BDCC00252012 PULSE | Alldatasheet
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Technical content
X Pcs. Date : Chang.Yuwen Tom.Chen Jacky.Chung REJECTED APPROVED Approved by MECHANICAL ENGINEER COMPONENT ENGINEER ELECTRICAL ENGINEER Drawn by Checked by Quantity： 2024/06/13 Pulse P/N： BDCC00252012R47MCG SPECIFICATION ACCEPTED BY: RoHS & Halogen Free & REACH Compliance. SPECIFICATION FOR APPROVAL Customer： Customer P/N: Drawing No： Dongguan No. 78, Puxing Rd., Yuliangwei Administration Area, Qingxi Town, Dongguan City, Guangdong,China FAX： +86-769-8773-0232 Vietnam No 143 - 145, Road No 10, VSIP Hai Phong, Lap Le Commune, Thuy Nguyen Dist, Haiphong City, Vietnam Tel：84-316 255 688 Fax：84-316 255 689 Pingzhen No.270, Nanfeng Rd., Pingzhen Dist., Taoyuan City 324019, Taiwan TEL：+886-2-6621-6900
BDCC00252012 Series Specification
1 Scope:
2 Part Numbering:
3 Rating:
4 Marking:
5 Standard Testing Condition
Temperature Ordinary Temperature(15 to 35℃) Ordinary Humidity(25 to 85% RH)Humidity 50 to 80 %RH This specification applies to Molding power inductors Operating Temperature: －40℃ ~125℃(Including self-temperature rise) Unless otherwise specified 20 to 30℃
BDCC00252012 Series Specification
6 Configuration and Dimensions:
A B C D Net Weight (grms) Size Code 252012
7 Electrical Characteristics:
Inductance Tolerance Test Freq. Irms(A) Isat(A) RDC(mΩ) (uH ) (±%) Max.(Typ) Max.(Typ) Max.(Typ) NOTE: 1.Operating temperature range －４０℃ ~ １２５℃(Including self - temperature rise) 2.Isat for Inductance drop 30% from its value without current. 3.Irms for a 40℃ temperature rise from 25℃ ambient. 4.All test data is referenced to 25℃ ambient 5.Absolute maximum voltage 20VDC 6. Rated current: Isat or Irms, whichever is smaller 252012 2.5±0.2 2.0±0.2 1.2 Max. 0.6±0.3 Part No. Net Weight (grms) ≒0.0365
BDCC00252012 Series Specification
8 BDCC00252012Series
8.1 Construction:
8.2 Material List:
1 Core Metal Powder
2 Wire Copper wire
BDCC00252012 Series Specification
9 Reliability Of Molding power inductors
1-1.Mechanical Performance No Item Specification 1-1-1 Flexure Strength The forces applied on the right Test device shall be soldered on the substrate conditions must not damage Substrate Dimension: 100x40x1.6mm the terminal electrode and the Deflection: 2.0mm metal body Keeping Time: 30sec 1-1-2 Vibration Appearance:No damage (for Test device shall be soldered on the substrate microscope of CASTOR MZ-45 20X) Oscillation Frequency: 10 to 55 to 10Hz for 1min Inductance change shall be Amplitude: 1.5mm within ±20% Time: 2hrs for each axis (X, Y & Z), total 6hrs 1-1-3 Resistance to Soldering Heat Appearance: No damage Pre-heating: 150℃, 1min More than 75% of the terminal. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free) electrode should be covered Solder Temperature: 260±5℃ with solder. Immersion Time: 10±1sec Inductance: within ±20% of initial value 1-1-4 Solder ability The electrodes shall be at Pre-heating: 150℃, 1min least 95% covered with new Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free) solder coating Solder Temperature: 245±5℃ Immersion Time: 4±1sec 1-1-5 Terminal Strength Test No split termination Test device shall be soldered on the substrate, then apply a force in the direction of the arrow. Force : 5N Keeping Time: 10±1sec 1-2.Environmental Performance No Item Specification 1-2-1 Temperature Cycle Appearance: No damage One cycle: Inductance:within±20% of Step Temperature (℃) Time (min) initial value 1 -40±3 30 2 25±2 3 3 125±3 30 4 25±2 3 Total: 100cycles Measured after exposure in the room condition for 24hrs 1-2-2 Humidity Resistance Temperature: 60±2℃ Relative Humidity: 90 ~ 95% / Time: 1000hrs Measured after exposure in the room condition for 24hrs 1-2-3 High Temperature: 125±3℃ Temperature Resistance Relative Humidity: 0% / Time: 1000hrs Measured after exposure in the room condition for 24hrs 1-2-4 Low Temperature: -40±3℃ Temperature Resistance Relative Humidity: 0% / Time: 1000hrs Measured after exposure in the room condition for 24hrs Test Method Test Method Mounting Pad F Chip
BDCC00252012 Series Specification Reflow Profile Note: 1. Tp<260℃ 2. Time [25℃ to peak temperature] < 8 minutes 3. Reflow soldering must not be performed more than 3 times. 4. For superior solder joint connectivity results, soldering under standard nitrogen atmosphere is recommended. Time (sec) Temperature ( Refer to J-STD-020F
BDCC00252012 Series Specification
10 Packaging:
10.1 Packaging -Cover Tape
The force for tearing off cover tape is 10 to 100 grams in the arrow direction.
10.2 Packaging Quantity
10.3 Reel Dimensions
252012 178 60 12 1.5 TYPE 252012
BDCC00252012 Series Specification
10.4 Tape Dimensions in mm
11 Recommended Land Pattern:
1.3 2.8 2.2
12 Note:
- The storage period is within 12 months. Products should be stored in the warehouse on the following condition: (Temperature: 5~40℃; Humidity: 20%~75%RH). Solderability should be checked if the period is exceeded. 2. Please make sure that your product has been evaluated and confirmed against your specifications when our product is mounted to your product. 3. Do not knock nor drop. 4. All the items and parameters in this product specification have been prescribed on the premise that our product is used for the purpose,under the condition and in the environment agreed upon between you and us. You are requested not to use our product deviating from such agreement. 5. Please keep the distance between transformer/coil and other components (refer to the standard IEC 950) TYPE 252012
BDCC00252012 Series Specification