Power Management

BD95500MUV

Rohm

Switching Regulator with MOSFET for DDR-SDRAM Cores

Manufacturer: Rohm

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Description BD95500MUV is a switching regulator with high output current (up to 6A) which can ac hieve low output voltage (0.7V to 5.0V) from a wide input voltage range (3V to 20V). Hi gh efficiency for the switching regulator can be realized by utilizing an internal N-MOSFET power transistor. A new technology called H3RegTM is a Rohm proprietary control method to realize ultra high transient response against load change. SLLM (Simple Light Load Mode) technology is also integrated to improve efficiency in light load mode, providing high efficiency over a wide load range. For protection and ease of use, the soft start function, variable frequency function, short circuit protection function with timer latch, over voltage protection function, and power good function are all built in. This switching regulator is specially designed for sets of various kinds.
Features 1) Integrated low ON resistance N-MOSFET (TYP. 50mΩ ) 2) H 3RegTM DC/DC converter controller 3) Adjustable Simple Light Load Mode (SLLM), and forced continuous mode 4) Thermal Shut Down (TSD), Under Voltage LockOut (UVLO), Adjustable Over Current Protection (OCP), Over Voltage Protection (OVP), S hort Circuit Protection(SCP) built-in 5) Soft start function to minimize rush current during startup 6) Adjustable switching frequency (f=200KHz ～1000KHz) 7) Built-in output discharge function 8) VQFN040V6060 Package 9) Tracking Function 10) Integrated boot strap diode 11) Power Good function
Applications Mobile PC, Desktop PC, LCD-TV, Digital Components, etc No.10030ECT21

Maximum Absolute Ratings (Ta=25℃) Parameter Symbol Ratings Unit Input Voltage 1 VCC 7 *1 V Input Voltage 2 VDD 7 *1 V Input Voltage 3 VIN 24 *1 V BOOT Voltage BOOT 30 V BOOT-SW Voltage BOOT-SW 7 V LG Voltage LG VDD V REF Voltage REF VCC V Output Voltage VOUT/Is+/Is- VCC V ILIM/SS/FS/MODE Voltage ILIM/SS/FS/MODE VCC V VREG Voltage VREG VCC V EN Input Voltage EN 7 V Output Current (Average) Isw 6 A Power Dissipation 1 Pd1 0.54 *2 W Power Dissipation 2 Pd2 1.00 *3 W Power Dissipation 3 Pd3 3.77 *4 W Power Dissipation 4 Pd4 4.66 *5 W Operating Temperature Range Topr -10～+100 ℃ Storage Temperature Range Tstg -55～+150 ℃ Junction Temperature Tjmax +150 ℃ *1 Not to exceed Pd, ASO, and Tjmax=150℃. *2 Reduced by 4.3mW for each increase in Ta of 1℃ over 25 ℃ (when don’t mounted on a heat radiation board ) (Copper foil area : 0mm 2)) ( 1 st and 4th copper foil area : 20.2mm2, 2nd and 3rd copper foil area : 5505mm2)) (All copper foil area : 5505mm 2))
Operating Conditions (Ta=25℃) Parameter Symbol Ratings Unit MIN MAX Input Voltage 1 VCC 4.5 5.5 V Input Voltage 2 VDD 4.5 5.5 V Input Voltage 3 VIN 3.0 20 V BOOT Voltage BOOT 4.5 25 V SW Voltage SW -0.7 20 V BOOT-SW Voltage BOOT-SW 4.5 5.5 V MODE Input Voltage MODE 0 5.5 V EN Input Voltage EN 0 5.5 V Output Adjustable Voltage REF 0.7 2.0 V Is Input Voltage Is+/Is- 0.7 2.7 V MIN ON Time Tonmin - 200 nsec *This product should not be used in a radioactive environment.

Electrical characteristics (Unless otherwise noted, Ta=25℃, VCC=5V, VDD=5V, EN / MODE=5V, VIN=12V, REF=1.8V, RFS=68kΩ） Parameter Symbol Limit Unit Condition Min. Typ. Max. [Whole Device] VCC Bias Current Icc - 1200 2000 μA VIN Bias Current Iin - 100 200 μA VCC Standby Current Iccstb - 0 10 μA EN ＝0V VIN Standby Current Iinstb - 0 10 μA EN ＝0V EN Low Voltage Enlow GND - 0.8 V EN High Voltage Enhigh 2.3 - 5.5 V EN Bias Current Ien - 7 10 μA VREG Voltage Vreg 2.475 2.500 2.525 V Ireg=0 to 500uA, Ta=-10℃ to 100 ℃* [Under Voltage Locked Out ] VCC Threshold Voltage Vcc_UVLO 4.1 4.3 4.5 V V CC:Sweep up VCC Hysteresis Voltage dVcc_UVLO 100 160 220 mV V CC:Sweep down VIN Threshold Voltage Vin_UVLO 2.4 2.6 2.8 V V IN:Sweep up VIN Hysteresis dVin_UVLO 100 160 220 mV V IN:Sweep down VREG Threshold Voltage Vreg_UVLO 2.0 2.2 2.4 V VREG:Sweep up VREG Hysteresis Voltage dVreg_UVLO 100 160 220 mV VREG:Sweep down [H3REGTM Control Block] ON Time Ton 400 500 600 nsec MAX ON Time Tonmax - 3 6.0 μsec MIN OFF Time Toffmin - 450 550 nsec [FET Block] High Side ON Resistance HGhon - 50 80 m Ω Low Side ON Resistance HGlon - 50 80 m Ω [SCP Block] SCP Start up Voltage Vscp REF ×0.60 REF ×0.70 REF ×0.80 V Delay Time Tscp - 1.0 2.0 ms [OVP Block] OVP Detect Voltage Vovp REF ×1.16 REF ×1.2 REF ×1.24 V [Soft Start Block] Charge Current Iss 2 4 6 μA Discharge Current Idis 0.5 1.0 2.0 μA Standby Voltage Vss_stb - - 50 mV [Over Current Protection Block] Current Limit Threshold 1 Ilim1 40 50 60 mV ILIM=0.5V , Ta=-10℃ to 100 ℃ Current Limit Threshold2 Ilim2 160 200 240 mV ILIM=2.0V [Vout Setting] VOUT Offset Voltage 1 Voutoff1 REF-10m REF REF+10m V Ta=-10 ℃ to 100 ℃ VOUT Bias Current Ivout -100 0 100 nA REF Bias Current Iref -100 0 100 nA Is+ Input Current IIs+ -1 0 1 μA Is+=1.8V Is- Input Current IIs- -1 0 1 μA Is-=1.8V [MODE Block] SLLM Threshold VthSLLM VCC-0.5 - VCC V Forced Continuous Mode Vth CONT GND - 0.5 V Input Impedance RMODE - 400 - k Ω [Power Good Block] VOUT Power Good Low Voltage VoutPL REF ×0.85 REF ×0.90 REF ×0.95 V VOUT Power Good High Voltage VoutPH REF ×1.05 REF ×1.10 REF ×1.15 V

www.rohm.com 2010.05 - Rev.C © 2010 ROHM Co., Ltd. All rights reserved. 1.90 1.95 2.00 2.05 2.10 2.15 2.20 - 1 0 1 03 05 07 09 0 Ta(℃) VREG[V] 1.90 1.95 2.00 2.05 2.10 2.15 2.20 - 1 01 03 0 5 07 09 0 Ta(℃) VREG[V] 0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 01 . 534 . 56 Vcc(V) VREG(V) Sweep up Sweep down Sweep up Sweep down Left: 100℃ Middle: 25℃ Right: -10℃ - 1 0 1 03 05 07 09 0 Ta (℃) ⊿Is [mV] - 1 0 1 03 05 07 09 0 Ta (℃) VOUT-REF [mV] 200 240 280 320 360 400 0 5 10 15 20 25 VIN(V) frequency[kHz] Io=2A Io=0A ILIM=0.5V 2.490 2.492 2.494 2.496 2.498 2.500 - 1 01 03 05 07 09 0 Ta(℃) VREG[V] 4.00 4.05 4.10 4.15 4.20 4.25 4.30 - 1 0 1 03 05 07 09 0 Ta(℃) VCC[V] 2.40 2.45 2.50 2.55 2.60 2.65 2.70 - 1 0 1 03 05 07 09 0 Ta(℃) VIN[V] Sweep up Sweep down Sweep up Sweep down 100 0.001 0.01 0.1 1 10 Io(mA) η[%] 100 0.001 0.01 0.1 1 10 Io(mA) η[%] SLLM Forced Continuous 100 0.001 0.01 0.1 1 10 Io(mA) η[%] SLLM Forced Continuous SLLM Forced Continuous

Reference Data Fig.7 Ta vs VOUT Offset Fig.9 VIN vs fFig.8 Ta vs Current Limit Threshold Fig.5 Ta vs EN Threshold Fig.6 Vcc vs VREG Fig.4 Ta vs UVLO (VREG) Fig.10 Io vs Efficiency IN=7V, VOUT=1.5V) Fig.11 Io vs Efficiency (VIN=12V, VOUT=1.5V) Fig.12 Io vs Efficiency (VIN=19V, VOUT=1.5V) Fig.2 Ta vs UVLO (VCC) Fig.3 Ta vs UVLO (VIN) Fig.1 Ta vs VREG

www.rohm.com 2010.05 - Rev.C © 2010 ROHM Co., Ltd. All rights reserved. VOUT HG/LG IOUT VOUT HG/LG IOUT VOUT HG/LG IOUT VOUT HG/LG IOUT VOUT HG/LG IOUT VOUT HG/LG IOUT VOUT IL HG/LG VOUT IL HG/LG VOUT IL HG/LG HG/LG/SW IL HG/LG/SW IL HG/LG/SW IL

Reference Data Fig.13 Transient Response IN=7V) Fig.14 Transient Response (VIN=12V) Fig.15 Transient Response (VIN=19V) Fig.16 Transient Response (VIN=7V) Fig.17 Transient Response (VIN=12V) Fig.18 Transient Response (VIN=19V) Fig.19 SLLM Mode (IOUT=0A) Fig.20 SLLM Mode (IOUT=0.4A) Fig.21 SLLM Mode (IOUT=1A) Fig.22 Continuous Mode (Io=0A) Fig.23 Continuous Mode (Io=4A) Fig.24 OCP Status (Io=5A)

Reference Data
Block Diagram Fig.25 V IN change (5→19V) Fig.26 VIN change (19→5V) Fig.27 EN wake up HG/LG VOUT VIN VOUT EN SS VOUT PGOOD HG/LG VIN Continuous SLLM 0123456 Io [A] ΔTc [℃] 100 200 300 400 500 0.001 0.01 0.1 1 10 Iout [A] Frequency [kHz SLLM Continuous 1.48 1.49 1.50 1.51 1.52 0.001 0.01 0.1 1 10 Iout [A] Output Voltage [V Continuous SLLM Fig.29 IOUT vs f Fig.30 IOUT vs ΔTc Fig.28 IOUT vs VOUT Reference Block H3 Reg TM Controller Block R Q S SLLM/ Driver Circuit Thermal Protection VREG VIN UVLO Delay SCPREF × 0.85 SS × 0.85 V OUT REF × 1.2 V OUT 2.5VReg 2.5V OVP SS Soft Start MODE Power Good SS TSD UVLO ILIM SCP TSD × 0.1 Vcc REF EN PGOOD V OUT GND FS MODE N.C. ILIM Is+ Is- CE EN/UVLO ILIM Current Limit PGND PGND VDD SW VIN BOOT VDD SSVREGVINSVcc VDD VIN C OUT V OUT C IN 3.3V ～ 20V 5 37 7 9 1213424086

Pin Configuration
Pin Function Table PIN No. PIN name PIN function

1 PGOOD Power Good Output Pin(+/-10% Window)

2 N.C. -

3 CE Ceramic Capacitor Reactive Pin

4 ILIM Current Limit Setting Pin

5 VCC Power Supply Input pin (Control Block)

6 GND Sense GND

7 VREG IC Reference Voltage (2.5V/500uA)

8 FS Switching Frequency Adjustable Pin (30k～100kΩ)

9 SS/TRACK Soft Start Setting Pin (w/ Capacitor)/Tracking Voltage Input Pin

10 REF Vo Setting Pin

11 VOUT Output Voltage Sense Pin

12 Is- Current Sense Pin -

13 Is+ Current Sense Pin +

14 VDD FET Driver Power Supply Pin (5V Input)

22-29 SW High Side FET Source Pin

30 PGND Power GND Pin

31-36 VIN Battery Voltage Input pin (3.3~20V Input)

37 VINS Battery Voltage Sense pin

38 BOOT HG Driver Power Supply Pin

39 EN Enable Input pin (IC ON when High)

40 MODE

Control Mode Adjustment Pin Low: Continuous High: SLLM bottom FIN Substrate connection *Connect the bottom side (FIN) to the ground terminal 1 2 3 4 5 29 28 27 26 25 30 36 15 24 23 22 7 8 9 PGND PGND PGND PGND PGND PGND PGND SW SW SW SW SW SW SW SW PGND VIN VIN VIN VIN VIN VIN VCC GND VREG FS SS/ TRACK REF VINS BOOT EN MODE PGOOD N.C. ILIM CE VOUT Is- Is+ VDD

Pin Descriptions ・VCC (5 Pin) This is the power supply pin for IC internal circuits, except the FET driver. The input supply voltage range is 4.5V to 5.5V. It is recommended that a 10Ω/0.1uF C-R filter be put in this pin from VDD rail. ・EN (39 Pin) When EN pin voltage is at least 2.3V, the status of this switching regulator becomes active. Conversely, the status switches off when EN pin voltage goes lower than 0.8V and circuit current becomes 0µA. ・VDD (14 Pin) This is the power supply pin to drive the LOW side FET and for Boot-strap diode. It is recommended that a 1~10µF bypass capacitor be established to compensate for rush current during the FET ON/OFF transition. ・VREG (7 Pin) This is the reference voltage output pi n. The voltage is 2.5V, with 500uA current ability. It is recommended that a 0.22~1µF capacitor (X5R or X7R) be established between VREG and GND (6 Pin). When REF is not adjusted from the external voltage supply, the REF voltage can be adjusted using the external resistor divider of VREG. ・REF (10 Pin) This is the output voltage ad justment pin by resistor divider network fr om VREG pin (0.7~2.0V). It is also very convenient for synchronizing external voltage supply. The IC controls the output voltage (REF≒VOUT). ・ILIM (4 Pin) BD95500MUV detects the voltage between Is+ pin and Is- pin and limits the output current (OCP). Voltage equivalent to 1/10 of the ILIM voltage is the voltage drop of external cu rrent sense resistor. A very low current sense resistor or inductor DCR can also be used for this platform. ・SS/TRACK (9 Pin) This is the adjustment pin to set the soft start time. SS voltage is low during standby status. When EN is ON, the soft start time can be determined by the SS charge current and capacitor between SS-GND. Until SS reaches REF voltage, the output voltage is equivalent to SS voltage. And also this pin enables to operate tracking function. The output voltage keeps track of a power supply rail by connecting 10kΩ resistance between the power supply rail and SS/TRACK pin. ・VINS (37 Pin) The duty cycle is determined by input voltage and controls output voltage. In other words, the output voltage is affected by input voltage. Therefore, when VINS voltage fluctuates, the output voltage bec omes also unstable. Since the VINS line is also the input voltage of the switching regulator, stability depends on the impedance of the voltage supply. It is recommended to establish a bypass capacitor or CR filter suitable for the actual application. ・FS (8 Pin) This is the pin to adjust the switching frequency with the re sistor. It is recommended that a resistor be established to GND (6 pin).The frequency range is from 200kHz to 1000kHz. ・Is+ (13 pin), Is- (12 pin) These pins are connected to both sides of the current sense resistor to detect output current. The voltage drop between Is+ and Is- is compared with the voltage equivalent to 1/10 of ILIM voltage. When this voltage drop hits the specified voltage level, the output voltage is OF F. Since the maximum input voltage is 2.7V, set the output voltage by the resistance division value in case the output voltage is 2.7V or more. ・BOOT (38 pin) This is the voltage supply to drive the high side FET and a Diode for BOOT strap function is built in. The maximum absolute ratings are 30V (from GND) and 7V (from SW). BOOT voltage swings between (VIN+Vcc) and Vcc during active operation. ・PGOOD (1 pin) This pin is output pin for Power Good. It is open drain pin and recommended to connect to other power supply through the pull-up resistance (about 100kΩ). ・CE (3 pin) This pin is for the ceramic capacitor. It is useful to utilize low ESR capacitor for output capacitor. ・MODE (40 pin) This is the control mode changeable pin. The status is Low : continuous mode, the status is High : SLLMTM. ・VOUT (11 pin) This is the monitor pin for output voltage. This IC controls the voltage in the status of REF≒VOUT. When output voltage is required 2V or more, set the output voltage by the resistance division value. ・SW (22-29 pin) This is connected pin for coil. SW voltage swings between VIN and GND. It is recommended to connect by heavy and short pattern to coil. ・VIN (31-36 pin) This is input power supply pin. Recommend input voltage is 3.3V to 20V. Connect the input capacitor against PGND directly. ・PGND (15-21, 30 pin) This is power ground pin. It is recommended to connect by heavy and short pattern. Connect in reverse side of IC when connecting to GND (6 pin).

Explanation of Operation The BD95500MUV is a switching regulator cont roller incorporating ROHM’s proprietary H 3RegTM CONTROLLA control system. When VOUT drops due to a rapid load change, the system quickly restores VOUT by extending the tON time interval. Thus, it serves to improve the regulator’s transient response. Activating the Light Load Mode will also exercise Simple Light Load Mode (SLLM) control when the load is light, to further increase efficiency. H3RegTM control (Normal operation) OUT drops due to a rapid load change) VOUT REF HG LG VOUT REF HG Io LG tON+α TON= REF VIN × 1 f [sec]・・・(1) When VOUT falls to a threshold voltage (REF), the drop is detected, activating the H3RegTM CONTROLLA system. HG output is determined by the formula above. When VOUT drops due to a rapid load change, and the voltage remains below V REF after the programmed t ON time interval has elapsed, the system quickly restores VOUT by extending the t ON time, improving the transient response. H3RegTM CONTROLLA S R Q SLLM Driver Circuit SLLM VIN VOUT VIN VOUT REF HG LG SW PGND

Timing Chart ・Soft Start Function ・Soft Stop Function ・Timer Latch Type Short Circuit Protection EN SS VOUT IIN TSS VOUT SCP EN/UVLO 1ms REF×0.70 Spontaneous Discharge (It is determined by load and output capacitor) Soft start is exercised with the EN pin set high. Current control takes effect at startup, enabling a moderate output voltage “ramping start.” Soft start timing and incoming current are calculated with formulas (2) and (3) below. Tss= REF×Css 4μA(typ) [sec] Rush current IIN (ON)= Co×VOUT Tss [A] ・・・(2) ・・・(3) Soft start time (Css: Soft start capacitor; Co: Output capacitor) Soft stop is exercised with the EN pin set low. Current control takes effect at st artup, enabling a moderate output voltage. Soft start timing and incoming current are calculated with formulas (4) below. TSS (OFF) = (REF+2VBE)×Css 1μA (typ) [sec] ・・・(4) ΔVSS= 1.2[V] (typ) Tdelay = CSS 1μA(typ) [sec] ・・・(5) Soft stop time When output voltage (Is-) falls to REF ×0.7 or less, SCP comparator inside IC is exercised. If the status of High is continued 1ms or more (programmed time inside IC), the IC goes OFF. It can be restored either by reconnecting the EN pin or disabling UVLO. EN SS VOUT TSS(OFF) 0.1V 1.2V Tdelay

www.rohm.com 2010.05 - Rev.C © 2010 ROHM Co., Ltd. All rights reserved. ・Output Over Voltage Protection ・Over current protection circuit ・Synchronous operation with external power supply VOUT HG LG REF×1.2 Switching tMAX tON tON HG LG IL ILIMIT tON 3.3V (External Power Supply)

1.5 V (BD95500 Output 1)

When output rise to or above REF ×1.2, output ove r voltage protection is exercised, and low side FET goes up maximum for reducing output. （LG=High, HG=Low）. When output falls, it returns to the standard mode. During the normal operation, when V OUT becomes less than REF Voltage, HG becomes High during the time tON (P9). However, when inductor current exceeds I LIMIT threshold, HG becomes OFF. After MAX ON TIME, HG becomes ON again if the output voltage is lower than the specific voltage level and I L is lower than ILIMIT level. These power supply sequences are realized to connect SS pin to other power supply output through the resistance (10kΩ).

External Component Selection 1. Inductor (L) selection ※Passing a current larger than the inductor’s rated current will cause magnetic saturation in the inductor and decrease system efficiency. In selecting the inductor, be sure to allow enough margin to assure that peak current does not exceed the inductor rated current value. ※To minimize possible inductor damage and maximize efficiency, choose a inductor with a low (DCR, ACR) resistance. 2. Output Capacitor (C O) Selection Please give due consideration to the conditions in formula (8) below for output capacity, bear in mind that output rise time must be established within the soft start time frame. Note: Improper capacitor may cause startup malfunctions 3. Input Capacitor (Cin) Selection A low ESR capacitor is recommended to reduce ESR loss and maximize efficiency. ΔI (VIN-VOUT)×VOUT L×VIN×f [A]・・・(4) ΔIL=0.3×IOUTmax. [A]・・・(5) (VIN-VOUT)×VOUT ΔVOUT=ΔIL×ESR + ESL×ΔIL / TON・・・(7) Co≦ TSS×(Limit-IOUT) VOUT ・・・(8) IRMS=IOUT× VIN (VIN-VOUT) VIN [A]・・・(9) Where VIN=2×VOUT, IRMS= IOUT The inductor value is a major influence on the output ripple current. As formula (5) below indicates, the greater the inductor or the switching frequency, the lower the ripple current. The proper output ripple current setting is about 30% of maximum output current. (ΔIL: output ripple current; f: switch frequency) When determining the proper output capacitor, be sure to factor in the equivalent series resistance and equivalent series inductance required to set the output ripple voltage 20mV or more. In selecting the limit of inductor, be sure to allow enough margin for output voltage. Output ripple voltage is determined as in formula (7) below. (ΔIL: Output ripple current; ESR: CO equivalent series resistance, ESL: equivalent series inductance) Tss: Soft start time (See formula (2) in P10) Limit: Over current detection (See formula (10)(11) in P13) The input capacitor selected must have low enough ESR resistance to fully support large ripple output, in order to prevent extreme over current. The formula for ripple current IRMS is given in (9) below. ΔIL Output Ripple Current VIN IL L Co VOUT HG LG SW PGND Output Capacitor VIN L Co VOUT ESR ESL HG LG SW PGND Input Capacitor VIN L Co VOUT Cin HG LG SW PGND

www.rohm.com 2010.05 - Rev.C © 2010 ROHM Co., Ltd. All rights reserved. 4. Setting Detection Resistance V ILIM×0.1 R ILMIT= [A]・・・(10) ILMIT=VILIM×0.1× r×C L [A]・・・(11) L r×C (RL= ) detect point IL ILIMIT t The over current protection function detects the output ripple current peak value. This parameter (setting value) is determined as in formula (10) below. ILIM: ILIM voltage, R: Detection resistance) When the over current protection is detected by DCR of coil L, this parameter (setting value) is determined as in formula (11) below. (VILIM:ILIM voltage, RL: the DCR value of coil) As soon as the voltage drop between Is+ and Is- generated by the inducto r current becomes specific threshol d, the gate voltage of the high side MOSFET becomes low. Since the peak voltage of the induct or ripple current is detected, this operation can sense high current ripp le operation caused by inductance saturated rated current and lead to high reliable systems. VIN L Co VOUT Current limit IL R HG LG SW PGND Is+ Is- VIN L Co VOUT Current limit IL RL r C HG LG SW PGND Is+ Is- When the output voltage is 2.7V or more, use the resistance for setting output voltage like left figure, for Is+ and Is-. According to the setting value above, I LIMIT setting current is in proportion to the divided ratio. VIN HG LG SW PGND L Co VOUT IL R Current limit Is+ Is- VOUT R1 R1 R2 R2 (VILIM: ILIM voltage R: Detection resistance) ILMIT= R1+R2 [A]・・・(12) VLIMIT×0.1

www.rohm.com 2010.05 - Rev.C © 2010 ROHM Co., Ltd. All rights reserved. 5.Setting frequency 6. Setting standard voltage (REF) R E F = ×VREG [V]・・・(14) The On Time (t ON) at steady state is determined by resistance value connected to FS pin. But actually SW rising time and falling time come up due to influence of the external MOSFET gate capacit y or switching speed and tON is increased. The frequency is determined by the following formula after tON, input current and the REF voltage are fixed. ・・・(13) Consequently, total frequency becomes lower than the formula above. T ON is also influenced by Dead Time around the output current 0A area in continuous mode. This frequency becomes lower than setting frequency. It is recommended to check the steady frequency in large current area (at the point where the coil current doesn’t back up). 500 1000 1500 2000 2500 3000 05 0 1 0 0 1 5 0 2 0 0 RFS [kΩ] TON [nsec] VIN=5V 12V 16V 19V REF=1.8V 200 400 600 800 1000 1200 0 50 100 150 200 Resistance [kΩ] Frequency [kHz VIN=5V 12V 16V 19V F= REF VIN×tON It is available to set the reference voltage (REF) by the resistance division value from VREG in case it is no t set REF from an external power supply. It is available to synchronize setting the reference voltage (REF) with outside supply voltage [V] by using outside power supply voltage. R1+R2 VOUT H3RegTM CONTROLLA S RQ VIN VREG REF H3RegTM CONTROLLA S RQ VIN REF VOUT Outside voltage

www.rohm.com 2010.05 - Rev.C © 2010 ROHM Co., Ltd. All rights reserved. 7. Setting output voltage This IC is operated that output voltage is REF≒VOUT. And it is operated that output voltage is feed back to FB pin in case the output voltage is 0.7V to 2.0V. In case the output voltage range is 0.7V to 2.0V. It is operated that the resistance division value of the output voltage is feed back to VOUT pin in case the output voltage is more than 2.0V. output voltage≒ ×REF [V]・・・(15) And then the frequency is also in proportion to the divided ratio. In case the output voltage is more than 2.0V. V IN VIN H3RegTM CONTROLLA S RQ SLLM Driver Circuit SLLM Output voltage VOUT REF VOUT H3RegTM CONTROLLA S RQ SLLM Driver Circuit SLLM VIN Output voltage VIN REF R1+R2 R1+R2 R2 × VIN×tON REF ・・・(16)

I/O Equivalent Circuit 1pin (PGOOD) 3pin (CE) 4pin (ILIM) 7pin (VREG) 8pin (FS) 9pin (SS/TRACK) 10pin (REF) 11pin (VOUT) 12pin (Is-) 13pin (Is+) 22-29pin (SW) 31-36pin (VIN) 37pin (VINS) 38pin (BOOT) 39pin (EN) 40pin (MODE) VCC VCC VCC VCC VCC VCC VCC VCC VIN PGND SW VCC VCC VCC SW VDD

Evaluation Board Circuit (Frequency=300kHz Continuous/SLLM Circuit Example) BD95500MUV VQFN040V6060 VIN VIN VIN_S BOOT EN MOD E PGND PGND PGND PGND PGND PGND VDD Is+ Is- VOUT PGND SW PGND

30 PGOOD

(3.3V/6A) GND_VOUT R12 IPULSE R14 C10 + GND_VDD VDD(5V) SS REF VREG ILIM PGOOD R18 MODE EN VDD VDD SW2 C13 C12 R15 C16 C11 C15 VIN (5V) GND_VIN R20 C14 R13 R11 R19 R10 R3 R2 VIN VIN VIN VIN SW SW SW SW SW SW SW R20 C14 R19

Evaluation Board Parts List Part No Value Company Part name Part No Value Company Part name U1 - ROHM BD95500MUV R17 100k Ω ROHM MCR03 Series D1 - ROHM RB051L-40 R18 1k Ω ROHM MCR03 Series L1 4.3uH Sumida CDEP105NP-4R3MC-88 R19 10k Ω ROHM MCR03 Series Q1 - - - R20 12k Ω ROHM MCR03 Series R1 0Ω ROHM MCR03 Series C1 0.1uF MURATA GRM18 Series R2 0Ω ROHM MCR03 Series C2 100pF MURATA GRM18 Series R3 100k Ω ROHM MCR03 Series C3 0.47uF MURATA GRM18 Series R4 150k Ω ROHM MCR03 Series C4 1000pF MURATA GRM18 Series R5 68k Ω ROHM MCR03 Series C5 1000pF MURATA GRM18 Series R6 100k Ω ROHM MCR03 Series C6 10uF MURATA GRM21 Series R7 150k Ω ROHM MCR03 Series C7 - MURATA GRM18 Series R8 - ROHM MCR03 Series C8 220uF SANYO or something functional high polymer R9 100k Ω ROHM MCR03 Series C9 10uF MURATA GRM21 Series R10 10 Ω ROHM MCR03 Series C10 0.1uF MURATA GRM18 Series R11 - ROHM MCR03 Series C11 10uF KYOSERA or something CM316B106M25A R12 10 Ω ROHM MCR03 Series C12 0.1uF MURATA GRM18 Series R13 ROHM MCR03 Series C13 0.1uF MURATA GRM18 Series R14 1k Ω ROHM MCR03 Series C14 100pF MURATA GRM18 Series R15 1k Ω ROHM MCR03 Series C15 10uF KYOSERA or something CM316B106M25A R16 100kΩ ROHM MCR03 Series C16 0.1uF MURATA GRM18 Series

Operation Notes (1) Absolute maximum ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. (2) Connecting the power supply connector backward Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines. An external direction diode can be added. (3) Power supply lines Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line, separate the ground section and s upply lines of the digital and analog blocks. Furthermore, for all power supply terminals to ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the circuit, not that capacitance characteristic values are reduced at low temperatures. (4) GND voltage The potential of GND pin must be minimum potential in all operating conditions. (5) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipati on (Pd) in actual operating conditions. (6) Inter-pin shorts and mounting errors Use caution when positioning the IC fo r mounting on printed circuit boards. The IC may be damaged if there is any connection error or if pins are shorted together. (7) Actions in strong electromagnetic field Use caution when using the IC in the pr esence of a strong electromagnetic fiel d as doing so may cause the IC to malfunction. (8) ASO When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO. (9) Thermal shutdown circuit The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after oper ating this circuit or use the IC in an environment where the operation of this circuit is assumed. (10) Testing on application boards When testing the IC on an application board, connecting a capa citor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC. TSD ON Temp. [ ℃] (typ.) Hysteresis Temp. [ ℃] (typ.) BD95500MUV 175 15

www.rohm.com 2010.05 - Rev.C © 2010 ROHM Co., Ltd. All rights reserved. ①IC unit time θj-a=231.5℃/W ②1 layer (Substrate surface copper foil area : 0mm2) θj-a=125.0℃/W ③4 layer (Substrate surface and bottom copper foil area : 20.2mm2 2 nd and 3rd copper foil area : 5505mm2) θj-a=33.2℃/W ④4 layer (all layers copper foil area : 5505mm2) θj-a=26.8℃/W (11) Regarding input pin of the IC This monolithic IC contains P+ isolation and P substrat e layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of these P layers with t he N layers of other elements, creating a parasitic diode or transistor. For example, the relation between each potential is as follows: ○When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. ○When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes can occur inevitable in the structure of th e IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used. (12) Ground Wiring Pattern When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the grou nd potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either.

Power Dissipation VQFN040V6060 Example of IC structure 0 25 50 75 100 125 150 3.5 3.0 2.5 2.0 1.5 4.0 ①0.54W ②1.00W Power Dissipation: Pd [W] Ambient Temperature :Ta [℃] 1.0 0.5 4.5 5.0 ③3.77W ④4.66W Resistor Transistor (NPN) N N N P+ P + P P substrate GND Parasitic element Pin A N N P+ P+ P P substrate GNDParasitic element Pin B C B E N GND Pin A Parasitic element Pin B Other adjacent elements E B C GND Parasitic element

Ordering part number B D 9 5 5 0 0 M U V - E 2 Part No. Part No. Package MUV : VQFN040V6060 Packaging and forming specification E2: Embossed tape and reel ∗ Order quantity needs to be multiple of the minimum quantity. <Tape and Reel information> Embossed carrier tapeTape Quantity Direction of feed The direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs Direction of feed Reel 1pin (Unit : mm) VQFN040V6060 1.0MAX S0.08 S (0.22) 0.02+0.03 -0.02 6.0±0.1 6.0±0.1 1PIN MARK 11 0 2130 3.7±0.1 3.7±0.1 0.4±0.1 0.5 0.75 0.25 +0.05 -0.04 C0.2

R1010Awww.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. Notice ROHM Customer Support System http://www.rohm.com/contact/ Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, commu- nication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redunda ncy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospac e machinery, nuclear-reactor controller, fuel- controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.

Product Information

BD95500MUV specifications and overview.

Summary

Switching Regulator with MOSFET for DDR-SDRAM Cores

Description

Switching Regulator with MOSFET for DDR-SDRAM Cores

Source title BD95500MUV Datasheet(PDF) - Rohm

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