BM57 HIROSE | Alldatasheet
Document overview
- Manufacturer or author: Nobuhiro Aota（青田 伸宏）
- PDF pages: 1
Technical content
Features
0.3mm Pitch / Stacking Height 0.6mm / Width 1.9mm High Current (5A) *Includes the temperature rise due to current flow. Robust Design - Pin Count Variation: 10pos.
1 Low-profile design with high power
- Rated current: 5A for power contact, 0.3A for signal contact - 0.6mm stacking height, 1.9mm width
2 Full armored design prevents housing damage
3 Easy mating operation with wide self alignment range
4 Insert molded header and receptacle design
- Solder Wicking Prevention
5 Multi-point soldering enhances PCB peeling strength
Fully Armored Design Prevents Housing Damage Power Contact Saves Space 10.55mm Power Contact Power Contact 3.8mm 10.55mm –3.8mm = 6.75mm Reduced Length: 64％Reduced Conventional Product (P=0.35mm) Signal 46pos. BM57 Signal 10pos. + Power 2pos.