BDX53B_07 ONSEMI | Alldatasheet

Document overview

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Technical content

Features

  • /C0259High DC Current Gain - hFE = 2500 (Typ) @ IC = 4.0 Adc
  • /C0259Collector Emitter Sustaining V oltage - @ 100 mAdc VCEO(sus) = 80 Vdc (Min) - BDX53B, 54B VCEO(sus) = 100 Vdc (Min) - BDX53C, 54C
  • /C0259Low Collector-Emitter Saturation V oltage - VCE(sat) = 2.0 Vdc (Max) @ IC = 3.0 Adc VCE(sat) = 4.0 Vdc (Max) @ IC = 5.0 Adc
  • /C0259Monolithic Construction with Built-In Base-Emitter Shunt Resistors
  • /C0259Pb-Free Packages are Available* ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ MAXIMUM RATINGS ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ Rating ÎÎÎ ÎÎÎ Symbol ÎÎÎÎ ÎÎÎÎ Value ÎÎÎ ÎÎÎ Unit ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ Collector-Emitter Voltage BDX53B, BDX54B BDX53C, BDX54C ÎÎÎ ÎÎÎ ÎÎÎ VCEO ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ 100 ÎÎÎ ÎÎÎ ÎÎÎ Vdc ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ Collector-Base Voltage BDX53B, BDX54B BDX53C, BDX54C ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ VCB ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ 100 ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ Vdc ÎÎÎÎÎÎÎÎÎÎÎÎ Emitter-Base Voltage ÎÎÎ VEB ÎÎÎÎ 5.0 ÎÎÎ Vdc ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ Collector Current - Continuous - Peak ÎÎÎ ÎÎÎ ÎÎÎ IC ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ 8.0 ÎÎÎ ÎÎÎ ÎÎÎ Adc ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ Base Current ÎÎÎ ÎÎÎ IB ÎÎÎÎ ÎÎÎÎ 0.2 ÎÎÎ ÎÎÎ Adc ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ Total Device Dissipation @ TC = 25°C Derate above 25°C ÎÎÎ ÎÎÎ PD ÎÎÎÎ ÎÎÎÎ 0.48 ÎÎÎ ÎÎÎ W W/°C ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ Operating and Storage Junction Temperature Range ÎÎÎ ÎÎÎ ÎÎÎ TJ, Tstg ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ -/C025765 to +/C0257150 ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ THERMAL CHARACTERISTICS ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ Characteristic ÎÎÎ ÎÎÎ Symbol ÎÎÎÎ ÎÎÎÎ Max ÎÎÎ ÎÎÎ Unit ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ Thermal Resistance, Junction-to-Ambient ÎÎÎ ÎÎÎ R/C0113JA ÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ °C/W ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ Thermal Resistance, Junction-to-Case ÎÎÎ ÎÎÎ R/C0113JC ÎÎÎÎ ÎÎÎÎ 1.92 ÎÎÎ ÎÎÎ °C/W Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DARLINGTON

8 AMPERE

80/C0257-/C0257100 VOLTS, 65 WATTS TO-220AB CASE 221A STYLE 11 2 MARKING DIAGRAM & PIN ASSIGNMENT Base Emitter Collector Collector http://onsemi.com BDX5xy = Device Code x = 3 or 4 y = B or C A = Assembly Location Y = Year WW = Work Week G = Pb-Free Package BDX5xyG AY WW See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet.

ORDERING INFORMATION

Figure 1. Power Derating

  1. Pulse Test: Pulse Width /C0118 300 /C0109s, Duty Cycle /C0118 2%.

BDX53B, BDX53C (NPN), BDX54B, BDX54C (PNP) http://onsemi.com Figure 13. Darlington Schematic Device Package Shipping† BDX53B TO-220

50 Units / RailBDX53BG TO-220

(Pb-Free) BDX53C TO-220

50 Units / RailBDX53CG TO-220

(Pb-Free) BDX54B TO-220

50 Units / RailBDX54BG TO-220

(Pb-Free) BDX54C TO-220

50 Units / RailBDX54CG TO-220

(Pb-Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.

BDX53B, BDX53C (NPN), BDX54B, BDX54C (PNP) http://onsemi.com PACKAGE DIMENSIONS TO-220 CASE 221A-09 ISSUE AE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND LEAD IRREGULARITIES ARE ALLOWED. DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.570 0.620 14.48 15.75 B 0.380 0.405 9.66 10.28 C 0.160 0.190 4.07 4.82 D 0.025 0.035 0.64 0.88 F 0.142 0.161 3.61 4.09 G 0.095 0.105 2.42 2.66 H 0.110 0.155 2.80 3.93 J 0.014 0.025 0.36 0.64 K 0.500 0.562 12.70 14.27 L 0.045 0.060 1.15 1.52 N 0.190 0.210 4.83 5.33 Q 0.100 0.120 2.54 3.04 R 0.080 0.110 2.04 2.79 S 0.045 0.055 1.15 1.39 T 0.235 0.255 5.97 6.47 U 0.000 0.050 0.00 1.27 B Q H Z L V G N A K F 12 3 D SEATING PLANE-T- C ST U R J ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 BDX53B/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your loca l Sales Representative