BD9134MUV | DigiCamel IC Datasheet

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BD9134MUV_14 ROHM | Alldatasheet

Document overview

Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
PDF pages: 25

Technical content

Features

 Fast Transient Response because of Current Mode PWM Control System  High Efficiency for All Load Ranges because of Synchronous Switches (Nch/Nch FET) and SLLMTM (Simple Light Load Mode)  Soft-Start Function  Thermal Shutdown and UVLO Functions  Short-Circuit Protection with Time Delay Function  Shutdown Function

Applications

Power Supply for LSI including DSP, Microcomputer and ASIC Key Specifications  Input Voltage Range: 4.5V to 5.5V  Output Voltage Range: 3.25V to 3.35V  Output Current: 3.0A(Max)  Switching Frequency: 1MHz(Typ)  High side FET ON-Resistance: 82mΩ(Typ)  Low side FET ON-Resistance: 70mΩ(Typ)  Standby Current: 0μA (Typ)  Operating Temperature Range: -40°C to +105°C Package W(Typ) x D(Typ) x H(Max) Typical Application Circuit Figure 1. Typical Application Circuit

1 SW Power switch node 11 GND Ground pin

2 SW Power switch node 12 VOUT Output voltage detection pin

3 SW Power switch node 13 ITH GmAmp output pin/ connected to phase

7 PVCC Power switch supply pin 17 EN Enable pin(Active high）

8 PVCC Power switch supply pin 18 PGND Power switch ground pin

9 BST Bootstrapped voltage Input pin 19 PGND Power switch ground pin

10 VCC Power supply input pin 20 PGND Power switch ground pin

Figure 2. Pin Configuration Figure 3. Block Diagram

TSZ02201-0J3J0AJ00150-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 03.Oct.2014 Rev.002 www.rohm.com TSZ22111・15・001 Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Limit Unit VCC Voltage VCC -0.3 to +7 (Note 1) V PVCC Voltage PVCC -0.3 to +7 (Note 1) V BST Voltage VBST -0.3 to +13 V BST_SW Voltage VBST-SW -0.3 to +7 V EN Voltage VEN -0.3 to +7 V SW,ITH Voltage VSW, VITH -0.3 to +7 V Power Dissipation 1 Pd1 0.34 (Note 2) W Power Dissipation 2 Pd2 0.70 (Note 3) W Power Dissipation 3 Pd3 1.21 (Note 4) W Power Dissipation 4 Pd4 3.56 (Note 5) W Operating Temperature Range Topr -40 to +105 °C Storage Temperature Range Tstg -55 to +150 °C Maximum Junction Temperature Tjmax +150 °C (Note 1) Pd should not be exceeded. (Note 2) IC only (Note 3) Mounted on a 1-layer 74.2mmx74.2mmx1.6mm glass-epoxy board, occupied area by copper foil : 10.29mm2 (Note 4) Mounted on a 4-layer 74.2mmx74.2mmx1.6mm glass-epoxy board, occupied area by copper foil : 10.29mm2 , in each layers (Note 5) Mounted on a 4-layer 74.2mmx74.2mmx1.6mm glass-epoxy board, occupied area by copper foil : 5505mm2, in each layers Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions (Ta=-40°C to +105°C) Parameter Symbol Limit Unit Min Typ Max Power Supply Voltage VCC 4.5 5 5.5 V PVCC 4.5 5 5.5 V EN Voltage VEN 0 - 5.5 V Output Current ISW - - 3.0(Note 6) A (Note 6) Pd should not be exceeded. Electrical Characteristics (Ta=25°C VCC=PVCC=5V, VEN=VCC, unless otherwise specified.) Parameter Symbol Limit Unit Conditions Min Typ Max Standby Current ISTB - 0 10 μA EN=GND Active Current ICC - 250 500 μA EN Low Voltage VENL - GND 0.8 V Standby mode EN High Voltage VENH 2.0 VCC - V Active mode EN Input Current IEN - 1 10 μA VEN=5V Oscillation Frequency fOSC 0.8 1 1.2 MHz High Side FET ON-Resistance RONH - 82 115 mΩ PVCC=5V Low Side FET ON-Resistance RONL - 70 98 mΩ PVCC=5V OUTPUT Voltage VOUT 3.25 3.3 3.35 V ITH SInk Current ITHSI 10 18 - μA VOUT=4.1V ITH Source Current ITHSO 10 18 - μA VOUT=2.5V UVLO Threshold Voltage VUVLO1 3.6 3.8 4.0 V VCC=5V to 0V UVLO Release Voltage VUVLO2 3.65 3.9 4.2 V VCC=0V to 5V Soft-Start Time tSS 2.5 5 10 ms Timer Latch Time tLATCH 0.5 1 2 ms Output Short Circuit Threshold Voltage VSCP - 1.65 2.4 V VOUT =3.3V to 0V

Application Information

Operation BD9134MUV is a synchronous step -down switching regulator that achieves fast transient response by employing current mode PWM control system. It utilizes switching operation either in PWM (Pulse Width Modulation) mode for heavier load, or SLLMTM (Simple Light Load Mode) operation for lighter load to improve efficiency. (1) Synchronous Rectifier Integrated synchronous rectification using two MOSFETS reduces power dissipation and increases efficiency when compared to converters using external diodes. Internal shoot-through current limiting circuit further reduces power dissipation. (2) Current mode PWM Control The PWM control signal of this IC depends on two feedback loops, the voltage feedback and the inductor current feedback. (a) PWM (Pulse Width Modulation) Control The clock signal coming from OSC has a frequency of 1Mhz. When OSC sets the RS latch, the P -Channel MOSFET is turned ON and the N -Channel MOSFET is turned OFF. The opposite happens when the current comparator (Current Comp) resets the RS latch i.e. the P -Channel MOSFET is turned OFF and the N -Channel MOSFET is turned ON. Current Comp’s output is a comparison of two signals, the current feedb ack control signal “SENSE” which is a voltage proportional to the current IL, and the voltage feedback control signal, FB. (b) SLLMTM (Simple Light Load Mode) Control When the control mode is shifted by PWM from heavier load to lighter load or vice versa, t he switching pulse is designed to turn OFF with the device held operating in normal PWM control loop. This allows linear operation without voltage drop or deterioration in transient response during the sudden load changes. Although the PWM control loop con tinues to operate with a SET signal from OSC and a RESET signal from Current Comp, it is so designed such that the RESET signal is continuously sent even if the load is changed to light mode where the switching is tuned OFF and the switching pulses disappear. Activating the switching discontinuously reduces the switching dissipation and improves the efficiency. Figure19. Diagram of Current Mode PWM Control

Figure 20. PWM Switching Timing Diagram Figure 21. SLLMTM Switching Timing Diagram

TSZ02201-0J3J0AJ00150-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 03.Oct.2014 Rev.002 www.rohm.com TSZ22111・15・001 4. Switching Regulator Efficiency Efficiency η may be expressed by the equation shown below: Efficiency may be improved by reducing the switching regulator power dissipation factors Pda as follows: Dissipation factors: (1) ON-Resistance Dissipation of Inductor and FET： Pd(I2R) Where: RCOIL is the DC resistance of inductor. RON is the ON-Resistance of FET. IOUT is the Output current. (2) Gate Charge/Discharge Dissipation： Pd(Gate) Where: Cgs is the gate capacitance of FET. F is the switching frequency. V is the gate driving voltage of FET. (3) Switching Dissipation：Pd(SW) Where: F is the reverse transfer capacitance of FET. V is the peak current of gate. (4) ESR Dissipation of Capacitor：Pd(ESR) Where: IRMS is the ripple current of capacitor. ESR is the equivalent series resistance. (5) Operating Current Dissipation of IC：Pd(IC) Where: ICC is the circuit current.   PdP P P P L V I V OUT OUT IN OUT IN IN OUTOUT    ONCOILOUT R R I R IPd   22   DRIVE OUTRSSIN I f I C VSWPd      ESRI ESRPd RMS  2   CCIN I VICPd     2V f C GatePd gs   

Consideration on Permissible Dissipation and Heat Generation

must be carefully considered. charge/discharge dissipation and switching dissipation. D is the ON duty (=VOUT/VCC). RONH is the ON-Resistance of Highside MOSFET. RONL is the ON-Resistance of Lowside MOSFET. dissipation stated above, thermal design must be carried out with sufficient margin. Figure 27. Thermal Derating Curve

BD9134MUV Cautions on PCB Layout

Figure 34. Layout Diagram (2) Layout CITH and RITH between the pins ITH and GND as near as possible with least necessary wiring. Note: VQFN020V4040 (BD9134MUV) has thermal PAD on the reverse of the package.

Recommended Components Lists on Above Application

constants modifie d. Both static and transient characteristics should be considered in establishing these margins. and PVCC pins, and a Schottky Barrier diode or snubber established between the SW and PGND pins.

TSZ02201-0J3J0AJ00150-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 03.Oct.2014 Rev.002 www.rohm.com TSZ22111・15・001 Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply , such as mounting an external diode between the power supp ly and the IC ’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins . Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground a t the reference point of the application board to avoid fluctuations in the small -signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the inte rnal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low -impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may re sult in damaging the IC. Avoid nearby pins being shorted to each other especially to ground , power supply and output pin . Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.

Regarding the Input Pin of the IC

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Figure 36. Example of monolithic IC structure

Thermal Shutdown Circuit(TSD)

the TSD threshold, the circuits are automatically restored to normal operation. is recommended to start up the output with EN after supply voltage is within.

Ordering Information

MUV: VQFN020V4040 Packaging and forming specification E2: Embossed tape and reel Marking Diagram (TOP VIEW) VQFN020V4040 D 9 1 3 4 Part Number Marking LOT Number 1PIN MARK

Revision History

02.Mar.2012 001 New Release 03.Oct.2014 002 Applied the ROHM Standard Style and improved understandability.

Notice – GE Rev.003 © 2014 ROHM Co., Ltd. All rights reserved. Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. I f the flow soldering method is preferred on a surface-mount products , please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification

Notice – GE Rev.003 © 2014 ROHM Co., Ltd. All rights reserved. Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solel y responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Pre caution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Pre caution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of a ny third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise chang ed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties.

Notice – WE Rev.001 © 2014 ROHM Co., Ltd. All rights reserved. General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for failure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information.

Minimum Package Quantity 2500 Packing Type Taping Constitution Materials List inquiry RoHS Yes BD9134MUV - Web Page Distribution Inventory

Product Information

BD9134MUV specifications and overview.

Summary

Synchronous Buck Converter with Integrated FET

Description

Synchronous Buck Converter with Integrated FET

Source title BD9134MUV_14 Datasheet(PDF) - Rohm

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