Power Management

BD9F500QUZ

Rohm

4.5 V to 36 V Input, 5 A Integrated MOSFET Single Synchronous Buck DC/DC Converter 02.Apr.2020 Rev.001

Manufacturer: Rohm

Document: 58 Pages / 3Mb

Request Quote Download Datasheet Read online HTML view

Read BD9F500QUZ online.

BD9F500QUZ ROHM | Alldatasheet

Document overview

Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
PDF pages: 58

Technical content

Features

 Single Synchronous Buck DC/DC Converter  Constant On-Time Control  Light Load Mode Control  Adjustable Soft Start  Power Good Output  Nano Pulse Control™  Output Capacitor Discharge Function  Over Voltage Protection (OVP)  Over Current Protection (OCP)  Short Circuit Protection (SCP)  Thermal Shutdown Protection (TSD)  Under Voltage Lockout Protection (UVLO)  VMMP16LZ3030 Package Backside Heat Dissipation, 0.5 mm Pitch

Applications

 Step-down Power Supply for SoC, FPGA, Microprocessor  Printer (MFP / LBP / IJP / POS)  OA Equipment  Laptop PC  USB Type-C Applications Key Specifications  Input Voltage Range: 4.5 V to 36 V  Output Voltage Range: 0.6 V to 14 V  Output Current: 5 A (Max)  Switching Frequency: 600 kHz, 1 MHz, 2.2 MHz (Typ)  High-Side FET ON Resistance: 40 mΩ (Typ)  Low-Side FET ON Resistance: 22 mΩ (Typ)  Shutdown Current: 2 μA (Typ)  Operating Quiescent Current: 20 μA (Typ) Package W (Typ) x D (Typ) x H (Max) VMMP16LZ3030 3.0 mm x 3.0 mm x 0.40 mm Typical Application Circuit Nano Pulse Control™ is a trademark or a registered trademark of ROHM Co., Ltd. VMMP16LZ3030 VIN BOOT BD9F500QUZ SW FB VOUT L VREG 0.1 μF CREG AGND PGD SEL1 COUT CIN SEL2 PGND SS VIN CFB ENVEN VSEL1 VSEL2 DatasheetNano Pulse ControlTM

TSZ02201-0F2F0AJ00270-1-2 © 2020 ROHM Co., Ltd. All rights reserved. BD9F500QUZ 02.Apr.2020 Rev.001 www.rohm.com TSZ22111 • 15 • 001 PGND 4 3PGND FB SEL1 1316 15 14 5 6 7 8 SEL2 VREGPGND PGND AGND EN VIN SS PGD BOOT SW SW VIN VIN 17 18 Pin Configuration (TOP VIEW) Pin Descriptions Pin No. Pin Name Function 1-4 PGND Ground pins for the output stage of the switching regulator. 5, 17 SW Switch pin. This pin is connected to the source of the High -Side FET and the drain of the Low-Side FET. Connect a bootstrap capacitor of 0.1 µF between this pin and the BOOT pin. In addition, connect an inductor considering the direct current superimposition characteristic. 6 BOOT Pin for bootstrap. Connect a bootstrap capacitor of 0.1 µF between this pin and the SW pin. The voltage of this pin is the gate drive voltage of the High-Side FET.

7 PGD

Power Good pin. This pin is an open drain output that requires a pull-up resistor. See Function Explanations (4) Power Good for setting the resistance. If not used, this pin can be left floating or connected to the ground. 8 SS Pin for setting the soft start time of output voltage. The soft start time is 2 ms (Typ) when the SS pin is open. A ceramic capacitor connected to the SS pin makes the so ft start time more than 2 ms. See Selection of Components Externally Connected 4. Soft Start Capacitor for how to calculate the capacitance. 9 SEL1 Pin for setting switching control mode. See Function Explanations ( 7) Control Mode Selectable Function for how to control. 10 SEL2 Pin for setting switching control mode. See Function Explanations ( 7) Control Mode Selectable Function for how to control.

11 VREG

Internal power supply output pin. This node supplies power 5.2 V (Typ) to other blocks which are mainly responsible for the control function of the switching regulator. Connecting 2.2 µF (Typ) ceramic capacitor is recommended. 12 FB Output voltage feedback pin. See Selection of Components Externally Connected 3. Output Voltage Setting, FB Capacitor for the output voltage setting. 13 AGND Ground pin for the control circuit. 14 EN Enable pin. The device starts up with setting V EN to 1.2 V (Typ) or more. The device enters the shutdown mode with setting VEN to 1.1 V (Typ) or less. This pin must be terminated. 15, 16,

18 VIN

Power supply pin. Connecting 0.1 µF (Typ) and 10 µF (Typ) ceramic capacitors is recommended. The detail of a selection is described in Selection of Components Externally Connected 1. Input Capacitor . Connecting to the PCB VIN pattern by using thermal vias provides excellent heat dissipation characteristics. See PCB Layout Design for the detailed PCB layout design.

TSZ02201-0F2F0AJ00270-1-2 © 2020 ROHM Co., Ltd. All rights reserved. BD9F500QUZ 02.Apr.2020 Rev.001 www.rohm.com TSZ22111 • 15 • 001 Block Diagram 8 SS VREF PGOOD On-Time SELECTOR Control Logic HOCP REG VREG LOCP Error Amplifier FREQ OCP MODE PGD SEL2 SEL1 FB SS EN VREG VIN BOOT SW ZX/ROCP AGND PGND Main Comparator TSD SCP OVP UVLOVIN EN SW

TSZ02201-0F2F0AJ00270-1-2 © 2020 ROHM Co., Ltd. All rights reserved. BD9F500QUZ 02.Apr.2020 Rev.001 www.rohm.com TSZ22111 • 15 • 001 Description of Blocks 1. VREF This block generates the internal reference voltage. 2. REG This block generates the internal power supply. 3. Soft Start The Soft Start circuit slows down the rise of output voltage during start -up and controls the current, which allows the prevention of output voltage overshoot and inrush current. The internal soft start time is 2 ms (Typ) when the SS pin is open. A capacitor connected to the SS pin makes the rising time more than 2 ms. 4. Error Amplifier The Error Amplifier adjusts the Main Comparator input voltage to make the internal reference voltag e equal to FB voltage. 5. Main Comparator The Main Comparator compares the Error Amplifier output voltage and FB voltage (VFB). When VFB becomes lower than the Error Amplifier output voltage , the output turns high and reports to the On -Time block that the ou tput voltage has dropped below the control voltage. 6. On-Time This block generates On-Time. The designed On-Time is generated after the Main Comparator output turns high. 7. PGOOD The PGOOD block is for power good function. When the output voltage reaches within ±7 % (Typ) of the setting voltage, the built-in open drain Nch MOSFET connected to the PGD pin is turned off and the PGD pin becomes Hi-Z (High impedance). When the output voltage reaches outside ±10 % (Typ) of the setting voltage, the open drain Nch MOSFET is turned on and PGD pin is pulled down with 500 Ω (Typ). 8. UVLO The UVLO block is for under voltage lockout protection. The device is shutdown when input voltage (VIN) falls to 4.0 V (Typ) or less. The threshold voltage has the 200 mV (Typ) hysteresis. 9. TSD The TSD block is for thermal protection. The device is shutdown when the junction temperature Tj reaches to 175 °C (Typ) or more. The device is automatically restored to normal operation with a hysteresis of 25 °C (Typ) when the Tj goes down. 10. OVP The OVP block is for output over voltage protection. When the FB voltage (VFB) exceeds 120 % (Typ) or more of FB threshold voltage V FBTH, the SW pin is pulled down with 400 Ω (Typ). After VFB falls 115 % (Typ) or less of VFBTH, the device is returned to normal operation condition. 11. HOCP This block is for over current protection of the High -Side FET. When the current that flows through the High -Side FET reaches the value of over current limit, it turns off the High-Side FET and turns on the Low-Side FET. 12. LOCP This block is for over current protection of the Low -Side FET. While the current that flows through the Low -Side FET over the value of over current limit, the condition that being turned on the Low-Side FET is continued. 13. SCP This block is for short circuit protection. After soft start is completed and in condition where VFB is 90 % (Typ) of 0.6 V or less, this block counts the number of times of which current flowing in the Low-Side FET reaches over current limit. When 128 times is counted, the device is shutdown for 16 times of soft start time (Typ) and re-operates. 14. ZX/ROCP The ZX/ROCP is a comparator that monitors the inductor current. When inductor current falls below 0 A (Typ) while the Low-Side FET is on, it turns off the Low-Side FET (Light Load Mode). When the current that flows through the Low-Side FET reaches the value of over current limit, it turns off the Low-Side FET (Fixed PWM Mode). 15. Control Logic The Control Logic controls the switching operation and protection function operation. 16. SELECTOR This block controls switching frequency, maximum output current, and operating mode.

TSZ02201-0F2F0AJ00270-1-2 © 2020 ROHM Co., Ltd. All rights reserved. BD9F500QUZ 02.Apr.2020 Rev.001 www.rohm.com TSZ22111 • 15 • 001 Absolute Maximum Ratings (Ta = 25 °C) Parameter Symbol Rating Unit Input Voltage VIN -0.3 to +39 V SW Voltage VSW -0.3 to VIN + 0.3 V SW Voltage (3 ns pulse width) VSWAC1 -2 to VIN + 0.3 V SW Voltage (30 ns pulse width) VSWAC2 -1 to VIN + 0.3 V Voltage from GND to BOOT VBOOT -0.3 to +45 V Voltage from SW to BOOT ΔVBOOT-SW -0.3 to +7 V FB Voltage VFB -0.3 to +7 V VREG Voltage VVREG -0.3 to +7 V SEL1 Voltage VSEL1 -0.3 to VVREG + 0.3 V SEL2 Voltage VSEL2 -0.3 to VVREG + 0.3 V PGD Voltage VPGD -0.3 to +45 V EN Voltage VEN -0.3 to +39 V SS Voltage VSS -0.3 to +7 V Output Current IOUT 6 A Maximum Junction Temperature Tjmax 150 °C Storage Temperature Range Tstg -55 to +150 °C Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximu m junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. Thermal Resistance(Note 1) Parameter Symbol Thermal Resistance (Typ) Unit 1s(Note 3) 2s2p(Note 4) VMMP16LZ3030 Junction to Ambient θJA 125.1 50.7 °C/W Junction to Top Characterization Parameter(Note 2) ΨJT 12 8 °C/W (Note 1) Based on JESD51-2A (Still-Air). (Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at th e top center of the outside surface of the component package. (Note 3) Using a PCB board based on JESD51-3. (Note 4) Using a PCB board based on JESD51-5, 7. Layer Number of Measurement Board Material Board Size Single FR-4 114.3 mm x 76.2 mm x 1.57 mmt Top Copper Pattern Thickness Footprints and Traces 70 μm Layer Number of Measurement Board Material Board Size Thermal Via(Note 5) Pitch Diameter Top 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 μm 74.2 mm x 74.2 mm 35 μm 74.2 mm x 74.2 mm 70 μm (Note 5) This thermal via connects with the copper pattern of all layers.

TSZ02201-0F2F0AJ00270-1-2 © 2020 ROHM Co., Ltd. All rights reserved. BD9F500QUZ 02.Apr.2020 Rev.001 www.rohm.com TSZ22111 • 15 • 001 Recommended Operating Conditions Parameter Symbol Min Typ Max Unit Input Voltage VIN 4.5 - 36.0 V Operating Temperature(Note 1) Topr -40 - +85 °C Output Current(Note 1)(Note 2) IOUT 0 - 5 A 0 - 3 A Output Voltage Setting(Note 3) VOUT 0.6 - 14.0 V (Note 1) Tj must be 150 °C or less under the actual operating environment. Life time is derated at junction temperature greater than 125 °C. (Note 2) The maximum value of the output current is determined by the control mode selection. (Note 3) The switching frequency is reduced as needed to always ensure a proper regulation at low duty and high duty cycles. Use under the condition of VOUT ≤ VIN × 0.8 [V]. Electrical Characteristics (Unless otherwise specified Ta = 25 °C, VIN = 12 V, VEN = 3 V) Parameter Symbol Min Typ Max Unit Conditions Input Supply Shutdown Current ISDN - 2 10 µA VEN = 0 V Operating Quiescent Current IQ - 20 40 µA IOUT = 0 A, No switching UVLO Detection Threshold Voltage VUVLO1 3.7 4.0 4.3 V VIN falling UVLO Release Threshold Voltage VUVLO2 3.9 4.2 4.5 V VIN rising UVLO Hysteresis Voltage VUVLOHYS 100 200 400 mV Enable EN Threshold Voltage High VENH 1.1 1.2 1.3 V VEN rising EN Threshold Voltage Low VENL 1.0 1.1 1.2 V VEN falling EN Hysteresis Voltage VENHYS 50 100 200 mV EN Input Current IEN - 0 2 µA VEN = 3 V VREG VREG Shutdown Voltage VVREG_SD - 0 0.1 V VEN = 0 V VREG Output Voltage VVREG 5.0 5.2 5.4 V Reference Voltage, Error Amplifier, Soft Start FB Threshold Voltage VFBTH 0.594 0.600 0.606 V PWM mode FB Input Current IFB - - 100 nA VFB = 0.6 V Soft Start Time tSS 1.4 2.0 2.6 ms The SS pin is open. Soft Start Charge Current ISS 1.6 2.0 2.4 µA Control SEL1, SEL2 High Level Voltage VSELH VVREG -0.3 - VVREG V SEL1, SEL2 Low Level Voltage VSELL 0 - 0.3 V SEL1, SEL2 Input Current ISEL - - 3 µA On-Time1 tON1 - 458 - ns VOUT = 3.3 V, PWM mode, 600 kHz setting On-Time2 tON2 - 275 - ns VOUT = 3.3 V, PWM mode,

1 MHz setting

On-Time3 tON3 - 125 - ns VOUT = 3.3 V, PWM mode,

2.2 MHz setting

Minimum On-Time(Note 4) tMINON - 48 - ns SW (MOSFET) High-Side FET ON Resistance1 RONH1 - 40 80 mΩ VBOOT - VSW = 5 V, IOUTMAX = 5 A setting High-Side FET ON Resistance2 RONH2 - 65 130 mΩ VBOOT - VSW = 5 V, IOUTMAX = 3 A setting Low-Side FET ON Resistance1 RONL1 - 22 44 mΩ IOUTMAX = 5 A setting Low-Side FET ON Resistance2 RONL2 - 38 76 mΩ IOUTMAX = 3 A setting (Note 4) No tested on outgoing inspection.

TSZ02201-0F2F0AJ00270-1-2 © 2020 ROHM Co., Ltd. All rights reserved. BD9F500QUZ 02.Apr.2020 Rev.001 www.rohm.com TSZ22111 • 15 • 001 Electrical Characteristics – continued (Unless otherwise specified Ta = 25 °C, VIN = 12 V, VEN = 3 V) Parameter Symbol Min Typ Max Unit Conditions Power Good Power Good Rising Threshold Voltage VPGDTHGR 90 93 96 % VFB rising, VPGDTHGR = VFB / VFBTH x 100 Power Good Falling Threshold Voltage VPGDTHGF 104 107 110 % VFB falling, VPGDTHGF = VFB / VFBTH x 100 Power Fault Rising Threshold Voltage VPGDTHFR 107 110 113 % VFB rising, VPGDTHFR = VFB / VFBTH x 100 Power Fault Falling Threshold Voltage VPGDTHFF 87 90 93 % VFB falling, VPGDTHFF = VFB / VFBTH x 100 PGD Output Leakage Current ILKPGD - 0 1 µA VPGD = 5 V PGD MOSFET ON Resistance RPGD - 500 1000 Ω Protection Low-Side FET Over Current Detection Current 1(Note 1) ILOCP1 5.3 6.7 8.1 A IOUTMAX = 5 A setting Low-Side FET Over Current Detection Current 2(Note 1) ILOCP2 3.2 4.0 4.8 A IOUTMAX = 3 A setting (Note 1) No tested on outgoing inspection.

TSZ02201-0F2F0AJ00270-1-2 © 2020 ROHM Co., Ltd. All rights reserved. Figure 17. Low-Side FET ON Resistance1 vs Temperature Figure 18. Low-Side FET ON Resistance2 vs Temperature Figure 19. Switching Frequency vs Temperature Figure 20. Switching Frequency vs Temperature

1 MHz_IOUTMAX = 5 A_PWM setting)

1 MHz_IOUTMAX = 5 A_LLM setting)

Figure 26. Shutdown at No Load: VEN = 5 V to 0 V Figure 27. Start-up at RLOAD = 0.66 Ω: VEN = 0 V to 5 V Figure 28. Shutdown at RLOAD = 0.66 Ω: VEN = 5 V to 0 V

Basic Operation – continued

Externally Connected 4. Soft Start Capacitor for how to set the soft start time. Figure 63. Soft Start Timing Chart

Basic Operation – continued

(Typ). It is recommended to connect a pull-up resistor of 20 kΩ to 100 kΩ. Table 1. PGD Output Figure 64. Power Good Timing Chart

Basic Operation – continued

Shutdown: VEN ≤ 1.1 V (Typ)
UVLO: VIN ≤ 4.0 V (Typ)
TSD: Tj ≥ 175 °C (Typ)
OVP: VFB / VFBTH ≥ 120 % (Typ) When all of the above conditions are released, output discharge is stopped. (7) Control Mode Selectable Function BD9F500QUZ has the SEL1 pin and the SEL2 pin that can offer 9 different states of operation as a combination of Switching Frequency, Maximum Output Current and Operation mode. It can operate at two different current limits to support an output continuous current of 5 A, 3 A respectively. It can operate at three different frequencies of 600 kHz, 1 MHz and 2.2 MHz and also can choose between Light Load Mode and Fixed PWM mode for 600 kHz and 1 MHz operation. Do not change the mode control of Switching Frequency and Maximum Output Current during operation.

Table 2. Control Mode Selection

1 MHz (Typ)

Table 3. OCP Value

TSZ02201-0F2F0AJ00270-1-2 © 2020 ROHM Co., Ltd. All rights reserved. High-Side FET is turned off. Output voltage may decrease by changing frequency and duty due to the OCP operation. exceed the maximum junction temperature (Tjmax = 150 °C) during OCP and SCP operation. Table 4. The Operating Condition of OCP and SCP Figure 65. OCP and SCP Timing Chart

TSZ02201-0F2F0AJ00270-1-2 © 2020 ROHM Co., Ltd. All rights reserved. (Typ), IROCP2 = 2.5 A (Typ) while Low-Side FET is ON, the Low-Side FET turns OFF. device starts up. The hysteresis is 200 mV (Typ). Figure 66. UVLO Timing Chart hysteresis of 25 °C (Typ). Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings. protecting the IC from heat damage. MOSFETs are returned to normal operation condition. Switching operation restarts after VFB falls below VFBTH (Typ).

TSZ02201-0F2F0AJ00270-1-2 © 2020 ROHM Co., Ltd. All rights reserved. Table 5. Specification of Application Figure 67. Application Circuit Table 6. Recommended Component Values (Note 1) In order to reduce the influence of high frequency noise, connect a 0.1 μF ceramic capacitor CIN1 as close as possible to the VIN pin and the PGND pin. the loop response characteristics may change. Confirm with the actual application. (phase margin) using a FRA. However, the resistor is not used in actual application, use this resistor pattern in short-circuit mode.

TSZ02201-0F2F0AJ00270-1-2 © 2020 ROHM Co., Ltd. All rights reserved. Table 7. Specification of Application Figure 72. Application Circuit Table 8. Recommended Component Values (Note 1) In order to reduce the influence of high frequency noise, connect a 0.1 μF ceramic capacitor CIN1 as close as possible to the VIN pin and the PGND pin. the loop response characteristics may change. Confirm with the actual application. (phase margin) using a FRA. However, the resistor is not used in actual application, use this resistor pattern in short-circuit mode.

TSZ02201-0F2F0AJ00270-1-2 © 2020 ROHM Co., Ltd. All rights reserved. Table 9. Specification of Application Figure 77. Application Circuit Table 10. Recommended Component Values (Note 1) In order to reduce the influence of high frequency noise, connect a 0.1 μF ceramic capacitor CIN1 as close as possible to the VIN pin and the PGND pin. the loop response characteristics may change. Confirm with the actual application. (phase margin) using a FRA. However, the resistor is not used in actual application, use this resistor pattern in short-circuit mode.

TSZ02201-0F2F0AJ00270-1-2 © 2020 ROHM Co., Ltd. All rights reserved. Table 11. Specification of Application Figure 82. Application Circuit Table 12. Recommended Component Values (Note 1) In order to reduce the influence of high frequency noise, connect a 0.1 μF ceramic capacitor CIN1 as close as possible to the VIN pin and the PGND pin. the loop response characteristics may change. Confirm with the actual application. (phase margin) using a FRA. However, the resistor is not used in actual application, use this resistor pattern in short-circuit mode.

TSZ02201-0F2F0AJ00270-1-2 © 2020 ROHM Co., Ltd. All rights reserved. Table 13. Specification of Application Figure 87. Application Circuit Table 14. Recommended Component Values (Note 1) In order to reduce the influence of high frequency noise, connect a 0.1 μF ceramic capacitor CIN1 as close as possible to the VIN pin and the PGND pin. the loop response characteristics may change. Confirm with the actual application. (phase margin) using a FRA. However, the resistor is not used in actual application, use this resistor pattern in short-circuit mode.

TSZ02201-0F2F0AJ00270-1-2 © 2020 ROHM Co., Ltd. All rights reserved. Table 15. Specification of Application Figure 92. Application Circuit Table 16. Recommended Component Values (Note 1) In order to reduce the influence of high frequency noise, connect a 0.1 μF ceramic capacitor CIN1 as close as possible to the VIN pin and the PGND pin. the loop response characteristics may change. Confirm with the actual application. (phase margin) using a FRA. However, the resistor is not used in actual application, use this resistor pattern in short -circuit mode.

TSZ02201-0F2F0AJ00270-1-2 © 2020 ROHM Co., Ltd. All rights reserved. Table 17. Specification of Application Figure 97. Application Circuit Table 18. Recommended Component Values (Note 1) In order to reduce the influence of high frequency noise, connect a 0.1 μF ceramic capacitor CIN1 as close as possible to the VIN pin and the PGND pin. the loop response characteristics may change. Confirm with the actual application. (phase margin) using a FRA. However, the resistor is not used in actual application, use this resistor pattern in short-circuit mode.

TSZ02201-0F2F0AJ00270-1-2 © 2020 ROHM Co., Ltd. All rights reserved. Contact us if not use the recommended component values in Application Examples. possible to the VIN pin and the PGND pin in order to reduce the high frequency noise. voltage. For recommended inductance, use the values listed in Table 19. Figure 102. Waveform of Inductor Current Figure 103. Output LC Filter Circuit ΔIL can be represented by the following equation. IOUTMAX and 1/2 of the inductor ripple current ΔIL. Table 19. COUT affects the output ripple voltage. Select COUT so that it must satisfy the required ripple voltage The output ripple voltage can be estimated by the following equation. 𝑅𝐸𝑆𝑅 is the Equivalent Series Resistance (ESR) of the output capacitor. For example, given that COUT = 44 μF and RESR = 3 mΩ, ΔVRPL can be calculated as below.

Output LC Filter – continued

In addition, the total capacitance connected to VOUT needs to satisfy the value obtained by the following equation. 𝑡𝑆𝑆𝑀𝐼𝑁 is the minimum soft start time. 𝐼𝑂𝑈𝑇𝑀𝐴𝑋 is the maximum output current. ∆IL is the inductor current. IOUTSS is the maximum output current during soft start. A, and IOUTSS = 5 A, COUTMAX can be calculated as below. current at startup and prevented to turn on the output. Confirm this on the actual application. Table 19. Recommended inductance and output capacitance (Note 1) COUT_EFF is the sum of actual output capacitance.

Output Voltage Setting, FB Capacitor

the values listed in Table 20. The output voltage VOUT can be calculated as below. Figure 104. Feedback Resistor Circuit recommended CFB, use the values listed in Table 20. fSW is the switching frequency 600 kHz (Typ). fSW is the switching frequency 1 MHz, 2.2 MHz (Typ). check them on the actual application.

Output Voltage Setting, FB Capacitor – continued

Table 20. Recommended feedback resistance, CFB capacitance

Soft Start Capacitor (Soft Start Time Setting)

using below equation. The CSS should be set in the range between 0.01 μF and 0.1 μF. 𝐼𝑆𝑆 is the Soft Start Charge Current 2.0 µA (Typ). With CSS = 0.022 μF, tSS can be calculated as below. capacitance of no less than 0.82 μF. capacitance of no less than 0.022 μF.

TSZ02201-0F2F0AJ00270-1-2 © 2020 ROHM Co., Ltd. All rights reserved. BD9F500QUZ 02.Apr.2020 Rev.001 www.rohm.com TSZ22111 • 15 • 001 PCB Layout Design – continued When designing the PCB layout, pay attention to the following points:

Connect the input capacitor CIN1 and CIN2 as close as possible to the VIN pin and the PGND pin on the same plane as the IC.
Switching nodes such as SW are susceptible to noise due to AC coupling with other nodes. Route the inductor pattern L as thick and as short as possible.
The feedback line connected to the FB pin should be as far away from the SW nodes as possible.
Place the output capacitor COUT away from input capacitor CIN1 and CIN2 to avoid harmonics noise from the input.
Separate the reference ground and the power ground and connect them through VIA. The reference ground should be connected to the power ground that is close to the output capacitor COUT. It is because COUT has less high frequency switching noise.
To provide excellent heat dissipation characteristics connect the VIN pins to the PCB VIN pattern by using thermal vias.
Place the bypass capacitor between the VREG and AGND pins at a position as close as possible to the pin.
When the SEL1 and SEL2 pins are left open, the parasitic capacitance with the VIN, SW, and BOOT pins should be 0.2 pF or less.
R0 is provided for the measurement of feedback frequency characteristics (optional). By inserting a resistor into R0, it is possible to measure the frequency characteristics of feedback (phase margin) using FRA etc. R0 is short-circuited for normal use.

TSZ02201-0F2F0AJ00270-1-2 © 2020 ROHM Co., Ltd. All rights reserved. BD9F500QUZ 02.Apr.2020 Rev.001 www.rohm.com TSZ22111 • 15 • 001 I/O Equivalence Circuits 5, 17. SW 6. BOOT 7. PGD 8. SS 9. SEL1, 10. SEL2 11. VREG 12. FB 14.EN (Note) Resistor values are typical. SW VIN BOOT 30 Ω 350 Ω BOOT SW VIN VREG PGD 100 Ω 300 Ω SS 10 kΩ VREG 3 kΩ 25 kΩ 100 kΩ VREG 10 kΩ VIN 5 MΩ 1.5 MΩ BOOT EN 20 kΩ SEL1 SEL2 VREG 20 kΩ 2.5 MΩ VREG 10 kΩ VREG 10 kΩ FB 10 kΩ 50 kΩ 100 kΩ 10 kΩ

TSZ02201-0F2F0AJ00270-1-2 © 2020 ROHM Co., Ltd. All rights reserved. BD9F500QUZ 02.Apr.2020 Rev.001 www.rohm.com TSZ22111 • 15 • 001 Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply , such as mounting an external diode between the power supply and the IC ’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However, pins that drive inductive loads (e.g. motor driver outputs, DC -DC converter outputs) may inevitably go below ground due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the ap plication board to avoid fluctuations in the small -signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especi ally if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Testing on Application Boards When testing the IC on an application board , connecting a capacitor directly to a low -impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it f rom the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground , power supply and output pin . Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 9. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely hig h impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line.

Regarding the Input Pin of the IC

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Figure 108. Example of Monolithic IC Structure temperature and the decrease in nominal capacitance due to DC bias and others.

Thermal Shutdown Circuit (TSD)

falls below the TSD threshold, the circuits are automatically restored to normal operation.

Over Current Protection Circuit (OCP)

not be used in applications characterized by continuous operation or transitioning of the protection circuit.

Ordering Information

Packaging and forming specification E2: Embossed tape and reel Marking Diagram Part Number Marking LOT Number Pin 1 Mark VMMP16LZ3030 (TOP VIEW) 500 D 9 F

Revision History

02.Apr.2020 001 New Release

Notice-PGA-E Rev.004 © 2015 ROHM Co., Ltd. All rights reserved. Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( “Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse , is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. I f the flow soldering method is preferred on a surface-mount products , please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification

Notice-PGA-E Rev.004 © 2015 ROHM Co., Ltd. All rights reserved. Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use . Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and stor age so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper name s of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties.

Notice – WE Rev.001 © 2015 ROHM Co., Ltd. All rights reserved. General Precaution 1. Before you use our Products, you are requested to caref ully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of an y ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this documen t is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccura cy or errors of or concerning such information.

Product Information

BD9F500QUZ specifications and overview.

Summary

4.5 V to 36 V Input, 5 A Integrated MOSFET Single Synchronous Buck DC/DC Converter 02.Apr.2020 Rev.001

Description

4.5 V to 36 V Input, 5 A Integrated MOSFET Single Synchronous Buck DC/DC Converter 02.Apr.2020 Rev.001

Source title BD9F500QUZ Datasheet(PDF) - Rohm

Related Parts

More parts from the same family.

Browse manufacturer