BLV861 PHILIPS | Alldatasheet

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Technical content

Product specification Supersedes data of 1998 Jan 14

1998 Jan 16

UHF linear push-pull power transistor book, halfpage M3D099

1998 Jan 16 2

Philips Semiconductors Product specification UHF linear push-pull power transistor BLV861

FEATURES

  • Double stage internal input and output matching networks for an optimum wideband capability and high gain
  • Polysilicon emitter ballasting resistors for an optimum temperature profile
  • Gold metallization ensures excellent reliability.

APPLICATIONS

  • Common emitter class-AB output stages of television transmitter amplifiers (sound and vision) operating in bands 4 and 5 (470 to 860 MHz).

DESCRIPTION

NPN silicon planar epitaxial transistor with two sections in push-pull configuration. The device is encapsulated in a SOT289A 4-lead rectangular flange package, with a ceramic cap. PINNING Notes 1. Collectors c1 and c2 are internally connected. 2. Common emitters are connected to the flange. PIN SYMBOL DESCRIPTION 1 c1 collector 1; note 1 2 c2 collector 2; note 1 3 b1 base 1 4 b2 base 2 5 e common emitters; note 2 Fig.1 Simplified outline (SOT289A) and symbol. handbook, halfpage MAM374 e Top view QUICK REFERENCE DATA RF performance at Th =2 5°C in a common emitter push-pull test circuit. MODE OF OPERATION f (MHz) VCE (V) PL (W) G p (dB) ηC (%) ΔG p (dB) CW class-AB 860 28 100 ≥8.5 ≥55 ≤1 WARNING Product and environmental safety - toxic materials This product contains beryllium oxide. The product is entirely safe provided that the BeO disc is not damaged. All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of the user. It must never be thrown out with the general or domestic waste.

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Philips Semiconductors Product specification UHF linear push-pull power transistor BLV861 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). THERMAL CHARACTERISTICS Note 1. Thermal resistance is determined under specified RF operating conditions. SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCBO collector-base voltage open emitter − 65 V VCEO collector-emitter voltage open base − 30 V VEBO emitter-base voltage open collector − 3V IC collector current (DC) − 15 A Ptot total power dissipation T mb =2 5°C − 220 W Tstg storage temperature −65 +150 °C Tj operating junction temperature − 200 °C SYMBOL PARAMETER CONDITIONS VALUE UNIT R th j-mb thermal resistance from junction to mounting base Ptot= 220 W; note 1 0.8 K/W R th mb-h thermal resistance from mounting base to heatsink 0.2 K/W Fig.2 DC SOAR. Total device; both sections equally loaded. (1) Tmb =2 5°C. (2) Th =7 0°C. handbook, halfpage 102 MGK766 11 0 1 0 2 VCE (V) IC (A) (2) (1)

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Philips Semiconductors Product specification UHF linear push-pull power transistor BLV861 CHARACTERISTICS Values apply to either transistor section; Tj=2 5°C unless otherwise specified. Note 1. The value of Cc is that of the die only; it is not measurable because of the internal matching network.

APPLICATION INFORMATION

RF performance at Th =2 5°C in a common emitter push-pull class-AB test circuit. Ruggedness in class-AB operation The BLV861 is capable of withstanding a load mismatch corresponding to VSWR=3:1 through all phases under the conditions: Th =2 5°C; f = 860 MHz; VCE = 28 V; ICQ = 0.1 A; PL = 100 W; Rth mb-h= 0.2 K/W. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT V(BR)CBO collector-base breakdown voltage IE = 0; IC =3 5m A 6 5 −− V V(BR)CEO collector-emitter breakdown voltage IB = 0; IC =9 0m A 3 0 −− V V(BR)EBO emitter-base breakdown voltage I E = 2 mA; IC =0 3 −− V ICBO collector-base leakage current V CB =2 8V −− 3m A hFE DC current gain I C = 2.8 A; VCE =1 0V 3 0 − 120 − ΔhFE DC current gain ratio of both sections IC = 4.5 A; VCE = 10 V 0.67 − 1.5 − C c collector capacitance I E =ie= 0; VCE =2 8V ; f = 1 MHz; note 1 − 47 − pF MODE OF OPERATION f (MHz) VCE (V) ICQ (A) PL (W) G p (dB) ηC (%) ΔG p (dB) CW class-AB 860 28 0.1 100 ≥8.5 ≥55 ≤1

1998 Jan 16 5

Philips Semiconductors Product specification UHF linear push-pull power transistor BLV861 Fig.3 Power gain and collector efficiency as functions of load power; typical values. Th =2 5°C; f = 860 MHz; VCE = 28 V; ICQ = 0.1 A. handbook, halfpage MGK768 0 40 80 160 120 PL (W) G p (dB) G p ηC (%) ηC Th =2 5°C; f = 860 MHz; VCE = 28 V; ICQ = 0.1 A. Fig.4 Load power as a function of drive power; typical values. handbook, halfpage 01 0 3 0 MGK769 150 100 PD (W) PL (W) Fig.5 Intermodulation distortion as a function of output power; typical values. Th =2 5°C; VCE =2 8V ; ICQ = 0.1 A; 2-tone: f vision= 855.25 MHz (−8 dB); fsideband= 859.68 MHz (−16 dB). handbook, halfpage 0 200 100 300 400 −60 −20 −30 −40 −50 MGK770 Po sync (dB) dim (dB) Fig.6 Intermodulation distortion as a function of output power; typical values. Th =2 5°C; VCE =2 8V ; ICQ = 0.1 A; 3-tone: f vision= 855.25 MHz (−8 dB); fsideband= 859.68 MHz (−16 dB); fsound = 860.75 MHz (−10 dB). handbook, halfpage 0 200 100 15050 250 −60 −20 −30 −40 −50 MGK771 Po sync (W) dim (dB)

1998 Jan 16 6

Philips Semiconductors Product specification UHF linear push-pull power transistor BLV861 Fig.7 Class-AB test circuit at 860 MHz. handbook, full pagewidth MGK775 /,/, /,/,/, /,/,/,/, /,/,/,/, /,/,/, /,/,/, /,/,/,/, /,/,/,/, /,/,/, /,/,/, C6C5 C9C8C7 TR1 VCE = 28 V VCE = 28 V 50 Ω output 50 Ω input C10 C11 C12 C13 C2 C3 C14 C15 Vbias Vbias R5P1 TR3 TR2

1998 Jan 16 7

Philips Semiconductors Product specification UHF linear push-pull power transistor BLV861 Fig.8 Printed-circuit board and component layout for the 860 MHz class-AB test circuit. Dimensions in mm. The components are situated on one side of the copper-clad PTFE-glass board (TLX8) from Taconic, the other side is unetched and serves as a ground plane. Earth connections from the component side to the ground plane are made by through metallization. handbook, full pagewidth 50 Ω input 50 Ω output X2X1 TR1 R1C1 C13 C10 MGK776 C11 C12 TR3 VCE TR2 P1 R3 R4 R5 C14 C15 140

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Philips Semiconductors Product specification UHF linear push-pull power transistor BLV861 List of components Notes 1. American Technical Ceramics type 100A or capacitor of same quality. 2. American Technical Ceramics type 100B or capacitor of same quality. 3. American Technical Ceramics type 180R or capacitor of same quality. 4. The striplines are on a double copper-clad printed-circuit board: PTFE-glass material (TLX8) from Taconic r = 2.55); thickness 0.5 mm. COMPONENT DESCRIPTION VALUE DIMENSIONS CATALOGUE No. C1, C13 multilayer ceramic chip capacitor; note 1 15 pF C2, C11, C15 multilayer ceramic chip capacitor 15 nF 0805 2222 590 16629 C3, C12 multilayer ceramic chip capacitor 100 nF 1206 2222 581 16641 C4, C10 solid aluminium capacitor 100 µF; 40 V 2222 031 37101 C5 multilayer ceramic chip capacitor; note 2 8.2 pF C6 multilayer ceramic chip capacitor + Tekelek trimmer; note 2 10 pF; 0.6 to 4.5 pF C7 multilayer ceramic chip capacitor; note 3 10 pF C8 multilayer ceramic chip capacitor; note 3 2.7 pF C9 multilayer ceramic chip capacitor; note 2 3 pF C14 multilayer ceramic chip capacitor; note 1 100 nF L1, L8 stripline; note 4 46 × 1.8 mm L2, L3 stripline; note 4 20 × 5m m L4, L5 stripline; note 4 10 × 10 mm L6, L7 stripline; note 4 21 × 5m m B1 semi rigid coax balun UT70-25 Z = 25 Ω± 1.5Ω 46 mm B2 semi rigid coax balun UT70-25 Z = 25 Ω± 1.5Ω 46 mm R1, R2, R4 SMD resistor 1 Ω 0805 2122 118 04562 R3 SMD resistor 47 Ω 0805 2122 118 04598 R5 SMD resistor 1.2 k Ω 0805 2122 118 04579 P1 potentiometer 4.7 k Ω X1, X2 copper ribbon hairpin TR1 NPN push-pull RF transistor BLV861 9340 542 40112 TR2, TR3 NPN transistor BD139 9330 912 20112

1998 Jan 16 9

Philips Semiconductors Product specification UHF linear push-pull power transistor BLV861 Fig.9 Input impedance (per section) as a function of frequency (series components); typical values. Th =2 5°C; VCE = 28 V; ICQ = 0.1 A; PL = 100 W (total device). handbook, halfpage5 MGK772 Zi (Ω ) ri xi 400 600 800500 700 900 f (MHz) Fig.10 Load impedance (per section) as a function of frequency (series components); typical values. Th =2 5°C; VCE = 28 V; ICQ = 0.1 A; PL = 100 W (total device). handbook, halfpage 400 600 800500 700 900 MGK773 ZL (Ω ) f (MHz) R L XL Fig.11 Power gain and collector efficiency as functions of frequency; typical values. Th =2 5°C; VCE = 28 V; ICQ = 0.1 A; PL = 100 W (total device). handbook, halfpage 400 600 800 900 MGK774 f (MHz) G p (dB) ηC (%) 500 700 G p ηC Fig.12 Definition of transistor impedance. handbook, halfpage MBA451 Zi ZL

1998 Jan 16 10

Philips Semiconductors Product specification UHF linear push-pull power transistor BLV861 PACKAGE OUTLINE REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ SOT289A 97-06-28 0 5 10 mm scale Flanged ceramic package; 2 mounting holes; 4 leads SOT289A D U 1 H 1 A U 2H Ep b Q F c M A w 3 M Cw 2 q e C B w 1 ABM UNIT A mm Db 3.33 3.07 0.10 0.05 13.10 12.90 4.60 19.81 19.05 11.81 11.56 4.65 3.92 c EU 2 0.250.51 1.02 w 3 21.44 qw 2w 1F 1.65 1.40 U 1 28.07 27.81 H 1 4.85 4.34 p 3.43 3.17 Q 2.31 2.06 e 11.53 11.33 inches 0.131 0.121 0.004 0.002 0.516 0.508 0.181 0.780 0.750 0.465 0.455 0.183 0.055 1.105 1.095 0.191 0.171 0.135 0.125 0.091 0.081 0.454 0.446 H DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)

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Philips Semiconductors Product specification UHF linear push-pull power transistor BLV861 DEFINITIONS LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. Data Sheet Status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Where application information is given, it is advisory and does not form part of the specification.

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