BFR30LT1 ONSEMI | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 4

Technical content

Features

  • Pb−Free Package is Available ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ MAXIMUM RATINGS ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ Rating ÎÎÎÎ ÎÎÎÎ Symbol ÎÎÎÎ ÎÎÎÎ Value ÎÎÎ ÎÎÎ Unit ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ Drain−Source Voltage ÎÎÎÎ ÎÎÎÎ VDS ÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ Vdc ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ Gate−Source Voltage ÎÎÎÎ ÎÎÎÎ VGS ÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ Vdc ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ THERMAL CHARACTERISTICS ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ Characteristic ÎÎÎÎ ÎÎÎÎ Symbol ÎÎÎÎ ÎÎÎÎ Max ÎÎÎ ÎÎÎ Unit ÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎÎÎÎÎÎÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎ Total Device Dissipation (Note 1) TA = 25°C Derate above 25°C ÎÎÎÎ Î ÎÎ Î ÎÎÎÎ PD ÎÎÎÎ Î ÎÎ Î ÎÎÎÎ 225 1.8 ÎÎÎ Î Î Î ÎÎÎ mW mW/ °C ÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎÎÎÎÎÎÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎ Thermal Resistance, Junction−to−Ambient ÎÎÎÎ Î ÎÎ Î ÎÎÎÎ R JA ÎÎÎÎ Î ÎÎ Î ÎÎÎÎ 556 ÎÎÎ Î Î Î ÎÎÎ °C/W ÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎÎÎÎÎÎÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎ Total Device Dissipation Alumina Substrate, (Note 2) TA = 25°C Derate above 25°C ÎÎÎÎ Î ÎÎ Î ÎÎÎÎ PD ÎÎÎÎ Î ÎÎ Î ÎÎÎÎ 300 2.4 ÎÎÎ Î Î Î ÎÎÎ mW mW/ °C ÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎÎÎÎÎÎÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎ Thermal Resistance, Junction−to−Ambient ÎÎÎÎ Î ÎÎ Î ÎÎÎÎ R JA ÎÎÎÎ Î ÎÎ Î ÎÎÎÎ 417 ÎÎÎ Î Î Î ÎÎÎ °C/W ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ Junction and Storage Temperature ÎÎÎÎ ÎÎÎÎ TJ, Tstg ÎÎÎÎ ÎÎÎÎ −55 to +150 ÎÎÎ ÎÎÎ 1. Device mounted on FR4 glass epoxy printed circuit board using the recommended footprint. http://onsemi.com Device Package Shipping † BFR30LT1 SOT−23 3000/Tape & Reel SOT−23 CASE 318 STYLE 10 MARKING DIAGRAM

ORDERING INFORMATION

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.

1 DRAIN

2 SOURCE

BFR30LT1G SOT−23 (Pb−Free) 3000/Tape & Reel BFR31LT1 SOT−23 3000/Tape & Reel MxM x = 1 or 2 M = Date Code BFR31LT1G SOT−23 (Pb−Free) 3000/Tape & Reel

BFR30LT1, BFR31LT1 http://onsemi.com PACKAGE DIMENSIONS SOT−23 (TO−236) CASE 318−08 ISSUE AK STYLE 10: PIN 1. DRAIN 2. SOURCE 3. GATE *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* mm inchesSCALE 10:1 0.8 0.031 0.9 0.035 0.95 0.0370.95 0.037 2.0 0.079 D JK L A C B S H GV 1 2 DIM A MIN MAX MIN MAX MILLIMETERS 0.1102 0.1197 2.80 3.04 INCHES B 0.0472 0.0551 1.20 1.40 C 0.0350 0.0440 0.89 1.11 D 0.0150 0.0200 0.37 0.50 G 0.0701 0.0807 1.78 2.04 H 0.0005 0.0040 0.013 0.100 J 0.0034 0.0070 0.085 0.177 K 0.0140 0.0285 0.35 0.69 L 0.0350 0.0401 0.89 1.02 S 0.0830 0.1039 2.10 2.64 V 0.0177 0.0236 0.45 0.60 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. 318−01 THRU −07 AND −09 OBSOLETE, NEW STANDARD 318−08. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone : 81−3−5773−3850 BFR30LT1/D LITERATURE FULFILLMENT : Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone : 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.