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CTS® PART NUMBER*** SIZE PIN FIN CONFIGURATION THERMAL RESISTANCE CASE TO AMBIENT* °C/WATTS (W) (L) (H) T P G FIN MATRIX NATURAL CONVECTION** FORCED CONVECTION @ 400 LFPM BDN16-3CB/A01 BDN16-6CB/A01 W±0.01 With pre-applied adhesive, just peel off the release liner and press onto the component Reduces assembly costs; no more messy adhesives or greases required Excellent mechanical bond Thermally optimized pin fin Omnidirectional Adhesive shear strength at 100°C is 36psi (a one inch square heat sink would require a 36lb. force to remove heat sink) Applicable for BGA, PGA, PLCC, and QFP packages H±0.015 L±0.01 G±0.01 P±0.01 T±0.01 NOTES: *Thermal resistance of adhesive tape is included. Thermal resistance values based on power density of 3 watts/in2 *Part numbers listed for standard black anodized heat sinks with CTS adhesive tapes. All dimensions are in inches.