BF3506TV STMICROELECTRONICS | Alldatasheet
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November 1995 Ed : 1 FULL 50-60Hz RECTIFICATION BRIDGE ISOTOP (Plastic) .COMPACT ISOTOP DESIGN COMPATIBLE WITH FAST DIODES, TRANSISTORS AND PASSIVE COMPONENTS. .EXCELLENT THERMAL TRANSFER JUNC- TION TI HEATSINK .UL PENDING
DESCRIPTION
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (per diode unless specified) FEATURES AND BENEFITS The Bridges series from SGS-THOMSON has been designed to allow a better standardization of packages on boards principally designed with ISOTOP packages. The insulated package of the bridge will be able to sit on heatsink with other components. Single phase and 3-phase high power SMPS, UPS, MOTOR DRIVES and WELDING equipment will primarily find advan- tage in these industry package products. Screw version TM : ISOTOP is a trademark of SGS-THOMSON Microelectronics. PRELIMINARY DATASHEET IF(AV) 35A VRRM 600V VF (max) 1.3V MAIN PRODUCT CHARACTERISTICS Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 600 V VRSM Non repetitive peak reverse voltage 600 V IF(AV) totalAverage forward current Tc=80 °C Sinus 35 A IFSM Surge non repetitive forward current 50Hz JEDEC method 300 A I2.t Fusing 660 A 2.s Tstg Storage temperature range - 65 to + 150 °C Tj Max. operating junction temperature 150 °C Pmax total Total power dissipation 50 W
Symbol Parameter Test Conditions Min. Typ. Max. Unit IR * Reverse leakage current V R = 0.8 VRRM δ < 2% tp = 5ms Tj = 25°C1 0 µA Tj = 125°C 0.2 mA VF ** Forward voltage drop I F = 35 A δ < 2% tp = 380µs Tj = 25°C 1.4 V Tj = 125°C 1.3 V Pulse test : * tp = 5 ms, duty cycle < 2 % ** tp = 380 µs, duty cycle < 2 % For one diode: Pcond = 1.02 x IF(AV) + 0.008 x I2F(RMS) and Tj = Pcond x 4 x Rth(j-c) + Tc THERMAL RESISTANCE ELECTRICAL CHARACTERISTICS (Per diode) STATIC CHARACTERISTICS Symbol Parameter Value Unit Rth (j-c) total Junction to case 0.5 °C/W BF3506TV
PACKAGE DATA (millimeter) ISOTOP (Plastic) Cooling method : C Marking : Type number Weight : 28 g. (without screws) Electrical isolation : 2500V (RMS) Capacitance : < 45 pF Inductance : < 5 nH recommended for mounting the package on the heatsink and the 4 screws given with the screw version). - The screws supplied with the package are adapted for mounting on a board (or other types of terminals) with a thickness of 0.6 mm min and 2.2 mm max. REF. DIMENSIONS Millimeters Inches Min. Max. Min. Max. A 11.80 12.20 0.465 0.480 B 8.90 9.10 0.350 0.358 C 1.95 2.05 0.077 0.081 D 0.75 0.85 0.029 0.034 E 12.60 12.80 0.496 0.504 F 25.10 25.50 0.988 1.004 G 31.50 31.70 1.240 1.248 H 4.00 0.157 I 4.10 4.30 0.161 0.169 J 4.10 4.30 0.161 0.169 K 14.90 15.10 0.586 0.595 L 30.10 30.30 1.185 1.193 M 37.80 38.20 1.488 1.504 O 7.80 8.20 0.307 0.323 P 5.50 0.216 K L G M OOJ/ OI/OI/ H B A D EF screw H M4 C P Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. © 1995 SGS-THOMSON Microelectronics - Printed in Italy - All rights reserved. SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. BF3506TV