Power Management

BD9D300MUV

Rohm

4.0 V to 17 V Input, 3 A Integrated MOSFET Single Synchronous Buck DC/DC Converter 16.Sep.2021 Rev.002

Manufacturer: Rohm

Document: 42 Pages / 1Mb

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Document overview

Manufacturer or author: ROHM CO., LTD.
PDF pages: 42

Technical content

Features

◼ Single Synchronous Buck DC/DC Converter ◼ On-time Control ◼ Light Load Mode Control ◼ Over Current Protection (OCP) ◼ Short Circuit Protection (SCP) ◼ Thermal Shutdown Protection (TSD) ◼ Under Voltage Lockout Protection (UVLO) ◼ Adjustable Soft Start ◼ Power Good Output ◼ Over Voltage Protection (OVP) ◼ VQFN016V3030 Package Backside Heat Dissipation

Applications

◼ Step-down Power Supply for SoC, FPGA, Microprocessor ◼ Laptop PC / Tablet PC / Server ◼ LCD TV ◼ Storage Device (HDD / SSD) ◼ 2-series Cell Li-Ion Batteries Equipment ◼ Printer, OA Equipment ◼ Distributed Power Supply, Secondary Power Supply Key Specifications ◼ Input Voltage Range: 4 V to 17 V ◼ Output Voltage Range: 0.9 V to 5.25 V ◼ Output Current: 3 A (Max) ◼ Switching Frequency: 1.25 MHz (Typ) ◼ High-Side FET ON Resistance: 110 mΩ (Typ) ◼ Low-Side FET ON Resistance: 50 mΩ (Typ) ◼ Shutdown Current: 3 μA (Typ) ◼ Operating Quiescent Current: 20 µA (Typ) Package W (Typ) x D (Typ) x H (Max) VQFN016V3030 3.00 mm x 3.00 mm x 1.00 mm Typical Application Circuit EN PVIN BD9D300MUV PGD SW FB AVIN SS VPGD PGND RESERVE AGND VOUT VEN VIN VOUTSMODE COUT CIN VQFN016V3030 Datasheet

10 AVIN

Pin No. Pin Name Function 1, 2, 3 SW Switch pin. These pins are connected to the drain of the High -Side and Low -Side FET. In addition, connect an inductor considering the direct current superimposition characteristic.

4 PGD

Power Good pin. This pin is an open drain output that requires a pull-up resistor (to the VOUTS pin). See page 15 for setting the resistance. If not used, this pin can be left floating or connected to Ground. 5 FB Output voltage feedback pin. See page 32 for how to calculate the resistance s of the output voltage setting. 6 AGND Ground pin for the control circuit. 7 RESERVE Reserve pin. Connect to Ground.

8 MODE

Pin for setting switching control mode. Connecting this pin to the VOUTS pin forces the device to operate in the Pulse Width Modulation (PWM) mode control. Connecting to G round, the mode is automatically switched between the Light Load mode control and PWM mode control. Fix this pin to the VOUTS pin or Ground. Do not change the mode control during operation. 9 SS Pin for setting the soft start time of output voltage. The soft start time is 1 ms (Typ) when the SS pin is open. A ceramic capacitor connected to the SS pin makes the soft start time 1 ms or more. See page 32 for how to calculate the capacitance. 10 AVIN Pin for supplying power to the control circuit. Connecting 0.1 µF (Typ) ceramic ca pacitor is recommended. This pin is connected to PVIN. 11, 12 PVIN Power supply pins for the output MOSFETs . Connecting 10 µF (Typ) ceramic capacitor is recommended. 13 EN Enable pin. The device starts up when VEN is set to 0.9 V (Min) or more. The device enters the shutdown mode with setting VEN to 0.3 V (Max) or less. This pin must be properly terminated. 14 VOUTS Pin for discharging output and detecting output voltage. Connect to output voltage node. 15, 16 PGND Ground pins for the output stage of the switching regulator. - EXP-PAD A backside heat dissipation pad. Connecting to the internal PCB G round plane by using via provides excellent heat dissipation characteristics.

TSZ02201-0F3F0AJ00260-1-2 © 2019 ROHM Co., Ltd. All rights reserved. 16.Sep.2021 Rev.002 www.rohm.com TSZ22111 • 15 • 001 BD9D300MUV Block Diagram MODEPGD PGND SW PVIN EN AVIN AGND SS RESERVE VOUTS REG UVLO EN SCP OVP Soft Start VREF PGOOD On Time FB Control Logic DRV TSD Main Comparator LOCP ZXCMP HOCP Error Amplifier High-Side FET Low-Side FET

TSZ02201-0F3F0AJ00260-1-2 © 2019 ROHM Co., Ltd. All rights reserved. 16.Sep.2021 Rev.002 www.rohm.com TSZ22111 • 15 • 001 BD9D300MUV Description of Blocks 1. REG This block generates the internal power supply. 2. EN This is the enable block. When EN voltage (VEN) is set to 0.9 V (Min) or more , the internal circuit is activated and the device starts operation. Shutdown is forced if VEN is set to 0.3 V (Max) or less. 3. UVLO This block is for under voltage lockout protection. The device shuts down when input voltage falls to 3.6 V (Typ) or less. The threshold voltage has a hysteresis of 200 mV (Typ). 4. VREF This block generates the internal reference voltage. 5. TSD This block is for thermal protection. The device is shut down when the junction temperature (Tj) reaches to 175 °C (Typ) or more. The device is automatically restored to normal operation with a hysteresis of 25 °C (Typ) when the Tj goes down. 6. Soft Start This block slows down the rise of output voltage during start-up and controls the current, which allows the prevention of output voltage overshoot and inrush current. The internal soft start time is 1 ms (Typ) when the SS pin is open. A capacitor connected to the SS pin makes the rising time 1 ms or more. 7. PGOOD This block is for power good function. When the FB voltage (VFB) is more than or equal to 95 % (Typ) of 0.8 V, the built- in open drain Nch MOSFET connected to the PGD pin is off, and the PGD pin becomes High impedance. When VFB is less than or equal to 90 % (Typ) of 0.8 V, it turns on the built-in open drain Nch MOSFET and the PGD pin is pulled down with 100 Ω (Typ). 8. Control Logic + DRV This block controls switching operation and various protection functions. 9. OVP This block is for output over voltage protection. When VFB is more than or equal to 120 % (Typ) of 0.8 V, the output MOSFETs are off. After VFB is less than or equal to 115 % (Typ) of 0.8 V, the output MOSFETs are returned to normal operation condition. In addition, when VOUTS voltage (VVOUTS) reaches 5.95 V (Typ) or more, the output MOSFETs are off. After VVOUTS falls 5.65 V (Typ) or less, the output MOSFETs are returned to normal operation condition. If the condition of the over voltage protection is continued for 20 µs (Typ), the output MOSFETs are latched to off. 10. HOCP This block is for over current protection of the High-Side FET. When the current that flows through the High-Side FET reaches the value of over current limit, it turns off the High-Side FET and turns on the Low-Side FET. 11. LOCP This block is for over current protection of the Low-Side FET. While the current that flows through the Low-Side FET over the value of over current limit, the condition that being turned on the Low-Side FET is continued. 12. SCP This block is for short circuit protection. After soft start is completed and in condition where VFB is less than or equal to 90 % (Typ) of 0.8 V, this block counts the number of times of which current flowing in the High-Side FET or the Low-Side FET reaches over current limit. When 256 times is counted, the device is shut down for 15 ms (Typ) and re-operates. Counting is reset when VFB is more than or equal to 95 % (Typ) of 0.8V, or IC re-operates by EN, UVLO and SCP function. 13. Error Amplifier The Error Amplifier adjusts Main Comparator input voltage to make the internal reference voltage equal to VFB. 14. Main Comparator The Main Comparator compares the Error Amplifier o utput voltage and V FB. When V FB becomes lower than the Error Amplifier output voltage, the output turns H igh and reports to the On Time block that the output voltage has dropped below the control voltage. 15. On Time This block generates On Time. The designed On Time is generated after th e Main Comparator output turns H igh. The On Time is adjusted to control the frequency to be fixed even with I/O voltage is changed. 16. ZXCMP The ZXCMP is a comparator that monitors the inductor current. When inductor current falls below 0 A (Typ) while the Low-Side FET is on, it turns the FET off.

TSZ02201-0F3F0AJ00260-1-2 © 2019 ROHM Co., Ltd. All rights reserved. 16.Sep.2021 Rev.002 www.rohm.com TSZ22111 • 15 • 001 BD9D300MUV Absolute Maximum Ratings (Ta = 25 °C) Parameter Symbol Rating Unit Input Voltage VPVIN, VAVIN -0.3 to +20 V EN Voltage VEN -0.3 to VPVIN + 0.3 V MODE Voltage VMODE -0.3 to +7 V RESERVE Voltage VRESERVE -0.3 to +7 V SS Voltage VSS -0.3 to +20 V PGD Voltage VPGD -0.3 to +7 V FB Voltage VFB -0.3 to +7 V VOUTS Voltage VVOUTS -0.3 to +7 V SW Voltage VSW -0.3 to VPVIN + 0.3 V Output Current IOUT 3.5 A Maximum Junction Temperature Tjmax 150 °C Storage Temperature Range Tstg -55 to +150 °C Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins o r an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temper ature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. Thermal Resistance (Note 1) Parameter Symbol Thermal Resistance (Typ) Unit 1s (Note 3) 2s2p (Note 4) VQFN016V3030 Junction to Ambient θJA 189.0 57.5 °C/W Junction to Top Characterization Parameter (Note 2) ΨJT 23 10 °C/W (Note 1) Based on JESD51-2A (Still-Air). (Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3) Using a PCB board based on JESD51-3. (Note 4) Using a PCB board based on JESD51-5, 7. Layer Number of Measurement Board Material Board Size Single FR-4 114.3 mm x 76.2 mm x 1.57 mmt Top Copper Pattern Thickness Footprints and Traces 70 μm Layer Number of Measurement Board Material Board Size Thermal Via (Note 5) Pitch Diameter Top 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 μm 74.2 mm x 74.2 mm 35 μm 74.2 mm x 74.2 mm 70 μm (Note 5) This thermal via connects with the copper pattern of all layers.

TSZ02201-0F3F0AJ00260-1-2 © 2019 ROHM Co., Ltd. All rights reserved. 16.Sep.2021 Rev.002 www.rohm.com TSZ22111 • 15 • 001 BD9D300MUV Recommended Operating Conditions Parameter Symbol Min Typ Max Unit Input Voltage VPVIN, VAVIN 4.0 - 17 V Operating Temperature Ta -40 - +85 (Note 1) °C Output Current IOUT 0 - 3 A Output Voltage Setting VOUT 0.9 (Note 2) - 5.25 V (Note 1) Tj must be lower than 150C under actual operating environment. Life time is derated at junction temperature greater than 125 °C. (Note 2) Use under the condition of the output voltage (VOUT) ≥ input voltage (VIN) × 0.125. Electrical Characteristics (Unless otherwise specified Ta = 25 °C, VPVIN = VAVIN = 12 V, VEN = 5 V, VMODE = GND) Parameter Symbol Min Typ Max Unit Conditions Power Supply (AVIN) Shutdown Current ISDN - 3 10 µA VEN = 0 V Operating Quiescent Current ICC - 20 40 µA IOUT = 0 mA No switching UVLO Detection Threshold Voltage VUVLO 3.4 3.6 3.8 V VIN falling UVLO Hysteresis Voltage VUVLOHYS - 200 - mV Enable EN Input High Level Voltage VENH 0.9 - VAVIN V EN Input Low Level Voltage VENL GND - 0.3 V EN Input Current IEN - - 10 µA Reference Voltage, Error Amplifier, Soft Start FB threshold Voltage VFBTH 0.792 0.800 0.808 V FB Input Current IFB - 1 100 nA VFB = 0.8 V Soft Start Charge Current ISS 2.3 2.5 2.7 µA Internal Soft Start Time tSS 0.4 1 1.8 ms Control MODE Input High Level Voltage VMODEH 0.9 - VVOUTS V MODE Input Low Level Voltage VMODEL GND - 0.3 V On Time tONT - 333 - ns VOUT = 5.0 V Power Good Power Good Rising Threshold Voltage VPGDR 92 95 98 % VFB rising, VPGDR = VFB / VFBTH x 100 Power Good Falling Threshold Voltage VPGDF 87 90 93 % VFB falling, VPGDF = VFB / VFBTH x 100 PGD Output Leakage Current ILKPGD - 0 800 nA VPGD = 5 V PGD MOSFET ON Resistance RPGD - 100 200 Ω PGD Low Level Voltage VPGDL - 0.2 0.4 V IPGD = 2 mA SW (MOSFET) High-Side FET ON Resistance RONH - 110 220 mΩ Low-Side FET ON Resistance RONL - 50 100 mΩ High-Side Output Leakage Current ILKH - 0 10 µA No switching Low-Side Output Leakage Current ILKL - 0 10 µA No switching Protection Output OVP Detection Voltage VOVPH 115 120 125 % VFB rising, VOVPH = VFB / VFBTH x 100 Output OVP Release Voltage VOVPL 110 115 120 % VFB falling, VOVPL = VFB / VFBTH x 100 Low-Side FET Over Current Detection Current (Note 3) ILOCP 3.1 3.8 - A (Note 3) No tested on outgoing inspection.

Basic Operation – continued

Figure 31. Soft Start Timing Chart recommended to connect a pull-up resistor of 10 kΩ to 100 kΩ to the VOUTS pin. Table 1. PGD Output

5.95 V (Typ)

5.65 V (Typ)

TSZ02201-0F3F0AJ00260-1-2 © 2019 ROHM Co., Ltd. All rights reserved. frequency and duty due to OCP operation. the maximum junction temperature (Tjmax = 150 °C) during OCP and SCP operation. Table 2. The Operating Condition of OCP and SCP Figure 33. OCP and SCP Timing Chart

TSZ02201-0F3F0AJ00260-1-2 © 2019 ROHM Co., Ltd. All rights reserved. the device starts up. The hysteresis is 200 mV (Typ). Figure 34. UVLO Timing Chart µs (Typ), the output MOSFETs are latched to off, and it re-operates by Enable control or UVLO function.

3.8 V (Typ)

TSZ02201-0F3F0AJ00260-1-2 © 2019 ROHM Co., Ltd. All rights reserved. Table 3. Specification of Application (VIN = 12 V / VOUT = 5.0 V) Figure 35. Application Circuit Table 4. Recommended Component Values (Note 1) (VIN = 12 V / VOUT = 5.0 V) of the product and external components. response (phase margin) using a FRA. However, the resistor will not be used in actual application, use this resistor pattern in short-circuit mode.

TSZ02201-0F3F0AJ00260-1-2 © 2019 ROHM Co., Ltd. All rights reserved. Table 5. Specification of Application (VIN = 7.4 V / VOUT = 5.0 V) Figure 40. Application Circuit Table 6. Recommended Component Values (Note 1) (VIN = 7.4 V / VOUT = 5.0 V) of the product and external components. response (phase margin) using a FRA. However, the resistor will not be used in actual application, use this resistor pattern in short-circuit mode.

© 2019 ROHM Co., Ltd. All rights reserved. Table 7. Specification of Application (VIN = 12 V / VOUT = 3.3 V) Figure 45. Application Circuit Table 8. Recommended Component Values (Note 1) (VIN = 12 V / VOUT = 3.3 V) of the product and external components. response (phase margin) using a FRA. However, the resistor will not be used in actual application, use this resistor pattern in short-circuit mode.

© 2019 ROHM Co., Ltd. All rights reserved. Table 9. Specification of Application (VIN = 7.4 V / VOUT = 3.3 V) Figure 50. Application Circuit Table 10. Recommended Component Values (Note 1) (VIN = 7.4 V / VOUT = 3.3 V) of the product and external components. response (phase margin) using a FRA. However, the resistor will not be used in actual application, use this resistor pattern in short-circuit mode.

© 2019 ROHM Co., Ltd. All rights reserved. Table 11. Specification of Application (VIN = 7.4 V / VOUT = 1.8 V) Figure 55. Application Circuit Table 12. Recommended Component Values (Note 1) (VIN = 7.4 V / VOUT = 1.8 V) of the product and external components. response (phase margin) using a FRA. However, the resistor will not be used in actual application, use this resistor pattern in short-circuit mode.

© 2019 ROHM Co., Ltd. All rights reserved. Table 13. Specification of Application (VIN = 7.4 V / VOUT = 1.2 V) Figure 60. Application Circuit Table 14. Recommended Component Values (Note 1) (VIN = 7.4 V / VOUT = 1.2 V) of the product and external components. response (phase margin) using a FRA. However, the resistor will not be used in actual application, use this resistor pattern in short-circuit mode.

© 2019 ROHM Co., Ltd. All rights reserved. The output voltage value can be set by the feedback resistance ratio. For stable operation, use feedback resistance R1 of value from 100 kΩ to 300 kΩ. Figure 67. Feedback Resistor Circuit

Soft Start Capacitor (Soft Start Time Setting)

below equation. The CSS should be set in the range between 3300 pF and 0.1 μF. 𝐶𝑆𝑆 is the capacitor connected to the SS pin. With CSS = 0.01 µF, tSS can be calculated as below.

© 2019 ROHM Co., Ltd. All rights reserved. 16.Sep.2021 Rev.002 www.rohm.com TSZ22111 • 15 • 001 I/O Equivalence Circuits 1.2.3. SW 4. PGD 5. FB 8. MODE 9. SS 13. EN 14. VOUTS PGD 50 Ω FB Internal REG 10 kΩ MODE Internal REG 20 kΩ SS 10 kΩ Internal REG 25 kΩ EN 380 kΩ 20 kΩ VOUTS 10 kΩ 500 kΩ 35 kΩ SW PVIN Internal Circuit 500 kΩ 167 kΩ 300 kΩ

© 2019 ROHM Co., Ltd. All rights reserved. 16.Sep.2021 Rev.002 www.rohm.com TSZ22111 • 15 • 001 Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins . Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However, pins that drive inductive loads (e.g. motor driver outputs, DC -DC converter outputs) may inevitably go below gr ound due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small -signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specifi ed by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground , power supply and output pin . Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 9. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this w ay is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line.

Regarding the Input Pin of the IC

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Figure 69. Example of Monolithic IC Structure temperature and the decrease in nominal capacitance due to DC bias and others.

Thermal Shutdown Circuit(TSD)

falls below the TSD threshold, the circuits are automatically restored to normal operation.

Over Current Protection Circuit (OCP)

not be used in applications characterized by continuous operation or transitioning of the protection circuit.

Ordering Information

Packaging and forming specification E2: Embossed tape and reel Marking Diagram VQFN016V3030 (TOP VIEW) 300 Part Number Marking LOT Number Pin 1 Mark D 9 D

Revision History

18.Mar.2019 001 New Release 16.Sep.2021 002 P4 Consist Soft Start block explanation with Japanese version. P6 Correct of Output Voltage Setting symbol error in Recommended Operating Condition P6 Correct of Output OVP Release Voltage symbol error in Electrical Characteristics P7 Correct of Figure 3 MODE setting error in Typical Performance Curves

Notice-PGA-E Rev.004 © 2015 ROHM Co., Ltd. All rights reserved. Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. I f the flow soldering method is preferred on a surface-mount products , please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification

Notice-PGA-E Rev.004 © 2015 ROHM Co., Ltd. All rights reserved. Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensati on [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precau tion for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper name s of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties.

Notice – WE Rev.001 © 2015 ROHM Co., Ltd. All rights reserved. General Precaution 1. Before you use our Products, you are requested to caref ully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of an y ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this documen t is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccura cy or errors of or concerning such information.

Product Information

BD9D300MUV specifications and overview.

Summary

4.0 V to 17 V Input, 3 A Integrated MOSFET Single Synchronous Buck DC/DC Converter 16.Sep.2021 Rev.002

Description

4.0 V to 17 V Input, 3 A Integrated MOSFET Single Synchronous Buck DC/DC Converter 16.Sep.2021 Rev.002

Source title BD9D300MUV Datasheet(PDF) - Rohm

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