BK10 HIROSE | Alldatasheet
Document overview
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Technical content
0.3mm Pitch, 0.5mm Stacking Height, Fully Armored, Hybrid FPC-to-Board Connector May 2022 NEW
BK10 Series/0.3mm Pitch, 0.5mm Stacking Height, Fully Armored, Hybrid FPC-to-Board Connector
Features
- Ultra Low-profile and Space-saving Design 3. Dimpled Contact Lock Design for High Extraction Force 2. Robust Design Compact design ideal for mobile devices. ・ Stacking height : 0.5mm, Pitch : 0.3mm, Depth : 1.7mm Dimpled lock design on power and signal contacts enables high extraction force. Fully armored guides prevent housing damage due to misalignment when mating. Conventional Product Conventional Product BK10 BK10 0.1mm Reduced 16% Reduced Stacking Height : 0.6mm PCB Mounting Space : 14.25mm PCB Mounting Space : 12.04mm 0.35mm Pitch Signal 30Pos. +Power 2Pos. 0.3mm Pitch Signal 30Pos. +Power 2Pos. Stacking Height : 0.5mm 7.5mm 7.08mm 1.9mm1.7mm Ultra Low-profile and Space-saving Design Fully Armored Design Contact Lock Design <Conventional Products> <BK10> No Metal Parts Only Partially Covered with Metal Exposed Housing Housing is Covered by Metal : Signal Contact Lock : Power Contact Lock Receptacle Header Contact Lock
BK10 Series/0.3mm Pitch, 0.5mm Stacking Height, Fully Armored, Hybrid FPC-to-Board Connector 4. Enhanced PCB Peeling Strength 5. High Contact Reliability 6. Superior Mating Operability 7. Halogen-Free Both the header and receptacle have 3 solder areas at each power contact for greater PCB peeling strength. Both the power and signal contacts have a two-point contact design, ensuring high contact reliability. Wide self-alignment range with metal guides offers a smooth mating operation. (±0.29mm in pitch direction, ±0.24mm in width direction) Additionally, the clear tactile click generated by the unique locking contact design ensures complete mating. All materials and substances used to produce this product comply with Halogen-free standards. * As defined by IEC 61249-2-21 Br : 900ppm max., Cl : 900ppm max., Br+Cl : 1,500ppm max.
3 Solder Areas Enhance PCB Peeling Strength
3 Solder Areas
Back Side of the Receptacle Back Side of the Header
BK10 Series/0.3mm Pitch, 0.5mm Stacking Height, Fully Armored, Hybrid FPC-to-Board Connector Product Specifications Rated Current Signal Contact : 0.3A (Note 1) Power Contact : 5A Operating Temperature (Note 2) -55 to +85℃ Storage Temperature Range (Note 3) -10 to +60℃ Rated Voltage 30V AC/DC Note 1 : The total current capacity is 12A Max. for signal contacts. Note 2 : Includes temperature rise due to current flow. Note 3 : The term “storage” refers to long-term-storage of unused items before they are mounted on the PCB. Operating temperature range applies to the product in a temporary storage state such as non-powered after mounting on the PCB during transportation, etc. Items Specifications Conditions Contact Resistance Signal Contact : 50mΩ Max. Power Contact : 30mΩ Max. Measured at 20mV AC, 1kHz, 1mA Insulation Resistance 50MΩ Min. Measured at 100V DC Withstanding Voltage No flashover or insulation breakdown 100V AC for 1 min. Mating Durability Contact Resistance : Signal Contact : 50mΩ Max. Power Contact : 50mΩ Max. No damage, crack or looseness of parts 10 mating cycles Vibration Resistance No electrical discontinuity of 1µs or more No damage, crack or looseness of parts Frequency : 10 to 55Hz, single amplitude 0.75mm, 10 cycles in each of 3 axis directions for 5 minutes/cycle Shock Resistance No electrical discontinuity of 1µs or more No damage, crack or looseness of parts Acceleration : 490m/s , duration of pulse : 11ms at 3 times for 3 directions. Humidity Resistance Contact Resistance : Signal Contact : 50mΩ Max. Power Contact : 50mΩ Max. Insulation Resistance : 25MΩ Min. No damage, crack or looseness of parts 96 hours at temperature of 40±2℃ and humidity range from 90 to 95% Temperature Cycle Contact Resistance : Signal Contact : 50mΩ Max. Power Contact : 50mΩ Max. Insulation Resistance : 50MΩ Min. No damage, crack or looseness of parts -55℃ for 30min. → +85℃ for 30 min. for 5 Cycles (Stabilizing Time In Chamber : Within 2 to 3 min.) Sulphur Dioxide Contact Resistance : Signal Contact : 50mΩ Max. Power Contact : 50mΩ Max. No damage, crack or looseness of parts Exposed in 25 PPM for 96h at 25℃, 75±5%RH. (Test standard : JIS C 60068) Refer to the chart below when determining the product specifications from the product number. Please select from the product numbers listed in this catalog when placing orders. Materials / Finish Product Number Structure Part Component Material Finish Remarks Header Receptacle Insulator LCP Black UL94V-0 Signal Contact Copper Alloy Gold Plated over Nickel Underplating - Power Contact Copper Alloy Gold Plated over Nickel Underplating - Series Name BK10 Number of Power Contacts 2pos. Stacking Height 0.5mm Contact Pitch 0.3mm Number of Signal Contacts 30pos. Terminal Type V : Straight SMT Connector Type DP : Double-row Header DS : Double-row Receptacle Packaging (800) : Standard, Embossed Tape Packaging (20,000pcs per reel) (895) : Embossed tape packaging (1,000pcs per reel) Header/Receptacle BK10C 0.3 (8##)- - DP V
BK10 Series/0.3mm Pitch, 0.5mm Stacking Height, Fully Armored, Hybrid FPC-to-Board Connector Header Recommended Metal Mask Dimensions (Mask Thickness : 0.08mm) Recommended PCB Layout Part No. HRS No. No. of Pos. A B C D E Purchase Unit Signal Contact Power Contact ## : 00 ## : 95 per reel 1,000pcs per reel Unit : mm Note : This connector has no polarity.
BK10 Series/0.3mm Pitch, 0.5mm Stacking Height, Fully Armored, Hybrid FPC-to-Board Connector Receptacle Recommended Metal Mask Dimensions (Mask Thickness : 0.08mm) Recommended PCB Layout Part No. HRS No. No. of Pos. A B C D E Purchase Unit Signal Contact Power Contact ## : 00 ## : 95 per reel 1,000pcs per reel Unit : mm Note : This connector has no polarity.
BK10 Series/0.3mm Pitch, 0.5mm Stacking Height, Fully Armored, Hybrid FPC-to-Board Connector Packaging Specifications Diagram Unit : mm Header Embossed Tape Dimensions Reel Dimensions Part No. HRS No. No. of Pos. A B C D E F GSignal Contact Power Contact Part No. HRS No. No. of Pos. A B C D E F GSignal Contact Power Contact Unit : mm Receptacle Embossed Tape Dimensions Reel Dimensions
BK10 Series/0.3mm Pitch, 0.5mm Stacking Height, Fully Armored, Hybrid FPC-to-Board Connector Usage Precautions Recommended Solder Temperature Profile [Conditions] 1. Peak Temperature : Maximum of 250℃ 2. Heated Section : 220℃ Min., within 60 seconds 3. Preheated Section : 150 to 180℃, 90 to 120 seconds 4. Number of Reflow Cycles : Maximum of 2 cycles Note 1 : The temperature is the surface temperature of the PCB in the vicinity of the connector lead part. Note 2 : When using nitrogen reflow process, please mount the product with an oxygen concentration of 1000ppm or more. Please contact a Hirose representative if the concentration is below 1000ppm. Recommended Manual Soldering Conditions Soldering iron temperature : 340±10℃ Soldering time : within 3 seconds Recommended Metal Mask Thickness and Open Area to PCB Pattern Area Ratio Thickness : 0.08mm Aperture ratio : 100% on the Header side, 100% on the Receptacle side PCB Warpage A maximum of 0.02mm at the center of the connector with reference to both ends of the connector. Cleaning Not recommended. If this product is cleaned, please evaluate the performance before using it. Cleaning may cause a change in the mating/unmating properties as well as environmental resistance. Notes ・ Insertion or removal prior to board mounting may result in contact deformation. ・ Avoid supporting the PCB only with the connectors. Support it by other means such as bolts, screws, posts, etc. ・ Avoid excessive prying during mating/unmating as it may result in damage. ・ Do not apply flux which will cause solder wicking during manual soldering. ・ This product may have slight color differences due to production lot variability, but this does not have any effect on the performance. ・ Please refer to the next page for mating/unmating precautions. ・ It is advised to secure the mated connectors to the board with housings and cushioning materials because the product can disengage from FPC routing, dropping or other impact. ・ Do not use the connector outside of the specifications (i.e., rated current, rated voltage, PCB design and operating environment, etc.). Such usage could lead to material outgassing, ignition, or short-circuit, etc. ・ Please use a proper stiffener on the back of the FPC. We recommend using a glass epoxy material with a minimum thickness of 0.3mm or a stainless steel material with a minimum of thickness of 0.2mm. Usage Precautions
BK10 Series/0.3mm Pitch, 0.5mm Stacking Height, Fully Armored, Hybrid FPC-to-Board Connector Connector Handling Precautions 【Connector Mating Method】 1. Locate the guides and align the connectors to the appropriate mating position. The connector has guide ribs on the receptacle for proper mating alignment. Align the connectors with the guide ribs. 2. When the connector comes to the appropriate position, the connector will lower into place as indicated by the change in mated height. 3. When the connectors has lowered into place, the connector pair will be parallel to each other andcannot be moved back and forth or left and right. Please complete mating from this state by applying force. 4. Please make sure connectors are mated completely. If one side is floating or the connectors are mated at an angle, please unmate and then redo the mating procedure following the steps described. Receptacle Metal Cover Guide (Outside) Metal Cover Guide (Inside) (Please align the connectors) (Please align the connectors) Header
BK10 Series/0.3mm Pitch, 0.5mm Stacking Height, Fully Armored, Hybrid FPC-to-Board Connector 【Connector Un-Mating Precautions】 1. It is recommended to remove the connector by pulling perpendicular to the connector mounted surface. However, unmating FPC-to-board connectors can become more difficult with higher pin count connectors and thinner FPCs. 2. If is difficult to remove the connector parallel to the mounting surface, remove it diagonally towards the pitch direction. Do not remove the connector towards the width direction as it may put a large amount of stress on the contacts. 3. If the FPC is not rigid enough, there is a possibility of solder peeling or connector damage. Please check the repetitive operation of the FPC planned to be used in advance, such as during the early stage build. Please do not remove the FPC by holding one corner and pulling at a diagonal as this will put a great amount of stress on the contacts.
BK10 Series/0.3mm Pitch, 0.5mm Stacking Height, Fully Armored, Hybrid FPC-to-Board Connector ※ The contents of this catalog are current as of date of 05/ 2022. Contents are subject to change without notice for the purpose of improvements. While Taking into Consideration Specifications mentioned in this catalog are reference values. When considering to order or use this product, please confirm the Drawing and Product Specifications sheets. Use an appropriate cable when using the connector in combination with cables. If considering usage of a non- specified cable, please contact your sales representative. If assembly process is done by jigs & tools which are not identified by Hirose, assurance will not be given. If considering usage for below mentioned applications, please contact your sales representative. In cases where the application will demand a high level of reliability, such as automotive, medical instruments, public infrastructure, aerospace/ defense etc. Hirose must review before assurance of reliability can be given. 2-6-3,Nakagawa Chuoh, Tsuzuki-Ku, Yokohama-Shi 224-8540,JAPAN https://www.hirose.com/