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Technical content
Features
- Qualified for Bluetooth v4.2 specifications
- Supports HFP 1.6, HSP 1.2, A2DP 1.3, SPP 1.2, AVRCP 1.6
- Supports Bluetooth 4.2 dual-mode (BR/EDR/BLE) specifications (FW dependent)
- Stand-alone module with on-board PCB antenna and Bluetooth stack
- Supports high resolution up to 24-bit, 96 kHz audio data format
- Supports to connect two hosts with HFP/A2DP profiles simultaneously
- Supports to connect one host with SPP/BTLE
- Transparent UART mode for seamless serial data over UART interface
- Easy to configure with Windows ® GUI or directly by external MCU
- Supports firmware field upgrade
- Supports one microphone
- Castellated surface mount pads for easy and reli- able host PCB mounting
- RoHS compliant
- Ideal for portable battery operated devices
- Internal battery regulator circuitry DSP Audio Processing
- Supports 64 kbps A-Law, -Law PCM format/ Continuous Variable Slope Delta (CVSD) Modula- tion for SCO channel operation
- Supports 8/16 kHz noise suppression
- Supports 8/16 kHz echo cancellation
- Supports Modified Sub-Band Coding (MSBC) decoder for wide band speech
- Built-in High Definition Clean Audio (HCA) algo- rithms for both narrow band and wide band speech processing
- Packet loss concealment (PLC)
- Built-in audio effect algorithms to enhance audio streaming
- Supports Serial Copy Management System (SCMS-T) content protection FIGURE 1: BM63 MODULE Audio Codec
- SBC and optional AAC decoding
- 20-bit DAC with 98 dB SNR
- 16-bit ADC with 92 dB SNR
- Up to 24-bit, 96 kHz, I 2S digital audio Peripherals
- Built-in lithium-ion and lithium-polymer battery charger (up to 350 mA)
- Integrated 1.8V and 3V configurable switching regulator and low-dropout (LDO)
- Built-in ADC for battery voltage sense
- An AUX-In port for external audio input
- Three LED drivers
- Multiple I/O pins for control and status Bluetooth® 4.2 Stereo Audio Module
DS60001431A-Page 2 Advance Information 2016 Microchip Technology Inc. RF/Analog
- Frequency spectrum: 2.402 GHz to 2.480 GHz
- Receive sensitivity: -90 dBm (2 Mbps EDR)
- Class 2 output power (+2 dBm typical) HCI Interface
- High-speed HCI-UART interface (supports up to 921,600 bps) MAC/Baseband Processor
- Supports Bluetooth 4.2 dual-mode (FW dependent) - BR/EDR transport for audio, voice and SPP data exchange - BLE transport for proprietary transparent service and ANCS data exchange Operating Condition
- Operating voltage: 3.2V to 4.2V
- Operating temperature: -20°C to +70°C Compliance
- Bluetooth SIG QDID: 83345
Applications
- Soundbar and Subwoofer (FW dependent)
- Bluetooth portable speaker phone
- Multi-speaker (FW dependent)
Description
The BM63 module is a fully qualified Bluetooth v4.2 dual-mode (BDR/EDR/BLE) module for designers to add wireless audio and voice applications to their products. The BM63 module is a Bluetooth Special Interest Group (SIG) certified module that provides a complete wireless solution with a Bluetooth stack and an integrated PCB antenna in a compact surface- mount package. The BM63 module has an integrated lithium-ion and lithium-polymer battery charger, and a digital audio interface. The module supports HSP , HFP , SPP , A2DP and AVRCP profiles, and AAC and SBC codecs.
2016 Microchip Technology Inc. Advance Information DS60001431A-Page 3 BM63 Table of Contents TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regar ding this publication, please contact the Marketing Communications Department via E-mail at docerrorsmicrochip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We wel- come your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page . The last character of the literature number is the versi on number, (e.g., DS30000000A is version A of document DS30000000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revisi on of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following:
- Microchip’s Worldwide Web site; http://www.microchip.com
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2016 Microchip Technology Inc. Advance Information DS60001431A-Page 5 BM63
1.0 DEVICE OVERVIEW
The BM63 module is built around Microchip Technol- ogy IS2063 SoC. The IS2063 SoC integrates the Blue- tooth 4.2 dual-mode radio transceiver, Power Management Unit (PMU), crystal and DSP . Users can configure the BM63 module by using the UI tool and DSP tool, a Windows-based utility. Figure 1-1 illustrates a typical example of the BM63 module which is connected to an external MCU and a DSP/codec. FIGURE 1-1: APPLICATIO N USING BM63 MODULE
DS60001431A-Page 8 Advance Information 2016 Microchip Technology Inc. Table 1-1 provides the key features of the BM63 module. TABLE 1-1: BM63 KEY FEATURES Feature BM63 Application Multi-speaker/Soundbar/Subwoofer Stereo/mono Stereo Pin count 48 Dimensions (mm2) 15 x 32 PCB antenna Yes Tx power (typical) 2 dBm Audio DAC output 2 Channel DAC (single-ended) SNR at 2.8V (dB) -98 DAC (capless) SNR at 2.8V (dB) -98 ADC SNR at 2.8V (dB) -92 I 2S digital interface Yes Analog AUX-In Yes Mono MIC 1 External audio amplifier interface Yes UART Yes LED driver 3 Internal DC-DC step-down regulator Yes DC 5V adapter input Yes Battery charger (350 mA max) Yes ADC for thermal charger protection No Undervoltage protection (UVP) No GPIO 15 Button support 6 NFC (triggered by external NFC) Yes EEPROM Yes Customized voice prompt No Multitone Yes DSP sound effect Yes BLE Yes Bluetooth profiles HFP 1.6 AVRCP 1.6 A2DP 1.3 HSP 1.2 SPP 1.2
DS60001431A-Page 10 Advance Information 2016 Microchip Technology Inc. Table 1-2 provides the pin description of the module. TABLE 1-2: BM63 PIN DESCRIPTION Pin No Pin Type Name Description 1I D R 0 I 2S interface: digital left/right data 2I / O R F S 0 I 2S interface: left/right clock 3I / O S C L K 0 I 2S interface: bit clock 4O D T 0 I 2S interface: digital left/right data
5 O AOHPR Headphone output, right channel
6 O AOHPM Headphone common mode output/sense input
7 O AOHPL Headphone output, left channel
8 I MIC_N1 MIC1 mono differential analog negative input
9 I MIC_P1 MIC1 mono differential analog positive input
10 P MIC_BIAS Electric microphone biasing voltage
11 I AIR Right-channel single-ended analog input
12 I AIL Left-channel single-ended analog input
13 I/O P1_2 EEPROM clock SCL
14 I/O P1_3 EEPROM data SDA
15 I RST_N System reset (active-low)
16 I/O P0_1 Configurable control or indication pin
(Internally pulled-up if configured as an input)
17 I/O P2_4 System configuration pin along with P2_0 and EAN
pins used to set the module in any one of these modes:
- Application mode (for normal operation)
- Test mode (to change EEPROM values)
- Write Flash mode (to enter the new firmware into the module), refer to Table 5-1
18 I/O P0_4 Configurable control or indication pin
(Internally pulled-up if configured as an input)
- NFC detection pin, active-low
- Out_Ind_1
19 I/O P1_5 Configurable control or indication pin
(Internally pulled-up if configured as an input)
- NFC detection pin
- Slide switch detector, active-high
- Out_Ind_1
- Multi-SPK Master/Slave mode control (FW dependent)
20 I HCI_RXD HCI-UART data input
21 O HCI_TXD HCI-UART data output
22 P CODEC_VO Power supply/reference voltage for codec. Do not connect, for internal use only 23 P VDD_IO I/O positive supply. Do not connect, for internal use only
24 P ADAP_IN 5V power adapter input
2016 Microchip Technology Inc. Advance Information DS60001431A-Page 11 BM63 25 P BAT_IN Battery input. Voltage range: 3.2V to 4.2V. When an external power supply is connected to the ADAP_IN pin, the BAT_IN pin can be left open if battery is not connected.
26 P ADC_IN Analog input
27 P SYS_PWR System power output
28 I MFB Multi-function button and power-on key
UART RX_IND, active-high
29 I LED3 LED driver 3
30 I LED2 LED driver 2
31 I LED1 LED driver 1
32 P GND Ground reference
33 I/O P3_7 Configurable control or indication pin
(Internally pulled-up, if configured as an input) UART TX_IND, active-low
34 I/O P3_5 Configurable control or indication pin
(Internally pulled-down, if configured as an input)
35 I/O P0_0 Configurable control or indication pin
(Internally pulled-up if configured as an input) Slide switch detector, active-high
36 I/O P0_3 Configurable control or indication pin
(Internally pulled-up if configured as an input)
37 I EAN External address bus negative
System configuration pin along with P2_0 and P2_4 pins used to set the module in any one of these modes:
- Application mode (for normal operation)
- Test mode (to change EEPROM values)
- Write Flash mode (to enter new firmware into the mod- ule), refer to Table 5-1
38 I/O DM Differential data-minus USB
39 I/O DP Differential data-plus USB
40 I/O P3_6 Configurable control or indication pin
(Internally pulled-up if configured as an input) Multi-SPK Master/Slave mode control (FW dependent)
41 I/O P3_3 Configurable control or indication pin
(Internally pulled-up if configured as an input) FWD key, active-low
42 I/O P3_1 Configurable control or indication pin
(Internally pulled-up if configured as an input) REV key, active-low
43 I/O P0_2 Configurable control or indication pin
(Internally pulled-up if configured as an input) Play/Pause key (default)
44 I/O P2_0 System configuration pin along with P2_4 and EAN pins used
to set the module in one of these modes:
- Application mode (for normal operation)
- Test mode (to change EEPROM values)
- Write Flash mode (to enter the new firmware into the module), refer to Table 5-1
- Pulse/PWM signal output TABLE 1-2: BM63 PIN DESCRIPTION (CONTINUED) Pin No Pin Type Name Description
DS60001431A-Page 12 Advance Information 2016 Microchip Technology Inc. Legend: I= Input pin O= Output pin I/O= Input/Output pin P= Power pin Note: All I/O pins can be configured using the UI tool.
45 I/O P2_7 Configurable control or indication pin
(Internally pulled-up if configured as an input) Volume-up key (default), active-low
46 I/O P3_0 Configurable control or indication pin
(Internally pulled-up if configured as an input) AUX-In detector, active-low
47 I/O P0_5 Configurable control or indication pin
(Internally pulled-up if configured as an input) Volume-down key (default), active-low
48 P GND Ground reference
TABLE 1-2: BM63 PIN DESCRIPTION (CONTINUED) Pin No Pin Type Name Description
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2.0 AUDIO
The input and output audios have different stages and each stage can be programmed to vary the character- istics of the gain response. For microphones, both sin- gle-ended inputs and differential inputs are supported. To maintain a high-quality signal, a stable bias voltage source to the condenser microphone’s FET is provided. The DC blocking capacitors can be used at positive and negative sides of the input. Internally, this analog signal is converted to 16-bit, 8/16 kHz linear PCM data.
2.1 Digital Signal Processor
Digital Signal Processor (DSP) is used to perform speech and audio processing. The advanced speech features, such as acoustic echo cancellation and noise reduction are in-built. To reduce nonlinear distortion and help echo cancellation, an outgoing signal level to the speaker is monitored and adjusted to avoid satura- tion of speaker output or microphone input. Adaptive fil- tering is also applied to track the echo path impulse in response to provide echo free and full-duplex user experience. The embedded noise reduction algorithm helps to extract clean speech signals from a noisy input captured by the microphones, and improves mutual understanding in communication. Advanced audio features, such as multi-band dynamic range control, parametric multi-band equalizer, audio widening and virtual bass are in-built. The audio effect algorithms improve the user’s audio listening experience in terms of better quality after audio signal processing. Figure 2-1 and Figure 2-2 illustrate the processing flow of speaker-phone applications for speech and audio signal processing. FIGURE 2-1: SPEECH SIGNAL PROCESSING FIGURE 2-2: AUDIO SIGNAL PROCESSING
DS60001431A-Page 14 Advance Information 2016 Microchip Technology Inc. Users can configure DSP parameters using the DSP tool. For additional information, refer to the “ IS206X
2.2 Codec
The built-in codec has a high signal-to-noise ratio (SNR) and it consist of an ADC, a DAC and an addi- tional analog circuitry. Figure 2-3 through Figure 2-6 illustrate the dynamic range and frequency response of the codec. FIGURE 2-3: CODEC DAC DYNAMIC RANGE FIGURE 2-4: CODEC DAC THD+N VERSUS INPUT POWER Note: The DSP tool and “IS206X DSP Applica- tion Note ” document, are available for download from the Microchip web site at: www.microchip.com/BM63. Note: The data corresponds to the 16 ohm load with 2.8V operating voltage at 25°C room temperature. Note: The data corresponds to the 16 ohm load with 2.8V operating voltage at 25°C room temperature.
DS60001431A-Page 16 Advance Information 2016 Microchip Technology Inc.
2.3 Auxiliary Port
The BM63 module supports analog (line-in) signals from the external audio source. The analog (line-in) sig- nal can be processed by the DSP to generate different sound effects (multi-band, dynamic range compression and audio widening), which can be set by using the DSP tool.
2.4 Analog Speaker Output
The BM63 module supports the following analog speaker output modes:
- Capless mode – Recommended for headphone applications in which capless output connection helps to save the BOM cost by avoiding a large DC blocking capacitor. Figure 2-7 illustrates the capless mode.
- Single-ended mode – Used for driving an external audio amplifier where a DC blocking capacitor is required. Figure 2-8 illustrates the single-ended mode. FIGURE 2-7: CAPLESS MODE FIGURE 2-8: SINGLE-ENDED MODE
2016 Microchip Technology Inc. Advance Information DS60001431A-Page 17 BM63
3.0 TRANSCEIVER
The BM63 module is designed and optimized for Blue- tooth 2.4 GHz system. It contains a complete radio fre- quency transmitter/receiver section. An internal synthesizer generates a stable clock for synchronizing with another device.
3.1 Transmitter
The internal power amplifier (PA) has a maximum out- put power of +4 dBm. This is applied for class 2 or class 3 radios without an external RF PA. The transmitter performs IQ conversion to minimize the frequency drift.
3.2 Receiver
The low-noise amplifier (LNA) operates with TR-com- bined mode for single port application. It can save a pin on package without having an external Tx/Rx switch. The ADC can sample the input analog signal and con- vert it into a digital signal for demodulator analysis. A channel filter has been integrated into receiver channel before the ADC, which is used to reduce the external component count and increase the anti-interference capability. The image rejection filter is used to reject the image fre- quency for low-IF architecture. This filter for low-IF architecture is intended to reduce external Band Pass Filter (BPF) component for super heterodyne architec- ture. The Received Signal Strength Indicator (RSSI) signal feedback to the processor is used to control the RF out- put power to make a good trade-off for effective dis- tance and current consumption.
3.3 Synthesizer
Synthesizer generates a clock for radio transceiver operation. There is a VCO inside, with a tunable inter- nal LC tank that can reduce variation for components. A crystal oscillator with internal digital trimming circuit provides a stable clock for synthesizer.
3.4 Modem
For Bluetooth 1.2 specification and below, 1 Mbps was the standard data rate based on Gaussian Frequency Shift Keying (GFSK) modulation scheme. This basic rate modem meets Basic Data Rate (BDR) require- ments of Bluetooth 2.0 with Enhanced Data Rate (EDR) specification. For Bluetooth 2.0 and above specifications, EDR has been introduced to provide data rates of 3/2/1 Mbps. For baseband, both BDR and EDR utilize the same 1 MHz symbol rate and 1.6 kHz slot rate. For BDR, symbol 1 represents 1-bit. However, each symbol in the payload part of EDR packets represents 2 or 3 bits. This is achieved by using two different modulations, π/4 DQPSK and 8 DPSK.
3.5 Adaptive Frequency Hopping
(AFH) The BM63 module has AFH function to avoid RF inter- ference. It has an algorithm to check the nearby inter- ference and to choose clear channel for transceiver Bluetooth signal.
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4.0 POWER MANAGEMENT UNIT
The on-chip Power Management Unit (PMU) has two main features: lithium-ion and lithium-polymer battery charger, and voltage regulation. A power switch is used to switch over the power source between the battery and adapter. Also, the PMU provides current to drive three LEDs.
4.1 Charging a Battery
The BM63 module has a built-in battery charger which is optimized for lithium-ion and lithium-polymer batter- ies.The charger includes a current sensor for charging control, user programmable current regulation and high-accuracy voltage regulation. The charging current parameters are configured by the UI tool. Reviving, pre-charging, constant current and constant voltage modes and re-charging functions are included. The maximum charging current is 350 mA. Figure 4-1 illustrates the charging curve of a battery. FIGURE 4-1: CHARGING CURVE
4.2 Voltage Monitoring
A 10-bit successive approximation register ADC (SAR ADC) provides a dedicated channel for battery voltage level detection. The warning level can be programmed by using the UI tool. The ADC provides a granular res- olution to enable the external MCU to take control over the charging process.
4.3 LED Driver
Three dedicated LED drivers control the LEDs. They provide enough sink current (16 step control and 0.35 mA for each step), thus LEDs can be connected directly with the BM63 module. The LED settings can be configured using the UI tool. Figure 4-2 illustrates the LED drivers in the BM63 module.
DS60001431A-Page 20 Advance Information 2016 Microchip Technology Inc. FIGURE 4-2: LED DRIVER
4.4 Under Voltage Protection
When the voltage of the SYS_PWR pin drops below the voltage level of 2.9V, the system will shutdown auto- matically.
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5.0 APPLICATION INFORMATION
5.1 Host MCU Interface
The BM63 module supports UART commands. The UART commands enable an external MCU to control the BM63 module. Figure 5-1 illustrates the UART interface between the BM63 module and an external MCU. FIGURE 5-1: HOST MCU INTERFACE OVER UART The MCU can control the BM63 module over the UART interface and wake-up the module using the MFB pin, the P3_7 pin can be used for this function. Refer to the “UART_CommandSet” document for a list of functions the BM63 module supports and how to use the UI tool to configure the UART and UART Command Set tool. Note: The UART Command set Tool (SPKCom- mandSetTool v160.xx) and “UART_Com- mandSet” document are available for download from the Microchip web site at: www.microchip.com/BM63
2016 Microchip Technology Inc. Advance Information DS60001431A-Page 25 BM63
5.2 I 2S Mode Application
The BM63 module provides an I2S digital audio output interface to connect with the external codec or DSP. It provides 8, 16, 44.1, 48, 88.2 and 96 kHz sampling rates for 16-bit and 24-bit data formats. The I 2S setting can be configured by using the UI and DSP tools. Figure 5-7 and Figure 5-8 illustrate the I2S signal con- nection between the BM63 module and an external DSP. Use the DSP tool to configure the BM63 module as a master/slave. For additional information on timing specifications, refer to 8.1 “Timing specifications”. FIGURE 5-7: BM63 MODULE IN I 2S MASTER MODE FIGURE 5-8: BM63 MODULE IN I 2S SLAVE MODE
5.3 Reset
The BM63 module provides a watchdog timer (WDT) to reset the chip. It has an integrated Power-on Reset (POR) circuit that resets all circuits to a known Power-on state. This action can be driven by an exter- nal reset signal which is used to control the device externally by forcing it into a POR state. The RST_N signal input is active-low and no connection is required in most of the applications.
5.4 External Configuration and
The BM63 module can be configured by using an exter- nal configuration tool (EEPROM tool) and firmware is programmed by using a programming tool (Flash tool). Note: The UI and DSP tools are available for download from the Microchip web site at: www.microchip.com/BM63. Note: The EEPROM and Flash tools are avail- able for download from the Microchip web site at: www.microchip.com/BM63.
2016 Microchip Technology Inc. Advance Information DS60001431A-Page 27 BM63
5.5 Reference Circuit
Figure 5-10 through Figure 5-13 illustrate the BM63 module reference circuit for a stereo headset application. FIGURE 5-10: BM63 REFERENCE CIRCUIT FOR STEREO HEADSET
DS60001431A-Page 28 Advance Information 2016 Microchip Technology Inc. FIGURE 5-11: BM63 REFERENCE CIRCUIT FOR STEREO HEADSET
2016 Microchip Technology Inc. Advance Information DS60001431A-Page 29 BM63 FIGURE 5-12: BM63 REFERENCE CIRCUIT FOR STEREO HEADSET
DS60001431A-Page 30 Advance Information 2016 Microchip Technology Inc. FIGURE 5-13: BM63 REFERENCE CIRCUIT FOR STEREO HEADSET
2016 Microchip Technology Inc. Advance Information DS60001431A-Page 31 BM63 FIGURE 5-14: BM63 REFERENCE CIRCUIT FOR STEREO HEADSET
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6.0 PRINTED ANTENNA
6.1 Antenna Radiation Pattern
The BM63 module is integrated with one PCB printed antenna, see Figure 6-1. Figure 6-2 illustrates the 3D radiation pattern of the PCB printed antenna at 2441 MHz. FIGURE 6-1: RECOMMENDED KEEP OUT AREA FOR PCB ANTENNA
DS60001431A-Page 34 Advance Information 2016 Microchip Technology Inc. FIGURE 6-2: PCB ANTE NNA RADIATION PATTERN
6.2 Module Pl acement Guidelines
For Bluetooth-enabled products, the antenna placement affects the overall performance of the system. The antenna requires free space to radiate RF signals and it should not be surrounded by the ground plane. Microchip recommends that the areas underneath the antenna on the host PCB must not contain copper on the top, inner, or bottom layers, as illustrated in Figure 6-1. A low-impedance ground plane will ensure the best radio performance (best range, lowest noise). The ground plane can be extended beyond the minimum recommen- dation as required for the main PCB EMC noise reduction. For the best range performance, keep all external metal at least 15 mm away from the on-board PCB trace antenna. Figure 6-3 and Figure 6-4 illustrate the good and poor placement of the BM63 module on a host board with GND plane. TABLE 6-1: PCB ANTENNA CHARACTERISTICS Parameter Values Frequency 2400 MHz ~ 2480 MHz Peak Gain 1.927 dBi Efficiency 73.41%
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7.0 PHYSICAL DIMENSIONS
Figure 7-1 illustrates the PCB dimension of the BM63 module and Figure 7-2 illustrates the PCB footprint of the BM63 module. FIGURE 7-1: BM63 PCB DIMENSION Note: PCB Dimensions: X: 15.0 mm, Y: 32.0 mm, tolerances: 0.25 mm
DS60001431A-Page 38 Advance Information 2016 Microchip Technology Inc. FIGURE 7-2: RECOMMENDED BM63 PCB FOOTPRINT
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8.0 ELECTRICAL CHARACTERISTICS
This section provides an overview of the BM63 module electrical characteristics. Additional information will be provided in future revisions of this document as it becomes available. extended periods may affect device reliability. Functional operation of the device at these or any other conditions, above the parameters indicated in the operation listings of this specification, is not implied. Absolute Maximum Ratings Note: Stresses listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only. The functional operation of the device at those or any other conditions and those indicated in the operation listings of this specification, is not implied. Exposure to maximum rating condi- tions for extended periods may affect device reliability.
DS60001431A-Page 40 Advance Information 2016 Microchip Technology Inc. Note: These parameters are characterized but not tested in manufacturing. Note 1: Headroom = VADAP_IN – VBAT 2: When VADAP_IN – VBAT > 2V, the maximum fast charge current is 175 mA for thermal protection. 3: These parameters are characterized but not tested in manufacturing. TABLE 8-1: RECOMMENDED OPERATING CONDITION Symbol Parameter Min. Typical Max. Unit BAT_IN Input voltage for battery 3.2 3.8 4.2 V ADAP_IN Input voltage for adapter 4.5 5 5.5 V TOPERATION Operation temperature -20 +25 +70 ºC TABLE 8-2: I/O AND RESET LEVEL Parameter Min. Typical Max. Unit I/O Supply Voltage (VDD_IO) 3.0 3.3 3.6 V I/O Voltage Levels VIL input logic levels low 0 – 0.8 V VIH input logic levels high 2.0 – 3.6 V VOL output logic levels low – – 0.4 V VOH output logic levels high 2.4 – – V RST_N Threshold voltage – 0.8 – V TABLE 8-3: BATTERY CHARGER (1,3) Parameter Min. Typical Max. Unit ADAP_IN Input Voltage 4.5 5.0 5.5 V Supply current to charger only – 3 4.5 mA Maximum Battery Fast Charge Current Headroom > 0.7V (ADAP_IN = 5V) –3 5 0– m A Headroom = 0.3V~0.7V (ADAP_IN = 4.5V) –1 7 5 (2) –m A Trickle Charge Voltage Threshold –3– V Battery Charge Termination Current, (% of Fast Charge Current) –1 0– %
2016 Microchip Technology Inc. Advance Information DS60001431A-Page 41 BM63 Note 1: Test condition: BK_O = 1.8V with temperature +25 ºC. 2: These parameters are characterized but not tested in manufacturing. Note 1: fin = 1 kHz, B/W = 20~20 kHz, A-weighted, THD+N < 1%, 150 mVpp input. 2: These parameters are characterized but not tested in manufacturing. TABLE 8-4: LED DRIVER (1,2) Parameter Min. Typical Max. Unit Open-drain Voltage – – 3.6 V Programmable Current Range 0 – 5.25 mA Intensity Control – 16 – step Current Step – 0.35 – mA Power Down Open-drain Current – – 1 μA Shutdown Current – – 1 μA TABLE 8-5: AUDIO CODEC ANALOG TO DIGITAL CONVERTER (2) T = 25 oC, VDD = 2.8V, 1 kHz sine wave input, Bandwidth = 20 Hz~20 kHz Parameter (Condition) Min. Typical Max. Unit Resolution – – 16 Bit Output Sample Rate 8 – 48 kHz Signal to Noise Ratio (Note 1) (SNR at MIC or Line-in mode) –9 2– d B Digital Gain -54 – 4.85 dB Digital Gain Resolution – 2~6 – dB MIC Boost Gain – 20 – dB Analog Gain – - 60 dB Analog Gain Resolution – 2.0 – dB Input full-scale at maximum gain (differential) – 4 – mV/rms Input full-scale at minimum gain (differential) – 800 – mV/rms 3 dB bandwidth – 20 – kHz Microphone mode (input impedance) – 24 – kOhm THD+N (microphone input) at 30 mV/rms input – 0.02 – %
DS60001431A-Page 42 Advance Information 2016 Microchip Technology Inc. Note 1: fin = 1 kHz, B/W = 20~20 kHz, A-weighted, THD+N < 0.01%, 0dBFS signal, Load = 100 kOhm 2: fin = 1 kHz, B/W = 20~20 kHz, A-weighted, -1dBFS signal, Load =16 Ohm 3: fin = 1 kHz, B/W = 20~20 kHz, A-weighted, THD+N < 0.05%, 0dBFS signal, Load = 16 Ohm 4: These parameters are characterized but not tested in manufacturing. Note 1: The RF Tx power is modulation value. 2: The RF Transmit power is calibrated during the production using the MP tool and MT8852 Bluetooth Test equipment. 3: Test condition: VCC_RF = 1.28V, temperature +25 ºC. TABLE 8-6: AUDIO CODEC DIGITAL TO ANALOG CONVERTER (4) T = 25 oC, VDD = 2.8V, 1 kHz sine wave input, Bandwidth = 20 Hz~20 kHz Parameter (Condition) Min. Typical Max. Unit Over-sampling rate – 128 – f s Resolution 16 – 20 Bit Output Sample Rate 8 – 48 kHz Signal to Noise Ratio (Note 1) (SNR at capless mode) for 48 kHz –9 8– d B Signal to Noise Ratio (Note 1) (SNR at single-ended mode) for 48 kHz –9 8– d B Digital Gain -54 – 4.85 dB Digital Gain Resolution – 2~6 – dB Analog Gain -28 – 3 dB Analog Gain Resolution – 1 – dB Output Voltage Full-scale Swing (AVDD = 2.8V) 495 742.5 – mV/rms Maximum Output Power (16 Ohm load) – 34.5 – mW Maximum Output Power (32 Ohm load) – 17.2 – mW Allowed Load Resistive – 16 O.C. Ohm Capacitive – – 500 pF THD+N (16 Ohm load) (Note 2) –0 . 0 5– % Signal to Noise Ratio (SNR at 16 Ohm load) (Note 3) –9 8– d B TABLE 8-7: TRANSMITTER SE CTION FOR BDR AND EDR(1,2,3) Parameter Min. Typical Max. Bluetooth specification Unit Maximum RF transmit power – 2 –- 6 t o 4 dBm EDR/BDR Relative transmit power -4 -1.8 1 -4 to 1 dB
2016 Microchip Technology Inc. Advance Information DS60001431A-Page 43 BM63 Note 1: Test condition: VCC_RF = 1.28V with temperature +25 ºC. 2: These parameters are characterized but not tested in manufacturing. Note 1: The measurement data corresponds to Firmware v1.0. 2: Mode definition: Stand-by mode: Power-on without Bluetooth link Link mode: With Bluetooth link in Low-Power mode. 3: The current consumption values are measured with the BM63 EVB as a test platform, with BAT_IN = 3.8V. The distance between the smartphone and BM63 EVB is 30 cm, and the speaker is without loading. TABLE 8-8: RECEIVER SECTION FOR BDR AND EDR (1,2) Modulation Min. Typical Max. Bluetooth specification Unit Sensitivity at 0.1% BER GFSK – -89 – ≤-70 dBm Sensitivity at 0.01% BER π/4 DQPSK – -90 – ≤-70 dBm
8 DPSK – -83 – ≤-70 dBm
TABLE 8-9: SYSTEM CURRENT CONSUMPTION OF BM63(2,3) System Status Typical (1) Max. Unit System-off mode – 10 μA Stop advertising (Samsung S5 (SM-G900I)/Android™ 4.4.2) Stand-by mode 0.57 – mA Link mode 0.5 – mA ESCO link 15.1 – mA A2DP link 14.3 – mA Stop advertising (iPhone ® 6/iOS 8.4) Stand-by mode 0.6 – mA Link mode 0.6 – mA SCO link 15.3 – mA A2DP link 15.4 – mA
DS60001431A-Page 44 Advance Information 2016 Microchip Technology Inc.
8.1 Timing specifications
Figure 8-1 and Figure 8-2 illustrate the timing diagram of the BM63 module in I2S and PCM modes. FIGURE 8-1: TIMING DIAGRAM FOR I 2S MODES (MASTER/SLAVE) FIGURE 8-2: TIMING DIAGRAM FOR PCM MODES (MASTER/SLAVE) Note 1: fs: 8,16, 32, 44.1, 48, 88.2 and 96 kHz. 2: SCLK0: 64*fs/256*fs. 3: Word length: 16-bit and 24-bit.
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2016 Microchip Technology Inc. Advance Information DS60001431A-Page 47 BM63
9.0 SOLDERING RECOMMENDATIONS
The BM63 module is assembled using a standard lead-free reflow profile, IPC/JEDEC J-STD-020. The BM63 module can be soldered to the main PCB using a standard leaded and lead-free solder reflow profiles. To avoid any damage to the module, follow these rec- ommendations:
- Refer to the “ AN233 Solder Reflow Recommenda- tion” (DS00233) document for the soldering reflow recommendations
- The peak temperature should not exceed (TP) of +250 ºC
- Refer to the “Solder Paste” data sheet for specific reflow profile recommendations
- Use no-clean flux solder paste
- Do not wash the module as moisture can be trapped under the shield
- Use only one flow. If the PCB requires multiple flows, apply the module on the final flow. Figure 9-1 illustrates the reflow profile of the BM63 module. FIGURE 9-1: REFLOW PROFILE
DS60001431A-Page 48 Advance Information 2016 Microchip Technology Inc. NOTES:
2016 Microchip Technology Inc. Advance Information DS60001431A-Page 49 BM63
10.0 ORDERING INFORMATION
Table 10-1 provides the ordering information of the BM63 module. Note: The BM63 module can be purchased through a Microchip representative. Go to Microchip website www.microchip.com/ for the current pricing and a list of distributors for the product. TABLE 10-1: ORDERING INFORMATION Module Microchip IC Description Part No BM63 IS2063GM Bluetooth 4.2 Stereo Audio with BLE, I 2S, Flash, Class 2, no shield, built-in antenna BM63SPKA1MC2
DS60001431A-Page 50 Advance Information 2016 Microchip Technology Inc. NOTES:
2016 Microchip Technology Inc. Advance Information DS60001431A-Page 51 BM63 APPENDIX A: REVISION HISTORY Revision A (June 2016) This is the initial released version of this document.
DS60001431A-Page 52 Advance Information 2016 Microchip Technology Inc. NOTES:
2016 Microchip Technology Inc. Advance Information DS60001431A-Page 53 BM63 THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information:
- Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software
- General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing
- Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels:
- Distributor or Representative
- Local Sales Office
- Field Application Engineer (FAE)
- Technical Support Customers should contact their distributor, representative or Field Application Engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support
DS60001431A-Page 54 Advance Information 2016 Microchip Technology Inc. NOTES:
2016 Microchip Technology Inc. Advance Information DS60001431A-Page 55 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY , PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE . Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, AnyRate, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, ETHERSYNCH, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker, Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2016, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-5224-0705-8 Note the following details of the code protection feature on Microchip devices:
- Microchip products meet the specification cont ained in their particular Microchip Data Sheet.
- Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions.
- There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
- Microchip is willing to work with the customer who is concerned about the integrity of their code.
- Neither Microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are co mmitted to continuously improvin g the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT S YSTEM CERTIFIED BY DNV == ISO/TS 16949 ==
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