Power Management

BD9G500EFJ-LAE2

Rohm

7 V to 76 V Input, 5 A Integrated High–Side MOSFET, Single Buck DC/DC Converter 20.May.2022 Rev.002

Manufacturer: Rohm

Document: 39 Pages / 2Mb

Request Quote Download Datasheet Read online HTML view

Read BD9G500EFJ-LAE2 online.

DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
PDF pages: 39

Technical content

Features

◼ Long Time Support Product for Industrial Applications. ◼ Wide Input Voltage Range ◼ Integrated High-Side MOSFET ◼ Current Mode Control ◼ Adjustable Frequency ◼ Soft Start Function ◼ Over Current Protection (OCP) ◼ Under Voltage Lockout (UVLO) ◼ Thermal Shutdown Protection (TSD) ◼ Over Voltage Protection (OVP) ◼ HTSOP-J8 package

Applications

◼ Industrial Equipment ◼ Power Supply for FA’s Industrial Device ◼ Communications Power Systems Key Specifications ◼ Input Voltage Range: 7 V to 76 V ◼ Input Absolute Maximum Rating: 80 V

85 V (1 ms pulse , 50 % duty or less)

◼ Reference Voltage Accuracy: 1.0 V±1.0 % ◼ Output Current: 5 A (Max) ◼ High-Side MOSFET ON-Resistance: 100 mΩ (Typ) ◼ Shutdown Current: 0 μA (Typ) ◼ Operating Temperature Range: -40 °C to +125 °C Package W (Typ) x D (Typ) x H (Max) HTSOP-J8 4.9 mm x 6.0 mm x 1.0 mm Typical Application Circuits Datasheet

TSZ02201-0F2F0AJ00280-1-2 © 2020 ROHM Co., Ltd. All rights reserved. 20.May.2022 Rev.002 www.rohm.com TSZ22111 • 15 • 001 BD9G500EFJ-LA BD9G500UEFJ-LA Pin Configuration Pin Descriptions Pin No. Pin Name Function 1 SW Switch pin. This pin is connected to the source of the High-Side MOSFET. Connect a schottky barrier diode between this pin and the GND pin. 2 GND Ground pin. 3 COMP Output pin for the gm error amplifier and input to the PWM comparator. Connect phase compensation components to this pin. 4 FB Output voltage feedback pin. See Selection of Components Externally Connected Output Voltage Set Point for how to calculate the resistance of the output voltage setting. 5 RT The internal oscillator frequency set pin. The internal oscillator is set with a single resistor connected between this pin and the GND pin. Frequency range is 100 kHz to 650 kHz. 6 EN Turning this pin signal low (0.4 V or lower) forces the device to enter the shutdown mode. Turning this pin signal high (2.5 V or higher) enables the device. This pin must be terminated. 7 BOOT Bootstrap pin. Connect a bootstrap capacitor of 1 µF between this pin and the SW pin.The voltage of this capacitor is the gate drive voltage of the High Side MOSFET. 8 VIN Power supply pin. This pin for the switching regulator and control circuit. Connecting 15 µF and 1 µF ceramic capacitors are recommended. - EXP-PAD A backside heat dissipation pad. Connecting to the internal PCB Ground plane by using via provides excellent heat dissipation characteristics. VIN BOOT RT SW GND COMP FB EN (TOP VIEW) EXP-PAD

TSZ02201-0F2F0AJ00280-1-2 © 2020 ROHM Co., Ltd. All rights reserved. 20.May.2022 Rev.002 www.rohm.com TSZ22111 • 15 • 001 BD9G500EFJ-LA BD9G500UEFJ-LA 6EN VREF 4FB SOFT START 3COMP SLOPE VREG UVLO TSD OSC ERR PWM OVP OCP DRIVER LOGIC

7 BOOT

8 VIN

TSZ02201-0F2F0AJ00280-1-2 © 2020 ROHM Co., Ltd. All rights reserved. 20.May.2022 Rev.002 www.rohm.com TSZ22111 • 15 • 001 BD9G500EFJ-LA BD9G500UEFJ-LA Description of Blocks VREF Block creating internal reference voltage 3 V (Typ). VREG Block creating internal reference voltage 5 V (Typ). BOOTREG Block creating gate drive voltage. TSD The TSD block is for thermal protection. It shuts down the device when the internal temperature of IC rises to 175 °C (Typ) or more. Thermal protection circuit resets when the temperature falls. The circuit has a hysteresis of 25 °C (Typ). UVLO This is under voltage lockout block. It shuts down the device when the VIN pin voltage falls to 6.4 V (Typ) or less. The UVLO threshold voltage has a hysteresis of 200 mV (Typ). ERR The ERR amplifier is the circuit which compares the feedback voltage of the output voltage with the reference voltage. The ERR amplifier output (the COMP pin voltage) determine the switching duty. OSC Block generating oscillation frequency. SLOPE Creates delta wave from clock, generated by OSC, and voltage composed by current sense signal of High -Side MOSFET. PWM Settles the switching duty by comparing the output COMP pin voltage of ERR amplifier and signal of SLOPE block. DRIVER LOGIC This is DC / DC driver control block. Input signal from PWM and drives MOSFET. SOFT START The Soft Start circuit slows down the rise of output voltage during start -up and controls the current, which allows the prevention of output voltage overshoot and inrush current. OCP Current flowing in High -Side MOSFET is controlled one cycle when over current occurs. If OCP function 4 times sequentially, the device stops the operation for 20 ms (Typ) and subsequently initiates a restart. OVP When the FB pin voltage is 1.2 V (Typ) or more, it turns High-Side MOSFET OFF. After FB pin voltage drops, it returns to normal operation with hysteresis. This IC has Discharge MOS. This MOS turns on 100 ns (Typ) at each duty cycle. When the FB pin voltage is 2.0 V (Typ) or more, it turns Discharge MOS off also. OVDIS When the FB pin voltage is 1.0 V (Typ) or more and 2.0 V (Typ) or less and remains in that state for 16 cycle , the Discharge MOS On-time is set to 400 ns (Typ) and discharge output voltage.

TSZ02201-0F2F0AJ00280-1-2 © 2020 ROHM Co., Ltd. All rights reserved. 20.May.2022 Rev.002 www.rohm.com TSZ22111 • 15 • 001 BD9G500EFJ-LA BD9G500UEFJ-LA Absolute Maximum Ratings (Ta = 25 °C) Parameter Symbol Rating Unit Input Voltage VIN -0.3 to +80.0 V Input Voltage (1 ms pulse , 50 % duty or less) VINPULSE -0.3 to +85.0 V EN Pin Voltage VEN -0.3 to +80.0 V Voltage from GND to BOOT VBOOT -0.3 to +85.0 V Voltage from SW to BOOT(Note 1) ΔVBOOT-SW -0.3 to +7.0 V FB Pin Voltage VFB -0.3 to + 7.0 V COMP Pin Voltage VCOMP -0.3 to + 7.0 V RT Pin Voltage VRT -0.3 to + 7.0 V SW Pin Voltage VSW -0.5 to VIN + 0.3 V Maximum Junction Temperature Tjmax 150 °C Storage Temperature Range Tstg -55 to +150 °C Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins o r an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. (Note 1) Because this IC Voltage from SW to BOOT absolute maximum rating is 7 .0 V, Do not short VIN Pin to BOOT Pin after power ON. Thermal Resistance(Note 2) Parameter Symbol Thermal Resistance (Typ) Unit 1s(Note 4) 2s2p(Note 5) HTSOP-J8 Junction to Ambient θJA 112.8 24.3 °C/W Junction to Top Characterization Parameter(Note 3) ΨJT 6.0 2.0 °C/W (Note 2) Based on JESD51-2A (Still-Air). (Note 3) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 4) Using a PCB board based on JESD51-3. (Note 5) Using a PCB board based on JESD51-5, 7. Layer Number of Measurement Board Material Board Size Single FR-4 114.3 mm x 76.2 mm x 1.57 mmt Top Copper Pattern Thickness Footprints and Traces 70 μm Layer Number of Measurement Board Material Board Size Thermal Via(Note 5) Pitch Diameter Top 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 μm 74.2 mm x 74.2 mm 35 μm 74.2 mm x 74.2 mm 70 μm (Note 5) This thermal via connects with the copper pattern of all layers.

TSZ02201-0F2F0AJ00280-1-2 © 2020 ROHM Co., Ltd. All rights reserved. 20.May.2022 Rev.002 www.rohm.com TSZ22111 • 15 • 001 BD9G500EFJ-LA BD9G500UEFJ-LA Recommended Operating Conditions Parameter Symbol Min Typ Max Unit Input Voltage VIN 7 - 76 V Operating Temperature Topr -40 - +125(Note 1) °C Output Current IOUT 0 - 5 A Output Voltage Range VRANGE 1.0(Note 2) - 0.97 × VIN(Note 3) V (Note 1) Tj must be lower than 150 °C under actual operating environment. (Note 2) Use it in output voltage setting of which output pulse width does not become 3 50 ns (Typ) or less. (Note 3) When fosc = 200 kHz setting, the maximum Output Voltage is close to 0.97 (Typ) × (VIN - RONH × IOUT). Electrical Characteristics ( Unless otherwise specified Tj = -40 °C to +125 °C, VIN = 48 V, VEN = 3 V ) (Note 4) Only tested Tj = 25 °C on outgoing inspection. (Note 5) No tested on outgoing inspection. Parameter Symbol Min Typ Max Unit Conditions Operating Supply Current IOPR - 0.75 1.50 mA VFB = 3.0 V Tj = 25 °C Shutdown Current ISD - 0 10 µA VEN = 0 V Tj = 25 °C FB Threshold Voltage (Note 4) VFB 0.99 1.00 1.01 V FB Input Current IFB -0.1 0 +0.1 µA VFB = 1.1V Switching Frequency Range Using RT Pin fRTOSC 100 - 650 kHz Tj = 25 °C Switching Frequency fOSC 180 200 220 kHz Tj = 25 °C RT = 47 kΩ High-Side MOSFET ON-Resistance RONH - 100 140 mΩ ISW = -50 mA Tj = 25 °C Over Current limit(Note5) ILIMIT 6.4 8.0 - A Without switching Open Loop UVLO Threshold Voltage VUVLO 6.1 6.4 6.7 V VIN falling UVLO Hysteresis Voltage VUVLOHYS 100 200 300 mV EN High-Level Input Voltage VENH 2.5 - - V EN Low-Level Input Voltage VENL 0 - 0.4 V EN Input Current IEN 1.15 2.30 4.60 µA VEN = 3 V Tj = 25 °C Soft Start Time tSS 15 20 25 ms

TSZ02201-0F2F0AJ00280-1-2 © 2020 ROHM Co., Ltd. All rights reserved. Figure 32. Timing Chart with Enable Control Figure 33. Over Current Protection Timing Chart Figure 42. Over Current Protection Timing Chart

8 A(Typ)

The protective circuits are intended for prevention of damage caused by unexpected accidents. Do not use them for continuous protective operation.

2.1 Over Current Protection (OCP)

sequentially, the device stops the operation for 20 ms (Typ) and subsequently initiates a restart.

1.0 V(Typ)

Protective Functions - coutinued

2.2 Under Voltage Lockout Protection Function (UVLO)

This is under voltage lockout block. It shuts down the device when the VIN pin voltage falls to 6.4 V (Typ) or less. The UVLO threshold voltage has a hysteresis of 200 mV (Typ).

2.3 Over Voltage Discharge Function (OVDIS)

Discharge MOS On-time is set to 400 ns (Typ) and discharge output voltage. Figure 35. OVDIS Timing Chart

2.4 Over Voltage Protection Function (OVP)

duty cycle. When the FB pin voltage is 2.0 V (Typ) or more, it turns Discharge MOS off also.

2.5 Thermal Shutdown Function (TSD)

temperature (Tj) rises to 175 °C (Typ) or more, the TSD circuit will operate and turn OFF the output MOSFET. Figure 34. UVLO Timing Chart

TSZ02201-0F2F0AJ00280-1-2 © 2020 ROHM Co., Ltd. All rights reserved. Table 1. Specification of Application Figure 36. Application Circuit Table 2. Recommended Component Values(Note 1) (VOUT = 5.0 V) (Note 3) In order to reduce the influence of high frequency noise, connect a 1 μF ceramic capacitor as close as possible to the VIN pin and the GND pin.

TSZ02201-0F2F0AJ00280-1-2 © 2020 ROHM Co., Ltd. All rights reserved. Table 3. Specification of Application Figure 43. Application Circuit Table 4. Recommended Component Values(Note 1) ( VOUT = 3.3 V ) (Note 3) In order to reduce the influence of high frequency noise, connect a 1 μF ceramic capacitor as close as possible to the VIN pin and the GND pin.

3 VOUT = 12 V

Table 5. Specification of Application Figure 50. Application Circuit Table 6. Recommended Component Values(Note 1) (VOUT = 12 V) (Note 3) In order to reduce the influence of high frequency noise, connect a 1 μF ceramic capacitor as close as possible to the VIN pin and the GND pin.

3 VOUT = 12 V – continued

Figure 51. Efficiency vs Output Current Figure 52. Frequency Characteristics Figure 53. VOUT Ripple Figure 54. VOUT Ripple

TSZ02201-0F2F0AJ00280-1-2 © 2020 ROHM Co., Ltd. All rights reserved. 20.May.2022 Rev.002 www.rohm.com TSZ22111 • 15 • 001 BD9G500EFJ-LA BD9G500UEFJ-LA [mV] 2. Output LC Filter – Connected Computation ∆IL. with VIN = 48 V, VOUT = 5 V, L = 33 µH, and switching frequency f OSC = 200 kHz, the method is as below. ∆𝐼𝐿 = 𝑉𝑂𝑈𝑇 × (𝑉𝐼𝑁 − 𝑉𝑂𝑈𝑇) × 1 𝑉𝐼𝑁 × 𝑓𝑂𝑆𝐶 × 𝐿 = 679 Also for saturation current of inductor, select the one with larger current than the total of maximum output current and 1/2 of inductor ripple current ∆ IL.Output capacitor C OUT affects output ripple voltage characteristics. Select output capacitor COUT so that necessary ripple voltage characteristics are satisfied. Output ripple voltage can be expressed in the following method. ∆𝑉𝑅𝑃𝐿 = ∆𝐼𝐿 × (𝑅𝐸𝑆𝑅 + 1 8 × 𝐶𝑂𝑈𝑇 × 𝑓𝑂𝑆𝐶 RESR is the serial equivalent series resistance here. With COUT = 267 µF, RESR = 30 mΩ the output ripple voltage is calculated as below. ∆𝑉𝑅𝑃𝐿 = 0.679 × (30𝑚𝛺 + 1 8 × 267𝜇 × 200𝑘) = 21.96 Be careful of total capacitance value, when additional capacitor CLOAD is connected to output capacitor COUT. Use maximum additional capacitor CLOAD (Max) condition which satisfies the following method. Maximum starting inductor ripple current IL_START must smaller than over current limit 6.4 A (Min). Maximum starting inductor ripple current IL_START can be expressed in the following method. 𝐼𝐿_𝑆𝑇𝐴𝑅𝑇 = 𝐼𝑂𝑈𝑇𝑀𝐴𝑋 + ( ∆𝐼𝐿 2 ) + 𝐼𝐶𝐴𝑃 Charge current to output capacitor ICAP can be expressed in the following method. 𝐼𝐶𝐴𝑃 = (𝐶𝑂𝑈𝑇 + 𝐶𝐿𝑂𝐴𝐷) × 𝑉𝑂𝑈𝑇 𝑡𝑆𝑆 Computation with VIN = 48 V, VOUT = 5 V, L = 33 µH, IOUTMAX = 5 A (Max), switching frequency fOSC = 180 kHz (Min), Output capacitor COUT = 267 µF, Soft Start Time tSS = 15 ms (Min), the method is as below. 𝐶𝐿𝑂𝐴𝐷(𝑀𝑎𝑥) ≤ (6.4 − 𝐼𝑂𝑈𝑇𝑀𝐴𝑋 − ∆𝐼𝐿 2 ) × 𝑡𝑆𝑆 𝑉𝑂𝑈𝑇 − 𝐶𝑂𝑈𝑇 = 2801 3. Catch Diode BD9G500EFJ-LA should be taken to connect external catch diode between the SW pin and the GND pin. The diode require adherence to absolute maximum r atings of application. Opposite direction voltage should be hi gher than maximum voltage of the VIN pin. Also for saturation current of diode, select the one with larger current than the total of maximum output current and 1/2 of inductor ripple current ∆IL. 4. Bootstrap capacitor Bootstrap capacitor C3 shall be 1 μF. Connect a bootstrap capacitor between the SW pin and the BOOT pin. For capacitance of Bootstrap capacitor, take temperature characteristics, DC bias characteristics, etc. into consideration to set minimum value to no less than 0.047 μF. [mA] [V] [A] [µF] [A]

Input capacitor configuration

bias characteristics, etc. into consideration to set minimum value to no less than 4.7 μF.

7.1 Selection of Phase Compensation Resistor R1

The phase compensation resistance R1 can be determined by using the following equation.

7.2 Selection of phase compensation capacitance C2

cancels the phase delay due to the pole formed by the load often provides favorable characteristics. The phase compensation capacitance C2 can be determined by using the following equation.

7.3 Loop stability

In order to secure stability of DC/DC converter, confirm there is enough phase margin on actual equipment. Under the worst condition, it is recommended to secure phase margin more than 45°. operating environments (temperature, etc.). manufacturer of each measuring equipment to check its measuring method, etc. Figure 60. Feedback Resistor Circuit

Provide the input capacitor close to the VIN pin of the IC as possible on the same plane as the IC.
If there is any unused area on the PCB, provide a copper foil plane for the ground node to assist heat dissipation from the IC and the surrounding components.
Switching nodes such as SW are susceptible to noise due to AC coupling with other nodes. Trace to the coil and catch diode as thick and short as possible.
Provide lines connected to the FB pin and the COMP pin as far from the SW node.
Provide the output capacitor away from the input capacitor in order to avoid the effect of harmonic noise from the input. Top Layer Bottom Layer

Figure 62. Example of Sample Board Layout Pattern

TSZ02201-0F2F0AJ00280-1-2 © 2020 ROHM Co., Ltd. All rights reserved. 20.May.2022 Rev.002 www.rohm.com TSZ22111 • 15 • 001 BD9G500EFJ-LA BD9G500UEFJ-LA BOOTREG GND BOOT SW VIN EN GND GND GND GND GND RT GND GND FB GND I/O Equivalence Circuit 1. SW 7. BOOT 3. COMP 4. FB 5. RT 6. EN COMP VREG GND GND GND

TSZ02201-0F2F0AJ00280-1-2 © 2020 ROHM Co., Ltd. All rights reserved. 20.May.2022 Rev.002 www.rohm.com TSZ22111 • 15 • 001 BD9G500EFJ-LA BD9G500UEFJ-LA Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However, pins that drive inductive loads (e.g. motor driver outputs, DC -DC converter outputs) may inevitably go below ground due to back EMF or electromotive force. In such cases, the user should make sure that such vol tages going below ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small -signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low -impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mountin g may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 9. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line.

Regarding the Input Pin of the IC

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Figure 63. Example of Monolithic IC Structure temperature and the decrease in nominal capacitance due to DC bias and others.

Thermal Shutdown Circuit (TSD)

falls below the TSD threshold, the circuits are automatically restored to normal operation.

Over Current Protection Circuit (OCP)

not be used in applications characterized by continuous operation or transitioning of the protection circuit.

Ordering Information

B D 9 G 5 0 0 x E F J - LAE2 Production Line NONE: Production Line A “U”: Production Line B Package EFJ: HTSOP-J8 Product Class LA: For Industrial Applications Packaging and forming specification E2: Embossed tape and reel Package Part Number Remarks HTSOP-J8 BD9G500EFJ-LAE2 Production Line A(Note 1) HTSOP-J8 BD9G500UEFJ-LAE2 Production Line B(Note 1) (Note 1) For the purpose of improving production efficiency, Production Line A and B have a multi -line configuration. Electrical characteristics noted in Datasheet does not differ between Production Line A and B. Production Line B is recommended for new product. Marking Diagram HTSOP-J8 (TOP VIEW)

9 G 5 0 0 U

HTSOP-J8 (TOP VIEW) D 9 G 5 0 0 Part Number Marking LOT Number Pin 1 Mark

TSZ02201-0F2F0AJ00280-1-2 © 2020 ROHM Co., Ltd. All rights reserved. 20.May.2022 Rev.002 www.rohm.com TSZ22111 • 15 • 001 BD9G500EFJ-LA BD9G500UEFJ-LA Physical Dimension and Packing Information Package Name HTSOP-J8

Revision History

11.Jun.2020 001 New Release 20.May.2022 002 Add BD9G500UEFJ-LA

Notice-PAA-E Rev.004 © 2015 ROHM Co., Ltd. All rights reserved. Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( “Specific Applications ”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below . Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independen t verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse , is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsibl e or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. I f the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification

Notice-PAA-E Rev.004 © 2015 ROHM Co., Ltd. All rights reserved. Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties.

Notice – WE Rev.001 © 2015 ROHM Co., Ltd. All rights reserved. General Precaution 1. Before you use our Products, you are requested to caref ully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of an y ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this documen t is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccura cy or errors of or concerning such information.

Product Information

BD9G500EFJ-LAE2 specifications and overview.

Summary

7 V to 76 V Input, 5 A Integrated High–Side MOSFET, Single Buck DC/DC Converter 20.May.2022 Rev.002

Description

7 V to 76 V Input, 5 A Integrated High–Side MOSFET, Single Buck DC/DC Converter 20.May.2022 Rev.002

Source title BD9G500EFJ-LAE2 Datasheet(PDF) - Rohm

Related Parts

More parts from the same family.

Browse manufacturer