BDT60 BOURNS | Alldatasheet

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BDT60, BDT60A, BDT60B, BDT60C PNP SILICON POWER DARLINGTONS /g80 /g82/g79 /g68 /g85/g67/g84 /g73/g78/g70/g79/g82/g77/g65 /g84/g73/g79/g78 1AUGUST 1993 - REVISED SEPTEMBER 2002 Specifications are subject to change without notice.

  • Designed for Complementary Use with BDT61, BDT61A, BDT61B and BDT61C
  • 50 W at 25°C Case Temperature
  • 4 A Continuous Collector Current
  • Minimum hFE of 750 at 1.5 V, 3 A absolute maximum ratings at 25°C case temperature (unless otherwise noted) NOTES: 1. Derate linearly to 150°C case temperature at the rate of 0.4 W/°C. 2. Derate linearly to 150°C free air temperature at the rate of 16 mW/°C. RATING SYMBOL VALUE UNIT Collector-base voltage (IE = 0) BDT60 BDT60A BDT60B BDT60C V CBO -60 -80 -100 -120 V Collector-emitter voltage (I B = 0) BDT60 BDT60A BDT60B BDT60C V CEO -60 -80 -100 -120 V Emitter-base voltage V EBO -5 V Continuous collector current IC -4 A Continuous base current IB -0.1 A Continuous device dissipation at (or below) 25°C case temperature (see Note 1) P tot 50 W Continuous device dissipation at (or below) 25°C free air temperature (see Note 2) P tot 2W Operating junction temperature range T j -65 to +150 °C Storage temperature range Tstg -65 to +150 °C Operating free-air temperature range T A -65 to +150 °C B C E TO-220 PACKAGE (TOP VIEW) Pin 2 is in electrical contact with the mounting base. MDTRACA

BDT60, BDT60A, BDT60B, BDT60C PNP SILICON POWER DARLINGTONS /g80/g82/g79/g68/g85 /g67/g84 /g73/g78/g70/g79/g82/g77/g65 /g84/g73/g79/g78 AUGUST 1993 - REVISED SEPTEMBER 2002 Specifications are subject to change without notice. NOTES: 3. These parameters must be measured using pulse techniques, t p = 300 µs, duty cycle ≤ 2%. 4. These parameters must be measured using voltage-sensing contacts, separate from the current carrying conta cts. † Voltage and current values shown are nominal; exact values vary slightly with transistor parameters. electrical characteristics at 25°C case temperature (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT V(BR)CEO Collector-emitter breakdown voltage IC = -30 mA I B = 0 (see Note 3) BDT60 BDT60A BDT60B BDT60C -60 -80 -100 -120 V I CEO Collector-emitter cut-off current VCE = - 3 0 V VCE = - 4 0 V VCE = - 5 0 V VCE = - 6 0 V IB =0 IB =0 IB =0 IB =0 BDT60 BDT60A BDT60B BDT60C -0.5 -0.5 -0.5 -0.5 mA I CBO Collector cut-off current VCB = - 6 0 V VCB = -80 V VCB = -100 V VCB = -120 V VCB = - 3 0 V VCB = -40 V VCB = -50 V VCB = -60 V IE =0 IE =0 IE =0 IE =0 IE =0 IE =0 IE =0 IE =0 TC = 150°C TC = 150°C TC = 150°C TC = 150°C BDT60 BDT60A BDT60B BDT60C BDT60 BDT60A BDT60B BDT60C -0.2 -0.2 -0.2 -0.2 -2.0 -2.0 -2.0 -2.0 mA I EBO Emitter cut-off current VEB = -5 V I C =0 - 5 m A hFE Forward current transfer ratio VCE = -3 V I C = -1.5 A (see Notes 3 and 4) 750 VCE(sat) Collector-emitter saturation voltage IB = -6 mA I C = -1.5 A (see Notes 3 and 4) -2.5 V VBE(on) Base-emitter voltage VCE = -3 V I C = -1.5 A (see Notes 3 and 4) -2.5 V VEC Parallel diode forward voltage IE = -1.5 A I B = 0 -2.0 V thermal characteristics PARAMETER MIN TYP MAX UNIT RθJC Junction to case thermal resistance 2.5 °C/W RθJA Junction to free air thermal resistance 62.5 °C/W resistive-load-switching characteristics at 25°C case temperature PARAMETER TEST CONDITIONS † MIN TYP MAX UNIT ton Tu r n-o n tim e I C = -2 A VBE(off) = 5 V IB(on) = -8 mA RL = 20 Ω IB(off) = 8 mA tp = 20 µs, dc ≤ 2% 1µ s toff Turn-off time 4.5 µs

BDT60, BDT60A, BDT60B, BDT60C PNP SILICON POWER DARLINGTONS /g80 /g82/g79 /g68 /g85/g67/g84 /g73/g78/g70/g79/g82/g77/g65 /g84/g73/g79/g78 AUGUST 1993 - REVISED SEPTEMBER 2002 Specifications are subject to change without notice. TO-220 3-pin plastic flange-mount package This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound w ill withstand soldering temperature with no defor mation, and circuit performance characteristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly. MECHANICAL DATA TO220 ALL LINEAR DIMENSIONS IN MILLIMETERS ø 1,23 1,32 4,20 4,70 123 0,97 0,61 see Note C see Note B 10,0 10,4 2,54 2,95 6,0 6,6 14,55 15,90 12,7 14,1 3,5 6,1 1,07 1,70 2,34 2,74 4,88 5,28 3,71 3,96 0,41 0,64 2,40 2,90 VERSION 2 VERSION 1 NOTES: A. The centre pin is in electr ical contact with the mounting tab. B. Mounting tab corner profile according to package version. C. Typical fixing hole centre stand off height according to package version. Version 1, 18.0 mm. Version 2, 17.6 mm. MDXXBE