BLC05CX-1.5PF FUTUREWAFER | Alldatasheet
Document overview
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- PDF pages: 5
Technical content
Extremely Low Capacitance ESD device
Applications
- Personal Digital Assistance
- Wireless System
- Cellular Phones
- High Speed Data Line
- Ethernet
- USB Interface Feature
- Bi-directional configurations
- ESD Protection: Level 4
- Extra Low Capacitance:1.5pf(Max)
- 350 Watts peak pulse power per line (tp=8/20uS)
- Extra low IR for high temp.:IR<0.9uA@VR,TA=125°C
- Protection one power line or I/O port SOD323 IEC Compatibility
- EN61000-4
- 61000-4-2(ESD):Level 4,Contact:±30kv,Air::±30kv
- 61000-4-5(Surge):12A,8/20us Mechanical Characteristics
- Molded JEDEC SOD-323
- Weight 5 milligrams
- Flammability rating UL 94V-0
- Halogen Free Maximum Ratings@25°C unless otherwise specified Parameter Symbol Value Units Peak pulse power (tp=8/20us) see fig 1. PPP 350 Watts Operating Temperature TJ -55~150 °C Storage Temperature TSTG -55~150 °C E1602F2G-STD-FW-002 Futurewafer Tech Co., Ltd BLC05CX Device Characteristics ② Pin Identification 1,2 Input lines
Parameter Symbol Condition BLC05CX Units min max Reverse Stand-off Voltage VRWM Pin 2 to 1/Pin 1 to 2 5 V Reverse Breakdown Voltage VBR(min) IZ=1mA Pin to Pin 6.1 V Reverse Leakage Current IR(max) @VRWM,TA=25°C 0.9 uA Clamping Voltage VC(max) IPP=1A tp=8/20us 15 V IPP=12A tp=8/20us 25 V Peak Pulse Current IPP tp=8/20us 12 A Junction Capacitance C I/O Pin capacitance to Pin. Vdc=0V,f=1MHZ 1.5 pf ESD Standards VESD IEC61000-4-2,Contact 30 Kv IEC61000-4-2,Air 30 Kv BLC05CX Rating and characteristic curve
Electrical Characteristics
100W,8/20µS Extremely Low Capacitance ESD device E1602F2G-STD-FW-002 Futurewafer Tech Co., Ltd
Extremely Low Capacitance ESD device E1602F2G-STD-FW-002 Futurewafer Tech Co., Ltd
Box dimensions Shipping Weight(Max.) inch cm KB KG 9 27,000 9X9X5 23X23X13 3 2 18 54,000 9X9X9 23X23X23 6 3 40 120,000 21X9X9 53X23X23 13 6 108 324,000 27X9X17 69X23X43 34 16 7” Reel = 3,000pcs BLC05CX
Ordering information
Part No. Package Shipping BLC05CX SOD323 3,000/ Tape@Reel Package dimensions Millmeters Inchs DIM Min Max Min Max A B C D E F H 1.60 1.15 2.39 0.92 0.25 0.10 1.90 1.45 2.70 1.10 0.40 0.20 0.10 0.063 0.045 0.094 0.036 0.010 0.004 0.075 0.057 0.106 0.043 0.016 0.008 0.004
Package information
Extremely Low Capacitance ESD device E1602F2G-STD-FW-002 Futurewafer Tech Co., Ltd
Notes: 1. Controlling Dimension in Millmeters. 2. Dimension are exclusive of mold flash and metal burns. Reel Dia. Tape width A0 B0 K0 D E F W P0 P2 P tmax 178mm 8mm 1.55 ±0.1 2.9 ±0.1 1.35 ±0.1 1.5 ±0.1 1.75 ±0.1 3.5 ±0.05 8.0 ±0.3 4.0 ±0.1 2.0 ±0.05 4.0 ±0.1 0.25 BLC05CX Tape&Reel information Futurewafer Technology Co., Ltd 台灣未來芯航電股份有限公司 桃園市桃園區中正路 987 巷 50 弄 2 號 Tel ：+886-3-3573583/Tel ：+886-3-3574065 Futurewafer.com.tw Extremely Low Cpacitance ESD device E1602F2G-STD-FW-002 Futurewafer Tech Co., Ltd