BDX53B_06 ONSEMI | Alldatasheet

Document overview

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Technical content

Features

  • High DC Current Gain − hFE = 2500 (Typ) @ IC = 4.0 Adc
  • Collector Emitter Sustaining V oltage − @ 100 mAdc VCEO(sus) = 80 Vdc (Min) − BDX53B, 54B VCEO(sus) = 100 Vdc (Min) − BDX53C, 54C
  • Low Collector−Emitter Saturation V oltage − VCE(sat) = 2.0 Vdc (Max) @ IC = 3.0 Adc VCE(sat) = 4.0 Vdc (Max) @ IC = 5.0 Adc
  • Monolithic Construction with Built−In Base−Emitter Shunt Resistors
  • Pb−Free Packages are Available* ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ MAXIMUM RATINGS ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ Rating ÎÎÎ ÎÎÎ Symbol ÎÎÎÎ ÎÎÎÎ Value ÎÎÎ ÎÎÎ Unit ÎÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎÎÎÎÎÎÎÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎ Collector−Emitter Voltage BDX53B, BDX54B BDX53C, BDX54C ÎÎÎ Î Î Î ÎÎÎ VCEO ÎÎÎÎ Î ÎÎ Î ÎÎÎÎ 100 ÎÎÎ Î Î Î ÎÎÎ Vdc ÎÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎÎÎÎÎÎÎÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎ Collector−Base Voltage BDX53B, BDX54B BDX53C, BDX54C ÎÎÎ Î Î Î ÎÎÎ VCB ÎÎÎÎ Î ÎÎ Î ÎÎÎÎ 100 ÎÎÎ Î Î Î ÎÎÎ Vdc ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ Emitter−Base Voltage ÎÎÎ ÎÎÎ VEB ÎÎÎÎ ÎÎÎÎ 5.0 ÎÎÎ ÎÎÎ Vdc ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ Collector Current − Continuous − Peak ÎÎÎ ÎÎÎ IC ÎÎÎÎ ÎÎÎÎ 8.0 ÎÎÎ ÎÎÎ Adc ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ Base Current ÎÎÎ ÎÎÎ IB ÎÎÎÎ ÎÎÎÎ 0.2 ÎÎÎ ÎÎÎ Adc ÎÎÎÎÎÎÎÎÎÎÎÎ Î ÎÎÎÎÎÎÎÎÎÎ Î ÎÎÎÎÎÎÎÎÎÎÎÎ Total Device Dissipation @ TC = 25°C Derate above 25°C ÎÎÎ Î Î Î ÎÎÎ PD ÎÎÎÎ Î ÎÎ Î ÎÎÎÎ 0.48 ÎÎÎ Î Î Î ÎÎÎ W W/°C ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ Operating and Storage Junction Temperature Range ÎÎÎ ÎÎÎ TJ, Tstg ÎÎÎÎ ÎÎÎÎ −65 to +150 ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ THERMAL CHARACTERISTICS ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ Characteristic ÎÎÎ ÎÎÎ Symbol ÎÎÎÎ ÎÎÎÎ Max ÎÎÎ ÎÎÎ Unit ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ Thermal Resistance, Junction−to−Ambient ÎÎÎ ÎÎÎ R/C0113JA ÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ °C/W ÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎ Thermal Resistance, Junction−to−Case ÎÎÎ ÎÎÎ R/C0113JC ÎÎÎÎ ÎÎÎÎ 1.92 ÎÎÎ ÎÎÎ °C/W Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DARLINGTON

8 AMPERE

80−100 VOLTS, 65 WATTS TO−220AB CASE 221A STYLE 11 2 MARKING DIAGRAM & PIN ASSIGNMENT Base Emitter Collector Collector http://onsemi.com BDX5xy = Device Code x = 3 or 4 y = B or C A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package BDX5xyG AY WW See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet.

ORDERING INFORMATION

Figure 1. Power Derating

  1. Pulse Test: Pulse Width /C0118 300 /C0109s, Duty Cycle /C0118 2%.

BDX53B, BDX53C (NPN), BDX54B, BDX54C (PNP) http://onsemi.com Figure 13. Darlington Schematic Device Package Shipping† BDX53B TO−220

50 Units / RailBDX53BG TO−220

(Pb−Free) BDX53C TO−220

50 Units / RailBDX53CG TO−220

(Pb−Free) BDX54B TO−220

50 Units / RailBDX54BG TO−220

(Pb−Free) BDX54C TO−220

50 Units / RailBDX54CG TO−220

(Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.

BDX53B, BDX53C (NPN), BDX54B, BDX54C (PNP) http://onsemi.com PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND LEAD IRREGULARITIES ARE ALLOWED. DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.570 0.620 14.48 15.75 B 0.380 0.405 9.66 10.28 C 0.160 0.190 4.07 4.82 D 0.025 0.035 0.64 0.88 F 0.142 0.147 3.61 3.73 G 0.095 0.105 2.42 2.66 H 0.110 0.155 2.80 3.93 J 0.018 0.025 0.46 0.64 K 0.500 0.562 12.70 14.27 L 0.045 0.060 1.15 1.52 N 0.190 0.210 4.83 5.33 Q 0.100 0.120 2.54 3.04 R 0.080 0.110 2.04 2.79 S 0.045 0.055 1.15 1.39 T 0.235 0.255 5.97 6.47 U 0.000 0.050 0.00 1.27 B Q H Z L V G N A K F 12 3 D SEATING PLANE−T− C ST U R J TO−220AB CASE 221A−09 ISSUE AA STYLE 1: PIN 1. BASE 2. COLLECTOR 3. EMITTER 4. COLLECTOR ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 BDX53B/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.