BDV65 BOURNS | Alldatasheet

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BDV65, BDV65A, BDV65B, BDV65C NPN SILICON POWER DARLINGTONS /g80 /g82/g79 /g68 /g85/g67/g84 /g73/g78/g70/g79/g82/g77/g65 /g84/g73/g79/g78 1JUNE 1993 - REVISED SEPTEMBER 2002 Specifications are subject to change without notice.

  • Designed for Complementary Use with BDV64, BDV64A, BDV64B and BDV64C
  • 125 W at 25°C Case Temperature
  • 12 A Continuous Collector Current
  • Minimum hFE of 1000 at 4 V, 5 A absolute maximum ratings at 25°C case temperature (unless otherwise noted) NOTES: 1. This value applies for t p ≤ 0.1 ms, duty cycle ≤ 10% 2. Derate linearly to 150°C case temperature at the rate of 0.56 W/°C. 3. Derate linearly to 150°C free air temperature at the rate of 28 mW/°C. RATING SYMBOL VALUE UNIT Collector-base voltage (IE = 0) BDV65 BDV65A BDV65B BDV65C V CBO 100 120 V Collector-emitter voltage (I B = 0) BDV65 BDV65A BDV65B BDV65C V CEO 100 120 V Emitter-base voltage V EBO 5V Continuous collector current IC 12 A Peak collector current (see Note 1) I CM 15 A Continuous base current IB 0.5 A Continuous device dissipation at (or below) 25°C case temperature (see Note 2) P tot 125 W Continuous device dissipation at (or below) 25°C free air temperature (see Note 3) P tot 3.5 W Operating junction temperature range T j -65 to +150 °C Storage temperature range Tstg -65 to +150 °C Lead temperature 3.2 mm from case for 10 seconds T L 260 °C SOT-93 PACKAGE (TOP VIEW) Pin 2 is in electrical contact with the mounting base. MDTRAAA B C E

BDV65, BDV65A, BDV65B, BDV65C NPN SILICON POWER DARLINGTONS /g80/g82/g79/g68/g85 /g67/g84 /g73/g78/g70/g79/g82/g77/g65 /g84/g73/g79/g78 JUNE 1993 - REVISED SEPTEMBER 2002 Specifications are subject to change without notice. NOTES: 4. These parameters must be measured using pulse techniques, t p = 300 µs, duty cycle ≤ 2%. 5. These parameters must be measured using voltage-sensing contacts, separate from the current carrying conta cts. electrical characteristics at 25°C case temperature (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT V(BR)CEO Collector-emitter breakdown voltage IC = 30 mA I B = 0 (see Note 4) BDV65 BDV65A BDV65B BDV65C 100 120 V I CEO Collector-emitter cut-off current VCB = 3 0 V VCB = 40 V VCB = 50 V VCB = 60 V IB =0 IB =0 IB =0 IB =0 BDV65 BDV65A BDV65B BDV65C mA I CBO Collector cut-off current VCB = 6 0 V VCB = 80 V VCB = 100 V VCB = 120 V VCB = 3 0 V VCB = 40 V VCB = 50 V VCB = 60 V IE =0 IE =0 IE =0 IE =0 IE =0 IE =0 IE =0 IE =0 TC = 150°C TC = 150°C TC = 150°C TC = 150°C BDV65 BDV65A BDV65B BDV65C BDV65 BDV65A BDV65B BDV65C 0.4 0.4 0.4 0.4 mA I EBO Emitter cut-off current VEB = 5 V I C =0 5 m A hFE Forward current transfer ratio VCE = 4 V I C = 5 A (see Notes 4 and 5) 1000 VCE(sat) Collector-emitter saturation voltage IB = 20 mA I C = 5 A (see Notes 4 and 5) 2 V VBE Base-emitter voltage VCE = 4 V I C = 5 A (see Notes 4 and 5) 2.5 V VEC Parallel diode forward voltage IE = 10 A I B = 0 (see Notes 4 and 5) 3.5 V thermal characteristics PARAMETER MIN TYP MAX UNIT RθJC Junction to case thermal resistance 1° C / W RθJA Junction to free air thermal resistance 35.7 °C/W

BDV65, BDV65A, BDV65B, BDV65C NPN SILICON POWER DARLINGTONS /g80/g82/g79/g68/g85 /g67/g84 /g73/g78/g70/g79/g82/g77/g65 /g84/g73/g79/g78 JUNE 1993 - REVISED SEPTEMBER 2002 Specifications are subject to change without notice. THERMAL INFORMATION Figure 4. MAXIMUM POWER DISSIPATION vs CASE TEMPERATURE TC - Case Temperature - °C 0 25 50 75 100 125 150 Ptot - Maximum Power Dissipation - W 100 120 140 TIS140AA

BDV65, BDV65A, BDV65B, BDV65C NPN SILICON POWER DARLINGTONS /g80 /g82/g79 /g68 /g85/g67/g84 /g73/g78/g70/g79/g82/g77/g65 /g84/g73/g79/g78 JUNE 1993 - REVISED SEPTEMBER 2002 Specifications are subject to change without notice. SOT -93 3-pin plastic flange-mount package This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound w ill withstand soldering temperature with no defor mation, and circuit performance characteristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly. MECHANICAL DATA SOT-93 ALL LINEAR DIMENSIONS IN MILLIMETERS 4,90 4,70 1,37 1,17 0,78 0,50 2,50 TYP. 15,2 14,7 12,2 MAX. 16,2 MAX. 18,0 TYP. 31,0 TYP. 1,30 1,10 11,1 10,8 4,1 4,0 3,95 4,15 1 2 3 NOTE A: The centre pin is in electrical contact with the mounting tab. MDXXAW ø