DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 19
Technical content
1.1 General description
purpose driver or small cell final in the frequency range from 700 MHz to 1000 MHz. Available in gull wing or straight lead outline.
1.2 Features and benefits
1.3 Applications
Table 1. Application performance Typical RF performance at Tcase = 25 C; IDq1 = 15 mA; IDq2 = 60 mA. unless otherwise specified in a class-AB production circuit.
2.1 Pinning
2.2 Pin description
The exposed backside of the package is the ground terminal of the device. Table 2. Pin description
Table 2. Pin description …continued Table 3. Ordering information Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).
[1] When operated with a CW signal. [1] In production circuit with 1.3 k gate feed resistor. [2] In production circuit with 1.2 k gate feed resistor. Table 5. Thermal characteristics Table 6. DC characteristics case = 25 C; per section unless otherwise specified. Table 7. RF Characteristics PL(AV) = 8 W. Unless otherwise specified, measured in an NXP straight lead production circuit.
[1] 3GPP test model 1; 64 DPCH; PAR = 9.9 dB at 0.01 % probability on CCDF. Table 7. RF Characteristics …continued PL(AV) = 8 W. Unless otherwise specified, measured in an NXP straight lead production circuit. Table 8. Typical performance measured in a NXP wideband f = 700 MHz to 1000 MHz class AB application circuit.
Product data sheet Rev. 2 — 31 August 2015 6 of 19 NXP Semiconductors BLM8G0710S-15PB(G) LDMOS 2-stage power MMIC Printed-Circuit Board (PCB): Rogers 4350; thickness = 0.508 mm. Fig 3. Component layout for class-AB application circuit DDD PP PP Nȍ Nȍ Nȍ Nȍ
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx Product data sheet Rev. 2 — 31 August 2015 7 of 19 NXP Semiconductors BLM8G0710S-15PB(G) LDMOS 2-stage power MMIC Fig 4. Electrical schematic 5)LQ 9'6 9'6 ȍ Nȍ Nȍ DDD 9*6 9'6 %/0*63%3DWK$ %/0*63% 6LQJOHHQGHGFODVV$%FRPSDFWERDUG VFKHPDWLFV0+]YU %/0*63%3DWK% 9*6 9*6 5)B,1B$ QF QF QF QF QF QF 5)B,1B% 9'6 9*6 9'6 'ULYHU FODPSHG 5)VHQVH)(7 'ULYHU 5)SRZHU)(7 )LQDO FODPSHG 5)VHQVH)(7 'ULYHU FODPSHG 5)VHQVH)(7 )LQDO FODPSHG 5)VHQVH)(7 )LQDO 5)SRZHU)(7 'ULYHU 5)SRZHU)(7 )LQDO 5)SRZHU)(7 5)RXW $7&) $7&) $7&) IHUULWH $7&) IHUULWH Nȍ Nȍ
Product data sheet Rev. 2 — 31 August 2015 8 of 19 NXP Semiconductors BLM8G0710S-15PB(G) LDMOS 2-stage power MMIC
8.1 Possible circuit topologies
Fig 5. Dual section or single ended Fig 6. Doherty Fig 7. Quadrature combined DDD ,Q$ G%ĭ G%ĭ,Q% 2XW$ 2XW 2XW% DDD G%ĭ G%ĭ Ȝ &RPELQHU 2XW Ȝ 6SOLWWHU DDD G%ĭ G%ĭ 2XW G%&RXSOHU G%&RXSOHU
8.2 Ruggedness in class-AB operation
8.3 Impedance information
Table 9. Typical impedance tuned for maximum output power tp =1 0 0s; =1 0% ; ZS =5 0 . Typical values unless otherwise specified.
Table 9. Typical impedance tuned for maximum output power …continued tp =1 0 0s; =1 0% ; ZS =5 0 . Typical values unless otherwise specified. Table 10. Typical impedance tuned for maximum power added efficiency tp =1 0 0s; =1 0% ; ZS =5 0 . Typical values unless otherwise specified.
Table 10. Typical impedance tuned for maximum power added efficiency …continued tp =1 0 0s; =1 0% ; ZS =5 0 . Typical values unless otherwise specified.
Product data sheet Rev. 2 — 31 August 2015 12 of 19 NXP Semiconductors BLM8G0710S-15PB(G) LDMOS 2-stage power MMIC
8.4 Graphs
Tcase = 25 C; VDS =2 8V ; IDq1 =1 5m A ; IDq2 =6 0m A ; PL = 0.2 W. Per section. (1) magnitude of G p (2) magnitude of RL in Tcase = 25 C; VDS =2 8V ; IDq1 =1 5m A ; IDq2 =6 0m A ; PL = 0.2 W. Per section. (1) magnitude of G p (2) magnitude of RL in Fig 9. Wideband power gain and input return loss as function of frequency; typical values Fig 10. In-band power gain and input return loss as function of frequency; typical values Tcase = 25 C; VDS =2 8V ; IDq1 =1 5m A ; IDq2 =6 0m A . Per section. (1) f = 700 MHz (2) f = 800 MHz (3) f = 900 MHz (4) f = 1000 MHz Normalized at P L = 26 dBm; Tcase =2 5 C; VDS =2 8V ; IDq1 =1 5m A ; IDq2 = 60 mA. Per section. (1) f = 700 MHz (2) f = 800 MHz (3) f = 900 MHz (4) f = 1000 MHz Fig 11. Power gain and drain efficiency as function of output power; typical values Fig 12. Normalized phase response as a function of output power; typical values DDD I 0+] *S*S 5/5/LQLQ5/LQ DDD I 0+] *S*S 5/5/LQLQ5/LQ DDD G%P *S*S Ș'Ș' *S*S Ș'Ș' DDD G%P ijBBBBijVVijijV QRUP V QRUP ijVijV QRUP GHJ GHJ GHJ
Product data sheet Rev. 2 — 31 August 2015 13 of 19 NXP Semiconductors BLM8G0710S-15PB(G) LDMOS 2-stage power MMIC Tcase = 25 C; VDS =2 8V ; IDq1 =1 5m A ; IDq2 = 60 mA; f = 881 MHz; 2-tone CW; PL = 5 W. Per section. (1) IMD low (2) IMD high Fig 13. Intermodulation distortion as a function of tone spacing; typical values Tcase = 25 C; VDS =2 8V ; IDq1 =1 6m A ; IDq2 =6 0m A ; f = 900 MHz; 1-carrier W-CDMA; test model 1; PAR = 9.9 dB at 0.01 % probability on CCDF. Per section. Tcase = 25 C; VDS =2 8V ; IDq1 =1 5m A ; IDq2 =6 0m A ; measured on evaluation board. Fig 14. Adjacent channel power ratio and drain efficiency as function of output power; typical values Fig 15. Isolation as a function of frequency; typical values DDD WRQHVSDFLQJ 0+] ,0',0',0' G%F G%F G%F ,0',0',0' ,0',0',0' ,0',0',0' DDD G%P Ș'Ș' Ș'Ș' DDD I 0+]
Product data sheet Rev. 2 — 31 August 2015 14 of 19 NXP Semiconductors BLM8G0710S-15PB(G) LDMOS 2-stage power MMIC 9. Package outline Fig 16. Package outline SOT1211-2 (HSOP16F) 5HIHUHQFHV2XWOLQH YHUVLRQ (XURSHDQ SURMHFWLRQ ,VVXHGDWH ,(& -('(& -(,7$ 627 VRWBSR 8QLW PP PD[ QRP PLQ +623) SODVWLFKHDWVLQNVPDOORXWOLQHSDFNDJH OHDGV IODW 627 E E HHH H H H H +( 4 YZ VFDOH GHWDLO; H H PP SLQ LQGH[ E %ZE $ $ F ' ( 'LPHQVLRQV PPDUHWKHRULJLQDOGLPHQVLRQV H H H H H 0(7$/ 3527586,216 6285&( 1RWH 3DFNDJHERG\\GLPHQVLRQV³'DQG³(GRQRWLQFOXGHPROGDQGPHWDOSURWUXVLRQV$OORZDEOHSURWUXVLRQLVPPSHUVLGH /HDGZLGWKGLPHQVLRQV³EDQG³ E GRQRWLQFOXGHGDPEDUSURWUXVLRQV$OORZDEOHGDPEDUSURWUXVLRQLVPPLQWRWDOSHUOHDG
Product data sheet Rev. 2 — 31 August 2015 15 of 19 NXP Semiconductors BLM8G0710S-15PB(G) LDMOS 2-stage power MMIC Fig 17. Package outline SOT1212-2 (HSOP16) 5HIHUHQFHV2XWOLQH YHUVLRQ (XURSHDQ SURMHFWLRQ ,VVXHGDWH ,(& -('(& -(,7$ 627 VRWBSR +623 SODVWLFKHDWVLQNVPDOORXWOLQHSDFNDJH OHDGV 627 GHWDLO; H ' ( F 0(7$/ 3527586,216 6285&( Z%E Z%E $SLQLQGH[ ș H H H H H H 8QLW PP PD[ QRP PLQ 'LPHQVLRQV PPDUHWKHRULJLQDOGLPHQVLRQV 1RWH 3DFNDJHERG\\GLPHQVLRQV³' DQGC GRQRWLQFOXGHPROGDQGPHWDOSURWUXVLRQV$OORZDEOHSURWUXVLRQLVPPSHUVLGH /HDGZLGWKGLPHQVLRQVC E DQGC E GRQRWLQFOXGHGDPEDUSURWUXVLRQV$OORZDEOHGDPEDUSURWUXVLRQLVPPLQWRWDOSHUOHDG 'LPHQVLRQ$LVPHDVXUHGZLWKUHVSHFWWRERWWRPRIWKHKHDWVLQN'$780+3RVLWLYHYDOXHPHDQVWKDWWKHERWWRPRIWKHKHDWVLQNLV KLJKHUWKDQWKHERWWRPRIWKHOHDG $ $ $ $ E E F' ' ' Z PP VFDOH ș ' ( ( ( HH ( /S 4Y H H H H H
electrostatic sensitive devices. Table 11. Abbreviations Table 12. Revision history
- Table 7 on page 4: table updated
- Section 8.2 on page 9: section updated BLM8G0710S-15PB_S-15PBG v.1 20150702 Preliminary data sheet - -
Product data sheet Rev. 2 — 31 August 2015 17 of 19 NXP Semiconductors BLM8G0710S-15PB(G) LDMOS 2-stage power MMIC 13. Legal information
13.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.
Product data sheet Rev. 2 — 31 August 2015 18 of 19 NXP Semiconductors BLM8G0710S-15PB(G) LDMOS 2-stage power MMIC Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors BLM8G0710S-15PB(G) LDMOS 2-stage power MMIC © NXP Semiconductors N.V. 2015. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 31 August 2015 Document identifier: BLM8G0710S-15PB_S-15PBG Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 15. Contents