 mA Maximum battery fast charge current Headroom(3) > 0.7V (ADAP_IN = 5V) — 350 — mA Headroom = 0.3V to 0.7V (ADAP_IN = 4.5V) — 175(4) — mA Trickle charge voltage threshold — 3 — V Battery charge termination current (% of fast charge current) — 10 — % 1. These parameters are characterized, but not tested on production device. 2. It needs more time to get battery fully charged when ADAP_IN = 4.5V. 3. Headroom = VADAP_IN – VBAT_IN. 4. When VADAP_IN – VBAT_IN > 2V, the maximum fast charge current is 175 mA for thermal protection. Table 9-5. LED Driver (1) Parameter Min. Typ. Max. Unit Open-drain voltage — — 3.6 V Programmable current range 0 — 5.25 mA Intensity control — 16 — step Current step — 0.35 — mA Power-down open-drain current — — 1 μA Shutdown current — — 1 μA 1. These parameters are characterized, but not tested on production device. Table 9-6. Audio Codec Analog-to-Digital Converter (1,4) Parameter (Condition) Min. Typ. Max. Unit Resolution — — 16 Bit Output sample rate 8 — 48 kHz SNR ratio(2) (at MIC or Line-In) — 91 — dB Digital gain -54 — 4.85 dB Digital gain resolution — 2 to 6 — dB MIC boost gain — 20 — dB Analog gain — — 60 dB BM83 © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 56

Parameter (Condition) Min. Typ. Max. Unit Analog gain resolution — 2.0 — dB Input full-scale at maximum gain (differential) — 4 — mV/rms Input full-scale at minimum gain (differential) — 800 — mV/rms 3 dB bandwidth — 20 — kHz Microphone mode (input impedance) — 24 — kΩ THD+N ratio(3) — 0.04 — % THD+N ratio(3) — -68 — dB 1. These parameters are characterized, but not tested on production device. 2. T = 25°C, VDD = 1.8V, 1 kHz sine wave input, bandwidth = 20 Hz to 20 kHz. 3. f in = 1kHz sine tone, analog gain = -3 dB, digital gain = 0 dB, bandwidth = 22K, A-weighted, sweep across -100 dBv to 6 dBv. 4. Measurements performed on BM83 EVB platform. Table 9-7. Audio Codec Digital-to-Analog Converter(1,5) Parameter (Condition) Min. Typ. Max. Unit Over-sampling rate — 128 — fs Resolution 16 — 20 Bit Output sample rate 8 — 48 kHz SNR ratio(2)(at Capless mode) for 48 kHz — 95 — dB SNR(2)(at Single-ended mode) for 48 kHz — 95 — dB Digital gain -54 — 4.85 dB Digital gain resolution — 2 to 6 — dB Analog gain -28 — 3 dB Analog gain resolution — 1 — dB Output voltage full-scale swing (AVDD = 1.8V) 495 742.5 — mV/rms Maximum output power (16Ω load) — 34.5 — mW Maximum output power (32Ω load) — 17.2 — mW Allowed load Resistive 16 — — Ω Capacitive — — 500 pF THD Ratio (3) 0.15 0.02 0.05 % THD Ratio (3) -75 -70 -65 dB THD+N Ratio (3) 0.03 0.04 0.05 % THD+N Ratio (3) -72 -70 -65 dB SNR ratio (at 16Ω load) (4) — 95 — dB 1. These parameters are characterized, but not tested on production device. 2. T = 25°C, VDD = 1.8V, 1 kHz sine wave input, bandwidth = 20 Hz to 20 kHz. BM83 © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 57

f in=1KHz sine tone, analog gain = -3dB, digital gain = 0dB, bandwidth = 22K, A-weighting applied, sweep across -100dBv to 6dBv level, with various loads (16Ω, 32Ω, 100KΩ) 4. f in = 1 kHz, bandwidth = 20 Hz to 20 kHz, A-weighted, -1 dBFS signal, load =16Ω. 5. Measurements performed on the BM83 EVB platform. Table 9-8. Transmitter Section Class 1 (MPA Configuration) for BDR and EDR(1,4) Parameter(2,3) Bluetooth Specification Min. Typ. Max. Unit Transmit power BDR 0 to 20 10.5 11 11.5 dBm Transmit power EDR 2M 0 to 20 9 9.5 10 dBm Transmit power EDR 3M 0 to 20 9 9.5 10 dBm 1. These parameters are characterized, but not tested on production device. 2. The RF transmit power is the average power measured for the mid-channel (Channel 39). 3. The RF transmit power is calibrated during production using the MP tool and MT8852 Bluetooth test equipment. 4. Test condition: VCC_RF = 1.28V, temperature +25ºC. Table 9-9. Transmitter Section Class 2 (LPA Configuration) for BDR and EDR (1,4) Parameter(2,3) Bluetooth Specification Min. Typ. Max. Unit Transmit power BDR -6 to 4 1.5 2 2.5 dBm Transmit power EDR 2M -6 to 4 0 0.5 1 dBm Transmit power EDR 3M -6 to 4 0 0.5 1 dBm 1. These parameters are characterized, but not tested on production device. 2. The RF transmit power is the average power measured for the mid-channel (Channel 39). 3. The RF transmit power is calibrated during production using the MP tool and MT8852 Bluetooth test equipment. 4. Test condition: VCC_RF = 1.28V, temperature +25ºC. Table 9-10. Receiver Section for BDR/EDR/Bluetooth Low Energy(1,2) Parameter Bluetooth Specification Modulation Min. Typ. Max. Unit Sensitivity at 0.1% BER ≤-70 GFSK — -88 — dBm Sensitivity at 0.01% BER ≤-70 π/4 DQPSK — -90 — dBm ≤-70 8 DPSK — -84 — dBm Sensitivity at 0.1% BER ≤-70 Bluetooth Low Energy — -92 — dBm 1. These parameters are characterized, but not tested on production device. 2. Test condition: VCC_RF = 1.28V with temperature +25ºC. Table 9-11. BM83 System Current Consumption(1,2,3,6,7,8) Modes Condition Role Packet Type Current (Typ.) Unit A2DP mode Internal codec, iOS Master Slave 2DH5/3DH5 12.05 mA Internal codec, Android Slave Master 3DH5 12.32 mA BM83

Modes Condition Role Packet Type Current (Typ.) Unit Sniff mode(4) Internal codec, Bluetooth Low Energy disabled Slave DM1 548 µA Master 2DH1/3DH1 555 µA Internal codec, Bluetooth Low Energy enabled Slave DM1 832 µA Master 2DH1/3DH1 863 µA SCO/eSCO connection Mute at both far end and near end Slave 2EV3 14.1 mA Master 2EV3 13.94 mA Inquiry Scan Bluetooth Low Energy disabled ─ ─ 1.35 mA Bluetooth Low Energy enabled ─ ─ 1.70 mA Standby mode System off Slave ─ 2.81 µA Master ─ 2.85 µA RF modes(5) Continuous TX mode Modulation OFF, PL0 ─ 59 mA Modulation ON, PL0 ─ 30 mA Modulation OFF, PL2 ─ 35.5 mA Modulation ON, PL2 ─ 22 mA Continuous RX mode Packet count disable ─ 49 mA Packet count enable ─ 38.5 mA 1. VBAT_IN = 3.8V; current measured across BAT_IN. 2. BM83 module (mounted on BM83 Carrier Board) configured in standalone mode (internal codec) with SBC, used for measurements; no LEDs, no speaker load. 3. iPhone 6 (iOS v12.2) and OnePlus6 (Android™ Oxygen version 9.0.3) used for measurements. 4. Auto-unsniff mode is disabled. Sniff interval is 500 ms by default; observed time to enter sniff mode is approximately 20 secs. 5. RF TX power is set to 10 dBm. 6. Current measurements average over a period of 120 secs. 7. Distance between DUT (BM83) and Bluetooth source (smartphone) is 30 cms. 8. All measurements are taken inside a shield room.

9.1 Timing Specifications

Parameter Symbol Min. Typ. Max. Unit SCLK1 cycle time tSCLKCY 50 — — ns SCLK1 pulse width high tSCLKCH 20 — — ns SCLK1 pulse width low tSCLKCL 20 — — ns RFS1 setup time to SCLK1 rising edge tRFSSU 10 — — ns RFS1 hold time from SCLK1 rising edge tRFSH 10 — — ns DR1 hold time from SCLK1 rising edge tDH 10 — — ns 1. Test Conditions: Slave mode, fs = 48 kHz, 24-bit data, and SCLK1 period = 256 fs. BM83 © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 61

Soldering Recommendations The BM83 module can be soldered to the host board using standard leaded and lead-free solder reflow profiles. The BM83 module is assembled using a standard lead-free reflow profile, IPC/JEDEC J-STD-020. To avoid the damage to the module, it is mandatory to follow the recommendations as listed:

Refer to AN233 Solder Reflow Recommendation Application Note for the soldering reflow recommendations.
Do not exceed peak temperature (T P) of +260ºC.
Use no-clean flux solder paste.
Do not wash the module as moisture can be trapped under the shield.
Use only one flow. If the PCB requires multiple flows, apply the module on the final flow. The following figure illustrates the reflow profile of the BM83 module. Figure 10-1. Reflow Profile Preheat : + 150 to + 200 °C + 217 °C Slope : + 1 to + 2 °C /sec max . (+ 217 °C to peak ) Peak : + 260 °C (+ 5 /0 °C tolerance ) Ramp down rate : + 3 °C /sec max . 20 to 40 sec Time (sec ) 60 to 180 sec 60 to 150 sec+ 25 °C BM83 Soldering Recommendations © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 62

Ordering Information The following table provides the BM83 module ordering information. Table 11-1. BM83 Module Ordering Information Module Microchip IC Description Regulatory Certification Part Number BM83SM1 IS2083BM-232 Bluetooth 5.0 stereo audio module, Class 1 with shield FCC, ISED, CE, MIC, KCC, NCC, SRRC BM83SM1-00AA Note: The BM83 module can be purchased through a Microchip representative. Visit www.microchip.com for the current pricing and a list of distributors for the product. BM83

Ordering Information

Appendix A: Regulatory Approval The BM83 module(1) has received regulatory approval for the following countries:

Bluetooth Special Interest Group (SIG) QDID: – BM83 with Class 1 (2) : 134083 – BM83 (3) : 134099
United States/FCC ID: 2ADHKBM83SM1
Canada/ISED: – IC: 20266-BM83SM1 – HVIN: BM83SM1
Europe/CE
Japan/MIC: TBD
Korea/KCC: TBD
Taiwan/NCC: TBD
China/SRRC: CMIIT ID: TBD Note: 1. Module variants (test report covers all the variants) – BM83SM1with shield-can. FCC/ISED certificate is applicable only for BM83SM1 . – BM83AM1 without shield-can. BM83 AM1 is not for sale. FCC/ISED and CE test reports cover BM83AM1. 2. QDID for Class1 power level for BM83SM1, BM83AM1 3. QDID for Class2 power level for BM83SM1, BM83AM1

12.1 United States

The BM83 module has received Federal Communications Commission (FCC) CFR47 Telecommunications, Part 15 Subpart C “Intentional Radiators” single-modular approval in accordance with Part 15.212 Modular Transmitter approval. Single-modular transmitter approval is defined as a complete RF transmission sub-assembly, designed to be incorporated into another device, that must demonstrate compliance with FCC rules and policies independent of any host. A transmitter with a modular grant can be installed in different end-use products (referred to as a host, host product, or host device) by the grantee or other equipment manufacturer, then the host product may not require additional testing or equipment authorization for the transmitter function provided by that specific module or limited module device. The user must comply with all of the instructions provided by the Grantee, which indicate installation and/or operating conditions necessary for compliance. A host product itself is required to comply with all other applicable FCC equipment authorization regulations, requirements, and equipment functions that are not associated with the transmitter module portion. For example, compliance must be demonstrated: to regulations for other transmitter components within a host product; to requirements for unintentional radiators (Part 15 Subpart B), such as digital devices, computer peripherals, radio receivers, etc.; and to additional authorization requirements for the non-transmitter functions on the transmitter module (i.e., Suppliers Declaration of Conformity (SDoC) or certification) as appropriate (e.g., Bluetooth and Wi-Fi transmitter modules may also contain digital logic functions).

12.1.1 Labeling And User Information Requirements

The BM83 module has been labeled with its own FCC ID number, and if the FCC ID is not visible when the module is installed inside another device, then the outside of the finished product into which the module is installed must display a label referring to the enclosed module. This exterior label should use the following wording: BM83 Appendix A: Regulatory Approval © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 64

Contains Transmitter Module FCC ID: 2ADHKBM83SM1 or Contains FCC ID: 2ADHKBM83SM1 This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. The user's manual for the finished product should include the following statement: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy, and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna
Increase the separation between the equipment and receiver
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected
Consult the dealer or an experienced radio/TV technician for help Additional information on labeling and user information requirements for Part 15 devices can be found in KDB Publication 784748, which is available at the FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB) https://apps.fcc.gov/oetcf/kdb/index.cfm.

12.1.2 RF Exposure

All transmitters regulated by FCC must comply with RF exposure requirements. KDB 447498 General RF Exposure Guidance provides guidance in determining whether proposed or existing transmitting facilities, operations or devices comply with limits for human exposure to Radio Frequency (RF) fields adopted by the Federal Communications Commission (FCC). From the FCC Grant: Output power listed is conducted. This grant is valid only when the module is sold to OEM integrators and must be installed by the OEM or OEM integrators. This transmitter is restricted for use with the specific antenna(s) tested in this application for Certification and must not be co-located or operating in conjunction with any other antenna or transmitters within a host device, except in accordance with FCC multi-transmitter product procedures. BM83: These modules are approved for installation into mobile or/and portable host platforms.

12.1.3 Helpful Web Sites

Federal Communications Commission (FCC): http://www.fcc.gov.
FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB) https:// apps.fcc.gov/oetcf/kdb/index.cfm.

12.2 Canada

The BM83 been certified for use in Canada under Innovation, Science, and Economic Development Canada (ISED, formerly Industry Canada) Radio Standards Procedure (RSP) RSP-100, Radio Standards Specification (RSS) RSS- Gen and RSS-247. Modular approval permits the installation of a module in a host device without the need to recertify the device. BM83 Appendix A: Regulatory Approval © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 65

12.2.1 Labeling and User Information Requirements

Labeling Requirements (from RSP-100 - Issue 11, Section 3): The host product shall be properly labeled to identify the module within the host device. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host device; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number of the module, preceded by the word “Contains” or similar wording expressing the same meaning, as follows: Contains IC: 20266-BM83SM1 User Manual Notice for License-Exempt Radio Apparatus (from Section 8.4 RSS-Gen, Issue 4, November 2014): User manuals for license-exempt radio apparatus shall contain the following or equivalent notice in a conspicuous location in the user manual or alternatively on the device or both: This device complies with Industry Canada's license exempt RSS standard(s). Operation is subject to the following two conditions: (1) This device may not cause interference, and (2) This device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Guidelines on Transmitter Antenna for License Exempt Radio Apparatus: Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établisse-ment d'une communication satisfaisante. Immediately following the above notice, the manufacturer shall provide a list of all antenna types approved for use with the transmitter, indicating the maximum permissible antenna gain (in dBi) and required impedance for each.

12.2.2 RF Exposure

All transmitters regulated by Innovation, Science and Economic Development Canada (ISED) must comply with RF exposure requirements listed in RSS-102 - Radio Frequency (RF) Exposure Compliance of Radiocommunication Apparatus (All Frequency Bands). This transmitter is restricted for use with a specific antenna tested in this application for certification, and must not be co-located or operating in conjunction with any other antenna or transmitters within a host device, except in accordance with Canada multi-transmitter product procedures. BM83: The device operates at an output power level which is within the ISED SAR test exemption limits at any user distance. BM83 Appendix A: Regulatory Approval © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 66

12.2.3 Helpful Web Sites

Innovation, Science and Economic Development Canada (ISED): http://www.ic.gc.ca/.

12.3 Europe

The BM83 is a Radio Equipment Directive (RED) assessed radio module that is CE marked and has been manufactured and tested with the intention of being integrated into a final product. The BM83 module has been tested to RED 2014/53/EU Essential Requirements for Health and Safety (Article (3.1(a)), Electromagnetic Compatibility (EMC) (Article 3.1(b)), and Radio (Article 3.2), which is summarized in the following European Compliance Testing table. The ETSI provides guidance on modular devices in the “Guide to the application of harmonised standards covering articles 3.1b and 3.2 of the RED 2014/53/EU (RED) to multi-radio and combined radio and non-radio equipment” document available at http://www.etsi.org/deliver/etsi_eg/203300_203399/20 3367/01.01.01_60/ eg_203367v010101p.pdf. Note: To maintain conformance to the testing listed in the following European Compliance Testing table, the module shall be installed in accordance with the installation instructions in this data sheet and shall not be modified. When integrating a radio module into a completed product, the integrator becomes the manufacturer of the final product and is therefore responsible for demonstrating compliance of the final product with the essential requirements against the RED.

12.3.1 Labeling and User Information Requirements

The label on the final product that contains the BM83 module must follow CE marking requirements. Table 12-1. European Compliance Information Certification Standard Article Laboratory Report Number Date Safety EN60950-1:2006/ A11:2009/ A1:2010/ A12:2011/ A2:2013 3.1(a) TUV Rheinland, Taiwan 50206965 001 2019-03-18 Health EN300328 V2.1.1/ EN62479:2010 50211535 001 2019-03-18 50211536 001 2019-03-18 EMC EN301489-1 V2.1.1 3.1(b) 50196290 001 2019-03-18 EN301489-1 V2.2.0 EN301489-17 V3.1.1 EN301489-17 V3.2.0 Radio EN300328 V2.1.1 3.2 50211535 001 2019-03-18 50211536 001 2019-03-18

12.3.2 Conformity Assessment

From ETSI Guidance Note EG 203367, section 6.1, when non-radio products are combined with a radio product: If the manufacturer of the combined equipment installs the radio product in a host non-radio product in equivalent assessment conditions (i.e. host equivalent to the one used for the assessment of the radio product) and according to the installation instructions for the radio product, then no additional assessment of the combined equipment against article 3.2 of the RED is required. The European Compliance Information listed in the preceding table was performed using the integral chip antenna.

12.3.2.1 Simplified EU Declaration of Conformity

Hereby, Microchip Technology Inc. declares that the radio equipment type BM83 is in compliance with Directive 2014/53/EU. BM83 Appendix A: Regulatory Approval © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 67

The full text of the EU declaration of conformity for this product is available at http://www.microchip.com/design- centers/wireless-connectivity/.

12.3.3 Helpful Websites

A document that can be used as a starting point in understanding the use of Short Range Devices (SRD) in Europe is the European Radio Communications Committee (ERC) Recommendation 70-03 E, which can be downloaded from the European Communications Committee (ECC) at: http://www.ecodocdb.dk/. Additional helpful web sites are:

Radio Equipment Directive (2014/53/EU): https://ec.europa.eu/growth/single-market/european-standards/harmonised-standards/red_en
European Conference of Postal and Telecommunications Administrations (CEPT): http://www.cept.org
European Telecommunications Standards Institute (ETSI): http://www.etsi.org
The Radio Equipment Directive Compliance Association (REDCA): http://www.redca.eu/

12.4 Japan

The BM83 module has received type certification and is labeled with its own technical conformity mark and certification number as required to conform to the technical standards regulated by the Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the Radio Act of Japan. Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. Additional testing may be required:

If the host product is subject to electrical appliance safety (for example, powered from an AC mains), the host product may require Product Safety Electrical Appliance and Material (PSE) testing. The integrator should contact their conformance laboratory to determine if this testing is required
There is an voluntary Electromagnetic Compatibility (EMC) test for the host product administered by VCCI: http://www.vcci.jp/vcci_e/index.html

12.4.1 Labeling and User Information Requirements

The label on the final product which contains the BM83 module must follow Japan marking requirements. The integrator of the module should refer to the labeling requirements for Japan available at the Ministry of Internal Affairs and Communications (MIC) website. For the BM83 module, due to a limited module size, the technical conformity logo and ID is displayed in the data sheet and/or packaging and cannot be displayed on the module label. The final product in which this module is being used must have a label referring to the type certified module inside: XXX-XXXXX

12.4.2 Helpful Web Sites

Association of Radio Industries and Businesses (ARIB): http://www.arib.or.jp/english/. BM83 Appendix A: Regulatory Approval © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 68

12.5 Korea

The BM83 module has received certification of conformity in accordance with the Radio Waves Act. Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed.

12.5.1 Labeling and User Information Requirements

The label on the final product which contains the BM83 module must follow KC marking requirements. The integrator of the module should refer to the labeling requirements for Korea available on the Korea Communications Commission (KCC) website. The BM83 module is labeled with its own KC mark. The final product requires the KC mark and certificate number of the module: XXXX-XXX-xxx-XXXXXXXXXXXX

12.5.2 Helpful Websites

Korea Communications Commission (KCC): http://www.kcc.go.kr.
National Radio Research Agency (RRA): http://rra.go.kr.

12.6 Taiwan

The BM83 module has received compliance approval in accordance with the Telecommunications Act. Customers seeking to use the compliance approval in their product should contact Microchip Technology sales or distribution partners to obtain a Letter of Authority. Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed.

12.6.1 Labeling and User Information Requirements

For the BM83 module, due to the limited module size, the NCC mark and ID are displayed in the data sheet only and cannot be displayed on the module label: xxxxxxxxxxxxxx The user's manual should contain following warning (for RF device) in traditional Chinese: 注意 ! 依據低功率電波輻射性電機管理辦法第十二條經型式認證合格之低功率射頻電機，非經許可，公司、商號或使用者均不得擅自變更頻率、加大功率或變更原設計之特性及功能。第十四條低功率射頻電機之使用不得影響飛航安全及干擾合法通信；經發現有干擾現象時，應立即停用，並改善至無干擾時方得繼續使用。 BM83 Appendix A: Regulatory Approval © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 69

前項合法通信，指依電信規定作業之無線電信。低功率射頻電機須忍受合法通信或工業、科學及醫療用電波輻射性電機設備之干擾。

12.6.2 Helpful Web Sites

National Communications Commission (NCC): http://www.ncc.gov.tw

12.7 China

The BM83 module has received certification of conformity in accordance with the China MIIT Notice 2014-01 of State Radio Regulation Committee (SRRC) certification scheme. Integration of this module into a final product does not require additional radio certification, provided installation instructions are followed and no modifications of the module are allowed.

12.7.1 Labeling and User Information Requirements

The BM83 module is labeled with its own CMIIT ID as follows: CMIIT ID: XXXXXXXXXX When Host system is using an approved Full Modular Approval (FMA) radio: The host must bear a label containing the statement “This device contains SRRC approved Radio module CMIIT ID: CMIIT ID here”.

12.8 Other Regulatory Information

For information about other countries' jurisdictions not covered here, refer to http://www.microchip.com/design- centers/wireless-connectivity/certifications
Should other regulatory jurisdiction certification be required by the customer, or the customer needs to recertify the module for other reasons, contact Microchip for the required utilities and documentation BM83 Appendix A: Regulatory Approval © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 70

Document Revision History Revision Date Section Description A 07/2019 Document Initial Revision BM83 Document Revision History © 2019 Microchip Technology Inc. Preliminary Datasheet DS70005402A-page 71

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Product Information

BM83SM1 specifications and overview.

Summary

BM83 Bluetooth짰 Stereo Audio Module Data Sheet 2019

Description

BM83 Bluetooth짰 Stereo Audio Module Data Sheet 2019

Source title BM83SM1 Datasheet(PDF) - Microchip Technology

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