BD95601MUV-LB

BD95601MUV-LB ROHM | Alldatasheet

Document overview

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Technical content

Features

 Long Time Support Product for Industrial Applications.  Adjustable Light Load and Selectable Continuous Modes.  Multifunctional Protection Circuits. -Thermal Shut down (TSD). -Under Voltage Lock Out (UVLO). -Over Current Protection (OCP). -Over Voltage Protection (OVP). -Short Circuit Protection (SCP).  Adjustable Soft Start.  Power Good Output.  200kHz to 500kHz Switching Frequency. Key Specifications  VIN Input Voltage Range： 4.5V to 25V  VCC Input Voltage Range： 4.5V to 5.5V  VDD Input Voltage Range： 4.5V to 5.5V  Output Voltage Range： 0.75V to 2.0V  Standby Current： 0μA (Typ)  Operating Temperature Range： -10°C to +85°C Package W(Typ) x D(Typ) x H(Max) VQFN020V4040 4.00mm x 4.00mm x 1.00mm

Applications

 FPGA, POL application.  Mobile PC, Desktop PC, LCD-TV, Digital Components etc.  Industrial Equipment. Typical Application Circuit Figure 1. Application Circuit

TSZ02201-0A1A0A900210-1-2 © 2013 ROHM Co., Ltd. All rights reserved. Figure 2. Pin Configuration controlled until the SS input reaches the reference voltage of 0.75V.

2 EN/SLLM

Enable and Mode Selection Input. Voltage on this input selects the operating mode. 3 ILIM Coil Current Limit input. A 100KΩ resistor should be connected between this input and ground. 4 VCC IC Internal Circuits Power input. 5 FB Output Voltage Sense input. A resistor divider to this input sets the output voltage. 6 VOUT Output Voltage Monitor input. 7 FREQ Current Sense Amplifier Output. 9 Is- Input Current Sense Amplifier input. FREQ pin is output. reaches the specified voltage level (setting at ILIM pin), the switching is turned OFF. 11 PGND Ground pin for Low-side FET driver. MOS (3Ω when LG is high, 0.5Ω when LG is low.).

13 VDD

This is the power supply pin to drive the Low-side FET. during the FET on/off transition. 14 SW This is the ground pin for High-side FET. The maximum absolute rating is 30V from ground. output MOS (3Ω when HG is high, 2Ω when HG is low).

16 BOOT

This is the power supply pin to drive the High-side FET. The maximum absolute ratings are 35V from ground and 7V from SW. The switching waveform sweeps from (VIN+VDD) to VDD by BOOT operation. voltage. It is recommended to connect 1kΩ / 0.1μF CR filter.

18 OUT

capacitor to ground in series. It is recommended that a 0.01μF capacitor be established in normal operation.

19 PGOOD

This is an open drain pin and therefore requires an external pull-up. 20 GND Ground pin of control circuit. It is the same as FIN potential. FIN FIN Backside thermal pad. Please connect to the Ground.

TSZ02201-0A1A0A900210-1-2 © 2013 ROHM Co., Ltd. All rights reserved. Figure 3. Block Diagram

TSZ02201-0A1A0A900210-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 30.May.2017 Rev.004 www.rohm.co.jp TSZ22111・15・001 BD95601MUV-LB Absolute Maximum Ratings (Ta = 25°C) Parameter Symbol Rating Unit Condition Input Voltage 1 VCC 7 V Note 1, Note 2 Input Voltage 2 VDD 7 V Note 1, Note 2 Input Voltage 3 VIN 28 V Note 1, Note 2 BOOT Voltage BOOT 35 V Note 1, Note 2 BOOT-SW Voltage BOOT-SW 7 V Note 1, Note 2 HG-SW Voltage HG-SW 7 V Note 1, Note 2 LG Voltage LG VDD V Output Voltage VOUT/Is+/Is- VCC V EN Input Voltage EN 7 V Note 1 Power Dissipation 1 Pd1 0.34 W Note 3 Power Dissipation 2 Pd2 0.70 W Note 4 Power Dissipation 3 Pd3 2.20 W Note 5 Power Dissipation 4 Pd4 3.56 W Note 6 Operating Temperature Range Topr -10 to +85 °C Storage Temperature Range Tstg -55 to +150 °C Maximum Junction Temperature Tjmax +150 °C (Note 1) Not to exceed Pd. (Note 2) Instantaneous surge voltage, back electromotive force and voltage under less than 10% duty cycle . (Note 3) Derating in done 2.7 mW/°C for operating above Ta ≥ 25°C (when don’t mounted on a heat radiation board). Surface heat dissipation copper foil:10.29mm2. (Note 5) Derating in done 17.6 mW/°C for operating above Ta ≥ 25°C (Mount on 4-layer 74.2mm x 74.2mm x 1.6mm board Two sides heat dissipation copperfoil:10.29mm2. 2 or 3-layer : heat dissipation copper foil : 5505mm2). (Note 6) Derating in done 28.5 mW/°C for operating above Ta ≥ 25°C (Mount on 4-layer 74.2mm x 74.2mm x 1.6mm board) All layers heat dissipation copper foil:5505mm2. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions (Ta= 25°C) Parameter Symbol Min Typ Max Unit Condition Input Voltage 1 VCC 4.5 - 5.5 V Input Voltage 2 VDD 4.5 - 5.5 V Input Voltage 3 VIN 4.5 - 25 V BOOT Voltage BOOT 4.5 - 30 V SW Voltage SW -0.7 - 25 V BOOT-SW Voltage BOOT-SW 4.5 - 5.5 V EN Input Voltage EN 0 - 5.5 V Is Input Voltage IS+/IS- 0.7 - 2.7 V MIN ON Time TONMIN - - 80 ns

TSZ02201-0A1A0A900210-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 30.May.2017 Rev.004 www.rohm.co.jp TSZ22111・15・001 BD95601MUV-LB

Electrical Characteristics

(Unless otherwise specified VCC=5V VDD=5V EN=3V VIN=12V VOUT=1.05V RFS=36kΩ Ta=25°C) Parameter Symbol Min Typ Max Unit Conditions Whole Device VCC Bias Current ICC - 1500 1800 µA VCC Stand-by Current ICCSTB - 0 10 µA EN= 0V VIN Bias Current IIN - 30 80 µA VIN Stand-by Current IINSTB - 0 10 µA EN= 0V EN Low Voltage ENLOW GND - 0.8 V EN High Voltage (Forced Continuous Mode) ENHIGH_CON 2.3 - 3.8 V EN High Voltage (SLLM Mode) ENHIGH_SLLM 4.5 - 5.5 V EN Bias Current IEN - 15 25 µA EN= 3V Under Voltage Locked Out VCC Threshold Voltage VCC_UVLO 3.7 4.0 4.2 V VCC:Sweep up VCC Hysteresis Voltage dVCC_ UVLO 100 160 220 mV VCC:Sweep down H3RegTM Control ON Time TON 194 219 244 ns MAX ON Time TONMAX - 3.5 - µs MIN OFF Time TOFFMIN - 490 700 ns FET Driver HG High-side ON Resistance HGHON - 3.0 6.0 Ω HG Low-side ON Resistance HGLON - 2.0 4.0 Ω LG High-side ON Resistance LGHON - 3.0 6.0 Ω LG Low-side ON Resistance LGLON - 0.5 1.0 Ω SCP SCP Start-up Voltage VSCP 0.345 0.420 0.495 V SCP Delay Time TSCP - 2.5 - ms OVP FB Threshold Voltage VOVP 0.825 0.900 0.975 V Soft Start Charge Current ISS 1 2 3 µA Stand-by Voltage VSS_STB - - 50 mV Current Limit Setting Current IILIM - 10 - µA Current Limit Threshold Voltage VILIM 75 100 120 mV RILIM= 100kΩ Output Voltage Sense Output Reference Voltage 1 REF1 0.743 0.750 0.757 V Is+ Input Voltage IS+ -1 0 1 µA LS+= 1.05V Is- Input Voltage IS- -1 0 1 µA LS-= 1.05V POWER GOOD FB Power Good Voltage VPGOOD 0.38 0.47 0.56 V Discharge ON Resistance RONPGOOD - 50 150 Ω Diode for BOOT VF Voltage VF 0.4 0.5 0.6 V IF= 1mA

TSZ02201-0A1A0A900210-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 30.May.2017 Rev.004 www.rohm.co.jp TSZ22111・15・001 BD95601MUV-LB Description of Blocks BD95601MUV-LB is a single channel synchronous buck regulator using H3RegTM, Rohm’s latest constant on-time controller technology. Fast load response is achieved by controlling the output voltage using a comparator without relying on the switching frequency. When VOUT drops due to a rapid load change, the system quickly restores VOUT by extending the tON time interval. Thus, it serves to improve the regulator’s transient response. Activating the light load mode further increases efficiency by using Simple Light Load Mode (SLLM) control. H3RegTM Control (Normal operation) (VOUT drops due to a rapid load change) FB VOUT/VIN Circuit Transient Circuit Driver HG SW LG VIN VOUT FB REF HG LG HG output on-time is determined by the formula (1). When HG is off, LG is on until the output voltage becomes FB= REF. When FB falls to a reference voltage (REF), the drop is detected, activating the H3RegTM control system FB REF HG Io LG tON+α When VOUT drops due to a rapid load change, and the voltage remains below the output setting following the programmed tON time, the system quickly restores VOUT by extending the tON time, thus improving the transient response. Once VOUT is restored, the controller continues normal operation. tON= VOUT VIN x 1 f [sec]・・・(1) Comparator for Output voltage control Internal Reference Voltage REF

TSZ02201-0A1A0A900210-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 30.May.2017 Rev.004 www.rohm.co.jp TSZ22111・15・001 BD95601MUV-LB Description of Blocks - continued (Light Load Control) In SLLM (EN/SLLM = 4.5V to 5.5V), SLLM function will operate when the LG pin is off and the coil current is lower than 0A (the current goes from VOUT to SW). When the FB input is lower than REF voltage again, HG will be enabled once again. FB REF HG LG LOAD COUT *Attention: To affect the rapid transient response, the H3RegTM control monitors the current from the output capacitor to the load using the ESR of the output capacitor Do not use ceramic capacitors on COUT side of power supply. Ceramic bypass capacitors can be used near the individual loads if desired.

TSZ02201-0A1A0A900210-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 30.May.2017 Rev.004 www.rohm.co.jp TSZ22111・15・001 BD95601MUV-LB Timing Chart Soft-start function Timer Latch Type Short Circuit Protection Over Current Voltage Protection CSS (pF) Soft start time(ms) 12000 5 27000 10 51000 20 EN SS FB IIN tSS Soft start time Inrush current The Soft start function is exercised when the EN/SLLM input is set to high. Current control takes effect at startup enabling a moderate output voltage “ramping.” Soft start timing and incoming current are calculated with the following: formulas (2) and (3) below. tSS= 0.75(Typ) x CSS 2µA(Typ) [sec] ・・・(2) IIN = CO x VOUT tSS [A] ・・・(3) x VOUT VIN (CSS: Soft start capacitor C O: Output capacitor) FB SCP EN/UVLO tSCP REF x 0.56 Short circuit protection is enabled when FB falls to or below REF X 0.56. Once the programmed time period has elapsed, the output is latched off to prevent destruction of the circuit. Output voltage can be restored either by cycling the EN pin or disabling UVLO. Short circuit protection time is programmed at 2.5msec (Typ). tMAX tON tON HG LG IL ILIMIT During normal operation, if FB is less than REF, HG is high during the time tON, but when the coil current exceeds the ILIMIT threshold, HG is set to off. The next pulse returns to normal operation if the output voltage drops after the maximum on-time or IL becomes lower than ILIMIT.

TSZ02201-0A1A0A900210-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 30.May.2017 Rev.004 www.rohm.co.jp TSZ22111・15・001 BD95601MUV-LB Selection of Components Externally Connected 1. Inductor (L) Selection *Passing a current larger than inductor’s rated current will cause magnetic saturation in the inductor and decrease system efficiency. When selecting the inductor, be sure to allow enough margin to assure that peak currents do not exceed the inductor rated current value. *To minimize possible inductor damage and maximize efficiency, choose a inductor with a low (DCR, ACR) resistance. 2. Output Capacitor (Co) Selection Please give due consideration to the conditions in formula (7) below for the output capacitor, bearing in mind that the output start-up time must be established within the soft start timeframe. Capacitors used as bypass capacitors are connected to the load side affect the overall output capacitance ( CEXT, figure above). Please set the soft start time or over-current detection value, regarding these capacities. If an inappropriate capacitor is used, OCP may be detected during activation and may cause startup malfunctions. 3. Input Capacitor (Cin) Selection A ceramic capacitor is recommended to reduce ESR loss and maximize efficiency. ΔIL= (VIN - VOUT) x VOUT L x VIN x f [A]・・・(4) PGND PGND ΔIL VIN IL L CO VOUT Output ripple current Generally, lower inductance values offer faster response times but also result in increased output ripple and lower efficiency. 0.47μH to 2.2μH are a recommended range of values. The peak current rating of the coil is approximated by formula (5). Please select an inductor equal to or higher than this value. ILPEAK= IOUTMAX + (VIN-VOUT) x VOUT 2 x L x VIN x f [A]・・・(5) The inductor value is a major influence on the output ripple current. As formula (4) below indicates, the greater the inductor or the switching frequency, the lower the ripple current. ΔVOUT= ESR x ΔIL+ESL×ΔIL / tON・・・(6) CO+ CEXT ≤ tSS x (Limit- IOUT) VOUT ・・・(7) tSS: Soft start time Limit: Over current detection VIN L Co VOUT ESR Output capacitor ESL Load CEXT PGND PGND The output capacitor should be determined by equivalent series resistance and equivalent series inductance so that the output ripple voltage is 30mV or more. The rating of the capacitor is set with sufficient margin given the output voltage. ΔIL: Output ripple current ESR: Equivalent series resistance, ESL: Equivalent series inductance Input capacitor IRMS= IOUT x VOUT (VIN -VOUT) VIN [A]・・・(8) Where VIN = 2 x VOUT, IRMS= IOUT PGND PGND L CO VOUT Cin The input capacitor selected must have low enough ESR to fully support high output ripple so as to prevent extreme over current conditions. The formula for ripple current IRMS is given in (8) below. VIN

TSZ02201-0A1A0A900210-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 30.May.2017 Rev.004 www.rohm.co.jp TSZ22111・15・001 BD95601MUV-LB Selection of Components Externally Connected - continued 4. MOSFET selection The High-side MOSFET generates loss when switching, along with the loss due to on-resistance. Good efficiency is achieved by selecting a MOSFET with low on-resistance and low Qg (gate total charge amount). Recommended MOSFETs for various current values are as follows: Output current High-side MOSFET Low-side MOSFET to 5A RQ3E080GN RQ3E080GN 5 to 8A RQ3E120GN RQ3E150GN 8 to 10A RQ3E150GN RQ3E180GN 5. Set Point Output Voltage This IC operates such that output voltage is REF ≌ FB. <Output Voltage> Setting resistance are selected from 10kΩ to 50kΩ, because of external Noise resistant and feedback current. Please refer to constant the following for typical output voltage. Output voltage R1 R2 1.0V 10kΩ 30kΩ 1.2V 18kΩ+1.8kΩ 33kΩ 1.35V 24kΩ 30kΩ 1.5V 24kΩ 12kΩ(30kΩ//20kΩ) 1.8V 39kΩ+3kΩ 30kΩ 2.0V 36kΩ+0.68kΩ 22kΩ PHigh-side= PRON+PTRAN PLow-side= PRON < Loss of High-side MOSFET > < Loss of High-side MOSFET > VIN L Co VOUT Low-side MOSFET High-side MOSFET PGND PGND VOUT VIN x RON x IOUT2 + (Tr+Tf) x VIN x IOUT x f 6 = ・・・(9) VIN -VOUT VIN x RON x IOUT2 = ・・・(10) (Ron: On-resistance of FET, f: Switching frequency, Tr: Rise time, Tf: Fall time) The High-side and Low-side drivers are designed to activate N channel MOSFETs having low on-resistance. The chosen MOSFET may result in the loss described below, please select a proper FET for each considering the input-output and load current. VOUT = x REF(0.75V) (R1+R2)

TSZ02201-0A1A0A900210-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 30.May.2017 Rev.004 www.rohm.co.jp TSZ22111・15・001 BD95601MUV-LB Selection of Components Externally Connected - continued 6. Selecting resistance for over current setting (A) High-precision current detection circuit (use a low value resistor) (B) Low loss current detection circuit (Use DCR of L) ILMIT=0.1 x 0.1 R ILMIT= (R: Detection resistor) [A]・・・(11) (RL: DCR value of inductor) Must be adjusted so that the power dissipation into the r. About 47kΩ to 330kΩ. [A]・・・(12) L r x C RL = detect point IL ILIMIT t As shown in the diagram to the left, if the voltage between Is+ and VOUT exceed the ILMIT, the High-side FET gate is set low. Because the peak value of inductor current is detected and corresponds to the saturation time of inductor, the reliability of the system is improved. VIN L Co VOUT Current limit IL R RILIM 100kΩ GND PGND PGND VIN L Co VOUT Current limit IL RL r C GND PGND PGND However, r x C L LG HG IS+ VOUT ILIM ILIM VOUT IS+ LG HG Please make sure that 100kΩ is used for RILIM. RILIM 100kΩ Please make sure that 100kΩ is used for RILIM.

TSZ02201-0A1A0A900210-1-2 © 2013 ROHM Co., Ltd. All rights reserved. Figure 16. BD95601MUV-LB Basic Application Circuit

TSZ02201-0A1A0A900210-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 30.May.2017 Rev.004 www.rohm.co.jp TSZ22111・15・001 BD95601MUV-LB VOUT=1.0V, IOUT=6A Reference Designator Type Value Description Manufacturer Part Number Manufacturer Configuration (mm) C13, C14 POSCAP 470µF 2.5V, ±20%, ESR 6mΩmax 2R5TPF470M6L SANYO 7343 JP1 Jumper n/a Not applicable - - - R3 Resistor 30kΩ 1/16W, 50V, 0.5% MCR01MZPD3002 ROHM 1005 R4 Resistor 10kΩ 1/16W, 50V, 0.5% MCR01MZPD1002 ROHM 1005 R18 Resistor 0Ω Jumper, 1A, 50mΩmax MCR01MZPJ000 ROHM 1005 R20 Resistor n/a Not applicable - - - VOUT=1.2V, IOUT=4A Reference Designator Type Value Description Manufacturer Part Number Manufacturer Configuration (mm) C13, C14 POSCAP 470µF 2.5V, ±20%, ESR 6mΩmax 2R5TPF470M6L SANYO 7343 JP1 Jumper n/a Not applicable - - - R3 Resistor 30kΩ 1/16W, 50V, 0.5% MCR01MZPD3002 ROHM 1005 R4 Resistor 18kΩ 1/16W, 50V, 0.5% MCR01MZPD1802 ROHM 1005 R18 Resistor 0Ω Jumper, 1A, 50mΩmax MCR01MZPJ000 ROHM 1005 R20 Resistor n/a Not applicable - - - VOUT=1.8V, IOUT=6A Reference Designator Type Value Description Manufacturer Part Number Manufacturer Configuration (mm) C13, C14 POSCAP 470µF 2.5V, ±20%, ESR 6mΩmax 2R5TPF470M6L SANYO 7343 JP1 Jumper n/a Not applicable - - - R3 Resistor 30kΩ 1/16W, 50V, 0.5% MCR01MZPD3002 ROHM 1005 R4 Resistor 39kΩ 1/16W, 50V, 0.5% MCR01MZPD3902 ROHM 1005 R18 Resistor 3kΩ 1/16W, 50V, 5% MCR01MZPJ302 ROHM 1005 R20 Resistor n/a Not applicable - - - VOUT=1.35V, IOUT=4A Reference Designator Type Value Description Manufacturer Part Number Manufacturer Configuration (mm) C13, C14 POSCAP 470µF 2.5V, ±20%, ESR 6mΩmax 2R5TPF470M6L SANYO 7343 JP1 Jumper - 0: 1.35V, 1: 1.5V - - - R3 Resistor 30kΩ 1/16W, 50V, 0.5% MCR01MZPD3002 ROHM 1005 R4 Resistor 24kΩ 1/16W, 50V, 0.5% MCR01MZPD2402 ROHM 1005 R18 Resistor 0Ω Jumper, 1A, 50mΩmax MCR01MZPJ000 ROHM 1005 R20 Resistor 120kΩ 1/16W, 50V, 0.5% MCR01MZPD1203 ROHM 1005 VOUT=2.0V, IOUT=2A Reference Designator Type Value Description Manufacturer Part Number Manufacturer Configuration (mm) C13, C14 POSCAP 330µF 6.3V, ±20%, ESR 18mΩmax 6TPE330MIL SANYO 7343 JP1 Jumper n/a Not applicable - - - R3 Resistor 18kΩ 1/16W, 50V, 0.5% MCR01MZPD1802 ROHM 1005 R4 Resistor 30kΩ 1/16W, 50V, 0.5% MCR01MZPD3002 ROHM 1005 R18 Resistor 0Ω Jumper, 1A, 50mΩmax MCR01MZPJ000 ROHM 1005 R20 Resistor n/a Not applicable - - -

TSZ02201-0A1A0A900210-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 30.May.2017 Rev.004 www.rohm.co.jp TSZ22111・15・001 BD95601MUV-LB 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 25 50 75 100 125 150 Ambient Temperature(℃) Power Dissipation Pd （W) (1)0.34W (4)3.56W (3)2.20W (2)0.70W Power Dissipation PCB size: 74.2mm×74.2mm×1.6mmt Substrate(1): IC only Substrate(2): 1-layer (copper foil density 0mm2) Substrate(3): 4-layer (copper foil density 10.29 mm2) 2,3-layer (copper foil de density 5505mm2) Substrate(4): 4-layer (copper foil density 5505 mm2) Substrate(1)：θja=367.6°C /W Substrate(2)：θja=178.6°C /W Substrate(3)：θja=56.6°C /W Substrate(4)：θja=35.1°C /W

TSZ02201-0A1A0A900210-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 30.May.2017 Rev.004 www.rohm.co.jp TSZ22111・15・001 BD95601MUV-LB Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power s upply, such as mounting an external diode between the power supply and the IC ’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins . Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground trace s should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small -signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low -impedance output pin may subject the IC to stress. Always discharge capacitors co mpletely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorte d to each other especially to ground , power supply and output pin . Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.

TSZ02201-0A1A0A900210-1-2 © 2013 ROHM Co., Ltd. All rights reserved. power supply or ground line.

1. Regarding the Input Pin of the IC

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Figure 17. Example of monolithic IC structure temperature and the decrease in nominal capacitance due to DC bias and others.

1. Area of Safe Operation (ASO)
2. Thermal Shutdown Circuit(TSD)

the TSD threshold, the circuits are automatically restored to normal operation.

1. Over Current Protection Circuit (OCP)

not be used in applications characterized by continuous operation or transitioning of the protection circuit.

TSZ02201-0A1A0A900210-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 30.May.2017 Rev.004 www.rohm.co.jp TSZ22111・15・001 BD95601MUV-LB

Ordering Information

B D 9 5 6 0 1 M U V - L B E 2 Part Number Package MUV: VQFN Product class LB for Industrial E2: Embossed tape and reel (packing quantity 2500pcs) H2: Embossed tape and reel (packing quantity 250pcs) Marking Diagrams VQFN020V4040 (TOP VIEW) 95601 Part Number Marking LOT Number 1PIN MARK

TSZ02201-0A1A0A900210-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 30.May.2017 Rev.004 www.rohm.co.jp TSZ22111・15・001 BD95601MUV-LB Physical Dimension, Tape and Reel Information <Tape and Reel information> Tape Embossed carrier tape Quantity 250pcs Direction of feed Reel Direction of feed1pin The direction of the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand. *Order quantity needs to be multiple of the minimum quantity.

TSZ02201-0A1A0A900210-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 30.May.2017 Rev.004 www.rohm.co.jp TSZ22111・15・001 BD95601MUV-LB

Revision History

6.Sep.2013 001 New Release 1.Apr.2014 002 Delete sentence “and log life cycle” in General Description and Futures. Change “Packaging and forming specification” from E2 to H2. 02.Aug.2016 003 Modify some typo

Notice-PGA-E Rev.003 © 2015 ROHM Co., Ltd. All rights reserved. Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability ( such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( “Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsi bilities, adequate safety measures including but not limited to fail -safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below . Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions . If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no -clean type fluxes, cleanin g residue of flux is recommended); or Washing our Products by using water or water -soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of pe rformance characteristics after on -board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady -state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation d epending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under devian t condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface -mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface -mount products , please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification

Notice-PGA-E Rev.003 © 2015 ROHM Co., Ltd. All rights reserved. Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use . Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and stor age so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e .g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information an d data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatso ever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties.

Notice – WE Rev.001 © 2015 ROHM Co., Ltd. All rights reserved. General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for failure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information.