Power Management

BD95700MUV

Rohm

2phase Switching Regulator Controllers for Graphic Card

Manufacturer: Rohm

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Description BD95700MUV is a 2 phase switching regulator controller with high output current which can achieve low output voltage (0.4V ~ 3.3V) from AC/DC 5V or 12V. High efficiency for the switching regulator can be realized by utilizing an external N-MOSFET power transistor. A new technology called H3RegTM is a Rohm proprietary control method to realize ultra high transient response against load change without phase compensation capacitance and resistance. For various applications, it is available to select the 3 types of N-MOSFET gate drive voltage (12V: for drive ability, 8V: for intermediate drive ability, 5V: for small real estate).
Features 1) H 3RegTM Switching Regulator Controller without phase compensation capacitance and resistance 2) Ultra High Tolerance Internal Reference Voltage (+/- 1%) 3) Thermal Shut Down (TSD), Under Voltage LockOut (UVLO), Adjustable Over Current Protection (OCP), Over Voltage Protection (OVP), S hort Circuit protection(SCP) built-in 4) Soft start function to minimize rush current during startup 5) Switching Frequency Variable (f=50kHz~1000kHz) 6) Internal Bootstrap Diode 7) High Tolerance Current Balance Function 8) VQFN024V4040 Package (4.0mm x 4.0mm x 1.0mm) 9) Integrated 1-/2-phase Switching Function
Applications Graphic Cards, Desktop PC, Gaming Equipments, Digital Components
Maximum Absolute Ratings (Ta=25℃) Parameter Symbol Limit Unit Input Voltage 1 VCC 15 *1 V Input Voltage 2 VIN 15 *1 V Input Voltage 3 VCCDRV 15 *1 V Input Voltage 4 5VCC 7 *1 V Input Voltage 5 REFIN 7 *1*2 V Input Voltage 6 BUSEN 7 *1 V BOOT Voltage BOOT1, BOOT2 30 *1 V BOOT-SW Voltage BOOT-SW 15 *1 V UG-SW Voltage UG-SW 15 *1 V SW Voltage SW 15 V Power Dissipation Pd1 0.34 W Operating Temperature Range Topr 0 ～+70 ℃ Storage Temperature Range Tstg -55 ～+150 ℃ Junction Temperature Tjmax +150 ℃ *1 Do not to exceed Pd. *2 REFIN voltage can not go up higher than 5VCC voltage.
Operating Conditions (Ta=25℃) Parameter Symbol MIN MAX Unit Input Voltage 1 VCC 4.7 13.2 V Input Voltage 2 VIN 3.3 13.2 V Input Voltage 5 REFIN 0.4 3.3 V Input Voltage 6 BUSEN 0 3.3 V BOOT Voltage BOOT 4.5 27 V BOOT-SW Voltage BOOT-SW 4.5 13.2 V CS Input Voltage CS1-/CS1+/CS2-/CS2+ 0.4 3.3 V DROOP Setting Resistor R DROOP 0 510k Ω IOUT Setting Resistor R IOUT 0 5M Ω RT Setting Resistor R RT 10k 510k Ω * This product should not be used in a radioactive environment. No. 09030EBT19

ELECTRICAL CHARACTERISTICS (Unless otherwise noted, Ta=25℃, VCC=5V, VIN=12V, REF=1.2V, RT=100kΩ) Parameter Symbol Standard Value Unit Condition MIN TYP MAX [Total Block] Vcc Bias Current Icc - 4 10 mA Vcc Standby Current I STB - 1.5 2.0 mA [5Vcc Block] 5Vcc Output Voltage 5Vcc 4.9 5 5.1 V 5Vcc Output Current I 5Vcc 20 - - mA [UVLO Block] VCC Threshold Voltage Vcc_UVLO 4.2 4.5 4.7 V Low  High VCC Hysteresis Voltage dVcc_UVLO 130 180 230 mV BUS EN Threshold Voltage BUS_UVLO 0.6 0.8 0.9 V Low  High BUS EN Hysteresis Voltage dBUS_UVLO 5 25 50 mV 5Vcc Threshold Voltage 5Vcc_UVLO 4.1 4.3 4.5 V Low  High 5Vcc Hysteresis Voltage dVcc_UVLO 100 150 200 mV [Reference Voltage Block] Internal Reference Voltage V REF 0.594 0.600 0.606 V REFIN=5VCC REFIN Offset Voltage V REFIN REF_IN-10m REF_IN REF_IN+10m V REFIN Input Voltage Range V REF 0.4 - 3.3 V REFIN Off Threshold Voltage V th REFIN 4.5 - 5Vcc V [EN Threshold] EN Low voltage Enlow GND - 0.3 V REFIN pin voltage input EN High voltage Enhigh 0.4 - 5Vcc V REFIN pin voltage input [Operating Frequency] Oscillation Frequency F OSC - 500 - kHz ON Time T ON 100 200 300 nsec MIN OFF Time T Offmin - 400 500 nsec [IREFOUT voltage Block] IREFOUT Voltage V IREFOUT 1.176 1.2 1.224 V IREFOUT Drive Current I IREFOUT 3 5 - mA [FET Gate Driver Block] UG high side ON Resistance R onHGH - 6 12 Ω UG low side ON Resistance R onHGL - 4 8 Ω LG high side ON Resistance R onLGH - 6 12 Ω LG high side ON Resistance R onLGL - 1 2 Ω [Regulator for VCC] Output Voltage VCCDRV 7.2 8 8.8 V Vcc DRV Drive Current I VCCDRV - 10 - mA [Droop Block] Load Line Slope SLOPE LL - 40 - nA DCR=5m Ω Load Line Slope Gain SLOPEG AIN 0.75 0.8 0.85 [OCP (Over Current Protection) Block] Over Current Threshold OCP TH 0.95 1 1.05 V [OVP (Over Voltage Protection) Block] Over Voltage Threshold 1 OVP TH1 VREFx1.25 VREFx1.3 VREFx1.35 V REFIN=5Vcc Over Voltage Threshold 2 OVP TH2 REFINx1.25 REFINx1.3 REFINx1.35 V [SCP (Short Circuit Protection) Block] SCP Start up Voltage 1 V SCP1 VREFx0.45 VREFx0.5 VREFx0.55 V REFIN=5Vcc SCP Start up Voltage 2 V SCP2 REFINx0.45 REFINx0.5 REFINx0.55 V SCP Delay Time T SCP - 1 - ms [POK Detection Block] POK Threshold 1 POK THLOW1 VREFx0.7 VREFx0.75 VREFx0.80 V REFIN=5Vcc POK Threshold 2 POK THLOW2 VREFINx0.70 VREFINx0.75 VREFINx0.80 V * Design Guarantee

Block Diagram 5VReg 8VReg Controller H3RegTM Controller Vo Monitor EN UVLO Control Logic TSD Driver Circuit Driver Circuit VIN_BUS=12V BUSEN VCCDRV VCC 5VCC REFIN/EN AGND DROOP RT IMAX/IOUT PGND FB IREFOUT /POK 0.6V CS1+ VCC BUSEN 5VCC EN OFF OFF Current Sense Vo Comp OFF Vcc Vcc Vcc Vcc BT1 UG1 SW1 LG1 BT2 UG2 SW2 LG2 CS2- CS1- CS2+ CS1+ SW1 SW2 BG OCP 4.5V SCP FB CS1- CS2+ CS2- Load Slope OVPVout Vout 3ms Soft Start BG BUFFER 1-/2-Phase Switch VIN_EXT REFIN or 0.78V REFIN or 0.3V

Pin Configuration
Pin Function Table PIN No. PIN Name PIN Function

1 UG1 High Side FET Gate Drive Pin 1

2 BT1 Supply Voltage for UG1

3 5VCC 5V Regulator Output (Iomin=20mA)

4 AGND Sense GND

5 BUSEN Bus Enable, Power Supply Monitoring Pin

6 CS1+ Positive Input of Current Sensing 1

7 CS1- Negative Input of Current Sensing 1

8 CS2- Negative Input of Current Sensing 2

9 CS2+ Positive Input of Current Sensing 2

10 IMAX / IOUT Current Limi t/Output Current Indication

11 RT Switching Frequency Setting

12 DROOP Droop Control of the Load Line

13 FB Output Voltage Feedback Pin

14 PGND Power GND Pin

15 REFIN/ EN External Reference Input and Enable Pin

16 INREFOUT/ POK Internal Reference Voltage Output and Power Good Output Pin

17 BT2 Supply Voltage for UG2

18 UG2 High Side FET Gate Drive Pin 2

19 SW2 Switch Node for Channel 2

20 LG2 Low Side FET Gate Drive Pin 2

21 VCCDRV Driver for External Linear Regulator

22 VCC Supply Voltage Pin

23 LG1 Low Side FET Gate Drive Pin 1

24 SW1 Switch Node for Channel 1

/EN FB 24 7 CS1- SW1 CS1+ PGND DROOP

Pin Descriptions ・UG1 (Pin 1), UG2 (Pin 18) These are the voltage supply pins to drive the Gate of t he high side FET. This voltage swings between BT1/2 and SW1/2. High-speed Gate driving for the high side FET is achieved due to the low on-resistance (3 ohm when UG is high, 2 ohm when UG is low) of the driver. ・BT1 (Pin 2), BT2 (Pin 17) These are the voltage supply pins to drive the high side FE T. The maximum absolute ratings are 35V (from GND) and 15V (from SW1/2). BT1/2 voltages swing between VIN+VCC and VCC during active operation. ・5VCC (Pin 3) This is the internal 5V regulator output pin. The minimum output current capability is 20mA. ・AGND (Pin 4) This is the ground pin for IC internal circuits. It is equivalent to FIN voltage. ・BUSEN (Pin 5) This pin monitors the supply input VIN through resistance divider. The POR rising threshold level is set to 0.8V. ・Cs1+ (Pin 6), Cs2+ (Pin 9), Cs1- (Pin 7), Cs2- (Pin 8) These pins are connected to both sides of the current sense resistance or I nductance (DCR sensing) to detect output current. ・IMAX / IOUT (Pin 10) This pin has multiple functions such as the output current indication, OCP (Over Current Protection) limit setting, and the output voltage load line adjustment pi n. BD95700MUV detects the voltage betwe en Cs+ pin and Cs- pin and limits the output current (OCP) using resistance connected between IMAX/IOUT/Droop and GND. A very low current sense resistor or inductor DCR can also be used for this platform. ・RT (Pin 11) This is the pin to adjust the switching frequency based on the resistance value. The frequency range is f=50KHz - 1000KHz. ・DROOP (Pin 12) This pin can be used for the load slope setting of the output voltage. ・FB (Pin 13) This is the output voltage feedback pin. It is possible to adjust the output voltage using external resistor divider based on the equation, REFIN≒FB. However, FB becomes 0.6V when REFIN=5VCC. ・PGND (Pin 14) This is the power ground pin connected to the source of the low side FET. ・REFIN/EN (Pin 15) This is an internal or external refer ence voltage selectable pin. If REFIN is pulled up to 5V CC, internal reference voltage very convenient for synchronizing external voltag e supply. The IC controls the output voltage (REFIN ≒FB). And also this pin is used for enable function. If REFIN is less than 0.3V, the whole circuit is shut down. ・IREFOUT/POK (Pin 16) This pin is internal reference voltage output and power good output. During start up, this pin voltage is low. This pin becomes high impedance when FB pin voltage goes beyond 75% of specified FB voltage after soft start ends. ・SW1 (Pin 24), SW2 (Pin 19) These are the source pins for the high side FET. The maximum absolute ratings are 15V (from GND). SW1/2 voltage swings between VIN and GND. ・LG1 (Pin 23), LG2 (Pin 20) This is the voltage supply to drive the Gate of the low side FET. This voltage swings between VCC and PGND. High-speed Gate driving for the low side FET is achieved due to the low on-resistance (2 ohm when LG1/2 is high, 0.5 ohm when LG1/2 is low) of the driver. ・VCCDRV (Pin 21) This is the supply voltage pin to drive an external NPN/N_MOSFET for 8V linear regulator. The maximum absolute rating is 15V. VCC (Pin 22) This is the power supply pin for IC internal circuit and driv er circuit. The maximum circuit current is 10mA. There are 3 usages depending on a supply voltage for driver (5V, 8V, and 12V). It is recommended that a 0.1uF bypass capacitor be put in this pin to avoid voltage fluctuation when the VCC is supplied from 5V or 12V rail directly from the actual platforms. If 8V is used for the supply voltage, this pin is connected to the LD O output. In this case, it is recommended that at least 10uF ceramic capacitor be input to avoid oscillation.

Explanation of Operation The BD95700MUV is a synchronous buck regulator controller incorporating ROHM’s proprietary H3RegTM CONTROLLA control system. When VOUT drops due to a rapid load change, the system quickly restores VOUT by extending the TON time interval. Thus, it serves to improve the regulator’s transient response. H 3RegTM control (Normal operation) Phase switch function FB REF UG1 UG2 TON= REF VIN × 1 f [sec]・・・(1) When FB pin voltage (Vout) falls to a threshold voltage REF, the drop is detected, activating the H 3RegTMCONTROLLA system. UG output is determined with the formula above. LG outputs until the status of VOUT is lower than REF after the status of UG is off. Note: REF is an internal or external reference voltage. I f the internal reference is utiliz ed, REF=0.6V. If the external reference is utilized, REF = REFIN pin voltage. The IC normally operates in 2-phase mode, but when the input voltage on the VIN_EXT pin is cut off, the IC latches into single-phase mode. The IC will remain latched in this mode (even if a voltage is reintroduced onto the VIN_EXT pin) until the voltage is cycled on any of the EN, VCC or BUSEN pins. It will then re turn to two-phase mode. VIN_EXT BUSEN VOUT REF UG1 UG2 2-phase Single-phase 2-phase T2 T Stand-by

Timing Chart ・Soft Start Function ・Output Over Voltage Protection ・Short Circuit Protection with Timer Latch REFIN SS VOUT IIN TSS Soft start time (TSS) ≒ 3msec (fixed) Incoming current IIN= Co×VOUT 3msec [A] ・・・(2) FB UG LG REF x 1.3 Switching When the FB pin voltage becomes REF x 1.3, the output over voltage protection is activated and Low side MOSFET becomes ON to lower the output voltage (LG=High, UG=Low). When the output voltage goes back down to the specified level, the whole circuit becomes the normal operation mode. Soft start is activated when REF hits its enabling threshold (VCC, 5VCC, and BUSEN have to be beyond their own UVLO thresholds). Current control takes effec t at startup, enabling an output voltage “ramping start.” Soft start timing and incoming current are calculated with formulas (2) and below. (Co: Output capacitor) FB SCP REFIN/UVLO TSCP REF x 0.5 Short Circuit Protection kicks in when output falls to o r below REF x 0.5. When the programmed time period elapses, output is latched O FF to prevent destruction o f the IC. Output voltage can be restored either by reconnecting the REFIN pin (ON  OFF  ON) o r disabling UVLO (HIGH  Low  High).

External Component Selection 1. Inductor (L) selection ※Passing a current larger than the inductor’s rated current will cause magnetic saturation in the inductor and decrease system efficiency. In selecting the inductor, be sure to allow enough margin to assure that peak current does not exceed the inductor rated current value. ※To minimize possible inductor damage and maximize efficiency, choose a inductor with a low (DCR, ACR) resistance. 2. Output Capacitor (C O) Selection Please give due consideration to the conditions in formula (7) below for output capacity, bearing in mind that output rise time must be established within the soft start time frame. Note: Improper capacitor may cause startup malfunctions. 3. Input Capacitor (Cin) Selection A low ESR capacitor is recommended to reduce ESR loss and maximize efficiency. ΔIL= (VIN-VOUT) x VOUT L x VIN x f [A]・・・(3) ΔIL=0.3×IOUTmax/2. [A]・・・(4) (VIN-VOUT) x VOUT ΔIL x VIN x f [H]・・・(5) At least 20mV ripple voltage of the FB voltage is recommended by taking the equivalent series resistance and inductance into account. Output ripple voltage is determined as in formula (6) below. ΔVOUT=ΔIL×ESR+ESL×ΔIL/T ON・・・(6) Co≦ 3msec×(Limit-IOUT/2) VOUT ・・・(7) Input Capacitor IRMS= VOUT(VIN-VOUT) VIN [A]・・・(8) IOUT ΔIL VIN IL L Co VOUT Output Ripple Current VIN L Co VOUT Cin VIN L Co VOUT ESR Output Capacitor ESL The inductor value is a major influence on the output ripple current. As formula (3) below indicates, the greater the inductor or the switching frequency, the lower the ripple current. The proper output ripple current setting is about 30% of maximum output current. (ΔIL: output ripple current; f: switch frequency) (ΔIL: Output ripple current; ESR: CO equivalent series resistance, ESL:equivalent series inductance) ※ In selecting a capacitor, make sure the capacitor rating allows sufficient margin relative to output voltage. Note that a lower ESR can minimize output ripple voltage. Limit: Current Limit Value The input capacitor selected must have low enough ESR resistance to fully support large ripple output, in order to prevent extreme over current. The formula for ripple current IRMS is given in (8) below. Where VIN=2×VOUT,I RMS= x 2 IOUT

www.rohm.com 2009.04 - Rev.B © 2009 ROHM Co., Ltd. All rights reserved. 4.MOSFET Selection 5. OCP Setting Resistance 6. DROOP setting Resistance Pmain=P RON+PGATE+PTRAN Psyn=PRON+PGATE VOUT 4 x VIN x R ON x IOUT2 + Ciss x f x VDD+ VIN2 x Crss x IOUTx f 2 x IDRIVE VIN-VOUT 4 x VIN ×RON×IOUT2+Ciss×f×VDD VIN L Co VOUT synchronous switch main switch = ・・・(9) = ・・・(10) Loss on the main MOSFET (Ron: On-resistance of FET; Ciss: FET gate capacity; f: Switching frequency Crss: FET inverse transfer function; I DRIVE: Gate peak current) Loss on the synchronous MOSFET IIMAX = OCP threshold is determined by external OCP setting resistance (RIMAX) and IMAX calculated below. If V IMAX meet the following condition, OCP becomes activated. VCS1+―VCS1- 250kΩ VIMAX≦IIMAX×RIMAX (VIMAX: OCP Setting Voltage, VIMAX=1V) 250kΩ Vcs2+―Vcs2- The slope of the DROOP (VDROOP) can be set by the voltage drop caused by I DROOP and RDROOP. The equation is as follows. L r×C RL= ) (RL: the DCR value of coil) (VCS1+―VCS1-=IL× , RL ・・・(11) ・・・(12) VOUT VIN_BUS L Co OCP RL r C VIN_EXT L Co RL r C CS1+ CS1- CS2+ CS2- RIMAX IIMAX IL IOUT IMAX PIN VIMAX r r VIN_BUS L Co RL r C VIN_EXT L Co RL r C CS1+ CS1- CS2+ CS2- RDROOP IDROOP DROOP PIN IL IL r r VOUT IOUT IDROOP= 250ｋΩ Vcs1+ – Vcs1 – 250ｋΩ Vcs2+ – Vcs2 – L ( Vcs1+ – Vcs1 – = IL× RL, RL= r c , IOUT ≒ 2IL ) VOUT=REFIN – RDROOP × I DROOP

www.rohm.com 2009.04 - Rev.B © 2009 ROHM Co., Ltd. All rights reserved. 7. Setting output voltage The output voltage is REFIN = VOUT when VOUT is tied to the FB directly. The range of VOUT is 0.4V ~ 3.3V. R E F I N The output voltage is calculated as follows when resistor divider network is connected between the FB and VOUT. REFIN set 5Vcc. The range of Vout is 0.6～3.3V 8. Frequency Setting Resistance The Frequency at steady state is determined by resistance value connected to RT pin. But actual SW rising time and falling time are factored in due to the external MOSFET gate capacity or switching speed. As a result, On-Time increases. The frequency is determined by the following formula. Consequently, total frequency becomes lower than the formula above. On-Time increases by Dead Time on the condition of zero cross point of inductor current. And also switching frequency increases as the output current increases due to the fixed On-Time and the influence of conduction loss. It is recommended that switching frequency be checked on large current condition (at the point where the inductor current doesn’t become reversed from Vout). FB H3RegTM CONTROLLA S RQ Driver Circuit VIN VOUT BUSEN R1+R2 f [ H z ] = × 10-12×REF×RRT VIN ・・・(14) H3RegTM CONTROLLA S RQ Driver Circuit VIN VOUT BUSEN FB 0.6V VOUT Ton Ton = + 1 7 0 ×10-9 2×BUSEN Ton : ON TIME

www.rohm.com 2009.04 - Rev.B © 2009 ROHM Co., Ltd. All rights reserved. 9. UVLO BD95700MUV has function to detect input UVLO voltage in each VCC, 5VCC, and BUSEN for output voltage to start up. If all these inputs go beyond their own UVLO threshold voltage, the soft start function kicks in. These threshold voltages have their own hysteresis voltage to avoid faulty operation caused by input noises and glitchs. 10. Current Phase Balance BD95700MUV keeps the current phase balance between coil current IL1 and IL2 by controlling the status ΔVcs1 = ΔVcs2.And for that, it is needed to meet the reference formula below. For detecting the value of ΔVcs1 or ΔVcs2 exactly, it is also needed to meet the formula below. RL1 = VCC Hysteresis Window HysVCC Hys5VCC HysBUSEN Tss Tss Tss Tss Output OFF VCCUVLO BUSENUVLOVCCUVLO5VCCUVLOVCCUVLO Output OFF 5VCC BUSEN Output OFF Output OFF Output OFF VOUT （Tss: Soft Start Time） r1×C1 ・・・(16) VOUT VIN_BUS L1 RL1 r1 C1 VIN_EXT L2 RL2 r2 C2 CS2+ CS2- IL1 r1 r2 IL2 CS1+ CS1- ΔVcs2 ΔVcs1 Co Co SW r I I Vcs+ Vcs- However, Vcs+ and Vcs- are fed a small current from current sense amplifier, and this current causes a slight differ ence in the actual value obtained from formula (16). Refer to formula (17) below: This difference can be compensated for by adding resistor r2. ⊿Vcs=(⊿V- I x r) + I x r2・・・(18) To eliminate the difference, choose r2 to have the same value as r. ⊿Vcs

www.rohm.com 2009.04 - Rev.B © 2009 ROHM Co., Ltd. All rights reserved. 11. Vout small Ripple Voltage VIN R1 FB VOUT SW C=56pF Resistor R3 and capacitor C (=56pF)are needed to stabilize switching operation when Vout ripple voltage is less than 20mV. The values of R1, R2 and R3 are determined as in the formula (20) below

Reference Data Fig1.Sequence VOUT REFIN BUSEN VCC Fig2.Sequence Fig3.Sequence Fig4.Sequence Fig5.Sequence Fig6.Sequence Fig7.Load Transient Response (VCC=12V) Fig8.Load Transient Response (VCC=12V) Fig9.Load Transient Response (VCC=5V) Fig10.Load Transient Response (VCC=5V) Fig11.Load Transient Response (VCC=8V) Fig12.Load Transient Response (VCC=8V) VOUT(100mV/div) IOUT IOUT IOUT IOUT IOUT IOUT (20A/div) (20A/div) (20A/div) (20A/div) (20A/div) (20A/div) HG1,HG2(10V/div） HG1,HG2(10V/div） HG1,HG2(10V/div） HG1,HG2(10V/div） HG1,HG2(10V/div） HG1,HG2(10V/div） VOUT(100mV/div) VOUT(100mV/div) VOUT(100mV/div) VOUT(100mV/div) VOUT(100mV/div) VOUT REFIN BUSEN VCC VOUT REFIN BUSEN VCC VOUT REFIN BUSEN VCC VOUT REFIN BUSEN VCC VOUT REFIN BUSEN VCC

Reference Data 250 270 290 310 330 350 370 390 0 1 02 03 04 05 0 Iout[A] f[kHz] Fig19.Reference Function Fig13.Continuos MODE (VCC=5V) Fig14.Continuos MODE (VCC=8V) Fig15.Continuos MODE (VCC=12V) Fig16.SCP Function Fig17.SCP Function Fig18.Soft Start REFIN VOUT SW1, SW2 VOUT SW1, SW2 LG1 VOUT SW1, SW2 LG1 VOUT SW1, SW2 LG1 VOUT SW1 REFIN VOUT REFIN 1msec IOUT VOUT SW1 BUSEN SW1 Fig20.Frequency range functionally f = 400kHz 100 1 10 100 Iout[A] efficiency[%] Fig21.Efficiency Fig22.Current balance (Io=20A) Fig23.Current balance (Io=30A) Fig24.Current balance (Io=40A) 8V DRIVE 5V DRIVE 12V DRIVE IL1, IL2 SW1, SW2 IL1, IL2 SW1, SW2 IL1, IL2 SW1, SW2

www.rohm.com 2009.04 - Rev.B © 2009 ROHM Co., Ltd. All rights reserved. ■■BD95700MUV Evaluation Board Circuit with 5V Drive (VCC=5V input , VIN=3.3~12V input , REFIN=5VCC, Vout=1.2V ) ■■BD95700MUV Evaluation Board Parts List Part No Value Company Part name Part No Value Company Part name U1 ROHM BD95700MUV C17 - - - M2 infineon BSC119N03SG C18 1uF KYOCERA CM05B105K06A M3 infineon BSC119N03SG C19 10uF KYOCERA CT32X5R106K25A M4 Infineon BSC032N03SG C21 1uF KYOCERA CM105B105K16A M5 Infineon BSC032N03SG C23 0.1uF KYOCERA CM105X5R224K25A M6 Infineon BSC119N03SG C24 0.1uF KYOCERA CM105X5R224K25A M7 Infineon BSC119N03SG C25 10uF KYOCERA CM316X5R106M10A M8 Infineon BSC032N03SG C27 10uF KYOCERA CM316X5R106M06A M9 infineon BSC032N03SG C28 10uF KYOCERA CT32X5R106K25A C2 10uF KYOCERA CT32X5R106K25A C31 10uF KYOCERA CT32X5R106K25A C3 1uF KYOCERA CM05B105K16A R2 300k Ω ROHM MCR03 C5 1uF KYOCERA CM105B105K16A R3 30k Ω ROHM MCR03 C7 10uF KYOCERA CM316X5R106M06A R7 0 Ω ROHM MCR03 C8 10uF KYOCERA CM21B106M06A R8 240k Ω ROHM MCR03 C9 10uF KYOCERA CM21B106M06A R9 3.6M Ω ROHM MCR03 C10 10uF KYOCERA CM21B106M06A R15 10k Ω ROHM MCR03 C11 10uF KYOCERA CM21B106M06A R16 4.87k Ω ROHM MCR03 C12 - - - R17 4.87k Ω ROHM MCR03 C13 820uF SANYO NC641-643 R18 10k Ω ROHM MCR03 C14 820uF SANYO NC641-643 R20 4.87k Ω ROHM MCR03 C15 820uF SANYO NC641-643 R21 4.87k Ω ROHM MCR03 C16 - - - L1 0.47uH Cyntec PCMB105T-R47MS L2 0.47uH Cyntec PCMB105T-R47MS BUSEN REFIN AGND RT BOOT1 PH1 LG1 BOOT2 PH2 LG2 IOUT FB AGND CSN2 CSN1 C27 CSP1 R16 R17 VIN R2 BUSEN C25 C18 DROOP 5VCC VCC VCCDRV PGND VCC VCC5 DROOP RT IOUT PGND REFOUT_POK POK SW1 C23 C24 UG2 REFIN AGND CSP2 C14 PGND PGND PGND UG1 C5 C15 C16 PGND PGND PGND PGND PGND C21 C19 PGND PGND M5M4 M7M6 M9M8 AGND PGND AGND FB PGND VOUT BD95700MUV_VQFN24 HS R15 R18 3.3V ~ 12V PGND C13 PGND C17 PGND PGND PGND C10 PGND C11 PGND C12 PGND 100kΩ C28 PGND 100kΩ C31 PGND 56pF R21 R20

www.rohm.com 2009.04 - Rev.B © 2009 ROHM Co., Ltd. All rights reserved. ■■BD95700MUV Evaluation Board Circuit with 8V Drive (VIN=10.8~13.2V input , REFIN=5VCC, Vout=1.2V ) ■■BD95700MUV Evaluation Board Parts List Part No Value Company Part name Part No Value Company Part name U1 ROHM BD95700MUV C18 1uF KYOCERA CM05B105K06A M2 infineon BSC119N03SG C19 10uF KYOCERA CT32X5R106K25A M3 infineon BSC119N03SG C21 1uF KYOCERA CM105B105K16A M4 Infineon BSC032N03SG C23 0.1uF KYOCERA CM105X5R224K25A M5 Infineon BSC032N03SG C24 0.1uF KYOCERA CM105X5R224K25A M6 Infineon BSC119N03SG C25 10uF KYOCERA CM316X5R106M10A M7 Infineon BSC119N03SG C27 10uF KYOCERA CM316X5R106M06A M8 Infineon BSC032N03SG C28 10uF KYOCERA CT32X5R106K25A M9 infineon BSC032N03SG C31 10uF KYOCERA CT32X5R106K25A C2 10uF KYOCERA CT32X5R106K25A R1 10k Ω ROHM MCR03 C3 1uF KYOCERA CM05B105K16A R2 300k Ω ROHM MCR03 C5 1uF KYOCERA CM105B105K16A R3 30k Ω ROHM MCR03 C7 10uF KYOCERA CM316X5R106M06A R7 0 Ω ROHM MCR03 C8 10uF KYOCERA CM21B106M06A R8 240k Ω ROHM MCR03 C9 10uF KYOCERA CM21B106M06A R9 3.6M Ω ROHM MCR03 C10 10uF KYOCERA CM21B106M06A R15 10k Ω ROHM MCR03 C11 10uF KYOCERA CM21B106M06A R16 4.87k Ω ROHM MCR03 C12 - - - R17 4.87k Ω ROHM MCR03 C13 820uF SANYO NC641-643 R18 10k Ω ROHM MCR03 C14 820uF SANYO NC641-643 R20 4.87k Ω ROHM MCR03 C15 820uF SANYO NC641-643 R21 4.87k Ω ROHM MCR03 C16 - - - L1 0.47uH Cyntec PCMB105T-R47MS C17 - - - L2 0.47uH Cyntec PCMB105T-R47MS BUSEN REFIN AGND RT BOOT1 PH1 LG1 BOOT2 PH2 LG2 IOUT FB AGND CSN2 CSN1 C27 CSP1 R16 R17 VIN R1 BUSEN C25 C18 DROOP 5VCC VCC VCCDRV PGND VCC VCC5 DROOP RT IOUT PGND REFOUT_POK POK SW1 C23 C24 UG2 REFIN AGND CSP2 C14 PGND PGND PGND UG1 C5 C15 C16 PGND PGND PGND PGND PGND C21 C19 PGND PGND M5M4 M7M6 M9M8 AGND PGND AGND FB PGND VOUT BD95700MUV_VQFN24 HS R15 R18 3.3V ~ 12V PGND C13 PGND C17 PGND PGND PGND C10 PGND C11 PGND C12 PGND 100kΩ C28 PGND 100kΩ C31 PGND 220pF R21 R20

www.rohm.com 2009.04 - Rev.B © 2009 ROHM Co., Ltd. All rights reserved. ■■BD95700MUV Evaluation Board Circuit with 12V Drive ( VIN=12V input, VCC=12V input, REFIN=5VCC, Vout=1.2V ) ■■BD95700MUV Evaluation Board Parts List Part No Value Company Part name Part No Value Company Part name U1 ROHM BD95700MUV C17 - - - M2 infineon BSC119N03SG C18 1uF KYOCERA CM05B105K06A M3 infineon BSC119N03SG C19 10uF KYOCERA CT32X5R106K25A M4 Infineon BSC032N03SG C21 1uF KYOCERA CM105B105K16A M5 Infineon BSC032N03SG C23 0.1uF KYOCERA CM105X5R224K25A M6 Infineon BSC119N03SG C24 0.1uF KYOCERA CM105X5R224K25A M7 Infineon BSC119N03SG C25 10uF KYOCERA CM316X5R106M10A M8 Infineon BSC032N03SG C27 10uF KYOCERA CM316X5R106M06A M9 infineon BSC032N03SG C28 10uF KYOCERA CT32X5R106K25A C2 10uF KYOCERA CT32X5R106K25A C31 10uF KYOCERA CT32X5R106K25A C3 1uF KYOCERA CM05B105K16A R2 300k Ω ROHM MCR03 C5 1uF KYOCERA CM105B105K16A R3 30k Ω ROHM MCR03 C7 10uF KYOCERA CM316X5R106M06A R7 0 Ω ROHM MCR03 C8 10uF KYOCERA CM21B106M06A R8 240k Ω ROHM MCR03 C9 10uF KYOCERA CM21B106M06A R9 3.6M Ω ROHM MCR03 C10 10uF KYOCERA CM21B106M06A R15 10k Ω ROHM MCR03 C11 10uF KYOCERA CM21B106M06A R16 4.87k Ω ROHM MCR03 C12 - - - R17 4.87k Ω ROHM MCR03 C13 820uF SANYO NC641-643 R18 10k Ω ROHM MCR03 C14 820uF SANYO NC641-643 R20 4.87k Ω ROHM MCR03 C15 820uF SANYO NC641-643 R21 4.87k Ω ROHM MCR03 C16 - - - L1 0.47uH Cyntec PCMB105T-R47MS L2 0.47uH Cyntec PCMB105T-R47MS BUSEN REFIN AGND RT BOOT1 PH1 LG1 BOOT2 PH2 LG2 IOUT FB AGND CSN2 CSN1 C27 CSP1 R16 R17 VIN R2 BUSEN C25 C18 DROOP 5VCC VCC VCCDRV PGND VCC VCC5 DROOP RT IOUT PGND REFOUT_POK POK SW1 C23 C24 UG2 REFIN AGND CSP2 C14 PGND PGND PGND UG1 C5 C15 C16 PGND PGND PGND PGND PGND C21 C19 PGND PGND M5M4 M7M6 M9M8 AGND PGND AGND FB PGND VOUT BD95700MUV_VQFN24 HS R15 R18 12V PGND C13 PGND C17 PGND PGND PGND C10 PGND C11 PGND C12 PGND 100kΩ 220pF C28 PGND 100kΩ C31 PGND R21 R20

Operation Notes 1. Absolute maximum ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. 2. Connecting the power supply connector backward Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines. An external direction diode can be added. 3. Power supply lines Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line, separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply terminals to ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the circuit, not that capacitance characteristic values are reduced at low temperatures. 4. GND voltage The potential of GND pin must be minimum potential in all operating conditions. 5. Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 6. Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if pins are shorted together. 7. Actions in strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. 8. ASO When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO. 9. Thermal shutdown circuit The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit is assumed. TSD on temperature [°C] (typ.) Hy steresis temperature [°C] (typ.) BD95700MUV 175 15 10. Testing on application boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC.

www.rohm.com 2009.04 - Rev.B © 2009 ROHM Co., Ltd. All rights reserved. 11. Regarding input pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, the relation between each potential is as follows: When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used. 12. Ground Wiring Pattern When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either.

Power Dissipation Resistor Transistor (NPN) N N N P+ P + P P substrate GND Parasitic element Pin A N N P+ P+ P P substrate GND Parasitic element Pin B C B E N GND Pin A Parasitic element Pin B Other adjacent elements E B C GND Parasitic element Fig.25 Thermal derating curve (VQFN020V4040) Power dissipation:Pd [W] Ambient temperature:Ta [℃] 0 25 50 75 100 125 150 2.0 3.0 4.0 ②1.21W ①3.56W 1.0 ③0.70W ④0.34W 4 layers (Copper foil area : 5505mm copper foil in each layers. θj-a=35.1℃/W 4 layers (Copper foil area : 10.29m copper foil in each layers. θj-a=103.3℃/W ③ 4 layers (Copper foil area : 10.29m θj-a=178.6℃/W ④IC only. θj-a=367.6℃/W 105

Type Designations (Selections) for Ordering B D 9 5 7 0 0 M U V - E 2 Part No. Part No. Package MUV : VQFN024V4040 Packaging and forming specification E2: Embossed tape and reel (Unit : mm) VQFN024V4040 0.08 S S 1219 1318 0.4±0.1 0.02+0.03-0.02 1PIN MARK 2.4±0.1 C0.2 0.5 4.0±0.1 0.75 2.4±0.1 4.0±0.1 1.0MAX (0.22) 0.25+0.05 -0.04 ∗ Order quantity needs to be multiple of the minimum quantity. <Tape and Reel information> Embossed carrier tapeTape Quantity Direction of feed The direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs Direction of feed Reel 1pin

R0039Awww.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. Notice ROHM Customer Support System http://www.rohm.com/contact/ Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. Notes N o c o p y i n g o r r e p r o d u c t i o n o f t h i s d o c u m e n t , i n p a rt o r i n w h o l e , i s p e r m i t t e d w i t h o u t t h e consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, commu- nication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. T h e P r o d u c t s a r e n o t d e s i g n e d o r m a n u f a c t u r e d t o b e u s e d w i t h a n y e q u i p m e n t , d e v i c e o r system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.

Product Information

BD95700MUV specifications and overview.

Summary

2phase Switching Regulator Controllers for Graphic Card

Description

2phase Switching Regulator Controllers for Graphic Card

Source title BD95700MUV Datasheet(PDF) - Rohm

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