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Technical content

1.1 General description

purpose driver or small cell final in the frequency range from 1805 MHz to 2170 MHz. Available in gull wing or straight lead outline. [1] I Dq1 represents driver stage; IDq2 represents final stage.

1.2 Features and benefits

1.3 Applications

Table 1. Performance

2.1 Pinning

2.2 Pin description

The exposed backside of the package is the ground terminal of the device. Table 2. Pin description

Table 2. Pin description …continued Table 3. Ordering information Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).

[1] When operated with a CW signal. [1] In production circuit with 1205  gate feed resistor. [2] In production circuit with 460  gate feed resistor. Table 5. Thermal characteristics Table 6. DC characteristics Tcase = 25 °C; per section unless otherwise specified. Table 7. RF Characteristics measured in an Ampleon straight lead production circuit.

[1] 3GPP test model 1; 64 DPCH; PAR = 9.9 dB at 0.01 % probabili ty on CCDF. [1] For both sections (S-parameters measured with load-pull jig) . Table 7. RF Characteristics …continued measured in an Ampleon straight lead production circuit. Table 8. Typical performance

Product data sheet Rev. 3 — 13 September 2018 6 of 21 BLM7G1822S-80PB(G) LDMOS 2-stage power MMIC Printed-Circuit Board (PCB): Rogers 4350; thickness = 0.508 mm. Fig 3. Component layout 22 pF LED 2.2 kΩ 390 Ω 39 Ω 1.2 pF 33 pF 10 μF/50 V 12 kΩ 390 Ω 430 Ω 2.2 kΩ 3 dB 12 kΩ LM317 3 dB 1 uF/25 V 10 μF/6.3 V 5.1 Ω 10 pF 10 pF 39 Ω LM7341 LM7341 10 kΩ 1805-1880MHz 10 μF/50 V 1.2 pF BLM7G1822S-80PBG 22 pF 32V 1 kΩ 1.3 kΩ 1 kΩ 5.1 Ω 100 pF 100 Ω 10 kΩ 50 Ω 3.3 kΩ 10 μF/6.3 V 2.2 kΩ 33 pF BLM8G1822S80PBG QAB+DOH 100 pF GND 1 pF 1 pF 10 μF/50 V 10 μF/50 V 10 μF/50 V 10 μF/50 V 49 mm 41.5 mm amp00733

xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx Product data sheet Rev. 3 — 13 September 2018 7 of 21 BLM7G1822S-80PB(G) LDMOS 2-stage power MMIC Fig 4. Electrical schematic RF_OUT_B VDS(B2) RF_OUT_A V DS(A2) VDS(A1) 390 Ω 2.2 kΩ 10 kΩ 1.3 kΩ 2.2 kΩ bias 32 V ~5.1 V 12 kΩ LED 3.3 kΩ 1 kΩ aaa-019395 BLM7G1822S-80PG PathA BLM7G1822S-80PBG PathB 2VGS(A2) 3VGS(A1) 4RF_IN_A 5n.c. 6n.c. 7n.c. 8n.c. 9n.c. 10n.c. 11RF_IN_B 12VGS(B1) 13VGS(B2) 14VDS(B1) VDS(B1) 32 V Driver clamped RF sense FET Driver RF power FET Final clamped RF sense FET Driver clamped RF sense FET Final clamped RF sense FET Final RF power FET Driver RF power FET Final RF power FET VDS(A1) 32 V 39 Ω 5.1 Ω VDS(B2) VDS(A2) 10 μF 6.3 V 10 μF 6.3 V 1 μF 25 V 1 μF 50 V 10 pF ATC600F 10 pF ATC600F 1 pF 1 pF 22 pF ATC600F 100 pF ATC600F 100 Ω100 Ω 50 Ω RF in 100 pF ATC600F 1.2 pF ATC600F anaren 3 dB hybrid anaren 3 dB hybrid 1.2 pF ATC600F 33 pF ATC600F RF out 33 pF ATC600F 10 μF 50 V 22 pF ATC600F 10 μF 50 V 10 μF 50 V 10 μF 50 V 430 Ω out LM317L in adj 2 13 LM7341 DAC_in_A 2.2 kΩ 390 Ω 10 kΩ 12 kΩ 1 kΩ 5.1 Ω 39 Ω 10 μF 6.3 V 10 μF 6.3 V 1 μF 25 V 10 pF ATC600F 10 pF ATC600F LM7341 DAC_in_B 10 μF 50 V 10 μF 50 V

Product data sheet Rev. 3 — 13 September 2018 8 of 21 BLM7G1822S-80PB(G) LDMOS 2-stage power MMIC

8.1 Possible circuit topologies

Fig 5. Dual section or single ended Fig 6. Doherty Fig 7. Quadrature combined amp00514 -3 dB / Φ-0°In A In In B -3 dB / Φ-0° Out A Out Out B amp00603 -3 dB / Φ-0°In -3 dB / Φ-90° Combiner Out Splitter λ/4 λ/4 amp00515 -3 dB / Φ-0°In -3 dB / Φ-90° 3 dB Coupler Out 3 dB Coupler

8.2 Ruggedness in class-AB operation

CW and corresponding to PL(3dB) under ZS = 50  load.

8.3 Impedance information

Table 9. Typical impedance

8.4 Graphs

Table 9. Typical impedance …continued

Product data sheet Rev. 3 — 13 September 2018 11 of 21 BLM7G1822S-80PB(G) LDMOS 2-stage power MMIC Tcase = 25 C; VDS = 32 V; IDq1 + IDq2 = 272 mA (driver and final stages; valid for both sections A and B); V GS = 2.07 V (driver stage); VGS = 1.87 V (final stage). Test signal: pulsed CW. (1) f = 1805 MHz (2) f = 1840 MHz (3) f = 1880 MHz T case = 25 C; VDS = 32 V; IDq1 + IDq2 = 272 mA (driver and final stages; valid for both sections A and B); V GS = 2.07 V (driver stage); VGS = 1.87 V (final stage). Test signal: pulsed CW. (1) f = 1805 MHz (2) f = 1840 MHz (3) f = 1880 MHz Fig 11. Power gain as a function of output power; typical values Fig 12. Normalized phase response as a function of output power; typical values Tcase = 25 C; VDS = 32 V; IDq1 + IDq2 = 272 mA (driver and final stages; valid for both sections A and B); VGS = 2.07 V (driver stage); VGS = 1.87 V (final stage). Test signal: 2-tone CW; fc = 1840 MHz. (1) IMD low (2) IMD high Fig 13. Intermodulation distortion as a function of tone spacing; typical values aaa-019365 18 22 26 30 34 38 42 46 50 PL (dBm) GpGp (dB)(dB)(dB) (1)(1)(1) (2)(2)(2) (3)(3)(3) aaa-019366 18 22 26 30 34 38 42 46 50 -15 -10 PL (dBm) φ____ φs21s21/φ/φs21(norm)s21(norm) φs21/φs21(norm) (deg)(deg)(deg) (3)(3)(3) (2)(2)(2) (1)(1)(1) aaa-019367 1 10 102 103 -90 -70 -50 -30 -10 tone spacing (MHz) IMDIMDIMD (dBc)(dBc)(dBc) (1)(1)(1) (2)(2)(2) (1)(1)(1)(2)(2)(2) (1)(1)(1) (2)(2)(2) IMD3IMD3IMD3 IMD5IMD5IMD5 IMD7IMD7IMD7

Product data sheet Rev. 3 — 13 September 2018 12 of 21 BLM7G1822S-80PB(G) LDMOS 2-stage power MMIC Tcase = 25 C; VDS = 32 V; f = 1840 MHz; IDq1 + IDq2 = 272 mA (driver and final stages; valid for both sections A and B); V GS = 2.07 V (driver stage); VGS = 1.87 V (final stage). Test signal: 1-carrier W-CDMA; test model 1; 64 DPCH; PAR = 9.9 dB at 0.01 % probability CCDF. Tcase = 25 C; VDS = 32 V; f = 1840 MHz; IDq1 + IDq2 = 272 mA (driver and final stages; valid for both sections A and B); V GS = 2.07 V (driver stage); VGS = 1.87 V (final stage). Test signal: 1-carrier W-CDMA; test model 1; 64 DPCH; PAR = 9.9 dB at 0.01 % probability CCDF. Fig 14. Power gain and drain efficiency as function of output power; typical values Fig 15. Adjacent channel power ratio as a function of output power; typical values Tcase = 25 C; VDS = 32 V; f = 1840 MHz; IDq1 + IDq2 = 272 mA (driver and final stages; valid for both sections A and B); VGS = 2.07 V (driver stage); VGS = 1.87 V (final stage). Test signal: 1-carrier W-CDMA; test model 1; 64 DPCH; PAR = 9.9 dB at 0.01 % probability CCDF. Fig 16. Output peak-to-average ratio and peak output power as function of output power; typical values aaa-019368 25 30 35 40 45 20 0 22 6 24 12 26 18 28 24 30 30 PL (dBm) GpGp (dB)(dB)(dB) ηDηD (%)(%)(%) GpGp ηDηD aaa-019369 25 30 35 40 45 -80 -70 -60 -50 -40 -30 -20 PL (dBm) ACPRACPRACPR (dBc)(dBc)(dBc) ACPRACPR5M5MACPR5M ACPRACPR10M10MACPR10M aaa-019370 25 30 35 40 45 23 4 43 8 64 2 84 6 10 50 12 54 PL (dBm) PARPAROPARO (dB)(dB)(dB) PL(M)L(M)PL(M) (dBm)(dBm)(dBm) PARPAROPARO PL(M)L(M)PL(M)

Product data sheet Rev. 3 — 13 September 2018 13 of 21 BLM7G1822S-80PB(G) LDMOS 2-stage power MMIC 9. Package outline Fig 17. Package outline SOT1211-3 (sheet 1 of 2) SOT1211-3 Package outline drawing: Revision: Sheet 1 of 2 Revision date: 7/26/2018 Tolerances unless otherwise stated: Dimension: B 0.05 Angle: B 1° Third angle projectionSOT1211-3 units in mm. 1 14 1516 (18.01) (15.44) Min. 5.5 Min. 7.8 20.57 20.75(1) R0.32 R1.00 pin 17 (6) metal protrusion 4x (ground) in corners (2) 9.78 A 0.10 1.57 (5) 0.22 B0.05 9.96(1) L0.05 A (2.15) 1.00 (12x) 1.50 B 0.35 (14x) (3) 16.00 P2.00 0.1Z L0.25 B E0.10 (4) 3.92 - 0.03 0.08+L0.05 B 0.20( ) molding compound around the perimeter of the heatsink Min. 18.5 Min. 15.5 7.45 5.50 (3) 15.96B 0.20 R0.16 max. R1.38 (0.75) R0.60(4x) (7.04) (4.47) L0.25 B

Product data sheet Rev. 3 — 13 September 2018 14 of 21 BLM7G1822S-80PB(G) LDMOS 2-stage power MMIC Fig 18. Package outline SOT1211-3 (sheet 2 of 2) DETAIL B SCALE 50:1 DETAIL A SCALE 25:1 B A SOT1211-3 Package outline drawing: Revision: Sheet 2 of 2 Revision date: 7/26/2018 Tolerances unless otherwise stated: Dimension: B 0.05 Angle: B 1° Third angle projectionSOT1211-3 units in mm. Drawing Notes Items Description (1) Dimensions are excluding mold protrusion. Areas located adjacent to the leads have a maximum mold protrusion of 0.25 mold protrusion is maximum 0.15 mm per side. See also detail B. (2) The metal protrusion (tie bars) in the corner will not stick out of the molding compound protrusions (detail A). (3) The lead dambar (metal) protrusions are not included. Add 0.14 mm max to the total lead dimension at the dambar location. (4) The lead coplanarity over all leads is 0.1 mm maximum. (5) Dimension is measured 0.5 mm from the edge of the top package body. (6) The hatched area indicates the exposed metal heatsink. (7) The leads and exposed heatsink ar e plated with matte Tin (Sn). lead dambar location 0.25 max. (1) 0.25 max.(1) location of metal protrusion (2) 0.15 max. (1) 0.62 max (1)

Product data sheet Rev. 3 — 13 September 2018 15 of 21 BLM7G1822S-80PB(G) LDMOS 2-stage power MMIC Fig 19. Package outline SOT1212-3 (sheet 1 of 2) DETAIL C SCALE 25:1 C SOT1212-3 Package outline drawing: Revision: Sheet 1 of 2 Revision date: 7/26/2018 Tolerances unless otherwise stated: Dimension: B 0.05 Angle: B 1° Third angle projectionSOT1212-3 units in mm. 1 14 1516 (18.01) (15.44) 7.45 P2 0.1Z (4.47) (7.04) metal protrusion 4x (ground) in corners (2) 9.96(1) L 0.05 A 0.22 B0.05 9.78 A(0.75) (2.15) 0.10 H 0.00 - 0.02 0.06+ (6) 3.0° - 3° 4°+ 20.75 (1) 3.92 - .03 .08+ R0.32 20.57B pin 17 (4) Min. 15.5 Min. 18.5 0.20( ) compound rim all around the perimeter of the heatsink R0.60 (4x) Min. 5.5 Min. 7.8 L 0.05 B 5.5 (3)L 0.25 B 1.5 0.35 (7) Seating plane 0.95B 0.15 Gage plane R1.38 13.2B .30 R0.16 max.

Product data sheet Rev. 3 — 13 September 2018 16 of 21 BLM7G1822S-80PB(G) LDMOS 2-stage power MMIC Fig 20. Package outline SOT1212-3 (sheet 2 of 2) DETAIL A SCALE 25:1 DETAIL B SCALE 50:1 A B SOT1212-3 Package outline drawing: Revision: Sheet 2 of 2 Revision date: 7/26/2018 Tolerances unless otherwise stated: Dimension: B 0.05 Angle: B 1° Third angle projectionSOT1212-3 units in mm. Drawing Notes Items Description (1) Dimensions are excluding mold protrusion. Areas located adjacent to the leads have a maximum mold protrusion of 0.25 mold protrusion is maximum 0.15 mm per side. See also detail B. (2) The metal protrusion (tie bars) in the corner will not stick out of the molding compound protrusions (detail A). (3) The lead dambar (metal) protrusions are not included. Add 0.14 mm max to the total lead dimension at the dambar location. (4) The hatched area indicated the exposed heatsink. (5) The leads and exposed heatsink ar e plated with matte Tin (Sn). (6) Dimension is measured with respect to the bottom of the heatsink Datum H. Positive value means that the bottom of the heatsink is higher than the bottom of the lead. (7) Gage plane (foot length) to be measured from the seating plane. location of metal protrusion (2) 0.25 max.(1) lead dambar location 0.15 max. (1) 0.62 max. (1)

[1] CDM classification C1 is granted to any part that passes aft er exposure to an ESD pulse of 250 V. [2] HBM classification 1C is granted to any part that passes aft er exposure to an ESD pulse of 1000 V. electrostatic sensitive devices. Table 10. ESD sensitivity Table 11. Abbreviations

Table 12. Revision history

  • Table 3 on page 3: package outline versions changed to SOT1211-3 and SOT1212-3
  • Figure 3 on page 6: figure updated
  • Figure 5 on page 8: figure updated
  • Figure 6 on page 8: figure updated
  • Figure 7 on page 8: figure updated
  • Figure 8 on page 9: figure updated
  • Table 9 on page 9: typo corrected
  • Section 9 on page 13: package outline versions changed from SOT1211-2 and SOT1212-2 to SOT1211-3 and SOT1212-3
  • Table 10 on page 17: added table BLM7G1822S-80PB_S-80PBG v.2 20150901 Product data sheet - BLM7G1822 S-80PB_ S-80PBG v.1 BLM7G1822S-80PB_S-80PBG v.1 20150824 Product data sheet - -

Product data sheet Rev. 3 — 13 September 2018 19 of 21 BLM7G1822S-80PB(G) LDMOS 2-stage power MMIC 13. Legal information

13.1 Data sheet status

[1] Please consult the most recently issued document before init iating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definit ions”. [3] The product status of device(s) described in this document m ay have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.ampleon.com.

13.2 Definitions

Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. Ampleon does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local Ampleon sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between Ampleon and its customer, unless Ampleon and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the Ampleon product is deemed to offer functions and qualities beyond those described in the Product data sheet.

13.3 Disclaimers

Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon takes no responsibility for the content in this document if provided by an information source outside of Ampleon. In no event shall Ampleon be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, Ampleon’s aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of Ampleon. Right to make changes — Ampleon reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — Ampleon products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an Ampleon product can reasonably be expected to result in personal injury, death or severe property or environmental damage. Ampleon and its suppliers accept no liability for inclusion and/or use of Ampleon products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. Ampleon makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using Ampleon products, and Ampleon accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the Ampleon product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. Ampleon does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using Ampleon products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). Ampleon does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — Ampleon products are sold subject to the general terms and conditions of commercial sale, as published at http://www.ampleon.com/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. Ampleon hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of Ampleon products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains d ata from the objective specification for product development. Preliminary [short] data sheet Qualification This document contai ns data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.

Product data sheet Rev. 3 — 13 September 2018 20 of 21 BLM7G1822S-80PB(G) LDMOS 2-stage power MMIC Non-automotive qualified products — Unless this data sheet expressly states that this specific Ampleon product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. Ampleon accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without Ampleon’s warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond Ampleon’s specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies Ampleon for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond Ampleon’s standard warranty and Ampleon’s product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.

13.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Any reference or use of any ‘NXP’ trademark in this document or in or on the surface of Ampleon products does not result in any claim, liability or entitlement vis-à-vis the owner of this trademark. Ampleon is no longer part of the NXP group of companies and any reference to or use of the ‘NXP’ trademarks will be replaced by reference to or use of Ampleon’s own trademarks. 14. Contact information For more information, please visit: http://www.ampleon.com For sales office addresses, please visit: http://www.ampleon.com/sales

BLM7G1822S-80PB(G) LDMOS 2-stage power MMIC © Ampleon Netherlands B.V. 2018. All rights reserved. For more information, please visit: http://www.ampleon.com For sales office addresses, please visit: http://www.ampleon.com/sales Date of release: 13 September 2018 Document identifier: BLM7G1822S-80PB_S-80PBG Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 15. Contents