BD9110NV-E2 | DigiCamel IC Datasheet

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BD9106FVM_14 ROHM | Alldatasheet

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Technical content

Features

 Fast Transient Response because of Current Mode Control System  High Efficiency for All Load Ranges because of Synchronous Switches (Nch and Pch FET) and SLLMTM (Simple Light Load Mode)  Soft-Start Function  Thermal Shutdown and ULVO Functions  Short-Circuit Protection with Time Delay Function  Shutdown Function Application Power Supply for LSI including DSP, Microcomputer and ASIC Typical Application Circuit Key Specifications  Input Voltage Range BD9120HFN: 2.7V to 4.5V BD9106FVM, BD9107FVM: 4.0V to 5.5V BD9109FVM, BD9110NV: 4.5V to 5.5V  Output Voltage Range BD9109FVM: 3.30V ± 2% BD9120HFN: 1.0V to 1.5V BD9107FVM: 1.0V to 1.8V BD9106FVM, BD9110NV: 1.0V to 2.5V  Output Current BD9106FVM, BD9109FVM, BD9120HFN: 0.8A(Max) BD9107FVM: 1.2A(Max) BD9110NV: 2.0A(Max)  Switching Frequency: 1MHz(Typ)  FET ON-Resistance Pch(Typ) / Nch(Typ) BD9110NV: 200mΩ / 150mΩ BD9106FVM, BD9107FVM: 350mΩ / 250mΩ BD9120HFN, BD9109FVM: 350mΩ / 250mΩ  Standby Current: 0μA(Typ)  Operating Temperature Range BD9110NV: -25°C to +105°C BD9120HFN, BD9106FVM: -25°C to +85°C BD9107FVM, BD91 09FVM: -25°C to +85°C Packages W(Typ) x D(Typ) x H(Max) Figure 1. Typical Application Circuit

1 ADJ/VOUT Output voltage detection pin / ADJ for BD9106･07FVM

2 ITH GmAmp output pin/connected to phase compensation capacitor

3 EN Enable pin(active high)

4 GND Ground pin

5 PGND Power switch ground pin

6 SW Power switch node

7 PVCC Power switch supply pin

8 VCC Power supply input pin

1 ADJ Output voltage detection pin

2 VCC Power supply input pin

3 ITH GmAmp output pin/connected to phase compensation capacitor

8 EN Enable pin(active high)

8 VCC

7 PVCC

5 PGND

1 ADJ

2 ITH

4 GND

Figure 2. BD9106FVM, BD9107FVM

1 VOUT

Figure 3. BD9109FVM Figure 4. BD9110NV Figure 5. BD9120HFN

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 TSZ02201-0J3J0AJ00090-1-2 02.Oct.2014 Rev.003 Lineup Operating Temperature Range Input Voltage Range Output Voltage Range Output Current （Max） UVLO Threshold Voltage （Typ） Package Available Part Number -25°C to +85°C 4.0V to 5.5V Adjustable (1.0V to 2.5V) 0.8A 3.4V MSOP8 Reel of 3000 BD9106FVM-TR Adjustable (1.0V to 1.8V) 1.2A 2.7V MSOP8 Reel of 3000 BD9107FVM-TR 2.7V to 4.5V Adjustable (1.0V to 1.5V) 0.8A 2.5V HSON8 Reel of 3000 BD9120HFN-TR -25°C to +10 5°C 4.5V to 5.5V Adjustable (1.0V to 2.5V) 2.0A 3.7V SON00 8V5060 Reel of 2000 BD9110NV-E2 Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Limit Unit BD910xFVM BD9110NV BD9120HFN VCC Voltage VCC -0.3 to +7 (Note 1) -0.3 to +7 (Note 1) -0.3 to +7 (Note 1) V PVCC Voltage PVCC -0.3 to +7 (Note 1) -0.3 to +7 (Note 1) -0.3 to +7 (Note 1) V EN Voltage VEN -0.3 to +7 -0.3 to +7 -0.3 to +7 V SW , ITH Voltage VSW,VITH -0.3 to +7 -0.3 to +7 -0.3 to +7 V Power Dissipation 1 Pd1 0.38 (Note 2) 0.64 (Note 4) 0.63 (Note 6) W Power Dissipation 2 Pd2 0.58 (Note 3) 5.29 (Note 5) 1.75 (Note 7) W Operating Temperature Range Topr -25 to +85 -25 to +105 -25 to +85 °C Storage Temperature Range Tstg -55 to +150 -55 to +150 -55 to +150 °C Maximum Junction Temperature Tjmax +150 +150 +150 °C (Note 1) Pd should not be exceeded. (Note 2) IC only (Note 3) 1-layer. mounted on a 70mm x 70mm x 1.6mm glass-epoxy board (Note 4) IC only (Note 5) 4-layer. mounted on a 74.2mm x 74.2mm x 1.6mm glass-epoxy board, area of copper foil in 1st layer : 5505mm 2 (Note 7) 1-layer. mounted on a 74.2mm x 74.2mm x 1.6mm glass-epoxy board, area of copper foil : 65% Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins o r an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions (Ta=25°C) Parameter Symbol BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN Unit Min Max Min Max Min Max Min Max Min Max EN Voltage VEN 0 VCC 0 VCC 0 VCC 0 VCC 0 VCC V SW Average (Note 8) Pd should not be exceeded.

Electrical Characteristics

◎BD9106FVM (Ta=25°C, VCC=5V, VEN=VCC, R1=20kΩ, R2=10kΩ unless otherwise specified.) Parameter Symbol Min Typ Max Unit Conditions Standby Current ISTB - 0 10 μA EN=GND Bias Current ICC - 250 400 μA EN Low Voltage VENL - GND 0.8 V Standby mode EN High Voltage VENH 2.0 VCC - V Active mode EN Input Current IEN - 1 10 μA VEN=5V Oscillation Frequency fOSC 0.8 1 1.2 MHz Pch FET ON-Resistance (Note 9) RONP - 0.35 0.60 Ω PVCC=5V Nch FET ON-Resistance (Note 9) RONN - 0.25 0.50 Ω PVCC=5V ADJ Voltage VADJ 0.780 0.800 0.820 V Output Voltage (Note 9) VOUT - 1.200 - V ITH Sink Current ITHSI 10 20 - μA ADJ=H ITH Source Current ITHSO 10 20 - μA ADJ=L UVLO Threshold Voltage VUVLOTh 3.2 3.4 3.6 V VCC=H to L UVLO Hysteresis Voltage VUVLOHys 50 100 200 mV Soft Start Time tSS 1.5 3 6 ms Timer Latch Time tLATCH 0.5 1 2 ms (Note 9) Design Guarantee（Outgoing inspection is not done on all products） ◎BD9107FVM (Ta=25°C, VCC=5V, VEN=VCC, R1=20kΩ, R2=10kΩ unless otherwise specified.) Parameter Symbol Min Typ Max Unit Conditions Standby Current ISTB - 0 10 μA EN=GND Bias Current ICC - 250 400 μA EN Low Voltage VENL - GND 0.8 V Standby mode EN High Voltage VENH 2.0 VCC - V Active mode EN Input Current IEN - 1 10 μA VEN=5V Oscillation Frequency fOSC 0.8 1 1.2 MHz Pch FET ON-Resistance (Note 9) RONP - 0.35 0.60 Ω PVCC=5V Nch FET ON-Resistance (Note 9) RONN - 0.25 0.50 Ω PVCC=5V ADJ Voltage VADJ 0.780 0.800 0.820 V Output Voltage (Note 9) VOUT - 1.200 - V ITH Sink Current ITHSI 10 20 - μA VOUT=H ITH Source Current ITHSO 10 20 - μA VOUT=L UVLO Threshold Voltage VUVLOTh 2.6 2.7 2.8 V VCC=H to L UVLO Hysteresis Voltage VUVLOHys 150 300 600 mV Soft Start Time tSS 0.5 1 2 ms Timer Latch Time tLATCH 0.5 1 2 ms (Note 9) Design Guarantee（Outgoing inspection is not done on all products） BD9109FVM (Ta=25°C, VCC=PVCC=5V, VEN= VCC unless otherwise specified.) Parameter Symbol Min Typ Max Unit Conditions Standby Current ISTB - 0 10 μA EN=GND Bias Current ICC - 250 400 μA EN Low Voltage VENL - GND 0.8 V Standby mode EN High Voltage VENH 2.0 VCC - V Active mode EN Input Current IEN - 1 10 μA VEN=5V Oscillation Frequency fOSC 0.8 1 1.2 MHz Pch FET ON-Resistance (Note 9) RONP - 0.35 0.60 Ω PVCC=5V Nch FET ON-Resistance (Note 9) RONN - 0.25 0.50 Ω PVCC=5V Output Voltage (Note 9) VOUT 3.234 3.300 3.366 V ITH Sink Current ITHSI 10 20 - μA VOUT=H ITH Source Current ITHSO 10 20 - μA VOUT=L UVLO Threshold Voltage VUVLO1 3.6 3.8 4.0 V VCC=H to L UVLO Hysteresis Voltage VUVLO2 3.65 3.9 4.2 V VCC=L to H Soft Start Time tSS 0.5 1 2 ms Timer Latch Time tLATCH 1 2 3 ms SCP/TSD operated Output Short Circuit Threshold Voltage VSCP - 2 2.7 V VOUT=H to L (Note 9) Design Guarantee（Outgoing inspection is not done on all products）

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 TSZ02201-0J3J0AJ00090-1-2 02.Oct.2014 Rev.003 Electrical Characteristics – continued ◎BD9110NV (Ta=25°C, VCC=PVCC=5V, VEN=VCC, R1=10kΩ,R2=5kΩ unless otherwise specified.) Parameter Symbol Min Typ Max Unit Conditions Standby Current ISTB - 0 10 μA EN=GND Bias Current ICC - 250 350 μA EN Low Voltage VENL - GND 0.8 V Standby mode EN High Voltage VENH 2.0 VCC - V Active mode EN Input Current IEN - 1 10 μA VEN=5V Oscillation Frequency fOSC 0.8 1 1.2 MHz Pch FET ON-Resistance (Note 9) RONP - 200 320 mΩ PVCC=5V Nch FET ON-Resistance (Note 9) RONN - 150 270 mΩ PVCC=5V ADJ Voltage VADJ 0.780 0.800 0.820 V Output Voltage (Note 9) VOUT - 1.200 - V ITH Sink Current ITHSI 10 20 - μA VOUT=H ITH Source Current ITHSO 10 20 - μA VOUT=L UVLO Threshold Voltage VUVLOTh 3.5 3.7 3.9 V VCC=H to L UVLO Hysteresis Voltage VUVLOHys 50 100 200 mV Soft Start Time tSS 2.5 5 10 ms Timer Latch Time tLATCH 0.5 1 2 ms (Note 9) Design Guarantee（Outgoing inspection is not done on all products） ◎BD9120HFN (Ta=25 °C, VCC=PVCC=3.3V, VEN=VCC, R1=20kΩ , R2=10kΩ unless otherwise specified.) Parameter Symbol Min Typ Max Unit Conditions Standby Current ISTB - 0 10 μA EN=GND Bias Current ICC - 200 400 μA EN Low Voltage VENL - GND 0.8 V Standby mode EN High Voltage VENH 2.0 VCC - V Active mode EN Input Current IEN - 1 10 μA VEN=3.3V Oscillation Frequency fOSC 0.8 1 1.2 MHz Pch FET ON-Resistance (Note 9) RONP - 0.35 0.60 Ω PVCC=3.3V Nch FET ON-Resistance (Note 9) RONN - 0.25 0.50 Ω PVCC=3.3V ADJ Voltage VADJ 0.780 0.800 0.820 V Output Voltage(Note 9) VOUT - 1.200 - V ITH Sink Current ITHSI 10 20 - μA VOUT=H ITH Source Current ITHSO 10 20 - μA VOUT=L UVLO Threshold Voltage VUVLO1 2.400 2.500 2.600 V VCC=H to L UVLO Hysteresis Voltage VUVLO2 2.425 2.550 2.700 V VCC=L to H Soft Start Time tSS 0.5 1 2 ms Timer Latch Time tLATCH 1 2 3 ms SCP/TSD operated Output Short Circuit Threshold Voltage VSCP - VOUTx0.5 VOUTx0.7 V VOUT=H to L (Note 9) Design Guarantee（Outgoing inspection is not done on all products）

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 TSZ02201-0J3J0AJ00090-1-2 02.Oct.2014 Rev.003 4. Switching Regulator Efficiency Efficiency η may be expressed by the equation shown below: Efficiency may be improved by reducing the switching regulator power dissipation factors Pdα as follows: Dissipation factors: (1) ON-Resistance Dissipation of Inductor and FET：Pd(I2R) Where: RCOIL is the DC resistance of inductor RON is the ON-Resistance of FET IOUT is the output current (2) Gate Charge/Discharge Dissipation： Pd(Gate) Where: Cgs is the gate capacitance of FET f is the switching frequency V is the gate driving voltage of FET (3) Switching Dissipation：Pd(SW) Where: CRSS is the reverse transfer capacitance of FET IDRIVE is the peak current of gate (4) ESR Dissipation of Capacitor：Pd(ESR) Where: IRMS is the ripple current of capacitor ESR is the equivalent series resistance (5) Operating Current Dissipation of IC： Pd(IC) Where: ICC is the circuit current    ONCOILOUT R R I R IPd   22   2V f C GATEPd gs      DRIVE OUTRSSIN I f I C VSWPd      ESRI ESRPd RMS  2   CCIN I VICPd     dOUT OUT IN OUT IN IN OUTOUT P P P P P I V I V

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 TSZ02201-0J3J0AJ00090-1-2 02.Oct.2014 Rev.003 8. Recommended Components Lists On Above Application Table1. [BD9106FVM] Symbol Part Value Manufacturer Series L Coil 4.7μH Sumida CMD6D11B TDK VLF5014AT-4R7M1R1 CIN Ceramic capacitor 10μF Kyocera CM316X5R106K10A CO Ceramic capacitor 10μF Kyocera CM316X5R106K10A CITH Ceramic capacitor 750pF Murata GRM18series RITH Resistance VOUT=1.0V 18kΩ ROHM MCR10 1802 VOUT=1.2V 22kΩ ROHM MCR10 2202 VOUT=1.5V 22kΩ ROHM MCR10 2202 VOUT=1.8V 27kΩ ROHM MCR10 2702 VOUT=2.5V 36kΩ ROHM MCR10 3602 Table2. [BD9107FVM] Symbol Part Value Manufacturer Series L Coil 4.7μH Sumida CMD6D11B TDK VLF5014AT-4R7M1R1 CIN Ceramic capacitor 10μF Kyocera CM316X5R106K10A CO Ceramic capacitor 10μF Kyocera CM316X5R106K10A CITH Ceramic capacitor 1000pF Murata GRM18series RITH Resistance VOUT=1.0V 4.3kΩ ROHM MCR10 4301 VOUT=1.2V 6.8kΩ ROHM MCR10 6801 VOUT=1.5V 9.1kΩ ROHM MCR10 9101 VOUT=1.8V 12kΩ ROHM MCR10 1202 Table3. [BD9109VM] Symbol Part Value Manufacturer Series L Coil 4.7μH Sumida CMD6D11B TDK VLF5014AT-4R7M1R1 CIN Ceramic capacitor 10μF Kyocera CM316X5R106K10A CO Ceramic capacitor 10μF Kyocera CM316X5R106K10A CITH Ceramic capacitor 330pF Murata GRM18series RITH Resistance 30kΩ ROHM MCR10 3002 Table4. [BD9110NV] Symbol Part Value Manufacturer Series L Coil 2.2μH TDK LTF5022T-2R2N3R2 CIN Ceramic capacitor 10μF Kyocera CM316X5R106K10A CO Ceramic capacitor 22μF Kyocera CM316B226K06A CITH Ceramic capacitor 1000pF Murata GRM18series RITH Resistance VOUT=1.0V 12kΩ ROHM MCR10 1202 VOUT=1.2V VOUT=1.5V VOUT=1.8V VOUT=2.5V

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 TSZ02201-0J3J0AJ00090-1-2 02.Oct.2014 Rev.003 Table5. [BD9120HFN] Symbol Part Value Manufacturer Series L Coil 4.7μH Sumida CMD6D11B TDK VLF5014AT-4R7M1R1 CIN Ceramic capacitor 10μF Kyocera CM316X5R106K10A CO Ceramic capacitor 10μF Kyocera CM316X5R106K10A CITH Ceramic capacitor 680pF Murata GRM18series RITH Resistance VOUT=1.0V 8.2kΩ ROHM MCR10 8201 VOUT=1.2V 8.2kΩ ROHM MCR10 8201 VOUT=1.5V 4.7kΩ ROHM MCR10 4701 Note:The parts list presented above is an example of recommended parts. Although the parts are the same, actual circuit characteristics should be checked on your application carefully before use. Be sure to allow sufficient margins to accommodate variations between external devices and this IC when employing the depicted circuit with other circuit constants modified. Both static and transient characteristics should be considere d in establishing these margins. When switching noise is substantial and may impact the system, a low pass filter should be inserted between the VCC and PVCC pins, and a schottky barrier diode established between the SW and PGND pins.

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 TSZ02201-0J3J0AJ00090-1-2 02.Oct.2014 Rev.003 Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply , such as mounting an external diode between the power supply and the IC ’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins . Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small -signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequenc e and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low -impedance output pin may subject the IC to stre ss. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground , power supply and output pin . Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.

Regarding the Input Pin of the IC

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Figure 106. Example of monolithic IC structure

Thermal Shutdown Circuit(TSD)

the TSD threshold, the circuits are automatically restored to normal operation.

Ordering Information

NV : SON008V5060 HFN:MSOP8 FVM:HSON8 Packaging and forming specification E2: Embossed tape and reel (SON008V5060,) TR: Embossed tape and reel (MSOP8, HSON8) MSOP8(TOP VIEW) D 9 1 Part Number Marking LOT Number 1PIN MARK 0 6 HSON8 (TOP VIEW) 2 0 Part Number Marking LOT Number 1PIN MARK D 9 1 SON008V5060 (TOP VIEW) B D 9 11 0 Part Number Marking LOT Number 1PIN MARK MSOP8(TOP VIEW) D 9 1 Part Number Marking LOT Number 1PIN MARK 0 7 MSOP8(TOP VIEW) D 9 1 Part Number Marking LOT Number 1PIN MARK 0 9

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN Datasheet www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 TSZ02201-0J3J0AJ00090-1-2 02.Oct.2014 Rev.003 Physical Dimension Tape and Reel information

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN Datasheet www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 TSZ02201-0J3J0AJ00090-1-2 02.Oct.2014 Rev.003 Physical Dimension Tape and Reel information - continued

Revision History

17.Jan.2012 001 New Release 20.Sep.2013 002 Revise the items about Power dissipation 02.Oct.2014 003 Applied the ROHM Standard Style and improved understandability.

Notice – GE Rev.003 © 2014 ROHM Co., Ltd. All rights reserved. Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. I f the flow soldering method is preferred on a surface-mount products , please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification

Notice – GE Rev.003 © 2014 ROHM Co., Ltd. All rights reserved. Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solel y responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Pre caution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Pre caution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of a ny third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise chang ed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties.

Notice – WE Rev.001 © 2014 ROHM Co., Ltd. All rights reserved. General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for failure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information.

Minimum Package Quantity 3000 Packing Type Taping Constitution Materials List inquiry RoHS Yes BD9106FVM - Web Page Distribution Inventory

Product Information

BD9110NV-E2 specifications and overview.

Summary

Synchronous Buck Converter with Integrated FET

Description

Synchronous Buck Converter with Integrated FET

Source title BD9110NV-E2 Datasheet(PDF) - Rohm

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