BM091M

BM091M BENCENT | Alldatasheet

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Description

00A @ 8/20μ 100V/s At 1kV/ At 1kV/ At 100V/ At 100V/ 8/20μs ±10t 8/20μs 1 t 10/350μs 50Hz,1S,10 50Hz,0.18S,1 At 1A DC=50V VDC=0.5 28.1-2003 ance with ITU n :2003 Customers sho μs Sc Pa Ex s μs μs /μs /μs times time 1time times 1times V U-T Rec. K. S uld verify actua chematic Sy ackage (Top xterior for 99 % of Typical val for 99 % of Typical val 12; IEC 6164 Specifications a al device perfor ymbol p View) 90±20% f measured va ues of distrib f measured va lues of distrib 20,000 25,000 2500 100 ≤1.5 ~1.75 -40-90 without SMD 43-21 are subject to ch rmance in their Order Co Vers alues ≤ 600 bution ≤ 550 alues ≤ 500 bution ≤ 450 D BM09 hange without n specific applic ode: BM 0 sion: A1 201 6 V V 0 V V 0 V A A A A A V GΩ pF g notice. ations 091M 6-01-06 V V V V V A A A A A V Ω F g

(1)B (2) D (3) T Par Rec Pro Env Hi Lo Vib Re Not Sol www .be s Discharge BM (1) Bencent SM D L×W×H) (mm DC Breakdow Tolerance is D rt Numberin commended oduct Dimen vironmental T igh Temperatu ow Temperatu bration esistance of so te: Up-screen lderability T Sold encent.co Tube XXX M (2) ˄3 D Gas Dis c wn Voltage, e.g. DC Breakdown ng System d Soldering nsions l Reliability Testing items ure Storage T ure Storage T oldering heat n program ca Test derability om.cn M charge Tube ., 091=9×101= n Voltage, M=± Pad y Characteri s Test Test t an be specifie S in 8.3×8.3 × =90V ±20%, N=±30% istics Tempera Time:2H Tempera Time:2H Frequenc Amplitu Time：4 Tempera Time of ed by custom Solder Pot Tem Solder Dwe Customers sho T Pr ature: 90℃ H ature: -40℃ H cy：10-500H ude：0.15mm 45min ature: 260±5℃ dip soldering mer’s request mperature: ell Time: S uld verify actua Lead Mater Body Mater Terminal Fin roduct Char Techn Hz m g：10s，1tim REF A B C D E F REF A B C via contactin 245℃ 4-6 sec Specifications a al device perfor rial rial nish 1 racteristics nical standard me mm Φ9.3±0. 4.2±0.1 7.9±0.2 8.3±0.2 0.5±0.0 6±0.2 mm 7.95 4.5 ng Bencent s ±5℃ conds are subject to ch rmance in their Order Co Vers Copp Ceram 100% Matte- ds .1 Φ 1 0 2 0 2 0 service Lead-Free R BM09 hange without n specific applic ode: BM 0 sion: A1 201 6 per mics -Tin Plated inch Φ0.366±0.004 0.165±0.004 0.311±0.008 0.327±0.008 0.02±0.002 0.236±0.008 inch 0.313 0.177 0.315 Recommendat notice. ations 091M 6-01-06 tion

a Av Tam TS( Ref Pea Tim Tem Ra Tim (Tp Do www .be s Discharge kage Reel I flow Profile OUTLINE TAPING Reflow at Tempe Tempe Time verage ramp u mp˄TL˅ t o (max) to TL - flow - Te (Li - Te ak Temperatu me within 5°C mperature (tp amp-down Ra me 25°C to pe o not exceed encent.co Tube Information e E G Condition erature Min erature Max ˄min to ma up rate˄Liqu o peal Ramp-up Ra emperature (T iquids) emperature (T ure (Tp) C of actual p ate eak Tempera om.cn n REEL (PCS) 500 Pb- 150° 200° ax˅ 60 – uids˅ 3°C/ ate 3°C / TL) 217° TL) 60 – 260+ eak 20 – 6°C/ ture 8 mi 260° INSID CARTO (PCS 1000 -Free assemb 180 secs /second max /second max 150 seconds +0/-5 °C 40 seconds /second max inutes Max. Customers sho DE ON P bly Temperature S uld verify actua REF F E W D PER CARTO (PCS) 8000 TP TL TS(max) TS(min) t p Specifications a al device perfor F m 4.0 0 Φ1 2.0 6.5 0 8.4 7.5 1.75 2 Φ13 1 16. 5 ON L time to peak temper Preheat Ra tS are subject to ch rmance in their Order Co Vers mm 0±0.1 ﹢0.1 ±0.1 0±0.1 ±0.2 ±0.2 5±0.1 5±0.1 ±0.3 30±2 100 3±0.15 5±0.4 CARTON L W 60 36 ature amp-up BM09 hange without n specific applic ode: BM 0 sion: A1 201 6 inch 0.157±0.00 Φ0.059+0.00 0.472±0.00 0.079±0.00 0.256±0.00 0.331±0.00 0.295±0.00 0.069±0.00 0.63±0.01 Φ12.99±0.0 Φ3.94 ﹢0.03 0.512±0.00 0.65±0.01 SIZE(mm) W H 60 38 tP Ramp-down Time Critica TL to T TL -0.07 notice. ations 091M 6-01-06 079 H al Zone TP