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Document overview
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Technical content
1.1 General description
RF performance at VDS = 28 V; IDq = 110 mA.
1.2 Features and benefits
1.3 Applications
Table 1. Application performance (multiple frequencies) Typical RF performance at Tcase =2 5 C; IDq = 110 mA; in a class-AB application circuit.
[1] To be used in singl e ended applications only. Table 2. Pinning Table 3. Ordering information Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).
- Recommended operating conditions
See application note AN11198 for more details. Table 5. Thermal characteristics Table 6. DC characteristics Tj = 25 C; unless otherwise specified.
8.1 Frequency band 21 10 MHz to 2170 MHz
8.1.1 Application circuit
Table 7. RF characteristics IDq =1 1 0 m A ; Tcase =2 5 C; unless otherwise specified, in a production circuit. thickness copper plating is 35 m. See Table 8 for list of components. Table 8. List of components See Figure 2 for component layout. thickness copper plating is 35 m.
[1] American Technical Ce ramics type 100A or capacitor of same quality. [2] Murata GRM31MR71H105KA88L or capacitor of same quality. [3] Murata GRM21BR71H104KA01L or capacitor of same quality. [4] Murata GRM32ER71H106KA88L or capacitor of same quality.
8.1.2 Graphs
8.1.2.1 Pulsed CW
Table 8. List of components …continued See Figure 2 for component layout. thickness copper plating is 35 m.
Product data sheet Rev. 2 — 30 May 2013 6 of 16 NXP Semiconductors BLP7G22-10 LDMOS driver transistor VDS =2 8V ; IDq = 110 mA; f = 2140 MHz; = 10 %; tp = 20 s. (1) G p at Tcase = 37 C (2) G p at Tcase = 25 C (3) G p at Tcase = 85 C (4) D at Tcase = 37 C (5) D at Tcase = 25 C (6) D at Tcase = 85 C Fig 5. Power gain and drain efficiency as function of load power; typical values DDD *S*S Ș'Ș'
Product data sheet Rev. 2 — 30 May 2013 7 of 16 NXP Semiconductors BLP7G22-10 LDMOS driver transistor 8.1.2.2 2-Carrier W-CDMA VDS =2 8V ; IDq =1 1 0m A ; Tcase = 25 C; carrier spacing = 5 MHz; 46 % clipping; PAR = 8.4 dB at 0.01 % probability on CCDF. (1) G p at f = 2110 MHz (2) G p at f = 2140 MHz (3) G p at f = 2170 MHz (4) D at f = 2110 MHz (5) D at f = 2140 MHz (6) D at f = 2170 MHz VDS =2 8V ; IDq =1 1 0m A ; Tcase = 25 C; carrier spacing = 5 MHz; 46 % clipping; PAR = 8.4 dB at 0.01 % probability on CCDF. (1) f = 2110 MHz (2) f = 2140 MHz (3) f = 2170 MHz Fig 6. Power gain and drain efficiency as function of load power; typical values Fig 7. Adjacent channel power ratio (5 MHz) as a function of load power; typical values DDD *S*S Ș'Ș' DDD G%F G%F G%F
Product data sheet Rev. 2 — 30 May 2013 8 of 16 NXP Semiconductors BLP7G22-10 LDMOS driver transistor
8.2 Frequency band 7 28 MHz to 768 MHz
8.2.1 Application circuit
VDS =2 8V ; IDq = 110 mA; f = 2140 MHz; carrier spacing = 5 MHz; 46 % clipping; PAR = 8.4 dB at 0.01 % probability on CCDF. (1) T case = 37 C (2) T case = 25 C (3) T case = 85 C Fig 8. Adjacent channel power ratio (5 MHz) as a function of load power; typical values DDD G%F G%F G%F The used Printed-Circuit Board (PCB) material is Rogers RO4350; thickness = 0.762 mm; r = 3.5; thickness copper plating is 35 m. See Table 9 for list of components. Fig 9. Component layout DDD %/3*6 WR0+] 52PLO ,1387 287387 *1' & && & & & & & %,$6 '5$,1 *1' & &
[1] American Technical Ce ramics type 100A or capacitor of same quality. [2] Murata GRM21BR71H104KA01L or capacitor of same quality. [3] Murata GRM32ER71H106KA88L or capacitor of same quality.
8.2.2 Graphs
Table 9. List of components See Figure 9 for component layout. thickness copper plating is 35 m.
Product data sheet Rev. 2 — 30 May 2013 10 of 16 NXP Semiconductors BLP7G22-10 LDMOS driver transistor 9. Test information
9.1 Ruggedness in class-AB operation
The BLP7G22-10 is capable of withstanding a load mismatch corresponding to VSWR = 10 : 1 through all phases under the following conditions: VDS =2 8V ; IDq =1 1 0m A ; PL = 10 W; frequency from 700 MHz to 2700 MHz.
Product data sheet Rev. 2 — 30 May 2013 11 of 16 NXP Semiconductors BLP7G22-10 LDMOS driver transistor 10. Package outline Fig 12. Package outline SOT1179-2 (HVSON12) 5HIHUHQFHV2XWOLQH YHUVLRQ (XURSHDQ SURMHFWLRQ ,VVXHGDWH ,(& -('(& -(,7$ 627 VRW BSR 8QLW PP PD[ QRP PLQ 'LPHQVLRQV PPDUHWKHRULJLQDOGLPHQVLRQV 1RWH 3ODVWLFRUPHWDOSURWUXVLRQVRIPPPD[LPXPSHUVLGHDUHQRWLQFOXGHG +9621 SODVWLFWKHUPDOHQKDQFHGYHU\\WKLQVPDOORXWOLQHSDFNDJH QROHDGV WHUPLQDOV ERG\\[[PP 627 $ E 'K ( HH / YZ PP VFDOH \\&\\ % $ WHUPLQDO LQGH[DUHD GHWDLO; F E H H H $&%Y WHUPLQDO LQGH[DUHD
electrostatic sensitive devices. Table 10. Abbreviations
Table 11. Revision history
- Section 2 on page 2: several changes have been made
- Section 3 on page 2: several changes have been made
- Section 5 on page 3: section has been added
- Section 6 on page 3: several changes have been made
- Section 7 on page 3: several changes have been made
- Section 8 on page 4: section has been added
- Section 9 on page 10: section has been added
- Section 9.1 on page 10: section has been moved here from Section 7 on page 3
- Section 10 on page 11: the package outline has been changed BLP7G22-10 v.1 20120213 Objective data sheet - -
Product data sheet Rev. 2 — 30 May 2013 14 of 16 NXP Semiconductors BLP7G22-10 LDMOS driver transistor 14. Legal information
14.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
14.2 Definitions
Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.
14.3 Disclaimers
Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.
Product data sheet Rev. 2 — 30 May 2013 15 of 16 NXP Semiconductors BLP7G22-10 LDMOS driver transistor Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 15. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors BLP7G22-10 LDMOS driver transistor © NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 30 May 2013 Document identifier: BLP7G22-10 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 16. Contents