BM50 HIROSE | Alldatasheet

Document overview

  • Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
  • PDF pages: 11

Technical content

0.35mm Pitch, 0.6mm Stacking Height, 15A Rated Current, Power/Signal Hybrid FPC-to-Board Connector Mar. 2022 This product was selected as a CES Innovation Awards Honoree The CES Innovation Awards are based upon descriptive materials submitted to the judges. CTA did not verify the accuracy of any submission or of any claims made and did not test the item to which the award was given.

BM50 Series/0.35mm Pitch, 0.6mm Stacking Height, 15A Rated Current, Power/Signal Hybrid FPC-to-Board Connector

Features

  1. Space-saving Design with 15A Rated Current The power contact supports 15A per position and the signal contact supports 0.3A per position for high power supply capability. Additionally, the BM50U has a space-saving design that minimizes connector size. PCB Mounting Space : 13㎟ PCB Mounting Space : 9㎟ 0.4mm Pitch 2 Power Pos./4 Signal Pos. Rated Current : Power Contact 10A Conventional Product 0.35mm Pitch 2 Power Pos./4 Signal Pos. Rated Current : Power Contact 15A BM50 Increase the Rated Current from 10A to 15A While Achieving Space Reduction (30% Decrease in PCB Mounting Space) 2. High Contact Reliability Multi-point contact design with 4-point power contact and 2-point signal contact for stable connection. Power Contact 4-point Contact Signal Contact 2-point Contact 3. Compact with High Extraction Force The original lock design ensures high extraction force and prevents unmating due to impact. 4. Halogen-free No chlorine or bromine exceeding the standard values are used in this connector. In accordance with IEC 61249-2-21 Br : 900ppm max., Cl : 900ppm max., Br+Cl : 1500ppm max.

BM50 Series/0.35mm Pitch, 0.6mm Stacking Height, 15A Rated Current, Power/Signal Hybrid FPC-to-Board Connector

Applications

Devices that require low-profile, compact design such as smartphones, wearable terminals and tablet PCs. Built-in Battery

  • Battery Connection ●USB Connection -Space-saving -High Current Capacity -Compatible with USB Power Delivery -Easy to Replace USB Connector -No Need for Main Board Height Alignment* *By using an FPC to connect the USB to the PCB, the USB can be placed anywhere within the design of the end product. Housing PCBUSB Housing Product Specifications Rated Current Signal Contact : 0.3A Power Contact : 15A Operating Temperature (Note 1) -55 to +85℃ Operating Humidity Range (Note 2) 90% RH Max. Rated Voltage 60V AC/DC Storage Temperature (Note 3) -10 to +60℃ Storage Humidity Range (Note 2)(Note 3) 90% RH Max. Item Specifications Conditions Contact Resistance Signal Contact 30mΩ , Power Contact 5mΩ Measured at 20mV AC, 1kHz, and 1mA Insulation Resistance 1000 ＭΩ Min. Measured at 100V DC Withstanding Voltage No flashover or dielectric breakdown 150V AC for 1 min. Mating Durability Contact Resistance : Signal Contact 30mΩ Power Contact 5mΩ 10 cycles Vibration Resistance No electrical discontinuity of 1μs or more. Frequency : 10 to 55Hz, half amplitude of 0.75mm, 10 cycles in each of 3 axis directions for 5 minutes/cycle Humidity Resistance Contact Resistance : Signal Contact 30mΩ Power Contact 5mΩ Insulation Resistance : 1000MΩ Min. Left for 96 hours at a temperature of 40 ± 2℃ and a humidity range from 90 to 95% Temperature Cycle Contact Resistance : Signal Contact 30mΩ Power Contact 5mΩ Insulation Resistance : 1000MΩ Min. -55℃ for 30 minutes → 85 for 30 minutes, 5 cycles (Tank transfer time: within 2 to 3 min.) Solder Heat Resistance No dissolution or resin melting that will affect performance. Reflow : At recommended temperature profile Hand solder : Solder iron temperature of 350℃ for 3 seconds max. Note 1 : Includes temperature rise caused by current flow. Note 2 : Use without condensation. Note 3 : Storage refers to long-term storage of unused items before they are mounted on the PCB. Operating temperature and humidity range apply when the product is not powered after PCB mounting and when temporarily stored during transportation.

BM50 Series/0.35mm Pitch, 0.6mm Stacking Height, 15A Rated Current, Power/Signal Hybrid FPC-to-Board Connector Material/Finish Part Component Material Finish UL Standard Header Receptacle Insulator LCP Black UL94V-0 Signal Contact Copper Alloy Gold Plated - Power Contact Copper Alloy Gold Plated - Product Number Structure Refer to the chart below when determining the product specifications from the product number. Please select from the product numbers listed in this catalog when placing orders.

  • Header/Receptacle BM 50U - 4 DP / 2 - 0.35 V (51) ❶ ❷ ❸ ❹ ❺ ❻ ❼ ❽ ❶ Series Name BM ❺ No. of Power Contacts 2pos. ❷ Series No. 50U ❻ Contact Pitch 0.35mm No. of Signal Contacts 4pos. ❼ Terminal Design V : Straight SMT ❹ Connector Type DP : Header DS : Receptacle Plating Specifications and Packaging (51) : Gold Plating Thickness 0.05μm Embossed Packaging (20,000pcs per reel) (53) : Gold Plating Thickness 0.05μm Embossed Packaging (1,000pcs per reel)

BM50 Series/0.35mm Pitch, 0.6mm Stacking Height, 15A Rated Current, Power/Signal Hybrid FPC-to-Board Connector Header A B 0.1 0.15 0.48 1.65 C

  • Recommended PCB Layout 1.95±0.020.18±0.02 C±0.02 0.91±0.02 E±0.02 D±0.02 0.26±0.02 0.54±0.02 0.64±0.02
  • Recommended Metal Mask Dimensions (Mask Thickness : 0.08mm) 1.95±0.01 0.64±0.01 0.54±0.01 0.26±0.01D±0.01 E±0.01 0.91±0.01 C±0.01 0.18±0.01 Part No. HRS No. No. of Pos. A B C D E Purchase Unit (##):(51) Purchase Unit (##):(53)Signal Contact Power Contact per reel 1,000pcs per reel Unit : mm Note : This connector has no polarity.

BM50 Series/0.35mm Pitch, 0.6mm Stacking Height, 15A Rated Current, Power/Signal Hybrid FPC-to-Board Connector Receptacle 0.6 0.9 0.4 B C A 2.0

  • Recommended PCB Layout 0.29±0.02 0.18±0.02 A±0.02 0.42±0.02 1.04±0.02 1.4±0.02 1.64±0.02 2.3±0.02 F±0.02 0.9±0.02 E±0.02 D±0.02 0.48±0.02
  • Recommended Metal Mask Dimensions (Mask Thickness : 0.08mm) 0.29±0.01 0.48±0.01 D±0.01 E±0.01 0.9±0.01F±0.01 2.3±0.01 1.64±0.01 1.4±0.01 1.04±0.01 0.42±0.01 A±0.01 0.18±0.01 Part No. HRS No. No. of Pos. A B C D E F Purchase Unit (##):(51) Purchase Unit (##):(53)Signal Contact Power Contact per reel 1,000pcs per reel Unit : mm Note : This connector has no polarity.

BM50 Series/0.35mm Pitch, 0.6mm Stacking Height, 15A Rated Current, Power/Signal Hybrid FPC-to-Board Connector Packaging Specifications Diagram 6OSFFMJOH%JSFDUJPO 6OSFFMJOH%JSFDUJPO ""## ʶ ʶ ʶ ʶ ʶ ʶ ʶʶП ˔3FFM%JNFOTJPOT˔&NCPTTFE5BQF%JNFOTJPOT )FBEFS ˔3FFM%JNFOTJPOT˔&NCPTTFE5BQF%JNFOTJPOT 3FDFQUBDMF ʶ ʶ ʶ ʶ ʶʶП ʶ ʶ П4130$,&5 )0-& '"34*%& П4130$,&5 )0-& '"34*%& #"3$0%& -"#&- #"3$0%& -"#&- ʶ ʶ ʶ Пʶʢ/PUFʣ Пʶʢ/PUF̍ʣ ʶ Пʶʢ/PUFʣ Пʶʢ/PUF̍ʣ П ʶ П ʶ /PUF̍ɿ5IF TQFDJpDBUJPOJTПʶ /PUF̎ɿ5IF TQFDJpDBUJPOJTПʶ /PUF̍ɿ5IF TQFDJpDBUJPOJTПʶ /PUF̎ɿ5IF TQFDJpDBUJPOJTПʶ IEC 60286-3, JIS C 0806 Compliant

BM50 Series/0.35mm Pitch, 0.6mm Stacking Height, 15A Rated Current, Power/Signal Hybrid FPC-to-Board Connector Usage Precautions Recommended Temperature Profile 【Conditions】 1. Peak Temperature : 250℃ 2. Heating : 220℃ min. for 60 sec. max. 3. Preheating : 150 to 180℃, 90 to 120 sec. 4. Number of Reflow Cycles : 2 cycles max. 250℃ 220℃ 60 sec. max. 90-120 sec. 180℃ Temperature (℃) 250 200 150 100 Room Temperature 150℃ 0 50 100 150 200 250 300 Heating Time (sec.) Note : Temperature refers to the surface temperature of the board near the connector lead. Reflow mounting in a nitrogen environment is recommended. Recommended Manual Soldering Conditions Soldering iron temperature : 340 ± 10℃ ; Soldering time : within 3 seconds Recommended Metal Mask Thickness and Open Area to PCB Pattern Area Ratio Thickness : 0.08mm Aperture Ratio : Receptacle Side : 100%, Header Side : 100% Board Warpage Max. of 0.02mm at the center in reference to both ends of the connector Cleaning Cleaning is not recommended. If you clean this product, please evaluate its performance before using it. (Cleaning may impair the mating/unmating properties and lower resistance to environmental factors.) Precautions ・Be careful when mating/unmating the connector when it is not mounted on the PCB as it may cause damage/deformation to contacts. ・Avoid supporting the PCB only with the connectors. Support it by other means such as bolts, screws, posts, etc. ・Excessive prying during unmating/mating may result in damage. ・In the case of hand soldering, please do not apply any flux which could cause flux wicking. ・This product may have slight color differences due to production lot variability, but this does not affect the performance. ・Please refer to the following page for handling precautions when inserting and removing. ・Because the product can disengage if dropped (or other impact), or by FPC routing, it is advised to secure the mated connectors to the board with housings and cushioning materials. ・Do not use the connector in non-recommended conditions (i.e., rated current, rated voltage, PCB design and operating environment, etc.). Such usage could lead to material outgassing, ignition, or short-circuit, etc. Refer to the specifications and guidelines for board pattern dimensions, board cautions, and connector treatment. Please contact Hirose if connector usage in conditions other than those described in the specifications and the guidelines is being considered.

BM50 Series/0.35mm Pitch, 0.6mm Stacking Height, 15A Rated Current, Power/Signal Hybrid FPC-to-Board Connector Connector Handling Precautions 【Mating Disengagement Prevention】 Please use cushioning. This connector may come off due to impact such as dropping. Cushioning should be large enough to cover the entire connector. $VTIJPOJOH 【Mating Method】 1.Locate the guide port and align. This product has a guide rib on the header to ensure proper engagement. Align the connector so that it is in this position. 2.Once aligned, the connector engages. You can feel the mated height of the connector lower. Move Slightly .PWFUIFDPOOFDUPSGPSXBSEBOECBDLXBSE MFGUBOESJHIUUPpOEUIFHVJEFQPSU 5IFNBUFEIFJHIUMPXFST UPUIFQFSGFDUNBUFEDPOEJUJPO

2-6-3,Nakagawa Chuoh,Tsuzuki-Ku,Yokohama-Shi 224-8540,JAPAN https://www.hirose.com BM50 Series/0.35mm Pitch, 0.6mm Stacking Height, 15A Rated Current, Power/Signal Hybrid FPC-to-Board Connector 3.In the engaged state, the connectors are parallel to each other, and the connectors cannot move forward, backward, left, or right. Complete mating from this state. Move Slightly 4.Check that mating is completed. If one side is floating, or if it is mated at a diagonal, remove and re-mate. 【Handling Precautions for Connector Removal】 1.When removing the connector, it is preferable to pull it out in the upward direction from the connector mounting surface. However, when removing the FPC from the circuit board it becomes more difficult to remove it vertically with higher pin counts and thin FPCs. 2.If difficult to remove, extract the connector diagonally in the direction of the pitch. Note that removal from the widthwise side will apply a large load to the contacts. When removing from the width direction, pull the end of the FPC in the upward direction. (When a force is applied in the horizontal direction, a large load is applied to the contact.)

2-6-3,Nakagawa Chuoh,Tsuzuki-Ku,Yokohama-Shi 224-8540,JAPAN https://www.hirose.com ※The contents of this catalog are current as of date of 3/2022. Contents are subject to change without notice for the purpose of improvements. BM50 Series/0.35mm Pitch, 0.6mm Stacking Height, 15A Rated Current, Power/Signal Hybrid FPC-to-Board Connector 3.If the FPC does not have sufficient rigidity, solder stripping or connector breakage may occur. Please use it after checking the repetitive operation with a flexible board in advance, such as during a trial manufacture run. Refrain from holding the corner of the flexible board and removing it diagonally as it will result in a large load to the contacts. While Taking into Consideration Specifications mentioned in this catalog are reference values. When considering to order or use this product, please confirm the Drawing and Product Specifications sheets. Use an appropriate cable when using the connector in combination with cables. If considering usage of a non-specified cable, please contact your sales representative. If assembly process is done by jigs & tools which are not identified by Hirose, assurance will not be given. If considering usage for below mentioned applications, please contact your sales representative. In cases where the application will demand a high level of reliability, such as automotive, medical instruments, public infrastructure, aerospace/ defense etc. Hirose must review before assurance of reliability can be given.