BK0402HS121

BK1608HS121-T TAIYO-YUDEN | Alldatasheet

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notice_e-01 Notice for TAIYO YUDEN products Please read this notice before using the TAIYO YUDEN products. REMINDERS ■ Product information in this catalog is as of October 2011. All of the contents speciﬁed herein are subject to change wi thout notice due to technical improvements, etc. Therefore, please check for the latest information carefully be - for e practical application or usage of the Products. P lease note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorpo - ra ting such products, which are caused under the conditions other than those speciﬁed in this catalog or individual sp eciﬁcation. ■ Please contact Taiyo Yuden Co., Ltd. for further details of product speciﬁcations as the individual speciﬁcation is av ailable. ■ Please conduct validation and veriﬁcation of products in actual condition of mounting and operating environment be fore commercial shipment of the equipment. All electronic components or functional modules listed in this catalog are developed, designed and intended for us e in general electronics equipment.(for AV, office automation, household, office supply, information service, te lecommunications, ( such as mobile phone or PC) etc.). Before incorporating the components or devices into any equipment in the ﬁeld such as transportation,( automotive control, train control, ship control), transportation signal, di saster prevention, medical, public information network (telephone exchange, base station) etc. which may have di rect inﬂuence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance. D o not incorporate the products into any equipment in ﬁelds such as aerospace, aviation, nuclear control, subma - ri ne system, military, etc. where higher safety and reliability are especially required. I n addition, even electronic components or functional modules that are used for the general electronic equipment, if the equipment or the electric circuit require high safety or reliability function or performances, a sufﬁcient reliabil - it y evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to in stall a protective circuit is strongly recommended at customer's design stage. The contents of this catalog are applicable to the products which are purchased from our sales ofﬁces or distribu - to rs (so called “TA IYO YUDEN’s ofﬁcial sales channel ”). It is only applicable to the products purchased from any of TAIYO YUDEN ’ s of ﬁcial sales channel. ■ Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may oc - cu r in connection with a third party's intellectual property rights and other related rights arising from your usage of pr oducts in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights. Caution for export C ertain items in this catalog may require speciﬁc procedures for export according to “Fo reign Exchange and For - eign Trade Control Law ” o f Japan, “U.S. Export Administration Regulations ”, and other applicable regulations. Should you have any question or inquiry on this matter, please contact our sales staff.

126 mlci07_e-01 ■ FEATURES ■ ORDERING CODE ■ EXTERNAL DIMENSIONS/STANDARD QUANTITY ■ APPLICATIONS ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. ❼Internal code △ Standard Products △＝Blank Space ❷External Dimensions 2125（0805） 2 .0×1.25 ❹Impedance 〔Ω〕 example 150 15 101 100 102 1000 ❺Characteristics ー Standard Products ❶Type BK Multilayer Chip Be ad Inductor BK H Multilayer Chip Be ad Inductor B K 1 6 0 8 H S 1 2 1 － T ○ ❶ ❷ ❸ ❹ ❺ ❻ ❼ ❻Packaging T Tape & Reel ❸Material HW Refer to impedance cu rves for material di fferences HS HR HM LM LL TS ◦ Internal silver printed layer creates a closed circuit which acts as a ma gnetic shield minimizing heat generation and crosstalk. ◦ N o need for grounding provides greater circuit design ﬂexibility. ◦ S everal material types and a broad range of impedance values pro - vi de noise countermeasures for various applications. HS ： With low R-XL cross point frequency characteristics and large r esistance part working as damping function, suppresses un - ne cessary resonance and keeps signal integrity. HW ： With a lower R-XL cross point frequency characteristics than t hose of HS, strongly suppresses unnecessary resonance. TS ： Low DC resistance HS version. For power supply lines . H M ： Resistance part rising exceeding from 20MHz. For general us - a ge, especially effective for video signal lines. HR ： Resistance part rising exceeding from 10MHz. For general us - a ge, Wider effective range than that of HM. LM ： With larger impedance set at around 200MHz considering for n oise regulation. LL ： Resistance part steeply rising exceeding from 100MHz. For high s peed signal line, good for clock line, sharply cutting noise off. ◦ T he small case size lineup with 01005 inch size. ◦ Hi gh frequency noise countermeasure in personal computers, digital ca meras and other information system products. For use on digital pr oduct clock lines and general signal lines. ◦Ra diated noise suppression in computer or printer interfaces and har - ne ss connectors. ◦No ise suppression in video and other AV products. ◦ Pr events interference between circuits in cellular phones （P HS, PDC, etc.） ◦Due to the closed internal circuit which acts as a magnetic shield, the TS material is extremely effective as a noise ﬁlter on LSI power supply li nes where downsizing of components is needed. MULTILAYER CHIP BEAD INDUCTORS (BK SERIES) REFLOWWAVE＊ Type L W T e Standard Quantity ［pc s］ Paper Tape Em bossed Tape BK 0402 （01005） 0.40±0.02 （0.016±0.001） 0.20±0.02 （0.008±0.001） 0.20±0.02 （0.008±0.001） 0.10＋0.04 ー0.03 （0.004 ＋0.002 ー0.001 ） 20000 ー BK0603 （0201） 0.60±0.03 （0.024±0.001） 0.30±0.03 （0.012±0.001） 0.30±0.03 （0.012±0.001） 0.15±0.05 （0.006±0.002） 15000 ー BK1005 （0402） 1.00±0.05 （0.039±0.002） 0.50±0.05 （0.020±0.002） 0.50±0.05 （0.020±0.002） 0.25±0.10 （0.010±0.004） 10000 ー BKH1005 （0402） 1.00±0.05 （0.039±0.002） 0.50±0.05 （0.020±0.002） 0.50±0.05 （0.020±0.002） 0.25±0.10 （0.010±0.004） 10000 ー BK1608 （0603） 1.6±0.15 （0.063±0.006） 0.8±0.15 （0.031±0.006） 0.8±0.15 （0.031±0.006） 0.3±0.2 （0.012±0.008） 4000 ー BK2125 （0805） 2.0＋0.3 ー0.1 （0.079＋0.012 ー0.004 ） 1.25±0.2 （0.049±0.008） 0.85±0.2 （0.020±0.012） 4000 ー 1.25±0.2 （0.049±0.008）ー 2000 Unit：mm（inch） xcept for BK0402, BK0603, BK1005, BKH1005 ■ OPERATING TEMP. ◦ －55～125℃

127mlci07_e-01 NOISE SUPPRESSION COMPONENTS ʗFERRITE BEAD INDUCTORS ■ AVAILABLE MATERIALS ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. I max=100～200mA 4 5 1000 800 600 400 200 Frequency [MHz] IZI 100 100001000101

1 LL121

2 LL800

3 LL560

4 LL470

5 LL330

6 LL220

7 LL100

I max=100～200mAI max=150～500mA 800 500 600 700 400 300 200 100 0 100 100001000101 Frequency [MHz] IZI

1 HS601

2 HS241

3 HS121

4 HS800

5 HS330

6 HS220

Frequency [MHz] IZI 100 1000 10000101 1 2 4 5

1 HM601

2 HM471

3 HM241

4 HM121

5 HM600

I max=300 ～600mA I max=300mA I max=200mA I max=300 ～1500mA HM HM HM HM HM I max=200～350mA I max=250～500mA I max=150～200mA

1 LL241

2 LL181

3 LL121

4 LL680

5 LL560

6 LL470

7 LL300

I max=200～300mA TS TS TS I max=300 ～400mA HS HS HS HS HS HM HM HM HM HM LM LM LM LM LL LL LL I max=300 ～1200mA I max=400 ～800mA I max=300 ～600mA I max=200～400mA I max=150～350mA 1600 1400 1200 1000 800 600 400 200 HM HM HM HM HM HM750 6 I max=300 ～1000mA I max=250～600mA I max=120mA

1 HS102

2 HS601

3 HS431

4 HS241

5 HS121

6 HS680

7 HS800

8 HS330

9 HS100

5 LL470

6 LL330

7 LL220

8 LL100

1 LM182

I max=300 ～500mA I max=240～540mA I max=220～260mA 700 500 300 HW HW HW HW HW 200 180 160 140 120 100 1 121 2 700 3 100 300 250 200 150 100 1 121 2 750 800 600 400 200

1 HR601

2 LM152

■BK0603 ■BK1005 ■BK0402 ■BK1608 ■BK2125 HS type HM type LL t ype HW type HS type HM type HS t ype HM t ype LL t ype LM t ype HR type HW type HS type HM t ype LL type LL type LM type TS t ype HS t ype HM t ype LL t ype LM t ype BK H type

128 mlci07_e-01 ■ PART NUMBERS ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. Ordering code EHS（Environmental Hazardous Substances ） Impedance 〔Ω〕 Measuring frequency 〔MHz〕 DC resistance 〔Ω〕（max.） R ated current A〕（max.） T hickness 〔mm〕（inch） B K 1005 HW 680 RoHS 68±25％ 100 0.17 500 0.50±0.05 （0.020±0.002） BK 1005 HW 121 RoHS 120±25％ 0.24 450 BK 1005 HW 241 RoHS 240±25％ 0.31 400 BK 1005 HW 431 RoHS 430±25％ 0.50 350 BK 1005 HW 601 RoHS 600±25％ 0.60 300 BK 1005 HS 100 RoHS 10±5 0.03 10 00 BK 1005 HS 330 RoHS 33±25％ 0.06 70 0 BK 1005 HS 680 RoHS 68±25％ 0.10 70 0 BK 1005 HS 800 RoHS 80±25％ 0.10 70 0 BK 1005 HS 121 RoHS 120±25％ 0.20 500 BK 1005 HS 241 RoHS 240±25％ 0.30 400 BK 1005 HS 431 RoHS 430±25％ 0.45 350 BK 1005 HS 601 RoHS 600±25％ 0.55 300 BK 1005 HS 102 RoHS 1000±25％ 0.58 300 BK 1005 HR 601 RoHS 600±25％ 0.60 300 BK 1005 HM 750 RoHS 75±25％ 0.18 350 BK 1005 HM 121 RoHS 120±25％ 0.18 300 BK 1005 HM 241 RoHS 240±25％ 0.30 300 BK 1005 HM 471 RoHS 470±25％ 0.45 250 BK 1005 HM 601 RoHS 600±25％ 0.50 250 BK 1005 HM 102 RoHS 1000±25％ 0.70 150 BK 1005 LL 100 RoHS 10±25％ 0.11 50 0 BK 1005 LL 220 RoHS 22±25％ 0.18 40 0 BK 1005 LL 330 RoHS 33±25％ 0.25 40 0 BK 1005 LL 470 RoHS 47±25％ 0.33 35 0 BK 1005 LL 680 RoHS 68±25％ 0.31 400 BK 1005 LL 121 RoHS 120±25％ 0.45 350 BK 1005 LL 181 RoHS 180±25％ 0.50 300 BK 1005 LL 241 RoHS 240±25％ 0.70 250 BK 1005 LM 182 RoHS 1800±25％ 0.90 120 BKH 1005 LM 152 RoHS 1500±25％ 1.50 200 BKH 1005 LM 182 RoHS 1800±25％ 2.00 200

BK1005 Ordering code EHS（Environmental Hazardous Substances ） Impedance 〔Ω〕 Measuring frequency 〔MHz〕 DC resistance 〔Ω〕（max.） R ated current A〕（max.） T hickness 〔mm〕（inch） B K 0603 HS 220 RoHS 22±25％ 100 0.065 500 0.30±0.03 （0.012±0.001） BK 0603 HS 330 RoHS 33±25％ 0.070 500 BK 0603 HS 800 RoHS 80±25％ 0.40 200 BK 0603 HS 121 RoHS 120±25％ 0.45 200 BK 0603 HS 241 RoHS 240±25％ 0.65 200 BK 0603 HS 601 RoHS 600±25％ 1.20 150 BK 0603 HM 600 RoHS 60±25％ 0.25 200 BK 0603 HM 121 RoHS 120±25％ 0.40 200 BK 0603 HM 241 RoHS 240±25％ 0.80 200 BK 0603 HM 471 RoHS 470±25％ 1.05 100 BK 0603 HM 601 RoHS 600±25％ 1.20 100 BK 0603 LL 100 RoHS 10±25％ 0.25 200 BK 0603 LL 220 RoHS 22±25％ 0.45 200 BK 0603 LL 330 RoHS 33±25％ 0.55 150 BK 0603 LL 470 RoHS 47±25％ 0.70 150 BK 0603 LL 560 RoHS 56±25％ 1.00 100 BK 0603 LL 800 RoHS 80±25％ 1.30 100 BK 0603 LL 121 RoHS 120±25％ 1.50 100 Ordering code EHS（Environmental Hazardous Substances ） Impedance 〔Ω〕 Measuring frequency 〔MHz〕 DC resistance 〔Ω〕（max.） R ated current A〕（max.） T hickness 〔mm〕（inch） B K 0402 HS 100 RoHS 10±5 100 0.10 54 0 0.20±0.02 （0.008±0.001） BK 0402 HS 700 RoHS 70±25％ 0.37 28 0 BK 0402 HS 121 RoHS 120±25％ 0.53 240 BK 0402 HM 750 RoHS 75±25％ 0.45 260 BK 0402 HM 121 RoHS 120±25％ 0.60 220
BK0603
BK0402

129mlci07_e-01 NOISE SUPPRESSION COMPONENTS ʗFERRITE BEAD INDUCTORS ■ PART NUMBERS ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. Ordering code EHS（Environmental Hazardous Substances ） Impedance 〔Ω〕 Measuring frequency 〔MHz〕 DC resistance 〔Ω〕（max.） R ated current A〕（max.） T hickness 〔mm〕（inch） B K 1608 HW 121 RoHS 120±25％ 100 0.15 600 0.80±0.15 （0.031±0.006） BK 1608 HW 241 RoHS 240±25％ 0.25 450 BK 1608 HW 431 RoHS 430±25％ 0.30 400 BK 1608 HW 601 RoHS 600±25％ 0.40 300 BK 1608 HS 220 RoHS 22±25％ 0.05 1500 BK 1608 HS 330 RoHS 33±25％ 0.08 1200 BK 1608 HS 470 RoHS 47±25％ 0.10 900 BK 1608 HS 600 RoHS 60±25％ 0.10 800 BK 1608 HS 800 RoHS 80±25％ 0.10 600 BK 1608 HS 121 RoHS 120±25％ 0.18 500 BK 1608 HS 241 RoHS 240±25％ 0.25 400 BK 1608 HS 601 RoHS 600±25％ 0.45 350 BK 1608 HS 102 RoHS 1000±25％ 0.60 300 BK 1608 HM 121 RoHS 120±25％ 0.20 350 BK 1608 HM 241 RoHS 240±25％ 0.35 300 BK 1608 HM 471 RoHS 470±25％ 0.45 250 BK 1608 HM 601 RoHS 600±25％ 0.60 250 BK 1608 HM 102 RoHS 1000±25％ 0.70 200 BK 1608 LL 300 RoHS 30±25％ 0.20 500 BK 1608 LL 470 RoHS 47±25％ 0.30 400 BK 1608 LL 560 RoHS 56±25％ 0.30 400 BK 1608 LL 680 RoHS 68±25％ 0.35 300 BK 1608 LL 121 RoHS 120±25％ 0.50 300 BK 1608 LL 181 RoHS 180±25％ 0.65 250 BK 1608 LL 241 RoHS 240±25％ 0.80 250 BK 1608 LL 331 RoHS 330±25％ 0.85 200 BK 1608 LL 431 RoHS 430±25％ 0.85 200 BK 1608 LL 511 RoHS 510±25％ 0.90 200 BK 1608 LL 681 RoHS 680±25％ 1.00 150 BK 1608 LM 751 RoHS 750±25％ 0.60 300 BK 1608 LM 152 RoHS 1500±25％ 0.75 250 BK 1608 LM 182 RoHS 1800±25％ 0.85 200 BK 1608 LM 252 RoHS 2500±25％ 1.10 200 BK 1608 TS 431 RoHS 430±25％ 0.21±30% 400 BK 1608 TS 601 RoHS 600±25％ 0.27±30% 350 BK 1608 TS 102 RoHS 1000±25％ 0.30±30% 300 Ordering code EHS（Environmental Hazardous Substances ） Impedance 〔Ω〕 Measuring frequency 〔MHz〕 DC resistance 〔Ω〕（max.） R ated current A〕（max.） T hickness 〔mm〕（inch） B K 2125 HS 150 RoHS 15±25％ 100 0.05 1200 0.85±0.2 （0.033±0.008） BK 2125 HS 220 RoHS 22±25％ 0.05 1200 BK 2125 HS 330 RoHS 33±25％ 0.05 1200 BK 2125 HS 470 RoHS 47±25％ 0.05 1000 BK 2125 HS 750 RoHS 75±25％ 0.10 1000 BK 2125 HS 101 RoHS 100±25％ 0.10 900 BK 2125 HS 121 RoHS 120±25％ 0.15 800 BK 2125 HS 241 RoHS 240±25％ 0.20 600 BK 2125 HS 431 RoHS 430±25％ 0.25 500 BK 2125 HS 601 RoHS 600±25％ 0.30 500 BK 2125 HS 102 RoHS 1000±25％ 0.40 300 BK 2125 HM 121 RoHS 120±25％ 0.15 800 BK 2125 HM 241 RoHS 240±25％ 0.20 600 BK 2125 HM 471 RoHS 470±25％ 0.25 500 BK 2125 HM 601 RoHS 600±25％ 0.25 500 BK 2125 HM 102 RoHS 1000±25％ 0.35 400 BK 2125 LL 560 RoHS 56±25％ 0.20 600 BK 2125 LL 121 RoHS 120±25％ 0.30 400 BK 2125 LL 241 RoHS 240±25％ 0.35 300 BK 2125 LM 751 RoHS 750±25％ 0.30 400 BK 2125 LM 152 RoHS 1500±25％ 0.35 400 BK 2125 LM 182 RoHS 1800±25％ 0.45 300 1.25±0.2 （0.049±0.008）BK 2125 LM 252 RoHS 2500±25％ 0.75 200

BK1608
BK2125

130 mlci07_e-01 ■ ELECTRICAL CHARACTERISTICS ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. 250 200 150 100 0 100 100001000101 Frequency [MHz] BK0402 HS121 ImpedanceʦЊʧ BK0402 HÇl750 㻓㻘㻓㻔㻓㻓㻔㻘㻓㻕㻓㻓㻕㻘㻓㻖㻓㻓㻔㻔㻓㻔㻓㻓㻔㻓㻓㻓㻔㻓㻓㻓㻓㻩㼕㼈㼔㼘㼈㼑㼆㼜㻃㻃㻾㻰㻫㼝㼀 Çy Çq Çw 300 250 200 150 100 0 100 100001000101 Frequency [MHz] BK0402 HM750 ImpedanceʦЊʧ 300 250 200 150 100 0 100 100001000101 Frequency [MHz] BK0402 HM121 ImpedanceʦЊʧ 100 0 100 100001000101 Frequency [MHz] BK0402 HS100 ImpedanceʦЊʧ 250 200 150 100 0 100 100001000101 Frequency [MHz] BK0402 HS700 ImpedanceʦЊʧ ̯ ̧ ■BK0402 R X Z 100 100001000101 250 200 150 100 100 0 100 100001000101 Frequency [MHz] BK0603 HS220 ImpedanceʦЊʧ BK0603 HS330 100 100101 1000 10000 Frequency ʦMHzʧ ImpedanceʦЊʧ R X Z R X Z 100 100001000101 250 200 150 100 ■BK0603 100 100001000101 250 200 150 100 100 100001000101 250 200 150 100 100 100001000101 BK0603 HS601 1000 800 600 400 200 Frequency ʦMHzʧ ImpedanceʦЊʧ 100 100001000101 Z R X BK0603 LL220 Frequency ʦMHzʧ ImpedanceʦЊʧ 250 200 150 100 100 100001000101 Z ̧ BK0603 LL100 Frequency ʦMHzʧ ImpedanceʦЊʧ 250 200 150 100 100 100001000101 Z R X BK0603 HM241 500 400 300 200 100 Frequency ʦMHzʧ ImpedanceʦЊʧ 100 100001000101 Z X R BK0603 HM471 Frequency ʦMHzʧ ImpedanceʦЊʧ 1000 800 600 400 200 100 100001000101 Z R BK0603 HM601 Impedance[ɹ] 1000 800 600 400 200 Z R BK0603 LL330 Frequency ʦMHzʧ ImpedanceʦЊʧ 500 400 300 200 100 100 100001000101 X Z BK0603 LL470 500 400 300 200 100 0 100101 1000 10000 Frequency ʦMHzʧ ImpedanceʦЊʧ R X Z BK0603 LL560 500 400 300 200 100 0 100101 1000 10000 Frequency ʦMHzʧ ImpedanceʦЊʧ Z R X BK0603 LL800 1000 800 600 400 200 0 100101 1000 10000 Frequency ʦMHzʧ ImpedanceʦЊʧ Z R X BK0603 LL121 1000 800 600 400 200 0 100101 1000 10000 Frequency ʦMHzʧ ImpedanceʦЊʧ Z BK1005 HW680 Frequency ʦMHzʧ ImpedanceʦЊʧ 250 200 150 100 0 100101 1000 10000 R X Z ■BK1005

131mlci07_e-01 NOISE SUPPRESSION COMPONENTS ʗFERRITE BEAD INDUCTORS ■ ELECTRICAL CHARACTERISTICS ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. BK1005 HW121 250 200 150 100 Frequency ʦMHzʧ ImpedanceʦЊʧ 100101 1000 10000 BK1005 HW241 500 400 300 200 100 Frequency ʦMHzʧ ImpedanceʦЊʧ 100101 1000 10000 R X Z BK1005 HW431 1000 800 600 400 200 Frequency ʦMHzʧ ImpedanceʦЊʧ 100101 1000 10000 R X Z BK1005 HW601 1000 800 600 400 200 Frequency ʦMHzʧ ImpedanceʦЊʧ 100101 1000 10000 R X Z BK1005 HS100 100 Frequency ʦMHzʧ ImpedanceʦЊʧ 100101 1000 10000 R X Z BK1005 HS330 100 ImpedanceʦЊʧ 100101 1000 10000 R X Z BK1005 HS680 250 200 150 100 Frequency ʦMHzʧ ImpedanceʦЊʧ 100 100001000101 X Z 250 200 150 100 BK1005 HS800 250 200 150 100 Frequency ʦMHzʧ ImpedanceʦЊʧ 100101 1000 10000 R X Z BK1005 HS431 1000 800 600 400 200 0 100101 100001000 Frequency ʦMHzʧ ImpedanceʦЊʧ RRX ZZ RRX ZZ BK1005 HS102 2000 1000 0 1000100101 10000 Frequency ʦMHzʧ ImpedanceʦЊʧ BK1005 HR601 1000 800 600 400 200 BK1005 HM750 200 150 100 2000 1000 1 1 0 1000100 10000 BK1005 HM102 250 150 200 100 1 1 0 100 1000 10000 BK1005 LL100 250 200 150 100 1 1 0 100 1000 10000 BK1005 LL220 500 400 300 200 100 1 1 0 100 1000 10000 BK1005 LL330 BK1005 HM121 250 200 150 100 0 100 1000101 10000 Frequency ʦMHzʧ ImpedanceʦЊʧ RR X Z 500 100 200 300 400 1 1 0 100 1000 10000 500 400 300 200 100 1 1 0 100 1000 10000 BK1005 LL470

132 mlci07_e-01 ■ ELECTRICAL CHARACTERISTICS ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. 2500 2000 1500 1000 500 1 1 0 100 100001000 BK1005 LM182 RR X ZZ BKH1005 LM152 Impedance[ɹ] 3000 2500 2000 1500 1000 500 Z R X BKH1005 LM182 Impedance[ɹ] 3000 2500 2000 1500 1000 500 Z R X ■BK1608 500 400 300 200 100 1 1 0 100 1000 10000 BK1005 LL680

133mlci07_e-01 NOISE SUPPRESSION COMPONENTS ʗFERRITE BEAD INDUCTORS ■ ELECTRICAL CHARACTERISTICS ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. 500 250 1 1 0 100 1000 10000 BK1608 LL300 500 250 1 1 0 100 1000 10000 BK1608 LL470 500 250 1 1 0 100 1000 10000 BK1608 LL560 500 250 1 1 0 100 1000 10000 BK1608 LL680 1500 750 1 1 0 100 1000 BK1608 LL121 2000 4000 ■BK2125

134 mlci07_e-01 ■ ELECTRICAL CHARACTERISTICS ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. R Z X 10001001010 500 1000 R Z 10001001010 500 1000 X

135mlci07_e-01 NOISE SUPPRESSION COMPONENTS ʗFERRITE BEAD INDUCTORS ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.

mlci0109_reli-PRP1 mlci0109_reli_e-01 ■ PACKAGING ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. ◦Tape & Reel Packaging ①Minimum Qu antity ②Taping material ◦Paper tape (0.315 inches wide) ③Taping Dimensions Unit : mm （inch） To next page C K 2125 C K S 2125 C K P 2012 C K P 2016 C K P 2520 N M 2012 N M 2520 L K 2125 H K 2125 B K 2125 B K 3216 Type Thickness 〔mm〕（inch） Chip cavity Insertion Pi tch Tape Thickness A B F T CK1608（0603） 0 .8 （0.031） 1.0±0.2 （0.039±0.008） 1.8±0.2 （0.071±0.008） 4.0±0.1 （0.157±0.004） 1.1ｍａｘ（0.043max ） CK2125（0805） 0.85 （0.033） 1.5±0.2 （0.059±0.008） 2.3±0.2 （0.091±0.008） 4.0±0.1 （0.157±0.004） 1.1ｍａｘ（0.043max ） CKS2125（0805） 0.85 （0.033） 1.5±0.2 （0.059±0.008） 2.3±0.2 （0.091±0.008） 4.0±0.1 （0.157±0.004） 1.1ｍａｘ（0.043max ） LK1005（0402） 0.5 （0.020） 0.65±0.1 （0.026±0.004） 1.15±0.1 （0.045±0.004） 2.0±0.05 （0.079±0.002） 0.8ｍａｘ（0.031max） LK1608（0603） 0.8 （0.031） 1.0±0.2 （0.039±0.008） 1.8±0.2 （0.071±0.008） 4.0±0.1 （0.157±0.004） 1.1ｍａｘ（0.043max ） LK2125（0805） 0.85 （0.033） 1.5±0.2 （0.059±0.008） 2.3±0.2 （0.091±0.008） 4.0±0.1 （0.157±0.004） 1.1ｍａｘ（0.043max ） HK0402（01005） 0.2 （0.008） 0.25±0.04 （0.010±0.002） 0.45±0.04 （0.018±0.002） 2.0±0.05 （0.079±0.002） 0.36ｍａｘ 0.014max） HK0603（0201） 0.3 （0.012） 0.40±0.06 （0.016±0.002） 0.70±0.06 （0.028±0.002） 2.0±0.05 （0.079±0.002） 0.45ｍａｘ（0.018max） HK1005（0402） 0.5 （0.020） 0.65±0.1 （0.026±0.004） 1.15±0.1 （0.045±0.004） 2.0±0.05 （0.079±0.002） 0.8ｍａｘ（0.031max） HK1608（0603） 0.8 （0.031） 1.0±0.2 （0.039±0.008） 1.8±0.2 （0.071±0.008） 4.0±0.1 （0.157±0.004） 1.1ｍａｘ（0.043max ） HKQ0603S（0201） 0.3 （0.012） 0.40±0.06 （0.016±0.002） 0.70±0.06 （0.028±0.002） 2.0±0.05 （0.079±0.002） 0.45ｍａｘ（0.018max） HKQ0603U（0201） 0.3 （0.012） 0.40±0.06 （0.016±0.002） 0.70±0.06 （0.028±0.002） 2.0±0.05 （0.079±0.002） 0.45ｍａｘ（0.018max） AQ105（0402） 0.5 （0.020） 0.75±0.1 （0.030±0.004） 1.15±0.1 （0.045±0.004） 2.0±0.05 （0.079±0.002） 0.8ｍａｘ（0.031max） Type Thickness ［mm］（inch） S tandard Quantity ［pc s］ Paper Tape Em bossed Tape CK 1608（0603） 0 .8 4000 ー（0.031） CK2125（0805） .85 4000 ー（0.033） 1.25 ー 2000（0.049） CKS2125（08 05） 0.85 4000 ー（0.033） 1.25 ー 2000（0.049） CKP2012（08 05） 0.9 ー 3000（0.035） CKP2016（08 06） 0.9 ー 3000（0.035） CKP2520（10 08） 0.7 ー 3000（0.028） 0.9 ー 3000（0.035） 1.1 ー 2000（0.043） NM2012（0805） 0.9 ー 3000（0.035） NM2520（1008） 1.1 ー 2000（0.043） LK1005（0402） 0 .5 10000 ー（0.020） LK1608（0603） 0 .8 4000 ー（0.031） LK2125（0805） .85 4000 ー（0.033） 1.25 ー 2000（0.049） HK0402（01005） 0.2 20000 ー（0.008） HK0603（0201） 0 .3 15000 ー（0.012） HK1005（0402） 0 .5 10000 ー（0.020） HK1608（0603） 0 .8 4000 ー（0.031） HK2125（0805） .85 ー 4000（0.033） 1.0 ー 3000（0.039） HKQ0603S（02 01） 0.3 15000 ー（0.012） HKQ0603U（02 01） 0.3 15000 ー（0.012） AQ105（0402） 0 .5 10000 ー（0.020） BK0402（01005） 0.2 20000 ー（0.008） BK0603（0201） 0 .3 15000 ー（0.012） BK1005（0402） 0 .5 10000 ー（0.020） BKH1005（04 02） 0.5 10000 ー（0.020） BK1608（0603） 0 .8 4000 ー（0.031） BK2125（0805） .85 4000 ー（0.033） 1.25 ー 2000（0.049） BK2010（0804） 0 .45 4000 ー（0.018） BK3216（1206） 0 .8 ー 4000（0.031） BKP0603（02 01） 0.3 15000 ー（0.012） BKP1005（04 02） 0.5 10000 ー（0.020） BKP1608（06 03） 0.8 4000 ー（0.031） BKP2125（08 05） 0.85 4000 ー（0.033） C K 1608 C K 2125 C K S 2125 L K 10 05 L K 1608 L K 2125 H K 0402 H K 0 603 H K 10 05 H K 1608 H K Q 0 603 A Q 105 B K 0402 B K 0 603 B K 10 05 B K 1608 B K 2125 B K 2010 B K P 0 603 B K P 10 05 B K P 1608 B K P 2125 B K H 10 05

mlci0109_reli-PRP2mlci0109_reli_e-01 ■ PACKAGING ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. Unit : mm （inch） ◦Embossed Tape (0.315 inches wide) ④LEADER AND BLANK PORTION 160mm or more ʢ6.3inches or moreʣ Direction of tape feed 100mm or more ʢ3.94inches or moreʣ 400mm ore more ʢ15.7inches or moreʣ ⑤Reel Size 2.0ʶ0.5 ʢ0.079ʶ0.031ʣ П13.0ʶ0.2 ʢП0.512ʶ0.020ʣ ⑥Top tape strength The top tape requires a peel-off force of 0.1 ～0.7N in the direction of the arrow as illustrated below. Type Thickness 〔mm〕（inch） Chip cavity Insertion Pi tch Tape Thickness A B F T BK0402（01005） 0 .2 （0.008） 0.25±0.04 （0.010±0.002） 0.45±0.04 （0.018±0.002） 2.0±0.05 （0.079±0.002） 0.36ｍａｘ 0.014max） BK0603（0201） 0.3 （0.012） 0.40±0.06 （0.016±0.002） 0.70±0.06 （0.028±0.002） 2.0±0.05 （0.079±0.002） 0.45ｍａｘ（0.018max） BK1005（0402） 0.5 （0.020） 0.65±0.1 （0.026±0.004） 1.15±0.1 （0.045±0.004） 2.0±0.05 （0.079±0.002） 0.8ｍａｘ（0.031max） BK1608（0603） 0.8 （0.031） 1.0±0.2 （0.039±0.008） 1.8±0.2 （0.071±0.008） 4.0±0.1 （0.157±0.004） 1.1ｍａｘ（0.043max ） BK2125（0805） 0.85 （0.033） 1.5±0.2 （0.059±0.008） 2.3±0.2 （0.091±0.008） 4.0±0.1 （0.157±0.004） 1.1ｍａｘ（0.043max ） BK2010（0804） 0.45 （0.018） 1.2±0.1 （0.047±0.004） 2.17±0.1 （0.085±0.004） 4.0±0.1 （0.157±0.004） 0.8ｍａｘ（0.031max） BKP0603（0201） 0.3 （0.012） 0.40±0.06 （0.016±0.002） 0.70±0.06 （0.028±0.002） 2.0±0.05 （0.079±0.002） 0.45ｍａｘ（0.018max） BKP1005（0402） 0.5 （0.020） 0.65±0.1 （0.026±0.004） 1.15±0.1 （0.045±0.004） 2.0±0.05 （0.079±0.002） 0.8ｍａｘ（0.031max） BKP1608（0603） 0.8 （0.031） 1.0±0.2 （0.039±0.008） 1.8±0.2 （0.071±0.008） 4.0±0.1 （0.157±0.004） 1.1ｍａｘ（0.043max ） BKP2125（0805） 0.85 （0.033） 1.5±0.2 （0.059±0.008） 2.3±0.2 （0.091±0.008） 4.0±0.1 （0.157±0.004） 1.1ｍａｘ（0.043max ） BKH1005（0805） 0.5 （0.020） 0.65±0.1 （0.026±0.004） 1.15±0.1 （0.045±0.004） 2.0±0.05 （0.079±0.002） 0.8ｍａｘ（0.031max） Unit : mm （i nch ） Type Thickness 〔mm〕（inch） Chip cavity Insertion Pi tch Tape Th ickness A B F K T CK2125（0805） 1.25 （0.049） 1.5±0.2 （0.059±0.008） 2.3±0.2 （0.091±0.008） 4.0±0.1 （0.157±0.004） 2.0 （0.079） 0.3 （0.012） CKS2125（0805） 1.25 （0.049） 1.5±0.2 （0.059±0.008） 2.3±0.2 （0.091±0.008） 4.0±0.1 （0.157±0.004） 2.0 （0.079） 0.3 （0.012） CKP2012（0805） 0.9 （0.035） 1.55±0.2 （0.061±0.008） 2.3±0.2 （0.091±0.008） 4.0±0.1 （0.157±0.004） 1.3 （0.051） 0.3 （0.012） CKP2016（0806） 0.9 （0.035） 1.8±0.1 （0.071±0.004） 2.2±0.1 （0.087±0.004） 4.0±0.1 （0.157±0.004） 1.3 （0.051） 0.25 （0.01） CKP2520（1008） 0.7 （0.028） 2.3±0.1 （0.091±0.004） 2.8±0.1 （0.110±0.004） 4.0±0.1 （0.157±0.004） 1.4 （0.055） 0.3 （0.012） 0.9 （0.035） 1.4 （0.055） 1.1 （0.043） 1.7 （0.067） NM2012（0805） 0.9 （0.035） 1.55±0.2 （0.061±0.008） 2.3±0.2 （0.091±0.008） 4.0±0.1 （0.157±0.004） 1.3 （0.051） 0.3 （0.012） NM2520（1008） 1.1 （0.043） 2.3±0.1 （0.091±0.004） 2.8±0.1 （0.110±0.004） 4.0±0.1 （0.157±0.004） 1.7 （0.067） 0.3 （0.012） LK2125（0805） 1.25 （0.049） 1.5±0.2 （0.059±0.008） 2.3±0.2 （0.091±0.008） 4.0±0.1 （0.157±0.004） 2.0 （0.079） 0.3 （0.012） HK2125（0805） 0.85 （0.033） 1.5±0.2 （0.059±0.008） 2.3±0.2 （0.091±0.008） 4.0±0.1 （0.157±0.004） 1.5 （0.059） 0.3 （0.012）1.0 （0.039） 2.0 （0.079） BK2125（0805） 1.25 （0.049） 1.5±0.2 （0.059±0.008） 2.3±0.2 （0.091±0.008） 4.0±0.1 （0.157±0.004） 2.0 （0.079） 0.3 （0.012） BK3216（1206） 0.8 （0.031） 1.9±0.1 （0.075±0.004） 3.5±0.1 （0.138±0.004） 4.0±0.1 （0.157±0.004） 1.4 （0.055） 0.3 （0.012）

mlci0109_reli-PRP3 mlci0109_reli_e-01 ■ RELIABILITY DATA ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. Multilayer chip inductors and beads 1. Operating Temperature Range BK0402 －55～＋125℃ BK0603 BK1005 BKH1005 BK1608 BK2125 ARRAY BK2010 BK3216 BKP0603 －55～＋85℃BKP1005 BKP1608 BKP2125 CK1608 －40～＋85℃ CK2125 CKS2125 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 LK2125 HK0402 －55～＋125℃HK0603 HK1005 HK1608 －40～＋85℃HK2125 HKQ0603S －55～＋125℃HKQ0603U AQ105 2. Storage Temperature Range BK0402 －55～＋125℃ BK0603 BK1005 BKH1005 BK1608 BK2125 ARRAY BK2010 BK3216 BKP0603 －55～＋85℃BKP1005 BKP1608 BKP2125 CK1608 －40～＋85℃ CK2125 CKS2125 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 LK2125 HK0402 －55～＋125℃HK0603 HK1005 HK1608 －40～＋85℃HK2125 HKQ0603S －55～＋125℃HKQ0603U AQ105

mlci0109_reli-PRP4mlci0109_reli_e-01 ■ RELIABILITY DATA ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. Multilayer chip inductors and beads 3. Rated Current BK0402 240～540mA DC B K0603 100～500mA ＤＣ BK1005 120～1000mA ＤＣ BKH1005 200mA ＤＣ BK 1608 150～1500mA ＤＣ BK2125 200～1200mA ＤＣ ARRAY BK2010 100mA ＤＣ BK 3216 100～200mA ＤＣ BKP0603 1.0A ＤＣ BK P1005 800～2000mA D C B KP1608 1.0～3.0A ＤＣ BK P2125 1.5～4.0A ＤＣ CK 1608 50～60mA DC CK 2125 60～500mA D C C KS2125 110～280mA DC C KP2012 0.7～1.2A DC CK P2016 0.9～1.6A DC CK P2520 1.1～1.8A DC NM 2012 0.8～1.5A DC NM 2520 0.9～1.1A DC LK 1005 20～25mA DC LK 1608 1～150mA DC LK 2125 5～300mA DC HK 0402 160～380mA D C H K0603 60～470mA DC H K1005 110～300mA D C H K1608 150～300mA D C H K2125 300mA DC HK Q0603S 130～600mA D C H KQ0603U 130～600mA D C A Q105 280～710mA DC Deﬁnition of rated current ：・In the CK, CKS and BK Series, the rated current is the value of current at which the temperature of the element is increased within 20 ℃. ・In t he BK Series P type and CK Series P type, NM Series the rated current is the value of current at which the temperature of the element is increased within 40 ℃. ・In t he LK,HK,HKQ,and AQ Series, the rated current is either the DC value at which the internal L value is decreased within 5% with the application of DC bias, or the value of current at w hich the temperature of the element is increased within 20 ℃. 4. Impedance BK0402 10～120Ω ±2 5% BK0603 10～600Ω ±2 5% BK1005 10～1800Ω ±2 5% BKH1005 1500～1800Ω ±2 5% BK1608 22～2500Ω ±2 5% BK2125 15～2500Ω ±2 5% ARRAY BK2010 5～1000Ω ±2 5% BK3216 68～1000Ω ±2 5% BKP0603 22～33Ω ±2 5% BKP1005 10～220Ω ±2 5% BKP1608 33～470Ω ±2 5% BKP2125 33～330Ω ±2 5% CK1608 CK2125 CKS2125 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 LK2125 HK0402 HK0603 HK1005 HK1608 HK2125 HKQ0603S HKQ0603U AQ105 【Test Methods and Remarks 】 BK

0402 Series

asuring frequency ：10 0±1MHz Measuring equipment ：E4 991A（or its equivalent ） Measuring jig ：16 196D（or its equivalent ） BK0603 Series, BKP0603 Series Me asuring frequency ：10 0±1MHz Measuring equipment ：42 91A（or its equivalent ） Measuring jig ：16 193A（or its equivalent ） BK1005 Series, BKP1005 Series, BKH1005 Series Me asuring frequency ：10 0±1MHz Measuring equipment ：42 91A（or its equivalent ） Measuring jig ：16 192A（or its equivalent ）, 16193A（or its equivalent ） BK1608・2125 Se ries, BKP1608・2125 Series Measuring frequency ：10 0±1MHz Measuring equipment ：42 91A（or its equivalent ）, 4195A（or its equivalent ） Measuring jig ：16 092A（or its equivalent ） or 16192A（or its equivalent ）/HW BK2010・3216 Se ries Measuring frequency ：10 0±1MHz Measuring equipment ：42 91A（or its equivalent ） , 4195A（or its equivalent ） Measuring jig ：16 192A（or its equivalent ）

mlci0109_reli-PRP5 mlci0109_reli_e-01 ■ RELIABILITY DATA ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. Multilayer chip inductors and beads 5. Inductance BK0402 BK0603 BK1005 BKH1005 BK1608 BK2125 ARRAY BK2010 BK3216 BKP0603 BKP1005 BKP1608 BKP2125 LK1005 0.12～2.2μH：±10% Q 0 .12～2.2μH：±30% HKQ0603S 0.6～6.2nH： ±0.3nH 6.8～22nH：±5% HKQ0603U 0.6～6.2nH： ±0.3nH 6.8～22nH：±5% 【Test Methods and Remarks 】 CK S eries： Me asuring frequency ：2 to 4 MHz （CK1608） Measuring frequency ：2 to 2 5MHz （CK2125） Measuring frequency ：2 to 1 0MHz （CKS2125） LK Series： Me asuring frequency ：10 t o 25MHz （LK1005） Measuring frequency ：1 to 5 0MHz （LK1608） Measuring frequency ：0. 4 to 50MHz （LK2125） CKP Series, NM Series ： Me asuring frequency ：1M Hz（CKP2012, CKP2016, CKP2520, NM2012・NM2520） Measuring equipment, jig ：・4 194A＋16085B＋16092A（or its equivalent ）・4195A＋41951＋16092A（or i ts equivalent ）・4294A＋16192A（or i ts equivalent ）・4291A＋16193A（or i ts equivalent ）/LK1005 ・4285A＋42841A＋42842C＋42851－61100（CK P2012・CKP2016・CKP2520・NM2012・NM2520） Measuring current ：・1 mA rms（0.047 to 4.7μH）・0.1mA rms（5.6 to 33μH） HK、HKQ、AQ Series： M easuring frequency ：10 0MHz（HK0402・HK0603・HK1005・AQ105） Measuring frequency ：50 /100MHz（HK1608・HK2125） Measuring frequency ：50 0MHz（HKQ0603S・HKQ0603U） Measuring equipment, jig ：・4 291A＋16197A（or its equivalent ）/HK0603・AQ105 ・4291A＋16193A（or i ts equivalent ）/HK1005 ・E4991A＋16197A（or i ts equivalent ）/HKQ0603S・HKQ0603U ・4291A＋16092＋in-house m a de jig（or its equivalent ）/HK1608・HK2125 ・E4991A＋16196D（or i ts equivalent ）/HK0402

mlci0109_reli-PRP6mlci0109_reli_e-01 ■ RELIABILITY DATA ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. Multilayer chip inductors and beads 6. Q BK0402 BK0603 BK1005 BKH1005 BK1608 BK2125 ARRAY BK2010 BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 20 min. CK 2125 15～20 min. CK S2125 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 10～20 min. LK 1608 10～35 min. LK 2125 15～50 min. HK 0402 3 min. HK0603 4～5 min. HK 1005 8 min. HK1608 8～12 min. HK 2125 10～18 min. HK Q0603S 10～13 min. HK Q0603U 10～13 min. AQ 105 8 min. 7. DC Resistance BK0402 0.10～0.53Ω ma x. BK0603 0.065～1.50Ω ma x. BK1005 0.03～0.80Ω ma x. BKH1005 1.50～2.00Ω ma x. BK1608 0.05～1.10Ω ma x. BK2125 0.05～0.75Ω ma x. ARRAY BK2010 0.10～0.90Ω ma x. BK3216 0.15～0.80Ω ma x. BKP0603 0.065～0.070Ω ma x. BKP1005 0.030～0.20Ω ma x. BKP1608 0.025～0.18Ω ma x. BKP2125 0.020～0.075Ω ma x. CK2125 0.16～0.65Ω max. CKS2125 0.09～0.40Ω ty p. 0.12～0.52Ω ma x. CKP2012 0.10～0.28Ω ma x. CKP2016 0.08～0.20Ω ma x. CKP2520 0.05～0.16Ω ma x. NM2012 0.10～0.19Ω ma x. NM2520 0.13～0.22Ω ma x. LK1005 0.41～1.16Ω ma x. LK1608 0.2～2.2Ω ma x. LK2125 0.1～1.1Ω ma x. HK0402 0.18～0.99Ω ma x. HK0603 0.11～3.74Ω ma x. HK1005 0.08～4.8Ω ma x. HK1608 0.05～2.6Ω ma x. HK2125 0.10～1.5Ω ma x. HKQ0603S 0.06～1.29Ω max. HKQ0603U 0.06～1.29Ω max. AQ105 0.07～0.45Ω ma x. 【Test Methods and Remarks 】 Me asuring equipment ：VO AC-7412（made by Iwasaki Tsushinki ） VOAC-7512（made by Iwasaki Tsushinki ）【Test Methods and Remarks 】 CK S eries： Me asuring frequency ：2 to 4 MHz（CK1608） Measuring frequency ：2 to 2 5MHz（CK2125） LK Series： Me asuring frequency ：10 t o 25MHz（LK1005） Measuring frequency ：1 to 5 0MHz（LK1608） Measuring frequency ：0. 4 to 50MHz（LK2125） Measuring equipment, jig ：・4 194A＋16085B＋16092A（or its equivalent ）・4195A＋41951＋16092A（or i ts equivalent ）・4294A＋16192A（or i ts equivalent ）・4291A＋16193A（or i ts equivalent ）/LK1005 Measuring current ：・1 mA rms（0.047 to 4.7μH）・0.1mA rms（5.6 to 33μH） HK、HKQ、AQ Series： M easuring frequency ：10 0MHz（HK0603・HK1005・AQ105） Measuring frequency ：50 /100MHz（HK1608・HK2125） Measuring frequency ：50 0MHz（HKQ0603S・HKQ0603U） Measuring equipment, jig ：・4291A＋16197A（or its equivalent ）/HK0603・AQ105 ・4291A＋16193A（or its equivalent ）/HK1005 ・E4991A＋16197A（or i ts equivalent ）/HKQ0603S・ HKQ0603U ・4291A＋16092A＋ in -house made jig（or its equivalent ）/HK1608・HK2125 ・E4991A＋16196D（or i ts equivalent ）HK0402

mlci0109_reli-PRP7 mlci0109_reli_e-01 ■ RELIABILITY DATA ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. Multilayer chip inductors and beads 8. Self Resonance Frequency（SRF） BK0402 BK0603 BK1005 BKH1005 BK1608 BK2125 ARRAY BK2010 BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 17～25MHz mi CK2125 24～235MHz mi n. CKS2125 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 40～180MHz mi LK1608 9～260MHz mi n. LK2125 13～320MHz mi n. HK0402 29000 ～10000MHz m i n. HK0603 900～10000MHz m i n. HK1005 400～10000MHz m i n. HK1608 300～10000MHz m i n. HK2125 200～4000MHz m i n. HKQ0603S 1900～10000MHｚ mi n. HKQ0603U 1900～10000MHｚ mi n. AQ105 2300～10000MHz m i n. 【Test Methods and Remarks 】 LK S eries： Me asuring equipment ：41 95A（or its equivalent ） Measuring jig：41 951＋16092A（or its equivalent ） HK、HKQ、AQ Series： M easuring equipment ：87 19C（or its equivalent ）・8753D（or its equivalent ）/HK2125 9. Temperature Characteristic BK0402 BK0603 BK1005 BKH1005 BK1608 BK2125 ARRAY BK2010 BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKS2125 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 LK2125 HK0402 Inductance ch ange：Within ±10％ HK0603 HK1005 HK1608 HK2125 HKQ0603S HKQ0603U AQ105 【Test Methods and Remarks 】 HK、HKQ、AQ Series：T emperature range ：－30 to ＋85℃ Reference temperature ：＋2 0℃

mlci0109_reli-PRP8mlci0109_reli_e-01 ■ RELIABILITY DATA ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. Multilayer chip inductors and beads 10. Resistance to Flexure of Substrate BK0402 No mechanical damage. BK0603 BK1005 BKH1005 BK1608 BK2125 ARRAY BK2010 BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKS2125 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 LK2125 HK0402 HK0603 HK1005 HK1608 HK2125 HKQ0603S HKQ0603U AQ105 【Test Methods and Remarks】 Warp：2mm（BK Series without 0402size, BKP , BKH, CK, CKS, CKP , NM, LK, HK, HKQ, AQ Series）：1mm（BK0402, HK0402 Series ） Testing board：glass epoxy-resin substrate Thickness：0.8mm 11. Solderability BK0402 At least 75％ o f terminal electrode is covered by new solder. BK0603 BK1005 BKH1005 BK1608 BK2125 ARRAY BK2010 BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 At least 75％ o f terminal electrode is covered by new solder. CK2125 CKS2125 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 LK2125 HK0402 HK0603 HK1005 HK1608 HK2125 HKQ0603S HKQ0603U AQ105 【Test Methods and Remarks 】 So lder temperature ：23 0±5℃ Duration：4±1 se c.

mlci0109_reli-PRP9 mlci0109_reli_e-01 ■ RELIABILITY DATA ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. Multilayer chip inductors and beads 12. Resistance to Soldering BK0402 Appearance ：No si gniﬁcant abnormality. Impedance c h ange：Within ±30％ BK0603 BK1005 BKH1005 BK1608 BK2125 ARRAY BK2010 BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 No mechanical damage. Re maining terminal electrode ：70％ min. Inductance c h ange R10 ～4R7 ： W ithin ±10％ 6R8 ～100 ： W ithin ±15％ CKS2125 ： W ithin ±20％ CKP2012 、CK P2016、CKP2520、NM2012、NM2520：Within ±30％ CK2125 CKS2125 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 No mechanical damage. Remaining terminal electrode ：70％ min. Inductance change ：Within ±15％ LK1608 No mechanical damage. Re maining terminal electrode ：70％ min. Inductance change 47N ～4R7：Within ±10％ 5R6～330：Within ±15％LK2125 HK0402 No mechanical damage. Re maining terminal electrode ：70％ min. Inductance ch ange：Within ±5％ HK 0603 HK1005 HK1608 HK2125 HKQ0603S HKQ0603U AQ105 【Test Methods and Remarks 】 So lder temperature ：26 0±5℃ Duration：10±0.5 se c. Preheating temperature ：15 0 to 180℃ Preheating time ：3 mi n. Flux：Immersion i n to methanol solution with colophony for 3 to 5 sec. Recovery：2 to 3 h rs of recovery under the standard condition after the test. （See Note 1） 13. Thermal Shock BK0402 Appearance ：No si gniﬁcant abnormality. Impedance c h ange：Within ±30％ BK0603 BK1005 BKH1005 BK1608 BK2125 ARRAY BK2010 BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 No mechanical damage. In ductance c h ange：Within ±20％ Q change：Within ±30％ Inductance c h ange：Within ±20％（CKS2125） CK2125 CKS2125 CKP2012 No mechanical damage. Inductance change ：Wi thin ±30％ CKP2016 CKP2520 NM2012 NM2520 LK1005 No mechanical damage. In ductance c h ange：Within ±10％ Q change：Within ±30％LK1608 LK2125 HK0402 No mechanical damage. In ductance c h ange：Within ±10％ Q change：Within ±20％ HK0603 HK1005 HK1608 HK2125 HKQ0603S HKQ0603U AQ105 【Test Methods and Remarks 】 Co nditions f o r 1 cycle Step 1：Minimum operating temperature ＋0 －3 ℃ 30±3 min. Step 2：Room temperature 2 to 3 min. S tep 3：Maximum operating temperature ＋3 －0 ℃ 30±3 min. Step 4：Room temperature 2 to 3 min. N umber of cycles：5 Re covery：2 to 3 h rs of recovery under the standard condition after the test. （See Note 1） (Note 1) When there are questions concerning mesurement result ；measurement shall be made after 48 ±2 hrs of recovery under the standard condition.

mlci0109_reli-PRP10mlci0109_reli_e-01 ■ RELIABILITY DATA ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. Multilayer chip inductors and beads 14. Damp Heat （Steady state ） BK0402 Appearance ：No si gniﬁcant abnormality. Impedance c h ange：Within ±30％ BK0603 BK1005 BKH1005 BK1608 BK2125 ARRAY BK2010 BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 No mechanical damage. In ductance c h ange：Within ±20％ Q change：Within ±30％CK2125 CKS2125 Inductance c h ange：Within ±20％ CKP2012 No mechanical damage. Inductance change ：Wi thin ±30％ CKP2016 CKP2520 NM2012 NM2520 LK1005 No mechanical damage. In ductance c h ange：Within ±10％ Q change：Within ±30％LK1608 LK2125 No mechanical damage. Inductance change ：Wi thin ±20％ Q change：Within ±30％ HK0402 No mechanical damage. In ductance c h ange：Within ±10％ Q change：Within ±20％ HK0603 HK1005 HK1608 HK2125 HKQ0603S HKQ0603U AQ105 【Test Methods and Remarks 】 BK , BKP, BKH Series： Te mperature：40±2℃ Humidity：90 to 9 5％RH Duration：500＋24 －0 hrs Recovery：2 to 3 h rs of recovery under the standard condition after the removal from test chamber. （See Note 1） Humidity：90 to 9 5％RH Duration：500±12 hr s Recovery：2 to 3 h rs of recovery under the standard condition after the removal from test chamber. （See Note 1）

mlci0109_reli-PRP11 mlci0109_reli_e-01 ■ RELIABILITY DATA ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. Multilayer chip inductors and beads 15. Loading under Damp Heat BK0402 Appearance ：No si gniﬁcant abnormality. Impedance c h ange：Within ±30％ BK0603 BK1005 BKH1005 BK1608 BK2125 ARRAY BK2010 BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 No mechanical damage. In ductance c h ange：Within ±20％ Q change：Within ±30％CK2125 CKS2125 No mechanical damage. Inductance change ：Wi thin ±20％ CKP2012 No mechanical damage. Inductance change ：Wi thin ±30％ CKP2016 CKP2520 NM2012 NM2520 LK1005 No mechanical damage. Inductance change ：Wi thin ±10％ Q change：Within ±30％ LK1608 No mechanical damage. In ductance c h ange：0.047 to 12.0μH：Within ±10％ 15.0 to 33.0μH：Within ±15％ Q change：Within ±30％ LK2125 No mechanical damage. Inductance change ：Wi thin ±20％ Q change：Within ±30％ HK0402 No mechanical damage. In ductance c h ange：Within ±10％ Q change：Within ±20％ HK0603 HK1005 HK1608 HK2125 HKQ0603S HKQ0603U AQ105 【Test Methods and Remarks 】 BK , BKP, BKH Series： Te mperature：40±2℃ Humidity：90 to 9 5％RH Applied current ：Ra ted current Duration：500＋24 －0 hrs Recovery：2 to 3 h rs of recovery under the standard condition after the removal from test chamber. （See Note 1） Humidity：90 to 9 5％RH Applied current ：Ra ted current Duration：500±12 hr s Recovery：2 to 3 h rs of recovery under the standard condition after the removal from test chamber. （See Note 1） Note on standard condition: "standard condition" referred to herein is deﬁned as follows: 5 to 35℃ o f temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure. When there are questions concerning measurement results: In o rder to provide correlation data, the test shall be conducted under condition of 20 ±2℃ o f temperature, 60 to 70% relative humidity, and 86 to 106kPa of air pressure. Unless otherwise speciﬁed, all the tests are conducted under the "standard condition." ote 1) Measurement shall be made after 48 ±2 hr s of recovery under the standard condition.

mlci0109_reli-PRP12mlci0109_reli_e-01 ■ RELIABILITY DATA ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. Multilayer chip inductors and beads 16. Loading at High Temperature BK0402 Appearance ：No si gniﬁcant abnormality Impedance c h ange：Within ±30％ BK0603 BK1005 BKH1005 BK1608 BK2125 ARRAY BK2010 BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 No mechanical damage. In ductance c h ange：Within ±20％ Q change：Within ±30％CK2125 CKS2125 No mechanical damage. Inductance change ：Wi thin ±20％ CKP2012 No mechanical damage. Inductance change ：Wi thin ±30％ CKP2016 CKP2520 NM2012 NM2520 LK1005 No mechanical damage. Inductance change ：Wi thin ±10％ Q change：Within ±30％ LK1608 No mechanical damage. In ductance c h ange：0.047 to 12.0μH：Within ±10％ 15.0 to 33.0μH：Within ±15％ Q change：Within ±30％ LK2125 No mechanical damage. Inductance change ：Wi thin ±20％ Q change：Within ±30％ HK0402 No mechanical damage. In ductance c h ange：Within ±10％ Q change：Within ±20％ HK0603 HK1005 HK1608 HK2125 HKQ0603S HKQ0603U AQ105 【Test Methods and Remarks 】 BK , BKH Series： Te mperature：125±3℃ Applied current ：Ra ted current Duration：500＋24 －0 hrs Recovery：2 to 3 h rs of recovery under the standard condition after the removal from test chamber. （See Note 1）：85±2℃ （HK 1005, AQ105 operating temperature range － 55 to ＋85℃）：125±2℃ （HK 0402, HK0603, HK1005, HKQ0603S, HKQ0603U, AQ105 operating temperature range － 55 to ＋125℃） Applied current ：Ra ted current Duration：500±12 hr s Recovery：2 to 3 h rs of recovery under the standard condition after the test. （See Note 1） Note on standard condition: "standard condition" referred to herein is deﬁned as follows: 5 to 35℃ o f temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure. When there are questions concerning measurement results: In order to provide correlation data, the test shall be conducted under condition of 20 ±2℃ of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air pressure. Unless other - wise speciﬁed, all the tests are conducted under the "standard condition." ote 1) Measurement shall be made after 48 ±2 hr s of recovery under the standard condition.

mlci0109_reli-PRP13 mlci0109_reli_e-01 ■ PRECAUTIONS ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer chip bead Inductors 1. Circuit Design Precautions ◆Veriﬁcation o f o perating environment, electrical rating and performance 1. A malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social ramiﬁcations. A s such, any inductors to be used in such equipment may require higher safety and/or reliability considerations and should be clearly differentiated from co mponents u s ed in general purpose applications. ◆Operating C u rrent （Veriﬁcation of Rated current ） 1. The operating current for inductors must always be lower than their rated values. . Do not apply current in excess of the rated value because the inductance may be reduced due to the magnetic saturation effect. 2. PCB Design Precautions ◆Pattern conﬁgurations（D esign of Land-patterns ） 1. When inductors are mounted on a PCB, the size of land patterns and the amount of solder used （s ize of ﬁllet ）can directly affect inductor performance. Therefore, the following items must be carefully considered in the design of solder land patterns: （1） The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or cracking. Therefore, when d esigning land-patterns it is necessary to consider the appropriate size and conﬁguration of the solder pads which in turn determines the amount of so lder necessary to form the ﬁllets. （2） W hen m ore than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's soldering point is separated by solder-resist. （3） The larger size of land patterns and amount of solder, the smaller Q value after mounting on PCB. It makes higher the Q value to design land patterns s maller than terminal electrode of chips. ◆Pa ttern conﬁgurations（I nductor layout on panelized ［breakaway］ PC boards） 1. After inductors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing processes （P CB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reﬂow soldered boards etc. ）Fo r this reason, planning pattern conﬁgurations a n d the position of SMD inductors should be carefully performed to minimize stress. Technical co nsider- ations ◆Pattern conﬁgurations（D esign of Land-patterns ） 1. The following diagrams and tables show some examples of recommended patterns to prevent excessive solder amounts （l arger ﬁllets which extend above the component end terminations ）. Ex amples of improper pattern designs are also shown. （1） Recommended land dimensions for a typical chip inductor land patterns for PCBs Recommended land dimensions for wave-soldering Recommended land dimensions for reﬂow-soldering Type 1608 2125 3216Size L 1.6 2.0 3.2 W 0.8 1.25 1.6 （Unit：mm）（Unit：mm） Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore, please take proper precautions when designing land-patterns. Recommended l a nd dimension for Reﬂow-soldering Type 3216 2010 Size L 3.2 2.0 W 1.6 1.0 d 0.8 0.5 （Unit：mm）（2） Examples of good and bad solder application Item Not recommended Recommended Mixed mounting of SMD and leaded components Component placement close to the chassis Hand-soldering of leaded components near mounted components Horizontal component placement To next page

mlci0109_reli-PRP14mlci0109_reli_e-01 ■ PRECAUTIONS ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer chip bead Inductors 3. Considerations for automatic placement Precautions ◆Adjustment o f m ounting machine 1. Excessive impact load should not be imposed on the inductors when mounting onto the PC boards. . The maintenance and inspection of the mounter should be conducted periodically. ◆Se lection o f A dhesives 1. Mounting inductors with adhesives in preliminary assembly, before the soldering stage, may lead to degraded inductor characteristics unless the following fa ctors are appropriately checked; the size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, it is im perative to consult the manufacturer of the adhesives on proper usage and amounts of adhesive to use. Te chnical co nsider- ations ◆Adjustment of m ounting machine 1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the inductors, causing damage. To avoid this, the following points should be co nsidered b e fore lowering the pick-up nozzle: （1） The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC board after correcting for deﬂection of the board. （2） The pi ck-up pressure should be adjusted between 1 and 3N static loads. （3） To reduce the amount of deﬂection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins should be used under the PC b oard. The following diagrams show some typical examples of good pick-up nozzle placement: Item Improper method Proper method Single-sided mounting Double-sided mounting 2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the inductors because of mechanical impact on the inductors. To avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance, inspection and replacement of the pin should be conducted periodically. ◆Se lection of A dhesives 1. Some adhesives may cause reduced insulation resistance. The difference between the shrinkage percentage of the adhesive and that of the inductors may re sult in stresses on the inductors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect component pl acement, s o t he following precautions should be noted in the application of adhesives. （1） Required adhesive characteristics a. The adhesive should be strong enough to hold parts on the board during the mounting & solder process. b . The adhesive should have sufﬁcient strength at high temperatures. c . The adhesive should have good coating and thickness consistency. d . The adhesive should be used during its prescribed shelf life. e . The adhesive should harden rapidly. f . The adhesive must not be contaminated. g . The adhesive should have excellent insulation characteristics. h . The adhesive should not be toxic and have no emission of toxic gasses. （2） W hen u sing adhesives to mount inductors on a PCB, inappropriate amounts of adhesive on the board may adversely affect component placement. Too little adhesive may cause the inductors to fall off the board during the solder process. Too much adhesive may cause defective soldering due excessive ﬂo w of adhesive on to the land or solder pad. ［Re commended conditions ］ Figure 0805 case sizes as examples a 0.3mm min b 100～120μm c Area with no adhesive 2. PCB Design Technical consider - ations ◆Pattern conﬁgurations（I nductor layout on panelized ［breakaway］ PC boards） 1-1. The following are examples of good and bad inductor layout; SMD inductors should be located to minimize any possible mechanical stresses from board wa rp or deﬂection. Item Not recommended Recommended Deﬂection of the board 1-2. To layout the inductors for the breakaway PC board, it should be noted that the amount of mechanical stresses given will vary depending on inductor layout. An example below should be counted for better design. 1-3. When breaking PC boards along their perforations, the amount of mechanical stress on the inductors can vary according to the method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, any ideal SMD inductor layout must also consider the PCB splitting procedure.

mlci0109_reli-PRP15 mlci0109_reli_e-01 ■ PRECAUTIONS ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer chip bead Inductors 4. Soldering Precautions ◆Selection o f F lux 1. Since ﬂux may have a signiﬁcant effect on the performance of inductors, it is necessary to verify the following conditions prior to use; （1） Flux used should be with less than or equal to 0.1 wt% （ Chlorine conversion method ） of halogenated content. Flux having a strong acidity content should not be applied. （2） W hen so ldering inductors on the board, the amount of ﬂux applied should be controlled at the optimum level. （3） When using water-soluble ﬂux, special care should be taken to properly clean the boards. oldering 1. Temperature, time, amount of solder, etc. are speciﬁed in accordance with the following recommended conditions, and please contact us about peak tem-an d please contact us about peak tem - pe rature when you use lead-free paste. Te chnical co nsider- ations ◆Selection o f F lux 1-1. When too much halogenated substance （C hlorine, etc. ）content is used to activate the ﬂux, or highly acidic ﬂux is used, an excessive amount of residue after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the surface of the Inductor. -2. Flux is used to increase solderability in ﬂow soldering, but if too much is applied, a large amount of ﬂux gas may be emitted and may detrimentally affect so lderability. T o m inimize the amount of ﬂux applied, it is recommended to use a ﬂux-bubbling system. 1-3. Since the residue of water-soluble ﬂux is easily dissolved by water content in the air, the residue on the surface of Inductor in high humidity conditions may ca use a degradation of insulation resistance and therefore affect the reliability of the components. The cleaning methods and the capability of the machines us ed should also be considered carefully when selecting water-soluble ﬂux. ◆So ldering 1-1. Preheating when soldering H eating: C hip inductor components should be preheated to within 100 to 130 ℃ of the soldering. Cooling: The temperature difference between the components a n d cleaning process should not be greater than 100 ℃. Chip i nductors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore, the soldering process must be conducted with a great care so as to prevent malfunction of the components due to excessive thermal shock. R ecommended co nditions for soldering ［Reﬂow soldering ］ Temperature p r oﬁle Peak 260ˆ max 10 sec max ʢPb free solderingʣ ʢPb free solderingʣ ʢPb free solderingʣ Peak 260ˆ max 10 sec max ˞Ceramic chip components should be preheated to within 100 to 130ˆ of the soldering. ˞Assured to be reﬂow soldering for 2 times. ˞Ceramic chip components should be preheated to within 100 to 130ˆ of the soldering. ˞Assured to be wave soldering for 1 time. ˞Except for reﬂow soldering type. ʢ˞᷎ ̩T190ˆ ʢ3216Type maxʣ, ᷎̩ʽ130ˆ ʢ3225 Type mingʣ ˞It is recommended to use 20W soldering iron and the tip is 1П or less. ˞The soldering iron should not directly touch the components. ˞Assured to be soldering iron for 1 time. Note: The above proﬁles are the maximum allowable soldering condition, therefore these proﬁles are not always recommended. Temperatureʢˆʣ 300 200 100 Temperatureʢˆʣ 300 200 100 Temperatureʢˆʣ 400 300 200 100 Preheating 150ˆ 60 sec min Gradually cooling Gradually cooling Gradually cooling Heating above 230ˆ 40 sec max Preheating 150ˆ 120 sec min 350ˆ max 3 sec max 60 sec min ᷎ ̩ Caution 1. The ideal condition is to have solder mass （ﬁllet）controlled to 1/2 to 1/3 of the thickness of the inductor, as shown below: 2. Because excessive dwell times can detrimentally affect solderability, soldering duration should be kept as close to recommended times as possible. ［Wave soldering ］ Temperature p r oﬁle Peak 260ˆ max 10 sec max ʢPb free solderingʣ ʢPb free solderingʣ ʢPb free solderingʣ Peak 260ˆ max 10 sec max ˞Ceramic chip components should be preheated to within 100 to 130ˆ of the soldering. ˞Assured to be reﬂow soldering for 2 times. ˞Ceramic chip components should be preheated to within 100 to 130ˆ of the soldering. ˞Assured to be wave soldering for 1 time. ˞Except for reﬂow soldering type. ʢ˞᷎ ̩T190ˆ ʢ3216Type maxʣ, ᷎̩ʽ130ˆ ʢ3225 Type mingʣ ˞It is recommended to use 20W soldering iron and the tip is 1П or less. ˞The soldering iron should not directly touch the components. ˞Assured to be soldering iron for 1 time. Note: The above proﬁles are the maximum allowable soldering condition, therefore these proﬁles are not always recommended. Temperatureʢˆʣ 300 200 100 Temperatureʢˆʣ 300 200 100 Temperatureʢˆʣ 400 300 200 100 Preheating 150ˆ 60 sec min Gradually cooling Gradually cooling Gradually cooling Heating above 230ˆ 40 sec max Preheating 150ˆ 120 sec min 350ˆ max 3 sec max 60 sec min ᷎ ̩ Caution 1. Make sure the inductors are preheated sufﬁciently. 2. The temperature difference between the inductor and melted solder should not be greater than 100 to 130 ℃. . Cooling after soldering should be as gradual as possible. . Wave soldering must not be applied to the inductors designated as for reﬂow soldering only. ［Hand soldering ］ Temperature p r oﬁle Peak 260ˆ max 10 sec max ʢPb free solderingʣ ʢPb free solderingʣ ʢPb free solderingʣ Peak 260ˆ max 10 sec max ˞Ceramic chip components should be preheated to within 100 to 130ˆ of the soldering. ˞Assured to be reﬂow soldering for 2 times. ˞Ceramic chip components should be preheated to within 100 to 130ˆ of the soldering. ˞Assured to be wave soldering for 1 time. ˞Except for reﬂow soldering type. ʢ˞᷎ ̩T190ˆ ʢ3216Type maxʣ, ᷎̩ʽ130ˆ ʢ3225 Type mingʣ ˞It is recommended to use 20W soldering iron and the tip is 1П or less. ˞The soldering iron should not directly touch the components. ˞Assured to be soldering iron for 1 time. Note: The above proﬁles are the maximum allowable soldering condition, therefore these proﬁles are not always recommended. Temperatureʢˆʣ 300 200 100 Temperatureʢˆʣ 300 200 100 Temperatureʢˆʣ 400 300 200 100 Preheating 150ˆ 60 sec min Gradually cooling Gradually cooling Gradually cooling Heating above 230ˆ 40 sec max Preheating 150ˆ 120 sec min 350ˆ max 3 sec max 60 sec min ᷎ ̩ Caution 1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm. 2. The soldering iron should not directly touch the inductor.

mlci0109_reli-PRP16mlci0109_reli_e-01 ■ PRECAUTIONS ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. 5. Cleaning Precautions ◆Cleaning c o nditions 1. When cleaning the PC board after the Inductors are all mounted, select the appropriate cleaning solution according to the type of ﬂux used and purpose of th e cleaning（e .g. to remove soldering ﬂux or other materials from the production process. ） 2. Cleaning conditions should be determined after verifying, through a test run, that the cleaning process does not affect the inductor's characteristics. Te chnical co nsider- ations ◆Cleaning co nditions 1. The use of inappropriate solutions can cause foreign substances such as ﬂux residue to adhere to the inductor, resulting in a degradation of the inductor's el ectrical properties（e specially insulation resistance ）. 2. Inappropriate cleaning conditions （i nsufﬁcient or excessive cleaning ）may detrimentally affect the performance of the inductors. （1） Excessive cleaning a. In the case of ultrasonic cleaning, too much power output can cause excessive vibration of the PC board which may lead to the cracking of the inductor or t he soldered portion, or decrease the terminal electrodes' strength. Thus the following conditions should be carefully checked; Ul trasonic o u tput Below 20W/ℓ Ultrasonic f r equency Below 40kHz Ultrasonic w a shing period 5 min. or less 6. Post cleaning processes Precautions ◆Application o f r esin coatings, moldings, etc. to the PCB and components. 1. With some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal st orage conditions resulting in the deterioration of the inductor's performance. . When a resin's hardening temperature is higher than the inductor's operating temperature, the stresses generated by the excess heat may lead to inductor da mage or destruction. . Stress caused by a resin's temperature generated expansion and contraction may damage inductors. T he use of such resins, molding materials etc. is not recommended. Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer chip bead Inductors 7. Handling Precautions ◆Breakaway P C b oards（splitting along perforations ） 1. When splitting the PC board after mounting inductors and other components, care is required so as not to give any stresses of deﬂection or twisting to the bo ard. 2. Board separation should not be done manually, but by using the appropriate devices. ◆Ge neral handling precautions . Always wear static control bands to protect against ESD. . Keep the inductors away from all magnets and magnetic objects. . Use non-magnetic tweezers when handling inductors. . Any devices used with the inductors （s oldering irons, measuring instruments ） should be properly grounded. 5. Keep bare hands and metal products （i .e., metal desk ）away from chip electrodes or conductive areas that lead to chip electrodes. 6. Keep inductors away from items that generate magnetic ﬁelds such as speakers or coils. ◆Me chanical c o nsiderations 1. Be careful not to subject the inductors to excessive mechanical shocks. （1） If inductors are dropped on the ﬂoor or a hard surface they should not be used. （2） When ha ndling the mounted boards, be careful that the mounted components do not come in contact with or bump against other boards or components. 8. Storage conditions Precautions ◆Storage 1. To maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control temperature and hu midity in the storage area. Humidity should especially be kept as low as possible. R ecommended c o nditions Ambient t e mperature Below 40 ℃ Humidity Be low 70% RH The ambient temperature must be kept below 30 ℃. E ven under ideal storage conditions inductor electrode solderability decreases as time passes, so inductors should be used within 6 months from the time of delivery. The packaging material should be kept where no chlorine or sulfur exists in the air. Te chnical co nsider- ations ◆Storage 1. If the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes an d deterioration of taping/packaging materials may take place. For this reason, components should be used within 6 months from the time of delivery. If exc eeding the above period, please check solderability before using the inductors.

Summary

MULTILAYER CHIP BEAD INDUCTORS (BK SERIES)

Description