BM20

BM20 MICROCHIP | Alldatasheet

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 2015 Microchip Technology Inc. Page 1 Preliminary Edition BM20/BM23 Bluetooth® 4.1 Stereo Audio Module Features:  Complete, Fully Certified, Embedded 2.4 GHz Bluetooth® Version 4.1 Module  Bluetooth Classic (BDR/EDR)  Bluetooth SIG Certified  Onboard embedded Bluetooth Stack  Transparent UART mode for seamless serial data over UART interface  Easy to configure with Windows GUI or direct by MCU  Firmware can be field upgradable via UART  Compact surface mount module: 29 x 15 x 2.5 mm3  Castellated surface mount pads for easy and reliable host PCB mounting  Environmentally friendly, RoHS compliant  Perfect for Portable Battery Operated Devices  Internal Battery Regulator Circuitry  Worldwide regulatory certifications  Audio-In / Out BM23 support digital audio I2S format. BM20 support analog audio output. Operational:  Operating voltage: 3.0V to 4.2V  Temperature range: ‐20C to 70°C  Simple, UART interface  Integrated crystal, internal voltage regulator, and matching circuitry  Multiple I/O pins for control and status RF/Analog:  Frequency: 2.402 to 2.480 GHz  Receive Sensitivity: ‐91 dBm (2Mbps EDR)  Power Output: class 2 / +4dBm max.  Connection Distance: >10m (free space and no interference) Audio processor  Support 64 kb/s A-Law or -Law PCM format, or CVSD (Continuous Variable Slope Delta Modulation) for SCO channel operation.  Noise suppression  Echo suppression  SBC and optional AAC decoding  Packet loss concealment  Build-in four languages (Chinese/ English/ Spanish/ French) voice prompts and 20 events for each one (This function can be set up in “IS20XXS_UI” tool.)  Support SCMS-T Audio Codec  20 bit DAC and 16 bit ADC codec  98dB SNR DAC playback Peripherals  Built-in Lithium-ion battery charger (up to 350mA)  Integrate 3V, 1.8V configurable switching regulator and LDO  Built-in ADC for battery monitor and voltage sense.  A line-in port for external audio input  Two LED drivers Flexible HCI interface  High speed HCI-UART (Universal Asynchronous Receiver Transmitter) interface (up to 921600bps) MAC/Baseband/Higher Layer:  Secure AES128 encryption  Bluetooth profiles - HFP v1.6 - HSP v1.1 - A2DP v1.2 - AVRCP v1.5 - SPP v1.0 - PBAP v1.0 Antenna:  Printed Antenna Compliance:  Bluetooth SIG QDID: 58996  Module certified for the United States (FCC) and Canada (IC), European Economic Area (CE), Korea (LTA), Taiwan (NCC) and Japan (MIC)

 2015 Microchip Technology Inc. Page 2 Preliminary Edition Figure 1: General Description: Stereo module is a fully-certified Bluetooth® Version 4.1 (BDR/EDR) module for designers who want to add Bluetooth® wireless audio and voice applications to their products. This Bluetooth SIG certified module provides a complete wireless solution with Bluetooth stack, integrated antenna, and worldwide radio certifications in a compact surface mount package, 29x15x2.5 mm3. This stereo module built-in Li-Ion charger and BM23 contain a digital audio interface. It supports HSP, HFP, SPP, A2DP, and AVRCP profiles. Both AAC and SBC codecs are supported for A2DP. Note that the customer must connect their own external analog CODEC/DSP/amplifier and MCU for audio output. Applications:  Bluetooth sound bar  Bluetooth stereo speaker phone

 2015 Microchip Technology Inc. Page 3 Preliminary Edition Table of Contents TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following:

• Microchip’s Worldwide Web site; http://www.microchip.com
• Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. Abbreviations List: HFP: Hands-free Profile AVRCP: Audio Video Remote Control Profile A2DP: Advanced Audio Distribution Profile PBAP: Phone Book Access Profile HSP: Headset Profile SPP: Serial Port Profile

 2015 Microchip Technology Inc. Page 4 Preliminary Edition

1.0 DEVICE OVERVIEW

The stereo module series include BM20 and BM23. The chip integrates Bluetooth 4.1 radio transceiver, PMU and DSP. Figure 1-1and 1-2 shows the application block diagram. FIGURE 1‐1: BM20 Typical Application The following depicts an example of BM20 module operate as an independent system or connected to an MCU. FIGURE 1‐2: BM23 Typical Application The following depicts an example of BM23 module connected to an MCU, external DSP/CODEC. MCUEEPROM IC IS2020S 16M Hz Crystal I2C UART BM20 Option Microphone Aux_In Audio Output MCUEEPROM IC IS2023S 16M Hz Crystal I2C UART BM23 Microphone Aux_In DSPI2S

 2015 Microchip Technology Inc. Page 5 Preliminary Edition

1.1 INTERFACE DESCRIPTION

BM20 pin diagram is shown in Figure 1-3. The pin descriptions are shown in Table 1-1 FIGURE 1-3: BM20 PIN DIAGRAM TABLE 1‐1: BM20 PIN DESCRIPTION Pin No. Pin type Name Description

1 I/O P0_0

IO pin, default pull-high input (Note 1) 1. Slide Switch Detector, active low. 2. UART TX_IND, active low.

2 I EAN Embedded ROM/External Flash enable

H: Embedded; L: External Flash

3 I P3_0 IO pin, default pull-high input (Note 1)

Line-in Detector (default), active low.

4 I P2_0

IO pin, default pull-high input System Configuration, H: Application L: Baseband(IBDK Mode)

5 I/O P1_5

IO pin, default pull-high input (Note 1) 1. NFC detection pin, active low. 2. Out_Ind_0 3. Slide Switch Detector, active low. 4. Buzzer Signal Output

6 I/O P0_4

IO pin, default pull-high input. (Note 1) 1. NFC detection pin, active low. 2. Out_Ind_0

7 O SPKR R-channel analog headphone output

8 O AOHPM Headphone common mode output/sense input.

 2015 Microchip Technology Inc. Page 6 Preliminary Edition Pin No. Pin type Name Description

9 O SPKL L-channel analog headphone output

10 P VDDA Positive power supply/reference voltage for CODEC , no need to add power

to this pin.

11 I MIC1_P Mic 1 mono differential analog positive input

12 I MIC1_N Mic 1 mono differential analog negative input

13 P MIC_BIAS Electric microphone biasing voltage

14 I AIR R-channel single-ended analog inputs

15 I AIL L-channel single-ended analog inputs

16 I RST System Reset Pin, Low: reset

17 P VCC_RF 1.28V RF LDO output, no need to add power to this pin.

18 I/O P0_1

IO pin, default pull-high input (Note 1) 1. FWD key when class 2 RF (default), active low. 2. Class1 TX Control signal of external RF T/R switch, active high.

19 P VDD_IO Power output , no need to add power to this pin

20 P ADAP_IN 5V Power adaptor input

21 P BAT_IN 3.3V~4.2V Li-Ion battery input 22 - NC No Connection

23 P GND Ground Pin

24 P SYS_PWR

BAT mode: 3.3~4.2V Adapter mode: 4.0V 25 P BK_OUT 1.8V buck output, no need to add power to this pin 26 I MFB 1. Power key when in off mode 2. UART_RX_IND: MCU use to wakeup BT (Note 1)

27 I LED1 LED Driver 1

28 I LED2 LED Driver 2

29 I P2_4

IO pin, default pull-high input System Configuration, L: Boot Mode with P2_0 low combination

30 I P0_2 IO pin, default pull-high input (Note 1)

Play/Pause key (default), active low.

31 I/O P0_3

IO pin, default pull-high input (Note 1) 1. REV key (default), active low. 2. Buzzer Signal Output 3. Out_Ind_1 4. Class1 RX Control signal of external RF T/R switch, active high.

32 O HCI_TXD HCI-UART TX data

33 I HCI_RXD HCI-UART RX data

34 I P0_5 IO pin, default pull-high input (Note 1)

Volume down (default), active low.

35 I P2_7 IO pin, default pull-high input (Note 1)

Volume up key (default), active low.

 2015 Microchip Technology Inc. Page 7 Preliminary Edition Pin No. Pin type Name Description

36 I P2_4

IO pin, default pull-high input System Configuration, L: Boot Mode with P2_0 low combination

37 P GND Ground Pin

• I: signal input pin * O: signal output pin * I/O: signal input/output pin * P: power pin Note 1: These button or functions can be setup by “IS20XXS_UI” tool.

 2015 Microchip Technology Inc. Page 8 Preliminary Edition BM23 pin diagram is shown in Figure 1-4. The pin descriptions are shown in Table 1-2 FIGURE 1-4: BM23 PIN DIAGRAM TABLE 1‐2: BM23 PIN DESCRIPTION Pin No. Pin Type Name

Description

1 I/O P0_0 IO pin, default pull-high input (Note 1)

UART TX_IND

2 I/O RFS0 I2S interface: DAC Left/Right Clock

3 I/O TFS0 I2S interface: ADC Left/Right Clock

4 I/O SLK0 I2S interface: Bit Clock

5 I DR0 I2S interface: DAC Digital Left/Right Data

6 O DT0 I2S interface: ADC Digital Left/Right Data

7 I/O P0_4 IO pin, default pull-high input

8 I EAN

Embedded ROM/External Flash enable High: ROM mode; Low: External Flash mode

9 I MIC1_P Mic 1 mono differential analog positive input

10 I MIC1_N Mic 1 mono differential analog negative input

11 P MIC_BIAS Power output, microphone biasing voltage

12 P VDDA Power output, reserve for external cap to fine tune audio frequency

response, no need to add power to this pin 13 I AIR Stereo analog line in, R-channel

14 I AIL Stereo analog line in, L-channel

 2015 Microchip Technology Inc. Page 9 Preliminary Edition Pin No. I/O Name Description

15 P GND Ground

16 I RST_N System Reset Pin, active when rising edge. 17 -- NC -- 18 -- NC --

19 P VDDIO Power output, VDDIO pin, no need to add power to this pin

20 I/O P1_5 IO pin, default pull-high input

21 I/O P0_1 IO pin, default pull-high input

22 P ADAP_IN 5V power adaptor input

23 P BAT_IN 3.3~4.2V Li-ion battery input 24 -- NC --

25 P SYS_PWR

BAT mode: 3.3~4.2V Adapter mode: 4.0V

26 P BK_OUT Power output, 1v8 pin, no need to add power to this pin

27 P MFB 1. Power key when in off mode 2. UART_RX_IND: MCU use to wakeup BT

28 P LED1 LED Driver 1, 4mA max

29 P LED2 LED Driver 2, 4mA max

30 I P2_4

IO pin, default pull-high input System Configuration, L: Boot Mode with P2_0 low combination

31 I/O P0_2 IO pin, default pull-high input

32 I/O P0_3 IO pin, default pull-high input

33 O HCI_TXD HCI-UART TX data

34 I HCI_RXD HCI-UART RX data

35 I/O P0_5 IO pin, default pull-high input

36 I/O P2_7 IO pin, default pull-high input

37 I/O P2_0 IO pin, default pull-high input

38 I/O P3_0 IO pin, default pull-high input

39 I P2_0

IO pin, default pull-high input System Configuration, H: Application L: Baseband(IBDK Mode) 40 P GND Ground. 41 -- NC -- 42 -- NC -- 43 -- NC -- * I: signal input pin * O: signal output pin * I/O: signal input/output pin * P: power pin Note 1: These button or functions can be setup by “IS20XXS_UI” tool.

 2015 Microchip Technology Inc. Page 10 Preliminary Edition

2.0 APPLICATION INFORMATION

2.1 OPERATION WITH EXTERNAL MCU

Stereo module support UART command set to make an external MCU to control module. Here is the connection interface between BMXX and MCU. FIGURE 2-1: INTERFACE BETWEEN MCU AND BMXX MODULE MCU can control module by UART interface and wakeup module by PWR pin. Stereo module provide wakeup MCU function by connect to P0_0 pin of module. “UART Command Set” document provide all function which module support and UI tool will help you to set up your system support UART command. For more detail description, please reference “UART_CommandSet_v154” document and “IS20XXS_UI” tool. BMXX HCI_TXD HCI_RXD MFB P0_0 MCU UART_TX UART_RX MCU_ WAKEUP BT_ WAKEUP UART interface UART interface

 2015 Microchip Technology Inc. Page 11 Preliminary Edition Here are some suggestions of UART control signal timing sequence: FIGURE 2-2: POWER ON/OFF SEQUENCE

 2015 Microchip Technology Inc. Page 14 Preliminary Edition FIGURE 2-7: TIMING SEQUENCE OF POWER DROP PROTECTION BAT_IN +4V RST_N from Reset IC If BT’s BAT use adaptor translates voltage by LDO, we recommend use “Reset IC” to avoid power off suddenly. Rest IC spec output pin must be “Open Drain”、delay time ≦ 10ms Recommend part: TCM809SVNB713 or G691L263T73 Power 2.9V ~

 2015 Microchip Technology Inc. Page 15 Preliminary Edition

2.2 I2S Signal Application for BM23

BM23 support I2S digital audio signal interface to connect your external CODEC/DSP. It provide 8k Hz, 44.1k Hz and 48k Hz sampling rate; it also support 16 bits and 24bits data format . The I2S setting can be set up by UI and DSP tools. The external CODEC/DSP needs to be connected to SLK0, RFS0, TFS0, DR0, and DT0 (pins 4, 2, 3, 5, and 6 respectively). The I2S signal connection between BM23 and external DSP as below: FIGURE 2-9: MASTER MODE REFERENCE CONNECTION FIGURE 2-10: SLAVE MODE REFERENCE CONNECTION Note 1: For 002 version chip or module, system should connect line 1 in slave mode figure. And, system not support ADC signal from external DSP/CODEC. Note 2: For other version chip or module, system should connect line 2 in slave mode figure. About “Mast” or “Slave” mode setting, you can use “DSP Configuration Tool” to set up system. BM23 RFS0 TFS0 DR0 SCLK0 DACLRC BCLK ADCDAT DACDAT DT0 EXTERNAL DSP/CODEC BM23 RFS0 TFS0 DR0 SCLK0 DACLRC BCLK ADCDAT DACDAT DT0 EXTERNAL DSP/CODEC (*1) (*2)

 2015 Microchip Technology Inc. Page 16 Preliminary Edition The clock and data timing as below: FIGURE 2-11: TIMING FOR I2S MODES (both master and slave) FIGURE 2-12: TIMING FOR PCM MODES (both master and slave)

2.3 RESET (RST_N)

RST is module reset pin which is active LOW. To reset the module, the RST_N must hold LOW for at least 63ns.

2.4 STATUS LED (LED1, LED2)

The status LED provide below status indication:  Standby  Inquiry  Link  Link Back  Low Battery  Page  Battery Charging Each status indication LED flashing sequence and brightness is configurable by UI tool. Bn-1 RFSn/TFSn SCLKn DRn/DTn Bn-2 B1 B0 Bn-1 Bn-2 B1 B0 Left Channel Right Channel 1/fs Word Length Bn-1 RFS0/TFS0 SCLK0 DR0/DT0 Bn-2 B1 B0 Bn-1 Bn-2 B1 B0 Left Channel 1/fs Word Length Right Channel

 2015 Microchip Technology Inc. Page 17 Preliminary Edition

2.5 EXTERNAL CONFIGURATION

Stereo module can be configured and firmware programmed using an external configuration and programming tool available from Microchip. Figure 2‐7 shows the configuration and firmware programming interface on BM23. It is recommended to include a pin header on the main PCB for development. Configuration and firmware programming modes are entered accordingly to the system configuration I/O pins as shown in Table 2-1. Pin P20, P24 and EAN pin have internal pull‐up. FIGURE 2-13: EXTERNAL PROGRAMMING HEADER CONNECTIONS (Here is the interface connect example of the BM23) TABLE 2-1: SYSTEM CONFIGURATION SETTINGS P20 P24 EAN Operational Mode High High High APP mode (Normal operation) Low High High Test mode (Write EEPROM) Low Low High Write Flash (Firmware programming if flash build-in in chip)

 2015 Microchip Technology Inc. Page 18 Preliminary Edition

3.0 ELECTRICAL CHARACTERISTICS

Table 3-1: ABSOLUTE MAXIMUM SPECIFICATION Symbol Parameter Min Max Unit BAT_IN Input voltage for battery 0 4.3 V ADAP_IN Input voltage for adaptor 0 7.0 V TSTORE Storage temperature -65 +150 ºC TOPERATION Operation temperature -20 +70 ºC Table 3-2: RECOMMENDED OPERATING CONDITION Symbol Parameter Min Typical Max Unit BAT_IN Input voltage for battery 3 3.7 4.2 V ADAP_IN Input voltage for adaptor 4.5 5 5.5 V TOPERATION Operation temperature -20 +25 +70 ºC Note: Absolute and Recommended operating condition tables reflect typical usage for device. TABLE 3-3: I/O AND RESET LEVEL Parameter Min. Typ. Max. Units I/O Supply Voltage (VDD_IO) 2.7 3.0 3.3 V I/O Voltage Levels VIL input logic levels low ‐0.3 0.8 V VIH input logic levels high 2.0 3.6 V VOL output logic levels low 0.4 V VOH output logic levels high 2.4 V RESET VTH,RES threshold voltage 1.6 V Note: (1) VDD_IO voltage is programmable by EEPROM parameters. (2) These parameters are characterized but not tested in manufacturing.

 2015 Microchip Technology Inc. Page 19 Preliminary Edition Table 3-4: BATTERY CHARGER Parameter Min Typical Max Unit ADAP_IN Input Voltage 4.5 5.0 5.5 V Supply current to charger only 3 4.5 mA Maximum Battery Fast Charge Current Note: ENX2=0 Headroom > 0.7V (ADAP_IN=5V) 170 200 240 mA Headroom = 0.3V (ADAP_IN=4.5V) 160 180 240 mA Maximum Battery Fast Charge Current Note: ENX2=1 Headroom > 0.7V (ADAP_IN=5V) 330 350 420 mA Headroom = 0.3V (ADAP_IN=4.5V) 180 220 270 mA Trickle Charge Voltage Threshold 3 V Battery Charge Termination Current, (% of Fast Charge Current) 10 % Note: (1) Headroom = VADAP_IN – VBAT (2) ENX2 is not allowed to be enabled when VADAP_IN – VBAT > 2V (3) These parameters are characterized but not tested in manufacturing. Table 3-5: LED DRIVER Parameter Min Typical Max Unit Open-drain Voltage 3.6 V Programmable Current Range 0 5.25 mA Intensity Control 16 step Current Step 0.35 mA Power Down Open-drain Current 1 μA Shutdown Current 1 μA Note: (1) Test condition: SAR_VDD=1.8V, temperature=25 ºC. (2) These parameters are characterized but not tested in manufacturing.

 2015 Microchip Technology Inc. Page 20 Preliminary Edition Table 3-6: AUDIO CODEC ANALOGUE TO DIGITAL CONVERTER T= 25oC, Vdd=3.0V, 1KHz sine wave input, Bandwidth = 20Hz~20KHz Parameter (Condition) Min. Typ. Max. Unit Resolution 16 Bits Output Sample Rate 8 48 KHz Signal to Noise Ratio Note: 1 (SNR @MIC or Line-in mode) 88 dB Digital Gain -54 4.85 dB Digital Gain Resolution 2~6 dB MIC Boost Gain 20 dB Analog Gain 60 dB Analog Gain Resolution 2.0 dB Input full-scale at maximum gain (differential) 4 mV rms Input full-scale at minimum gain (differential) 800 mV rms 3dB bandwidth 20 KHz Microphone mode (input impedance) 24 KΩ THD+N (microphone input) @30mVrms input 0.02 % Note: (1) fin=1KHz, B/W=20~20KHz, A-weighted, THD+N < 1%, 150mVpp input (2) These parameters are characterized but not tested in manufacturing.

 2015 Microchip Technology Inc. Page 21 Preliminary Edition Table 3-7: AUDIO CODEC DIGITAL TO ANALOGUE CONVERTER T= 25oC, Vdd=3.0V, 1KHz sine wave input, Bandwidth = 20Hz~20KHz Parameter (Condition) Min. Typ. Max. Unit Over-sampling rate 128 fs Resolution 16 20 Bits Output Sample Rate 8 48 KHz Signal to Noise Ratio Note: 1 (SNR @cap-less mode) for 48kHz 96 dB Signal to Noise Ratio Note: 1 (SNR @single-end mode) for 48kHz 98 dB Digital Gain -54 4.85 dB Digital Gain Resolution 2~6 dB Analog Gain -28 3 dB Analog Gain Resolution 1 dB Output Voltage Full-scale Swing (AVDD=2.8V) Note:3 742.5 mV rms Maximum Output Power (16Ω load) 34.5 mW Maximum Output Power (32Ω load) 17.2 mW Allowed Load Resistive 8 16 O.C. Ω Capacitive 500 pF THD+N (16Ω load) 0.05 % Signal to Noise Ratio (SNR @ 16Ωload) 96 dB Note: (1) fin=1KHz, B/W=20~20KHz, A-weighted, THD+N < 0.01%, 0dBFS signal, Load=100KΩ (2) These parameters are characterized but not tested in manufacturing. (3) Vdd, AVDD are generated by internal LDO Table 3-8: TRANSMITTER SECTION FOR BDR AND EDR Parameter Min Typ Max Bluetooth specification Unit Maximum RF transmit power 3.0 4.0 -6 to 4 dBm EDR/BDR Relative transmit power -4 -1.2 1 -4 to 1 dB Note: The RF Transmit power is calibrated during production using MP Tool software and MT8852 Bluetooth Test equipment. Test condition: VCC_RF= 1.28V, temperature=25 ºC.

 2015 Microchip Technology Inc. Page 22 Preliminary Edition Table 3-9: RECEIVER SECTION FOR BDR AND EDR Modulation Min Typ Max Bluetooth specification Unit Sensitivity at 0.1% BER GFSK -90 ≤-70 dBm Sensitivity at 0.01% BER π/4 DQPSK -91 ≤-70 dBm 8DPSK -82 ≤-70 dBm Note: (1) Test condition: VCC_RF= 1.28V, temperature=25 ºC. (2) These parameters are characterized but not tested in manufacturing. Table 3-10: SYSTEM CURRENT CONSUMPTION OF ANALOG AUDIO OUTPUT System Status Typ. Max. Unit System Off Mode 2 5 uA Standby Mode 0.8 mA Linked Mode 0.4 mA SCO Link 7.8 mA A2DP Link (V p-p=200mV; 1k tone signal) 10.7 mA Note: Use BM20 EVB as test platform. Test condition: BAT_IN= 3.8V, link with HTC EYE cell phone; distance between cell phone and EVB: 30cm. Table 3-11: SYSTEM CURRENT CONSUMPTION OF DIGITAL AUDIO OUTPUT(I2S) System Status Typ. Max. Unit System Off Mode 2 5 uA Standby Mode 0.4 mA Linked Mode 0.4 mA SCO Link 9.3 mA A2DP Link (1k tone signal) 11.7 mA Note: Use BM23 EVB as test platform Test condition: BAT_IN= 3.8V, link with HTC M8 cell phone; distance between cell phone and EVB: 30cm; I2S signal link with YAMAHA YDA174 EVB

 2015 Microchip Technology Inc. Page 23 Preliminary Edition

4.0 PRINTED ANTENNA INFORMATION

4.1 MODULE RADIATION PATTERN

The stereo module contains a PCB printed antenna. The PCB printed antenna radiation pattern is shown in Figure 4-2. FIGURE 4-1: ANTENNA KEEP OUT AREA EXAMPLES FIGURE 4-2: ANTENNA 3D RADIATION PATTERN @2441 MHz

 2015 Microchip Technology Inc. Page 24 Preliminary Edition

4.2 MODULE PLACEMENT RULE

On the main PCB, the areas under the antenna should not contain any top, inner layer, or bottom copper as shown in Figure 4‐1. A low‐impedance ground plane will ensure the best radio performance (best range, lowest noise). The ground plane can be extended beyond the minimum recommended as need for the main PCB EMC noise reduction. For the best range performance, keep all external metal away from the ceramic chip antenna at least 15 mm. Here are some examples of good and poor placement on a carrier board with GND plane. FIGURE 4-3: MODULE PLACEMENT EXAMPLES FIGURE 4-4: GND PLANE ON MAIN APPLICATION BOARD System GND Plane Worse Case Poor Case Good Case Acceptable Case

 2015 Microchip Technology Inc. Page 25 Preliminary Edition MIC1 Board Name Size Title Rev Date: Sheet of P/N MAIN CIRCUIT 1.1 BM20 Reference Circuit B 1 1Thursday , April 16, 2015 XXXX 5F, No.5, Industry E. Rd. VII, Hsinchu Science Park, Hsinchu City 30078, Taiwan TEL. 886-3-5778385 AMP_EN JP2 JP 1x8 RST_N HCI_TXD HCI_RXD TX_IND Audio AMP Enable P0_0 MFB UART_TXD UART CONTROL (by MCU) UART_RXD RESET_n MFB/RX_IND BAT_IN C19 10u/16VJP5 JP 1x2 Li Battery Connector BAT_IN JP3 JP 1x8 RESERVE For BLUETOOTH DEBUG HCI_TXD HCI_RXD EAN P2_4 P2_0 SW1 SW-TACT 1 2 3 4 MFB HCI_TXD HCI_RXD EAN P2_0 P2_4 PCB1 BM20 ANT1 ANT2 ANT3 P0_0 EAN P3_0 P2_0 P1_5 P0_4 SPKR AOHPM SPKL VDDA MIC1_P MIC1_N MIC_BIAS AIR GND 23 NC

22 BAT_IN

21 ADAP_IN

20 VDD_IO

19 P0_1

18 VCC_RF

17 RST

16 AIL

P2_4 P2_7 P0_5 HCI_RXD HCI_TXD P0_3 P0_2 P2_4 LED2 LED1 MFB BK_OUT SYS_PWR MFB SYS_PWR 1K/1%12 VDD_IO C26 1u/10V P0_0 STS2306 R10 100K 1 2 R12 100K R13 10K 1 2 Slide Switch Circuit SYS_PWRSLIDE_SW GD S STS2301 MFB ON SW8 SW-1BIT 1 2 RESET BUTTON SW2 SW-TACT 1 2 3 4 DP1 DP-4 RST_N 1u/16V MMBT3904 C93 NP-0603 C92 NP-0603 C18 10u/16V LINE_R P3_0 LINE INPUT LINE_L TSH-3865D C15 0.1u/16V 1 2 1 2 NP-0603 NP-0603 C17 1u/16V C16 1u/16V AIL AIR VBUS ID GND USBM3121-051-1-BN-R P0_3 VOL+ FWD P0_1 15p/50V SW5 SW-TACT C12 15p/50V P2_7 SW7 SW-TACT AOHPM P0_2 15p/50V PLAY/PAUSE SPKR SW3 SW-TACT VOL- REV SPKL PJ-2001-5K 15p/50V SW4 SW-TACT C11 15p/50V Stereo Jack P0_5 SW6 SW-TACT LED2 LED1 LED1LED-B LED2LED-HR

12 SYS_PWR

Backup Plug-In Reset Circuit JP6 JP 1x1

1 NFC

MIC_BIAS MIC_N1 MIC_P1 AOHPM AMP_EN P3_0 AIR P0_0 SPKL SPKR P0_1 RST_N AIL VDD_IO BAT_IN MIC_BIAS C13 2.2u/6.3VR3 1 2 R75 1 2 C72 2.2u/6.3V MIC_P1 MIC_N1 P0_5 C10 1u/16V 1 2 MFB P2_4 P2_7 C14 1u/16V SYS_PWR P0_2 LED2 LED1 PJ-2001-5K P0_3

5.0 REFERENCE CIRCUIT

5.1 BM20 REFERENCE CIRCUIT

 2015 Microchip Technology Inc. Page 26 Preliminary Edition SLK0 DR0 ADAP_IN C20 0.1u/16V DT0 EAN P0_0 System Configuration LINE IN Detection P2_0 P2_4 PWR/MFB/UART_RX_IND System Configuration System Configuration P3_0 GPIO Description MFB Receive frame synchronization Transmit frame synchronization BAT_IN P0_4 Serial clock PJ-3894D-S125 AIL AIR SPE0572 STEREO AUX LINE INPUT *P30 Low Active Line In Detect Serial data receive SPE0572 SPE0572 BAT_IN P3_0 470p/50V C12 470p/50V C11 0.1u/16V 10u/16V C10 10u/16V 10K R12 10K R10 1 2 R11 1 2 Serial data transmit ADAP_IN AMP_EN JP2 JP 1x8 HCI_TXD HCI_RXD C17 1u/16V DR0 SLK0 R2 33 1 2 TFS0 RFS0 DT0 RST_N C18 1u/16V MIC_BIAS MIC_N1 MIC_P1 RFS0 DP1 DP-4 P0_0 10u/16V CODEC_VO Audio AMP Enable P2 DC-JACK I2S INTERFACE MIC_N1 MIC_P1 P0_4 2.2u/6.3V R7 1K 1 2 R6 1K 1 2 2.2u/6.3V 220p/50V R8 2K 1 2 MIC_BIAS BATTERY CONNECTOR MFB JP3 JP 1x8 P0_0 DC POWER SOURCE C16 0.1u/16V UART_TX_IND(Flash) TP1 TP-4 LED TX_IND C3 0.047u/25V TP3 TP-4 4.7u/10V MIC_BIAS C6 0.047u/25V JP1 JP 1x8 MIC INPUT SYS_PWRRST_N ADAP_IN R3 33 1 2 R1 33 1 2 R5 33 1 2 R4 33 1 2 MFB/RX_IND RESET_n JP4 SJP 1x2 UART_RXD UART CONTROL (by MCU) PCB1 FP-BM23 P0_0 RFS0 TFS0 SLK0 DR0 DT0 P0_4 EAN MIC1_P MIC1_N MIC_BIAS VDDA AIR AIL GND SYS_PWR

25 AMB_DET

24 BAT_IN

23 ADAP_IN

22 P0_1

21 P1_5

P2_0 P3_0 P2_0 P2_7 P0_5 HCI_RXD HCI_TXD P0_3 P0_2 P2_4 LED2 LED1 MFB BK_OUT MFB P2_0 P3_0 HCI_TXD HCI_RXD P2_4 LED2 LED1 TP2 TP-4 BAT_IN RESERVE For BLUETOOTH DEBUG LED2 C13 0.1u/16VRED BLUE LED1 LED-B LED2 LED-HR SYS_PWR Board Name Size Title Rev Date: Sheet of P/N Reference Circuit of BM23 1.0 Reference Circuit of BM23 B 2 2Friday , March 13, 2015 XXXX 5F, No.5, Industry E. Rd. VII, Hsinchu Science Park, Hsinchu City 30078, Taiwan TEL. 886-3-5778385 LED1 UART_TXD EAN P2_0 P2_4 HCI_RXD EAN P0_4 HCI_TXDTP4 TP-4 Audio AMP Enable(ROM) AIR AIL TFS0

5.2 BM23 REFERENCE CIRCUIT

 2015 Microchip Technology Inc. Page 27 Preliminary Edition

6.0 CERTIFICATION INFORMATION

6.1 BQTF INFORMATION

FIGURE 6-1: BM15/BM20/BM23/BM25 QDID Data

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6.2 REGULATORY APPROVAL

BM23 has got these countries regulatory approval:

• United States; FCC ID: A8TBM23SPKXYC2A
• Canada; IC ID: 12246A-BM23SPKXYC2
• Europe
• Japan;
• Korea; Certification No.: MSIP-CRM-S9S-BM23SPKXY
• Taiwan; NCC No.: CCAL15LP0270T3 BM20 has got these contries regulatory approval  CE: BM20SPKXYNBZ  United States: FCC: A8TBM20SPKXYNBZ  Canada:IC ID: 12246A-BM20SPKS1  HVIN:BM20SPKS1  Japan: 202-SMD048  Korea KCC: MSP-CRM-mcp-BM20SPKS1NBC  Taiwan NCC: CCAN15LP0460T2  China SRRC: CMIIT ID:2015DJ7134 For more information, please reference appendix.

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7.0 MODULE OUTLINE AND REFLOW PROFILE

7.1 MODULE DIMENSION AND PCB FOOT PRINT

FIGURE 7-1: BM20 Outline Dimension

 2015 Microchip Technology Inc. Page 30 Preliminary Edition PCB dimension: X : 15.0 mm Y : 29.0 mm Tolerances: 0.25 mm FIGURE 7-2: BM23 Outline Dimension PCB dimension: X : 15.0 mm Y : 29.0 mm Tolerances: 0.25 mm

 2015 Microchip Technology Inc. Page 31 Preliminary Edition FIGURE 7-3: BM20 PCB FOOT PRINT Note: The “Keep Out Area” is reserved for RF performance check.

 2015 Microchip Technology Inc. Page 32 Preliminary Edition FIGURE 7-4: BM23 PCB FOOT PRINT Note: The “Keep Out Area” is reserved for RF performance check.

 2015 Microchip Technology Inc. Page 33 Preliminary Edition

7.2 REFLOW PROFILE

FIGURE 7-5: REFLOW PROFILE Soldering Recommendations Stereo module was assembled using standard lead‐free reflow profile IPC/JEDEC J‐STD‐020. The module can be soldered to the main PCB using standard leaded and lead‐free solder reflow profiles. To avoid damaging of the module, the recommendations are listed as follows:

• Refer to Microchip Technology Application Note AN233 Solder Reflow Recommendation (DS00233) for the soldering reflow recommendations
• Do not exceed peak temperature (TP) of 250 degree C Slope: 1~2℃/sec max. (217℃ to peak) Ramp down rate : Max. 3℃/sec. Preheat: 150~200℃ 25℃ 217℃ peak: 260 +5/-0℃ 60 ~ 180 sec. 60 ~150sec 20~40 sec. Time (sec)

 2015 Microchip Technology Inc. Page 34 Preliminary Edition

• Refer to the solder paste data sheet for specific reflow profile recommendations
• Use no‐clean flux solder paste
• Do not wash as moisture can be trapped under the shield
• Use only one flow. If the PCB requires multiple flows, apply the module on the final flow.

8.0 PACKAGING AND STORAGE INFORMATION

The module is packaged into trays (see following page) of sixty three (63) modules in a 7 x 9 format. These trays are then sealed into bags. Ten sealed bags are then placed in a box of 630 pieces with a dimension of 36 * 16 * 9.5 cm3. The shelf life of each module in a sealed bag is 12 months at <40°C and <90% relative humidity. After a bag is opened, devices that will be subjected to reflow solder or other high temperature processes must be mounted within 168 hours (7 days) at factory conditions of <30°C and <60% relative humidity.

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8.1 ORDERING INFORMATION

 2015 Microchip Technology Inc. Page 36 Preliminary Edition TABLE 5-1: Module Ordering Information Part Number Description BM20SPKS1NBC Bluetooth 4.1 BDR/EDR, Class 2 Surface Mount module with integrated antenna and shield BM23SPKS1NB9 Bluetooth 4.1 BDR/EDR, Class 2 Surface Mount module with integrated antenna and shield Note: The module can only be purchased through a Microchip representative. Go to http://www.microchip.com/ for current pricing and a list of distributors carrying Microchip products. APPENDIX

 2015 Microchip Technology Inc. Page 37 Preliminary Edition A.1 United States The module has received Federal Communications Commission (FCC) CFR47 Telecommunications, Part 15 Subpart C “Intentional Radiators” modular approval in accordance with Part 15.212 Modular Transmitter approval. Modular approval allows the end user to integrate the module into a finished product without obtaining subsequent and separate FCC approvals for intentional radiation, provided no changes or modifications are made to the module circuitry. Changes or modifications could void the user’s authority to operate the equipment. The end user must comply with all of the instructions provided by the Grantee, which indicate installation and/or operating conditions necessary for compliance. The finished product is required to comply with all applicable FCC equipment authorizations regulations, requirements and equipment functions not associated with the transmitter module portion. For example, compliance must be demonstrated to regulations for other transmitter components within the host product; to requirements for unintentional radiators (Part 15 Subpart B “Unintentional Radiators”), such as digital devices, computer peripherals, radio receivers, etc.; and to additional authorization requirements for the non‐ transmitter functions on the transmitter module (i.e., Verification, or Declaration of Conformity) (e.g., transmitter modules may also contain digital logic functions) as appropriate. A.1.1 LABELING AND USER INFORMATION REQUIREMENTS The module has been labeled with its own FCC ID number, and if the FCC ID is not visible when the module is installed inside another device, then the outside of the finished product into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording as follows: Contains Transmitter Module FCC ID: A8TBM23SPKXYC2A or Contains FCC ID: A8TBM23SPKXYC2A This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation A user’s manual for the finished product should include the following statement:

 2015 Microchip Technology Inc. Page 38 Preliminary Edition This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy, and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help. Additional information on labeling and user information requirements for Part 15 devices can be found in KDB Publication 784748 available at the FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB) http://apps.fcc.gov/oetcf/kdb/index.cfm.

3.1.2 RF EXPOSURE

All transmitters regulated by FCC must comply with RF exposure requirements. KDB 447498 General RF Exposure Guidance provides guidance in determining whether proposed or existing transmitting facilities, operations or devices comply with limits for human exposure to Radio Frequency (RF) fields adopted by the Federal Communications Commission (FCC). From the FCC Grant: Output power listed is conducted. This grant is valid only when the module is sold to OEM integrators and must be installed by the OEM or OEM integrators. This transmitter is restricted for use with the specific antenna(s) tested in this application for Certification and must not be co‐located or operating in conjunction with any other antenna or transmitters within a host device, except in accordance with FCC multi‐transmitter product procedures.

3.1.3 HELPFUL WEB SITES

Federal Communications Commission (FCC): http://www.fcc.gov FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB): http://apps.fcc.gov/oetcf/kdb/index.cfm

 2015 Microchip Technology Inc. Page 39 Preliminary Edition the host device, otherwise the A.2 Canada The BM23 module has been certified for use in Canada under Industry Canada (IC) Radio Standards Specification (RSS) RSS‐210 and RSS‐Gen. Modular approval permits the installation of a module in a host device without the need to recertify the device. A.2.1 LABELING AND USER INFORMATION REQUIREMENTS Labeling Requirements for the Host Device (from Section 3.2.1, RSS‐Gen, Issue 3, December 2010): The host device shall be properly labeled to identify the module within the host device. The Industry Canada certification label of a module shall be clearly visible at all times when installed in host device must be labeled to display the Industry Canada certification number of the module, preceded by the words “Contains transmitter module”, or the word “Contains”, or similar wording expressing the same meaning, as follows: Contains transmitter module IC: 12246A-BM23SPKXYC2 User Manual Notice for License‐Exempt Radio Apparatus (from Section 7.1.3 RSS‐Gen, Issue 3, December 2010): User manuals for license‐exempt radio apparatus shall contain the following or equivalent notice in a conspicuous location in the user manual or alternatively on the device or both: This device complies with Industry Canada license‐exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Transmitter Antenna (from Section 7.1.2 RSS‐Gen, Issue 3, December 2010): User manuals for transmitters shall display the following notice in a conspicuous location:

 2015 Microchip Technology Inc. Page 40 Preliminary Edition Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. The above notice may be affixed to the device instead of displayed in the user manual. User manuals for transmitters equipped with detachable antennas shall also contain the following notice in a conspicuous location: This radio transmitter (identify the device by certification number, or model number if Category II) has been approved by Industry Canada to operate with the antenna types listed below with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Immediately following the above notice, the manufacturer shall provide a list of all antenna types approved for use with the transmitter, indicating the maximum permissible antenna gain (in dBi) and required impedance for each. A.2.2 OSURE All transmitters regulated by IC must comply with RF exposure requirements listed in RSS‐102 ‐ Radio Frequency (RF) Exposure Compliance of Radiocommunication Apparatus (All Frequency Bands). A.2.3 WEB SITES Industry Canada: http://www.ic.gc.ca/

 2015 Microchip Technology Inc. Page 41 Preliminary Edition A.3 Europe The BM23 module is an R&TTE Directive assessed radio module that is CE marked and has been manufactured and tested with the intention of being integrated into a final product. The BM23 module has been tested to R&TTE Directive 1999/5/EC Essential Requirements for Health and Safety (Article (3.1(a)), Electromagnetic Compatibility (EMC) (Article 3.1(b)), and Radio (Article 3.2) and are summarized in Table 3‐1: European Compliance Testing. A Notified Body Opinion has also been issued. The R&TTE Compliance Association provides guidance on modular devices in document Technical Guidance Note 01 available at http://www.rtteca.com/html/download_area.htm. Note: To maintain conformance to the testing listed in Table A.3‐1: European Compliance Testing, the module shall be installed in accordance with the installation instructions in this data sheet and shall not be modified. When integrating a radio module into a completed product the integrator becomes the manufacturerof the final product and is therefore responsible for demonstrating compliance of the final product with the essential requirements of the R&TTE Directive. A.3.1 ABELING AND USER INFORMATION REQUIREMENTS The label on the final product which contains the BM23 module must follow CE marking requirements. The R&TTE Compliance Association Technical Guidance Note 01 provides guidance on final product CE marking. A.3.2 ANTENNA REQUIREMENTS From R&TTE Compliance Association document Technical Guidance Note 01: Provided the integrator installing an assessed radio module with an integral or specific antenna and installed in conformance with the radio module manufacturer’s installation instructions requires no further evaluation under Article 3.2 of the R&TTE Directive and does not require further involvement of an R&TTE Directive Notified Body for the final product. [Section 2.2.4] The European Compliance Testing listed in Table 3‐1 was performed using the integral ceramic chip antenna. TABLE A .3‐1: EUROPEAN COMPLIANCE TESTING Certificatio n Standards Article Laboratory Report Number Date Safety EN 60950‐ 1:2006+A11:2009+A1:2010 (3.1(a)) Health EN 50371:2002‐03 EN 301 489‐17 V2.1.1 (2009‐05) Radio EN 300 328 V1.7.1 (2006‐10) (3.2) Notified Body Opinion

 2015 Microchip Technology Inc. Page 42 Preliminary Edition A.3.3 HELPFUL WEB SITES A document that can be used as a starting point in understanding the use of Short Range Devices (SRD) in Europe is the European Radio Communications Committee (ERC) Recommendation 70‐ 03 E, which can be downloaded from the European Radio Communications Office (ERO) at: http://www.ero.dk/. Additional helpful web sites are:

• Radio and Telecommunications Terminal Equipment (R&TTE): http://ec.europa.eu/enterprise/rtte/index_en.htm
• European Conference of Postal and Telecommunications Administrations (CEPT): http://www.cept.org
• European Telecommunications Standards Institute (ETSI): http://www.etsi.org
• European Radio Communications Office (ERO): http://www.ero.dk
• The Radio and Telecommunications Terminal Equipment Compliance Association (R&TTE CA): http://www.rtteca.com/

 2015 Microchip Technology Inc. Page 43 Preliminary Edition A.4 Japan The BM23 module has received type certification and is labeled with its own technical conformity mark and certification number as required to conform to the technical standards regulated by the Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the Radio Act of Japan. Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. Additional testing may be required:

• If the host product is subject to electrical appliance safety (for example, powered from an AC mains), the host product may require Product Safety Electrical Appliance and Material (PSE) testing. The integrator should contact their conformance laboratory to determine if this testing is required.
• There is an voluntary Electromagnetic Compatibility (EMC) test for the host product administered by VCCI: http://www.vcci.jp/vcci_e/index.html A.4.1 LABELING AND USER INFORMATION REQUIREMENTS The label on the final product which contains the BM23 module must follow Japan marking requirements. The integrator of the module should refer to the labeling requirements for Japan available at the Ministry of Internal Affairs and Communications (MIC) website. The BM23 module is labeled with its own technical conformity mark and certification number. The final product in which this module is being used must have a label referring to the type certified module inside: Contains transmitter module with certificate number: A.4.2 HELPFUL WEB SITES Ministry of Internal Affairs and Communications (MIC): (ARIB): http://www.arib.or.jp/english/

 2015 Microchip Technology Inc. Page 44 Preliminary Edition A.5 Korea The BM23 module has received certification of conformity in accordance with the Radio Waves Act. Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. A.5.1 LABELING AND USER INFORMATION REQUIREMENTS The label on the final product which contains the BM23 module must follow KC marking requirements. The integrator of the module should refer to the labeling requirements for Korea available on the Korea Communications Commission (KCC) website. The BM23 module is labeled with its own KC mark. The final product requires the KC mark and certificate number of the module: (MSIP-CRM-S9S-BM23SPKXY) A.5.2 HELPFUL WEB SITES Korea Communications Commission (KCC): http://www.kcc.go.kr National Radio Research Agency (RRA): http://rra.go.kr

 2015 Microchip Technology Inc. Page 45 Preliminary Edition A.6 Taiwan The BM23 module has received compliance approval in accordance with the Telecommunications Act. Customers seeking to use the compliance approval in their product should contact Microchip Technology sales or distribution partners to obtain a Letter of Authority. installation instructions are followed and no modifications of the module are allowed. Integration of this module into a final product does not require additional radio certification provided A.6.1 LABELING AND USER INFORMATION REQUIREMENTS The BM23 module is labeled with its own NCC mark and certificate number as below: The user’s manual should contain below warning (for RF device) in traditional Chinese: 注意 ! 依據 低功率電波輻射性電機管理辦法 第十二條 經型式認證合格之低功率射頻電機，非經許可， 公司 、商號或使用者均不得擅自變更頻率、加大功率或變更原設計 之 特性及功能。 第十四條 低功率射頻電機之使用不得影響飛航安全及干擾合法通信； 經發現有干擾現象時，應立 即停用，並改善至無干擾時方得繼續使用。 前項合法通信，指依電信規定作業之無線電信。 低 功率射頻電機須忍受合法通信或工業、科學及醫療用電波輻射性 電機設備之干擾。 A.6.2 HELPFUL WEB SITES National Communications Commission (NCC): http://www.ncc.gov.tw CCAL15LP0270T3

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