BM78SPPS5NC2-0002AA

BM78_V01 MICROCHIP | Alldatasheet

Document overview

• Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
• PDF pages: 60

Technical content

Features

• Bluetooth Classic (BR/EDR) and Low Energy (LE)
• Certified to FCC, ISED, MIC, KCC, SRRC and NCC radio regulations
• Radio Equipment Directive (RED) Assessed Radio module
• Bluetooth 5.0 certified
• Transparent UART mode for seamless serial data over UART interface
• Easy to configure with User Interface (UI) tool, a Windows®-based utility or directly by MCUs
• Firmware can be upgraded in the field over UART (Flash version only)
• Integral chip antenna (BM78SPPS5MC2/NC2) or  external antenna (BM78SPP05MC2/NC2)
• Integrated crystal, internal voltage regulator, and matching circuitry
• Configurable I/O pins for control and status
• Supports Apple® iPod® Accessory Protocol (iAP2), (only BM78SPPx5MC2)
• Supports Bluetooth Low Energy secure connec- tions
• Supports Bluetooth Low Energy data packet length extension
• Small and compact surface mount module
• Castellated surface mount pads for easy and reli- able host PCB mounting
• Ideal for portable battery-operated devices
• One LED driver with 16 step brightness control RF/Analog
• Frequency spectrum: 2.402 GHz to 2.480 GHz
• Receive Sensitivity: -90 dBm (BR/EDR),  -92 dBm (LE)
• Class 2 output power (+1.5 dBm typical) Data Throughput Data throughput at 1 Mbps UART baud rate:
• BR/EDR: up to 32 Kbytes/s
• LE: up to 7 Kbytes/s Data throughput at 115200 bps UART baud rate:
• BR/EDR: up to 10 Kbytes/s
• LE: up to 6 Kbytes/s FIGURE 1: BM78 MODULE MAC/Baseband/Higher Layer
• Secure AES128 encryption
• Bluetooth 3.0: GAP , SPP , SDP , RFCOMM, and L2CAP
• Bluetooth profiles: GAP, GATT, ATT, SMP, and L2CAP Operating Conditions
• Operating voltage range: 3.3V to 4.2V
• Operating temperature: -20ºC to +70ºC

Applications

• Internet of Things (IoT)
• Secure payment
• Home and security
• Health and fitness
• Industrial and data logger
• LED lighting (16 configurations) Bluetooth® Dual-Mode Module

DS60001380B-Page 2  2016-2019 Microchip Technology Inc. General Description The BM78 module is a fully-certified Bluetooth module for customers to easily add dual-mode Bluetooth wire- less capability to their products. The BM78 module is built around Microchip's IS1678 Bluetooth dual-mode SoC, and it is available in ROM-based (BM78SPPx - 5NC2) and Flash-based (BM78SPPx5MC2) versions. Refer to 9.0 “Ordering Information” for additional information on the BM78 Stock Keeping Units (SKUs). The BM78 module bridges the customer products to smart phones or tablets for convenient data transfer, control, access to cloud applications and delivering the local connectivity for IoT. The BM78 module supports GAP , SDP, SPP , and GATT profiles. Data transfer is achieved through the Bluetooth link by sending or receiving data through Transparent UART mode, mak- ing it easy to integrate with any microprocessor or microcontroller with the UART interface. It also enables an easy configuration by using a UI tool, a Windows- based utility, or directly through UART by MCUs.

 2016-2019 Microchip Technology Inc. DS60001380B-Page 3 BM78 Table of Contents TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publicat ions to better suit your needs. Our publications will be refine d and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publicatio n, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, pleas e register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any pag e. The last character of the literature number is the version numb er, (e.g., DS30000000A is version A of document DS30000000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revis ion of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following:

• Microchip’s Worldwide Web site; http://www.microchip.com
• Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, re vision of silicon and data sheet (include literature number) yo u are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products .

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1.0 SYSTEM OVERVIEW

The BM78 module is a fully-certified, embedded  2.4 GHz Bluetooth (BR/EDR/LE) wireless module. It includes an on-board Bluetooth stack, power manage- ment subsystem, 2.4 GHz transceiver, and RF power amplifier. Customers can embed Bluetooth functionality into any application using the BM78 module. The BM78 module enables rapid product development and faster time to market, and it is designed to provide integrators with the following features:

• Simple integration and programming
• Reduced development time
• Superior wireless module with low-cost system
• Interoperability with Bluetooth host
• Wide range of applications The BM78SPPS5MC2/NC2 is a complete and fully reg- ulatory certified module with an integral ceramic chip antenna and RF shield. The BM78SPP05MC2/NC2 is a low-cost alternative with RF-out pin (for external antenna) and no RF shield. The integrator is responsi ble for the antenna, antenna matching, and regulatory certifications. T h e B M 7 8 m o d u l e i s a s m a l l , c o m p a c t , a n d s u r- face-mounted module with castellated pads for easy and reliable host PCB mounting. It is compatible with standard pick-and-place equipment and can inde - pendently maintain a low-power wireless connection. Low-power usage and flexible power management max- imize the lifetime of the BM78 module in battery oper - ated devices. A wide operating temperature range enable its applications in indoor and outdoor environ - ments. Figure 1-1 illustrates the internal block diagram of the BM78 module. FIGURE 1-1: INTERNAL BLOCK DIAGRAM OF BM78 MODULE BAT_ IN SW_ BTN LDO3V3_OUT LDO1V8_OUT PMU VDDIO WAKE_UP LED Driver I2C EEPROM UART GPIO IS1678 S/SM 16 MHz Crystal Matching Antenna BM78 Bluetooth ® Dual Mode Module HOST MCU SW_ BTN LDO33_O LDO18_O RST_N WAKE_UP SCL SDA BAT_ DET Bluetooth Baseband and RF TXD RXD RTS CTS VDD_IO Core

320 KB ROM

28 KB SRAM

(IS1678SM Only) (Only BM78SPPS5MC2/NC2) RST_N

DS60001380B-Page 6  2016-2019 Microchip Technology Inc. Table 1-1 provides various pins of the BM78SPPx5MC2/NC2 module. TABLE 1-1: PIN DESCRIPTION S5 Pin 05 Pin Symbol Type Description 1 — GND Power Ground reference 2 — GND Power Ground reference 3 1 GND Power Ground reference 4 2 BAT_IN Power Battery input (3.3V to 4.2V) Main positive supply input Connect to 10 μF (X5R/X7R) capacitor 5 3 SW_BTN DI Software Power Button H: Power On  L: Power Off 6 4 LDO33_O Power Internal 3.3V LDO output, cannot source more than  50 mA 7 5 VDD_IO Power I/O positive supply input. Internal use only, do not con- nect to other devices 8 6 LDO18_O Power Internal 1.8V LDO output. Internal use only, do not con- nect to other devices 9 7 WAKE_UP DI Wake up from Sleep mode (active-low) (internal pull up) 10 8 PMULDO_O Power Power Management Unit (PMU) output. Internal use only, do not connect to other devices 11 9 P0_4 DO Status Indication pin, refer to Table 2-4 12 10 P1_5 DO Status Indication pin, refer to Table 2-4 13 11 P1_2/SCL DO I2C SCL 14 12 P1_3/SDA DIO I2C SDA 15 13 P1_7 DIO Configurable control or Indication pin or UART CTS (input) 16 14 P0_5 DIO Configurable control or Indication pin 17 15 P0_0 DIO Configurable control or Indication pin or UART RTS (output) 18 16 P2_0 DI System configuration pin along with P2_4 and EAN pins, used to set the BM78 module in any one of the fol- lowing three modes:

• Application mode (for normal operation),
• Test mode (to change EEPROM values), and
• Write Flash mode (to download the firmware into the module), refer to Table 2-1 19 17 P2_4 DI System configuration pin along with P2_0 and EAN pins, used to set the BM78 module in any one of the fol- lowing three modes:
• Application mode (for normal operation),
• Test mode (to change EEPROM values), and
• Write Flash mode (to download the firmware into the module), refer to Table 2-1 Legend: A = Analog D = Digital I = Input O = Output

 2016-2019 Microchip Technology Inc. DS60001380B-Page 7 BM78 20 18 EAN DI External address-bus negative System configuration pin along with P2_0 and P2_4 pins used to set the module in any of the three modes:

• Application mode (for normal operation),
• Test mode (to change EEPROM values), and
• Write Flash mode (to download the firmware into the module), refer to Table 2-1 ROM: Must be pulled high to VDD_IO FLASH: Must be pulled down with 4.7 kOhm to Ground 21 19 RST_N DI Module Reset (active-low) (internal pull up) Apply a pulse of at least 63 ns 22 20 HCI_RXD DI UART data input 23 21 HCI_TXD DO UART data output 24 22 P3_1 DIO Configurable control or Indication pin (Internally pulled-up, if configured as an input) 25 23 P3_2 DIO Configurable control or Indication pin (Internally pulled-up, if configured as an input) 26 24 P3_3 DIO Configurable control or Indication pin (Internally pulled-up, if configured as an input) 27 25 P3_4 DIO Configurable control or Indication pin (Internally pulled-up, if configured as an input) 28 26 P3_6 DIO Do not connect 29 27 P3_7 DIO Configurable control or Indication pin (Internally pulled-up, if configured as an input) 30 28 LED1 DO LED driver, connect to LDO33_0 31 29 GND Power Ground reference — 30 BT_RF AIO External antenna connection (50 Ohm) 32 — GND Power Ground reference 33 — GND Power Ground reference Legend: A = Analog D = Digital I = Input O = Output TABLE 1-1: PIN DESCRIPTION (CONTINUED) S5 Pin 05 Pin Symbol Type Description

 2016-2019 Microchip Technology Inc. DS60001380B-Page 9 BM78 FIGURE 1-3: BM78SPP05MC2/NC2 PIN DIAGRAM

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2.0 APPLICATION INFORMATION

2.1 System Configuration

The system configuration I/O pins P2_0, P2_4 and EAN are used to set the configuration and firmware programming modes. Each of these pins have internal pull up and allow con- figuration settings and firmware update from the UART. Table 2-1 provides the system configuration settings. TABLE 2-1: SYSTEM CONFIGURATION SETTINGS

2.2 Control and Indication I/O Pins

The I/O pins, P0_0, P0_5, P1_7, P3_1, P3_2, P3_3, P3_4, and P3_7 are configurable control and indication pins. The control signals are input to the BM78 module and the indication signals are output from the BM78 module. Table 2-2 pr o vi des d ef au lt I / O pi n c onf igu r a- tion details. Note 1:The RTS pin can only be assigned to P0_0 and the CTS pin can only be assigned to P1_7. 2: The RTS and CTS pins can be configured as GPIOs, if flow control is disabled. Table 2-3 provides the configurable functions and descriptions of I/O pins. Module P2_0 P2_4 EAN Operational Mode BM78SPPx5NC2 (ROM Variant) Low High High Test mode (Write EEPROM) High High High APP mode (Normal operation) BM78SPPx5MC2 (Flash Variant) Low Low High Write Flash Low High Low Test mode (Write EEPROM) High High Low APP mode (Normal operation) TABLE 2-2: CONTROL AND INDICA TION I/O PIN ASSIGNMENTS PIN Symbol Default Configuration P0_0 UART_RTS(1,2) P0_5 N/C P1_7 UART_CTS(1,2) P3_1 INQUIRY CONTROL P3_2 LINK_DROP_CONTROL (DISCONNECT) P3_3 UART_RX_IND P3_4 PAIRING_KEY P3_7 LOW_BATTERY_IND TABLE 2-3: CONFIGURABLE F UNCTIONS AND DESCRIPTIONS Function Name Description Low battery indication This function, when assigned to a pin, ensures the output goes low when the battery level is below a specified level. The UI tool can set the battery level. RSSI indication When assigned to a pin, this function can be used to indicate the quality of the link based on the Received Signal Strength Indicator (RSSI) level. If the RSSI level is lower than the specified values, then the RSSI indication pin goes low. Link drop control When assigned to a pin, this function can be used to force the module to drop the current Bluetooth Low Energy (BLE) link with a peer device. Pulling the Link Drop pin low will force the disconnect. The pin needs to be pulled low for at least 10 ms.

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2.3 Status Indication I/O Pins

The I/O pins, P1_5 and P0_4, are status indicator pins: STATUS_IND_1 and STATUS_IND_2. Both the pins provide status indication to host MCUs. Table 2-4 pro- vides status indication of the P1_5 and P0_4 pins. UART RX indication When assigned to a pin, this function enables communication with the UART when the module is in Low-Power mode. When not in Low-Power mode, the module runs on a 16 MHz clock. If the user intends to provide data or com- mands through UART in the Low-Power mode, then the UART_RX_IND pin needs to be pulled low and the user has to wait at least 5 ms before sending the data. Pulling the UART_RX_IND pin low allows the module to operate the 16 MHz clock and to enable UART. Pairing key When assigned to a pin, this function can be used to force the module to enter Standby mode. The pin needs to be pulled down for at least 160 ms. Inquiry control When assigned to a pin, this function forces the module to enter Inquiry mode (Bluetooth Classic). The pin must be pulled low for at least 240 ms for the device to enter Inquiry mode. Profile_IND When assigned to a pin, this function can be used to indicate whether current connection is in Basic Data Rate (BDR)/Enhanced Data Rate (EDR) (Bluetooth Classic), or in BLE. If the Profile_IND pin is high, then the current connection is BDR/EDR connection. If low, then the current connection is a BLE connection. This pin is valid only for Link state. TABLE 2-3: CONFIGURABLE F UNCTIONS AND DESCRIPTIONS Function Name Description TABLE 2-4: STATUS INDICATION P1_5/STATUS_IND_1 P0_4/STATUS_IND_2 Indication H H Power-on (default setting) and Deep-sleep state. HH status should be stable for at least 500 ms H L Access state L H Link state (UART data transmitting) L L Link state (no UART data transmitted) Legend: L = Low H = High

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2.4 Power Tree

Figure 2-1 illustrates the power tree diagram of the BM78 module. FIGURE 2-1: POWER TREE DIAGRAM

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2.5 Software Power Button (SW_BTN)

The Software power button (SW_BTN) input pin pow - ers the BM78 module ON (high) or OFF (low) into the S4 mode. The S4 mode is the Deep-sleep mode and the S2 mode is the Sleep mode. The S4 mode can only be triggered by the SW_BTN pin, and the power con - sumption is lower in the S4 mode. Figure 2-2 through Figure 2-4 illustrates the waveforms of the BM78 module in the high and low status, that is access and link status. FIGURE 2-2: SW_BTN TIMING ( HIGH) AT APPLICATION MODE Note 1:MCU can send UART command, refer to Table 2-4. 2: Time duration (475 ms) is for reference purposes only; the host MCU must check the status pin. 3: Reset pin is not connected. 4: The Timing data corresponds to the BM78SPPx5NC2 (ROM variant) module.

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2.6 WAKE-UP

The WAKE_UP input pin wakes the BM78 module from Sleep mode. The WAKE_UP pin is active-low and puts the module from Sleep mode (S2) to Standby mode. Figure 2-5 illustrates the timing diagram of the BM78 module in the Wake-Up mode. FIGURE 2-5: WAKE-UP TIME Note 1:Time duration (85 ms) is for reference purposes only; the host MCU must check the status pin. 2: Refer to Table 2-4 for the status of the P0_4/P1_5 pin.

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2.7 External Reset

The BM78 module provides a Watchdog Timer (WDT) to reset the chip. It has an integrated Power-on Reset (POR) circuit that resets all circuits to a known Power-on state. This action can also be driven by an external Reset signal which is used to externally control the device by forcing it into a POR state. The RST_N signal input is active-low and connection is not required in most of the applications. Figure 2-6 illustrates the timing diagram of the BM78 module when it is in the Reset (RST_N is set to active-low) state. FIGURE 2-6: TIMING WAVEFORMS ON RESET Note 1:Auto Pattern mode can use external Reset signal. For more details on the Auto Pattern mode, refer to 3.0 “Operating Modes”. 2: The RST_N state trigger must be greater than 63 ns. 3: Manual pattern mode can use external Reset signal and Reset command. For more details on the Man- ual Pattern mode, refer to 3.0 “Operating Modes” and IS1678 UART Command Set User Guide. 4: Time duration (350 ms) is for reference purposes only; the host MCU must check the status pin.

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2.8 LED Driver

The BM78 module has a dedicated LED driver and the LED (LED1) can be connected directly with the BM78 module using this driver, see Figure 2-7. The maximum current sourcing for the LED is 5 mA, and it provides 16 options (steps) to trim the brightness. The LED brightness can be configured using the UI tool, a Windows-based utility. The following are status indications of the LED. Each indication is a configurable flashing sequence:

• Standby
• Link Back
• Low Battery
• Inquiry
• L i n k FIGURE 2-7: LED DRIVER

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2.9 Host MCU Interface over UART

Figure 2-8 illustrates the UART interface with host MCU and power scheme using 3.3V to the V DD. Bat- tery power is applied to the BAT_IN pin. From the LDO33_O pin, voltage can be routed to the VDD_IO pin and external circuitry including the MCU. This power scheme ensures that the BM78 module and MCU I/O voltages are compatible. FIGURE 2-8: POWER AND MCU INTERFACE EXAMPLE FOR BM78 MODULE Note: The internal 3.3V LDO current source must not exceed maximum value of  50 mA. Note 1:Ensure that VDD_IO and MCU VDD voltages are compatible. 2: The control and indication ports are configurable.

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2.10 Reference Circuit

Figure 2-9 through Figure 2-12 illustrate the reference schematic of the power supply design implemented for the BM78 module. FIGURE 2-9: BM78SPP05MC2/NC2 REFERENCE CIRCUIT Matching Circuit RF BAT_IN LDO33_O LED P3_7 P3_6 P3_4 P3_3 P3_2 EAN P1_5 P0_4 P3_1 RXD TXD P2_4 P2_0 P0_0 P0_5 P1_7 RST_N P1_3 P1_2 SW_BTN WAKEUP FP1 FP-BM77SPP GND1 BAT_IN2 SW_BTN3 LDO33_O4 VDD_IO5 LDO18_O6 WAKEUP7 PMULDO_O8 P0_49 P1_510 P1_2 /SCL11 P1_3 /SDA12 BT_RF 30 GND 29 LED1 28 P3_7 27 P3_6 26 P3_4 25 P3_3 24 P3_2 23 P3_1 22 HCI_TXD 21 HCI_RXD 20 RST_N19 P1_713 P0_514 P0_015 P2_016 P2_417 EAN 18 ANT1 ANT-ISSC 1nH NP-0402 1 2 TP1 RF-TP5 10u/16V NP-0402 1 2

 2016-2019 Microchip Technology Inc. DS60001380B-Page 21 BM78 FIGURE 2-10: BM78SPP05MC2/NC2 REFERENCE CIRCUIT LED LDO33_OLED MCU Functional GPIO Status_IND UART TXD / RXD UART CTS / RTSP0_0 P1_7 P0_0 P0_5 P1_7 P0_4 P1_5 TXD P3_7 RXD RST_N SW_BTN WAKEUP P3_4 P3_3 P3_2 P3_1 LED-B WAKE-UP WAKEUP SW3 TS08M-PF RESET RST_N SW2 TS08M-PF Push-on : pin 2-3 Push-off : pin 1-2 SW_BTN BAT_IN SW_BTN 20K/1% 1 2 SW1 PS-5177 1 1 2 2 3 366 Test PIN BAT_IN TXD RXD RST_N EAN P2_4 P2_0 SW_BTN TP3 TP-2 TP9 TP-2 TP6 TP-2TP5 TP-2 TP7 TP-2 TP4 TP-2 TP10 TP-2TP8 TP-2 TP2 TP-2 External I2C Device LDO33_O P1_2 P3_6 P1_3 10K/1% 1u/10V CN1 CONN1X5 10K/1%

DS60001380B-Page 22  2016-2019 Microchip Technology Inc. FIGURE 2-11: BM78SPPS5MC2/NC2 REFERENCE CIRCUIT BAT_IN LDO33_O LED P3_7 P3_6 P3_4 P3_3 P3_2 EAN P1_5 P0_4 P3_1 RXD TXD P2_4 P2_0 P0_0 P0_5 P1_7 RST_N P1_3 P1_2 SW_BTN WAKEUP FP1 FP-BM78SPPA GND3 BAT_IN4 SW_BTN5 LDO33_O6 VDD_IO7 LDO18_O8 WAKEUP9 PMULDO_O10 P0_411 P1_512 P12 / SCL13 P13 / SDA14 P1_715 P0_516 P0_017 P2_018 P2_419 EAN 20 RST_N21 GND 31 LED1 30 P3_7 29 P3_6 28 P3_4 27 P3_3 26 P3_2 25 P3_1 24 HCI_TXD 23 HCI_RXD 22 G 33 G 32 10u/16V

 2016-2019 Microchip Technology Inc. DS60001380B-Page 23 BM78 FIGURE 2-12: BM78SPPS5MC2/NC2 REFERENCE CIRCUIT MCU Functional GPIO Status_IND UART TXD / RXD UART CTS / RTSP0_0 P1_7 P0_0 P0_5 P1_7 P0_4 P1_5 TXD P3_7 RXD RST_N SW_BTN WAKEUP P3_4 P3_3 P3_2 P3_1 WAKE-UP WAKEUP SW3 TS08M-PF RESET RST_N SW2 TS08M-PF LED LDO33_OLED LED-B Push-on : pin 2-3 Push-off : pin 1-2 SW_BTN BAT_IN SW_BTN 20K/1% 1 2 SW1 PS-5177 1 1 2 2 3 366 Test PIN BAT_IN TXD RXD RST_N EAN P2_4 P2_0 SW_BTN TP3 TP-2 TP9 TP-2 TP6 TP-2TP5 TP-2 TP7 TP-2 TP4 TP-2 TP10 TP-2TP8 TP-2 TP2 TP-2 External I2C Device LDO33_O P1_2 P3_6 P1_3 1u/10V 10K/1% CN1 CONN1X5 10K/1%

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3.0 OPERATING MODES

The BM78 module allows the user to operate the module in two distinct modes:

• Auto Pattern mode
• Manual Pattern mode The Auto Pattern mode and the Manual Pattern mode use different state machines. The BM78 module can be operated in either of these modes by setting the value in the EEPROM memory location. The BM78 module is in Auto Pattern mode by default. To modify the EEPROM values, the module must be placed in the “Write EEPROM and Test mode” through the pins P2_0, P2_4 and EAN. The UI tool provides an easy Windows Graphical User Interface (GUI) to set or modify the EEPROM settings on the BM78 module. Figure 3-1 illustrates the basic algorithm followed by the BM78 module during startup, in deciding which state machine to be used for operation. FIGURE 3-1: OPERATING MODE CONFIGURATION Note: The UI tool is available for download from the Microchip web site at:  www.microchip.com/BM78.

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3.1 Auto Pattern Mode

The Auto Pattern mode is a state machine in which the Bluetooth-related operations are automated. It is primarily used to connect the module to a peer device and create a data pipe with the peer device through the Transparent UART mode, thus providing a “cable replacement” solution. Also, the BM78 module allows the user to enter some configuration commands in the Auto Pattern mode. For more details on the list of configuration commands that can be used in Auto Pattern mode, refer to the IS1678 UART Command Set User Guide. Figure 3-2 illustrates the basic state machine in the Auto Pattern mode. FIGURE 3-2: AUTO PATTERN MODE To evaluate and test the BM78 module in Auto Pattern mode, download and install the Auto Pattern tool (Windows-based GUI emulation tool), which is available on the Microchip website. This tool implements the communication protocol for Auto Pattern mode. It also provides a fast and easy way to test the functions and options available in the Auto Pattern mode. Note: The Auto Pattern tool and IS1678 UART Command Set User Guide ar e av ai lab le for download from the  Microchip website at:  www.microchip.com/BM78.

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3.2 Manual Pattern

The Manual Pattern mode provides full control of the BM78 module to the user and the module operates only based on the commands from the user or host MCU. Figure 3-3 illustrates the state machine followed by the BM78 module in the Manual Pattern mode. FIGURE 3-3: STATE CHANGES BY MCU IN MANUAL PATTERN The Manual Pattern mode also allows the Transparent UART mode. There is a small difference in the proto - cols followed in the Manual Pattern mode and the Auto Pattern mode. For more details on the protocol differ - ences, refer to the IS1678 UART Command Set User Guide. To evaluate and test the BM78 module in Manual Pat- tern mode, download and install the Manual Pattern tool (Windows-based GUI emulation tool), which is available from the Microchip website. This tool imple - ments the communication protocol for Manual Pattern mode. It also provides a fast and easy way to test the functions and options available in the Manual Pattern mode. Note: The Manual Pattern tool and IS1678 UART Command Set User Guide a r e available for download from the Microchip website at:  www.microchip.com/BM78.

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4.0 ELECTRICAL CHARACTERISTICS

This section provides an overview of the electrical characteris tics of the BM78 module. Additional information will be provided in future revisions of this document as it becomes available. extended periods may affect device reliability. Functional operation of the device at these or any other conditions, above the parameters indicated in the operation listings of this specification, is not implied. Absolute Maximum Ratings Note: Stresses listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only. The functional operation of the device at those or any other conditions and those indicated in the operation listings of this specification, is n ot implied. Exposure to maximum rating condi - tions for extended periods may affect device reliability.

DS60001380B-Page 30  2016-2019 Microchip Technology Inc. Table 4-1 through Table 4-7 provide the recommended operating conditions and the electrical specifications of the BM78 module. Note 1:HTOL life test condition: +125ºC, BAT_IN = 4.2V, LDO33_O = 3.3V, LDO18_O = 1.9V. Note 1:With 10 μF capacitor at LDO33_O as the condition for IP verification. 2: Output voltage can be calibrated using the MP tool. Note 1:With 1 μF capacitor at PMULDO_O as the condition for IP verification. 2: Output voltage can be calibrated by using the MP tool. TABLE 4-1: RECOMMENDED OPERATING CONDITIONS Rating Min. Typical Max. Ambient Operating temperature range -20ºC +25ºC +70ºC Relative Humidity (Operating) 10% — 90% Relative Humidity (Storage) 10% — 90% ESD HBM — ±2KV — MM — ±200V — HTOL (Note 1) — 1000 hrs — Supply voltage: BAT_IN 3.3V — 4.2V Supply voltage: 1V8, VCC_RF, VDD_XO, AVDD_SAR 1.8V 1.9V 2.1V SW_BTN 3.3V — 4.2V LED1 — — 3.6V Reset VTHRES threshold voltage — 1.6V — VIL input logic levels low -0.3V — 0.8V VIH input logic levels high 2.0V — 3.6V VOL output logic levels low (IOL = 12 mA) — — 0.4V VOH output logic levels high (IOH = 12 mA) 2.4V — — RF continuous Tx mode — — 43 mA RF continuous Rx mode — — 37 mA TABLE 4-2: 3.3V LDO ELECTRICAL PARAMETERS Parameter Min. Typical Max. Unit Operating Temperature -20 — +70 ºC Output Current (VIN = 3.6V/load regulation with 100mV drop) — 100 — mA Quiescent Current (VIN = 3.6V) — 150 — μA TABLE 4-3: PMU LDO Parameter Min. Typical Max. Unit Operating Temperature -20 — +70 ºC Output Current (VIN = 3.6V/load regulation with 0.3mV drop) — 100 — μA Quiescent Current (VIN = 3.6V) — 120 — μA

 2016-2019 Microchip Technology Inc. DS60001380B-Page 31 BM78 Note 1:SAR_BAT is connected with BAT_IN internally for battery voltage detection. TABLE 4-5: INTENSITY CONTROLLABLE LED DRIVER Note 1:Classic BR/EDR and RX_IND functions are enabled. 2: The data corresponds to BM78SPPx5NC2 (ROM variant). TABLE 4-4: SAR-ADC AND BATTERY VOLTAGE DETECTOR Parameter Min. Typical Max. Unit Operating Temperature -20 — +70 ºC AVDD_SAR power supply — 1.8 — V SAR_BAT detection (Note 1) 3.3 — 4.2 V Resolution — 10 — bit Operating Current (including bandgap) — — 1 mA Deep-sleep Current — — 1 μA Parameter Min. Typical Max. Unit Operating Temperature -20 — +70 ºC Open-drain Voltage — — 3.6 V Current Step — 0.3 — mA Programmable Current Range 0 — 5 mA Intensity Control — 16 — step Power Down Open-drain current — — 1 μA Deep-sleep Current — — 1 μA TABLE 4-6: POWER CO NSUMPTION-CLASSIC Test Condition Current Consumption (avg.) (mA) Remarks Standby mode 2.543 — Deep-Sleep mode 0.187 — Connected+Sniff, Master (no data) 0.541 No data was transmitted Sniff interval = 500 ms Connected+Sniff, Slave (no data) 0.551 No data was transmitted Sniff interval = 500 ms Data, Master 10.67 Data transmitted at 115200 bps; block size = 500 Data, Slave 14.87 Data transmitted at 115200 bps; block size = 500

DS60001380B-Page 32  2016-2019 Microchip Technology Inc. Note 1:Low energy, RX_IND function is enabled. 2: Data corresponds to the BM78SPPx5NC2 (ROM variant). TABLE 4-7: POWER CONS UMPTION-LOW ENERGY Test Condition Current Consumption (avg.) (mA) Remarks Deep-Sleep mode 0.13 — LE fast advertising 1.21 LE fast advertising interval = 100 ms

0.88 LE fast advertising interval = 160 ms

0.48 LE fast advertising interval = 500 ms

1.72 LE fast advertising interval = 100 ms+

0.62 LE fast advertising interval = 500 ms+

Reduced power advertising 0.39 LE Reduced Power advertising interval = 961 ms

1.00 LE Reduced Power advertising

interval = 961 ms+Beacon 100 ms

0.51 LE Reduced Power advertising

interval = 961 ms+Beacon 500 ms Connected (No data) 0.39 Connection interval = 1500 ms

0.43 Connection interval = 600 ms

Connected (iPhone 6 to module) 0.45 Connection interval = 500 ms

0.60 Connection interval = 200 ms

Connected (module to iPhone 6) 6.6 Connection interval = 500 ms

7.0 Connection interval = 200 ms

 2016-2019 Microchip Technology Inc. DS60001380B-Page 33 BM78

5.0 RADIO CHARACTERISTICS

Table 5-1 provides the transmitter performance characteristics of the BM78 module. TABLE 5-1: TRANSMITTER PERFORMANCE Table 5-2 provides the receiver performance character- istics of the BM78 module. TABLE 5-2: RECEIVER PERFORMANCE Basic Data Rate Min. Typical Max. Bluetooth Specification Unit BDR power — 1.5 — -6 ~ +4 dBmEDR (2M/3M) power — -1 — -6 ~ +4 LE power — 0.5 — -20 ~ +10 Note 1:The RF Transmit power can be calibrated during production by us ing the MP tool and the MT8852 Blue - tooth test equipment. 2: Test condition: VCC RF = 1.80V, temperature = +25ºC. Basic Data Rate Min. Typical Max. Bluetooth Specification Unit BDR Sensitivity — -90 — ≤-70 dBmEDR 2M Sensitivity — -90 — EDR 3M Sensitivity — -82 — LE Sensitivity — -92 — Note: Test condition: VCC RF = 1.80V, temperature = +25ºC.

DS60001380B-Page 34  2016-2019 Microchip Technology Inc. NOTES:

 2016-2019 Microchip Technology Inc. DS60001380B-Page 35 BM78

6.0 PHYSICAL DIMENSIONS

Figure 6-1 illustrates the physical dimensions of the BM78SPPS5MC2/NC2 module. FIGURE 6-1: BM78SPPS5MC2/NC2 MODULE DIMENSIONS

 2016-2019 Microchip Technology Inc. DS60001380B-Page 41 BM78

7.0 REFLOW PROFILE MODULE

The BM78 module is assembled using a standard lead-free reflow profile, IPC/JEDEC J-STD-020. The BM78 module can be soldered to the host PCB by using the standard leaded and lead-free solder reflow profiles. To avoid damage to the module, follow these recom - mendations:

• Refer to AN233 Solder Reflow Recommendation application note (DS00233) for the soldering reflow recommendations
• The peak temperature should not exceed (TP) of +250ºC
• Use no-clean flux solder paste
• Do not wash the module as moisture can be trapped under the shield
• Use only one flow. If the PCB requires multiple flows, apply the module on the final flow
• Standard: IPC/JEDEC J-STD-020: - Condition: Preheat:+150ºC to +200ºC for  60 to 120 seconds - Average ramp-up rate (+217ºC to peak):  +3ºC/sec max - Temperature maintained above +217ºC:  60 to 150 seconds - Time within +5ºC of peak temperature:  30 to 40 seconds - Peak temperature: +260ºC with +5/0ºC toler- ance - Ramp-down rate (peak to +217ºC):  +6ºC/sec max - Time within +25ºC to peak temperature:  8 minutes max - Cycle interval 5 minutes Figure 7-1 illustrates the reflow profile of the  BM78 module. FIGURE 7-1: REFLOW PROFILE

DS60001380B-Page 42  2016-2019 Microchip Technology Inc. NOTES:

 2016-2019 Microchip Technology Inc. DS60001380B-Page 43 BM78

8.0 MODULE PLACEMENT GUIDELINES

For a Bluetooth wireless product, the antenna place - ment affects the performance of the whole system. The antenna requires free space to radiate the RF signal and it cannot be surrounded by the ground plane. Microchip recommends that the areas underneath the antenna on the host PCB do not contain copper on the top, inner, or bottom layer. Figure 8-1 illustrates an example of good and poor module placement on a host PCB with the ground plane. The ground plane can be extended beyond the mini - mum recommendation as required for the main PCB EMC noise reduction. For the best range performance, keep all external metal at least 15 mm away from the ceramic chip antenna. FIGURE 8-1: MODULE PLACEMENT EXAMPLES TABLE 8-1: RECOMMENDED ANTENNA Description Manufacturer Part Number Manufacturer ANT ANT3216A063R2400A PIFA 2.4GHZ L3.2W1.6 ANT3216A063R2400A YAGEO

 2016-2019 Microchip Technology Inc. DS60001380B-Page 45 BM78

8.1 BM78SPPS5MC2/NC2 Ceramic Chip Antenna

The BM78SPPS5MC2/NC2 contains an integral ceramic chip antenna. Figure 8-3 illustrates the antenna radiation pattern of the ceramic chip antenna on the BM78SPPS5MC2/NC2. FIGURE 8-3: BM78SPPS5MC2/NC2 ANTENNA RADIATION PATTERN TABLE 8-2: ANTENNA RADIATION PATTERN DETAILS Parameter Values Frequency 2450 MHz Peak Gain 1.63 dBi Efficiency 71.55%

DS60001380B-Page 46  2016-2019 Microchip Technology Inc. NOTES:

 2016-2019 Microchip Technology Inc. DS60001380B-Page 47 BM78

9.0 ORDERING INFORMATION

Table 9-1 provides the various SKUs of the BM78 module. TABLE 9-1: BM78 MODULE SKUs Note: The BM78 module can be purchased through a Microchip representative. Contact Microchip sales office for information on Bluetooth v5.0 ROM variants of the BM78 module. Visit www.microchip.com for current pricing and a list of distributors for the product. Device Microchip IC Antenna Description Shield Regulatory Certification Ordering Number BM78SPPS5MC2 IS1678SM-151 On-board Bluetooth Dual mode, Class 2, Flash variant Yes FCC, ISED, CE, MIC, KCC, NCC, SRRC BM78SPPS5MC2-0002AA BM78SPP05MC2 IS1678SM-151 External Bluetooth Dual mode, Class 2, Flash variant No No BM78SPP05MC2-0002AA BM78SPPS5NC2 IS1678S-152 On-board Bluetooth Dual mode, Class 2, ROM variant Yes FCC, ISED, CE, MIC, KCC, NCC, SRRC BM78SPPS5NC2-0002AA BM78SPP05NC2 IS1678S-152 External Bluetooth Dual mode, Class 2, ROM variant No No BM78SPP05NC2-0002AA BM78SPPS5MC2 IS1678SM-152 On-board Bluetooth Dual mode, Class 2, Flash vari- ant. Firmware Rev 1.35 Yes FCC, ISED, CE, MIC, KCC, NCC, SRRC BM78SPPS5MC2-0004AA BM78SPP05MC2 IS1678SM-152 External Bluetooth Dual mode, Class 2, Flash vari- ant. Firmware Rev 1.35 No No BM78SPP05MC2-0004AA

DS60001380B-Page 48  2016-2019 Microchip Technology Inc. NOTES:

 2016-2019 Microchip Technology Inc. DS60001380B-Page 49 BM78 APPENDIX A: CERTIFICATION NOTICES The BM78 module (BM78SPPS5MC2) has received regulatory approval for the following countries:

• Bluetooth SIG/QDID: 110108
• United States/FCC ID: A8TBM78ABCDEFGH
• Canada: - IC: 12246A-BM78SPPS5M2 - HVIN: BM78SPPS5M2 - PMN: Bluetooth Module
• Europe/CE
• Japan/MIC: 202-SMD070
• Korea/KCC: MSIP-CRM-mcp-BM78SPPS5MC2
• Taiwan/NCC No: CCAN15LP0510T4
• China/SRRC: CMIIT ID: 2015DJ7133 The BM78 ROM module (BM78SPPS5NC2) will cover regulatory approval for the following countries:
• Bluetooth SIG/QDID: 110108
• United States/FCC ID: A8TBM78ABCDEFGH
• Canada: - IC: 12246A-BM78SPPS5M2 - HVIN: BM78SPPS5M2 - PMN: BM78SPPS5NC2
• Europe/CE
• Japan/MIC: 202-SMD070
• Korea/KCC: MSIP-CRM-mcp-BM78SPPS5MC2
• Taiwan/NCC No: CCAN18LP0800T1
• China/SRRC: CMIIT ID: 2018DJ3812 A.1 REGULATORY APPROVAL This section outlines the regulatory information for the BM78 module for the following countries:
• United States
• Canada
• Europe
• Japan
• K o r e a
• T a i w a n
• China
• Other Regulatory Jurisdictions A.1.1 UNITED STATES The BM78/BM78 ROM module has received Federal Communications Commission (FCC) CFR47 Telecom munications, Part 15 Subpart C “Intentional Radiators” single-modular approval in accordance with Part 15.212 Modular Transmitter approval. Single-modular transmitter approval is defined as a complete RF trans- mission sub-assembly, designed to be incorporated into another device, that must demonstrate compliance with FCC rules and policies independent of any host. A transmitter with a modular grant can be installed in dif- ferent end-use products (referred to as a host, host product, or host device) by the grantee or other equip- ment manufacturer, then the host product may not require additional testing or equipment authorization for the transmitter function provided by that specific module or limited module device. The user must comply with all of the instructions pro - vided by the Grantee, which indicate installation and/or operating conditions necessary for compliance. The host product itself is required to comply with all applicable FCC equipment authorizations regulations, requirements and equipment functions that are not associated with the transmitter module portion. For example, compliance must be demonstrated to regula- tions for other transmitter components within a host product; to requirements for unintentional radiators (Part 15 Subpart B), such as digital devices, computer peripherals, radio receivers, etc.; and to additional authorization requirements for the non-transmitter functions on the transmitter module (i.e., Verification, or Declaration of Conformity) (e.g., Bluetooth and Wi-Fi transmitter modules may also contain digital logic func- tions). A.1.2 LABELING AND USER INFORMATION REQUIREMENTS The BM78/BM78 ROM module has been labeled with its own FCC ID number, and if the FCC ID is not visible when the module is installed inside another device, then the outside of the finished product into which the module is installed must also display a label referring to the enclosed module. This exterior label can use word- ing as follows: Contains Transmitter Module  FCC ID: A8TBM78ABCDEFGH or Contains FCC ID:A8TBM78ABCDEFGH This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

DS60001380B-Page 50  2016-2019 Microchip Technology Inc. A user's manual for the product must include the follow- ing statement: Additional information on labeling and user information requirements for Part 15 devices can be found in KDB Publication 784748 available at the FCC Office of Engi- neering and Technology (OET) Laboratory Division Knowledge Database (KDB) http://apps.fcc.gov/oetcf/kdb/index.cfm. A.1.3 RF EXPOSURE All transmitters regulated by FCC must comply with RF exposure requirements. KDB 447498 General RF Exposure Guidance provides guidance in determining whether proposed or existing transmitting facilities, operations or devices comply with limits for human exposure to Radio Frequency (RF) fields adopted by the Federal Communications Commission (FCC). From the FCC Grant: Output power listed is conducted. This grant is valid only when the module is sold to OEM integrators and must be installed by the OEM or OEM integrators. This transmitter is restricted for use with the specific antenna(s) tested in this application for Certification and must not be co-located or operating in conjunction with any other antenna or transmitters within a host device, except in accordance with FCC multi-transmitter product procedures. A.1.4 HELPFUL WEB SITES Federal Communications Commission (FCC): http://www.fcc.gov FCC Office of Engineering and Technology (OET) Lab- oratory Division Knowledge Database (KDB): http://apps.fcc.gov/oetcf/kdb/index.cfm A.2 Canada The BM78/BM78 ROM module has been certified for use in Canada under Innovation, Science and Eco - nomic Development Canada (ISED, formerly Industry Canada) Radio Standards Procedure (RSP) RSP-100, Radio Standards Specification (RSS) RSS-Gen and RSS-247. Modular approval permits the installation of a module in a host device without the need to recertify the device. A.2.1 LABELING AND USER INFORMATION REQUIREMENTS Labeling Requirements (from RSP-100, Issue 11,  Section 3): The host product shall be properly labeled to identify the module within the host device. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product, otherwise the host device must be labeled to display the Innovation, Science and Economic Development Canada certification number of the module, preceded by the word “Contains”, or similar wording expressing the same meaning, as follows: User Manual Notice for License-Exempt Radio Appara- tus (from Section 8.4 RSS-Gen, Issue 4, November 2014): User manuals for license-exempt radio appara- tus shall contain the following or equivalent notice in a conspicuous location in the user manual or alterna - tively on the device or both: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equip - ment generates, uses and can radiate radio fre - quency energy, and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the follow ing measures:

• Reorient or relocate the receiving antenna
• Increase the separation between the equipment and receiver
• Connect the equipment into an outlet on a circuit different from that to which the receiver is con- nected
• Consult the dealer or an experienced radio/TV technician for help Contains IC: 12246A-BM78SPPS5M2 This device complies with Industry Canada’s license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) This device may not cause interference, and (2) This device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouil- lage est susceptible d'en compromettre le fonctionnement.

 2016-2019 Microchip Technology Inc. DS60001380B-Page 51 BM78 Guidelines on Transmitter Antenna for License Exempt Radio Apparatus: A.2.2 RF EXPOSURE All transmitters regulated by the Innovation, Science and Economic Development Canada (ISED) must comply with RF exposure requirements listed in RSS-102 - Radio Frequency (RF) Exposure Compli - ance of Radio communication Apparatus (All Fre - quency Bands). This transmitter is restricted for use with a specific antenna tested in this application for certification, and must not be co-located or operating in conjunction with any other antenna or transmitters, except in accor - dance with Innovation, Science and Economic Devel - opment Canada multi-transmitter guidelines. The device operates at an output power level which is within the ISED SAR test exemption limits at any user distance. A.2.3 HELPFUL WEB SITES Innovation, Science and Economic Development Can- ada (ISED): http://www.ic.gc.ca/ A.3 Europe The BM78/BM78 ROM module is an Radio Equipment Directive (RED) assessed radio module that is CE marked and has been manufactured and tested with the intention of being integrated into a final product. The BM78/BM78 ROM module has been tested to RED 2014/53/EU Essential Requirements for Health and Safety (Article (3.1(a)), Electromagnetic Compatibility (EMC) (Article 3.1(b)), and Radio (Article 3.2) and are summarized in Table A-1. The ETSI provides guidance on modular devices in “Guide to the application of harmonised standards cov- ering Article 3.1(b) and Article 3.2 of the Directive 2014/53/EU RED to multi-radio and combined radio and non-radio equipment ” document available at: http://www.etsi.org/deliver/etsi_eg/203300_203399/20 3367/01.01.01_60/eg_203367v010101p.pdf Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain must be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for suc - cessful communication. Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonction - ner avec une antenne d'un type et d'un gain max- imal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les ris - ques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établisse - ment d'une communication satisfaisante. Note: To maintain conformance to the testing listed in Table A-1, the module shall be installed in accordance with the installa - tion instructions in this data sheet and shall not be modified.  When integrating a radio module into a completed product the integrator becomes the manufacturer of the final product and is therefore responsible for demonstrating compliance of the final product with the essential requirements against the RED.

DS60001380B-Page 52  2016-2019 Microchip Technology Inc. A.3.1 LABELING AND USER INFORMATION REQUIREMENTS The label on the final product which contains the BM78/BM78 ROM module must follow CE marking requirements. A.3.2 CONFORMITY ASSESSMENT From ETSI Guidance Note EG 203367, section 6.1 Non-radio products are combined with a radio product: If the manufacturer of the combined equipment installs the radio product in a host non-radio product in equiva- lent assessment conditions (i.e. host equivalent to the one used for the assessment of the radio product) and according to the installation instructions for the radio product, then no additional assessment of the com - bined equipment against article 3.2 of the RED is required. The European Compliance Testing listed in Table A-1 was performed using the Integral Ceramic Chip antenna. A.3.2.1 Simplified EU Declaration of Conformity Hereby, Microchip Technology Inc. declares that the radio equipment type BM78/BM78 ROM is in compli - ance with Directive 2014/53/EU. The full text of the EU declaration of conformity, for this product, is available at: http://www.microchip.com/design-centers/wirless-con- nectivity A.3.3 HELPFUL WEBSITES A document that can be used as a starting point in understanding the use of Short Range Devices (SRD) in Europe is the European Radio Communications Committee (ERC) Recommendation 70-03 E, which can be downloaded from the European Communica - tions Committee (ECC) at: http://www.ecodocdb.dk/ Additional helpful web sites are:

• Radio Equipment Directive (RED): https://ec.europa.eu/growth/single-market/euro- pean-standards/harmonised-standards/red_en
• European Conference of Postal and Telecommu- nications Administrations (CEPT): http://www.cept.org
• European Telecommunications Standards Insti- tute (ETSI): http://www.etsi.org
• The Radio Equipment Directive (RED): http://www.redca.eu/ A.4 Japan The BM78/BM78 ROM module has received type cer- tification and is labeled with its own technical confor - mity mark and certification number as required to conform to the technical standards regulated by the Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the Radio Act of Japan. Integration of this module into a final product does not require additional radio certification provided installa - tion instructions are followed and no modifications of the module are allowed. Additional testing may be required:
• If the host product is subject to electrical appli- TABLE A-1: EUROPEAN COMPLIANCE TESTING Certification Standards Article Laboratory Report Number Date Safety EN 60950-1:2006+A11:2009 +A1:2010 +A12:2011+A2:2013 [3.1(a)] TUV Rheinland 10052799 001 2015-10-30 Health EN 300 328 V1.9.1 EN 62479:2010 10052796 001 10052797 001 2015-12-21 EMC EN 301 489-1 V1.9.2 [3.1(b)] 10052437 001 2015-09-14 EN 301 489-17 V2.2.1 EN 301 489-1 V2.1.1 10052437 002 2017-05-26 EN 301 489-1 V2.2.0 EN 301 489-17 V3.1.1 EN 301 489-17 V3.2.0 Radio EN 300 328 V1.9.1 (3.2) 10052796 001 10052797 001 2015-12-21 EN 300 328 V2.1.1 10052796 002 10052797 002 2017-05-26

 2016-2019 Microchip Technology Inc. DS60001380B-Page 53 BM78 ance safety (for example, powered from an AC mains), the host product may require Product Safety Electrical Appliance and Material (PSE) testing. The integrator must contact their confor- mance laboratory to determine if this testing is required

• There is an voluntary Electromagnetic Compatibil- ity (EMC) test for the host product administered by VCCI: http://www.vcci.jp/vcci_e/index.html A.4.1 LABELING AND USER INFORMATION REQUIREMENTS The label on the final product which contains the BM78 module must follow Japan marking requirements. The integrator of the module must refer to the labeling requirements for Japan available at the Ministry of Internal Affairs and Communications (MIC) website. The BM78 module is labeled with its own technical con- formity mark and certification number. The final product in which this module is being used must have a label referring to the type certified module inside:A.4.2 HELPFUL WEB SITES Ministry of Internal Affairs and Communications (MIC): Association of Radio Industries and Businesses (ARIB): http://www.arib.or.jp/english/ A.5 Korea The BM78/BM78 ROM module has received certifica - tion of conformity in accordance with the Radio Waves Act. Integration of this module into a final product does not require additional radio certification provided instal- lation instructions are followed and no modifications of the module are allowed. A.5.1 LABELING AND USER INFORMATION REQUIREMENTS The label on the final product which contains the BM78/BM78 ROM module must follow KC marking requirements. The integrator of the module must refer to the labeling requirements for Korea available on the Korea Communications Commission (KCC) website. The BM78 module is labeled with its own KC mark. The final product requires the KC mark and certificate num- ber of the module: A.5.2 HELPFUL WEB SITES Korea Communications Commission (KCC): http://www.kcc.go.kr National Radio Research Agency (RRA): http://rra.go.kr A.6 Taiwan The BM78/BM78 ROM module has received compli - ance approval in accordance with the Telecommunica- tions Act. Customers seeking to use the compliance approval in their product must contact Microchip Tech- nology Inc. sales or distribution partners to obtain a Let- ter of Authority. Integration of this module into a final product does not require additional radio certification provided installa - tion instructions are followed and no modifications of the module are allowed. A.6.1 LABELING AND USER INFORMATION REQUIREMENTS For the BM78 module, due to limited module size, the NCC mark and ID are displayed in the data sheet and/or packaging and cannot be displayed on the mod- ule label: For the BM78 ROM module, due to limited module size, the NCC mark and ID are displayed in the data sheet and/or packaging and cannot be displayed on the mod- ule label: The user's manual must contain below warning (for RF device) in traditional Chinese: 注意 ! 依據 低功率電波輻射性電機管理辦法 202-SMD070 MSIP-CRM-mcp-BM78SPPS5MC2 CCAN15LP0510T4 CCAN18LP0800T1

DS60001380B-Page 54  2016-2019 Microchip Technology Inc. 第十二條 經型式認證合格之低功率射頻電機，非經許 公司、商號或使用者均不得擅自變更頻率、加大功率或 變更原設計 之特性及功能。 第十四條 低功率射頻電機之使用不得影響飛航安全及 干擾合法通信； 經發現有干擾現象時，應立即停用，並改善至無干擾時 方得繼續使用。 前項合法通信，指依電信規定作業之無線電信。 低功率射頻電機須忍受合法通信或工業、科學及醫療用 電波輻射性 電機設備之干擾。 A.6.2 HELPFUL WEB SITES National Communications Commission (NCC): http://www.ncc.gov.tw A.7 China The BM78/BM78 ROM module has received certifica - tion of conformity in accordance with the China MIIT Notice 2014-01 of State Radio Regulation Committee (SRRC) certification scheme. Integration of this module into a final product does not require additional radio certification, provided installation instructions are fol - lowed and no modifications of the module are allowed. A.7.1 LABELING AND USER INFORMATION REQUIREMENTS The BM78 module is labeled with its own CMIIT ID as follows: When Host system is using an approved Full Modular Approval (FMA) radio: The host must bear a label con- taining the statement “This device contains SRRC approved Radio module CMIIT ID: 2015DJ7133”. The BM78 ROM module is labeled with its own CMIIT ID as follows: When Host system is using an approved Full Modular Approval (FMA) radio: The host must bear a label con- taining the statement “This device contains SRRC approved Radio module CMIIT ID: 2018DJ3812”. A.8 Other Regulatory Information

• For information on the other countries jurisdictions covered, refer to the http://www.micro- chip.com/design-centers/wireless-connectivity.
• Should other regulatory jurisdiction certification be required by the customer, or the customer need to recertify the module for other reasons, contact Microchip for the required utilities and documenta- tion. CMIIT ID: 2015DJ7133 CMIIT ID: 2018DJ3812

 2016-2019 Microchip Technology Inc. DS60001380B-Page 55 BM78 APPENDIX B: REVISION HISTORY Revision A (January 2016) This is the initial released version of this document. Revision B (April 2019) This revision includes the following changes and minor updates to text and formatting, which were incorpo - rated throughout the document. TABLE B-1: MAJOR SECTION UPDATES Section Update Description Document Updated Bluetooth version from 4.2 to 5.0. “Features” • Updated certification information.

• Updated Figure 1. “Data Throughput” Updated Kbytes/s. 1.0 “System Overview” Updated Table 1-1, Figure 1-1 and Figure 1-3. 2.0 “Application Information” Added Table 2-3. Updated Table 2-2, Figure 2-1 and Figure 2-8. 3.0 “Operating Modes” Updated this section. 4.0 “Electrical Characteristics” Updated Storage temperature. 6.0 “Physical Dimensions” Updated Figure 6-1, Figure 6-2, Figure 6-4 and Figure 6-5. 8.0 “Module Placement Guidelines” Updated Figure 8-1. 9.0 “Ordering Information” Updated Table 9-1 with certification information and added two part numbers. Appendix A: “Certification Notices” Updated this section.

DS60001380B-Page 56  2016-2019 Microchip Technology Inc. NOTES:

 2015-2019 Microchip Technology Inc. DS60001380B-page 57 BM78 THE MICROCHIP WEBSITE Microchip provides online support via our WWW site at www.microchip.com. This website is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the website contains the following information:

• Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip website at www.microchip.com . Under “Support”, click on “Customer Change Notification” and follow the registration instructions. CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support Customers should contact their distributor, representative or Field Application Engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the website at: http://microchip.com/support

DS60001380B-page 58  2015-2019 Microchip Technology Inc. NOTES:

 2019 Microchip Technology Inc. DS60001380B-page 59 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR I M P L I E D , W R I T T E N O R O R A L , S T A T U T O R Y O R OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY , PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE . Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2018, Microchip Technology Incorporated, All Rights Reserved. ISBN: 978-1-5224-4418-3 Note the following details of the code protection feature on Mi crochip devices:

• Microchip products meet the specification contained in their p articular Microchip Data Sheet.
• Microchip believes that its family of products is one of the m ost secure families of its kind on the market today, when used in the intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breac h the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerne d about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are com mitted to continuously improving the code protection features o f our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT S YSTEM CERTIFIED BY DNV == ISO/TS 16949 ==

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