BD9104FVM-TR

BD9102FVM_13 ROHM | Alldatasheet

Document overview

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Technical content

Features

 Fast Transient Response Because of Current Mode PWM Control System.  Highly Efficient for All Load Ranges Because of Synchronous Rectifier (Nch/Pch FET) and SLLM TM (Simple Light Load Mode)  Soft-Start Function.  Thermal Protection and UVLO Functions.  Short-Circuit Protection with Time Delay Function.  Shutdown Function

Applications

Power supply for HDD, portable electronic devices like PDA, and LSI including CPU and ASIC. Key Specifications  Input Voltage Range BD9102FVM: 4.0V to 5.5V BD9104FVM: 4.5V to 5.5V  Output Voltage Range BD9102FVM: 1.24V ± 2% BD9104FVM: 3.30V ± 2%  Output Current: 0.8A(Max)  Switching Frequency: 1.0MHz(Typ)  Pch FET ON-Resistance: 350mΩ(Typ)  Nch FET ON-Resistance: 250mΩ(Typ)  Standby Current: 0μA(Typ)  Operating Temperature Range: -25°C to +85°C Package W(Typ) x D(Typ) x H(Max) Typical Application Circuit Figure 1. Typical Application Circuit

© 2012 ROHM Co., Ltd. All rights reserved.

1 VOUT Output voltage detect pin

2 ITH Gmamp output pin/Connected to phase compensation capacitor

3 EN Enable pin(Active High)

4 GND Ground pin

5 PGND Power switch ground pin

6 SW Power switch node

7 PVCC Power switch supply pin

8 VCC Power supply input pin

Figure 3. BD9102FVM/ BD9104FVM Block Diagram Figure 2. Pin Configuration

www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 TSZ02201-0J3J0AJ00340-1-2 24.Oct.2013 Rev.003 Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Limit Unit VCC Voltage VCC -0.3 to +7 (Note 1) V PVCC Voltage PVCC -0.3 to +7 (Note 1) V EN Voltage VEN -0.3 to +7 V SW, ITH Voltage SW,ITH -0.3 to +7 V Power Dissipation 1 Pd1 0.38 (Note 2) W Power Dissipation 2 Pd2 0.58 (Note 3) W Operating Temperature Range Topr -25 to +85 °C Storage Temperature Range Tstg -55 to +150 °C Maximum Junction Temperature Tjmax +150 °C (Note 1) Pd should not be exceeded. (Note 2) Using the IC alone (Note 3) Mounted on 1 layer 70mm×70mm×1.6mm Glass Epoxy PCB Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins o r an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions (Ta=25°C) Parameter Symbol BD9102FVM BD9104FVM Unit Min Max Min Max VCC Voltage VCC 4.0 5.5 4.5 5.5 V PVCC Voltage PVCC (Note 4) 4.0 5.5 4.5 5.5 V EN Voltage VEN 0 VCC 0 VCC V SW Average Output Current ISW (Note 4) Pd should not be exceeded.

Electrical Characteristics

BD9102FVM(Ta=25°C,VCC=5V,VEN=VCC unless otherwise specified.) Parameter Symbol Min Typ Max Unit Conditions Standby Current ISTB - 0 10 μA EN=GND Bias Current ICC - 250 400 μA EN Low Voltage VENL - GND 0.8 V Standby Mode EN High Voltage VENH 2.0 VCC - V Active Mode EN Input Current IEN - 1 10 μA VEN=5V Oscillation Frequency fOSC 0.8 1 1.2 MHz Pch FET ON-Resistance (Note 5) RONP - 0.35 0.60 Ω PVCC=5V Nch FET ON-Resistance (Note 5) RONN - 0.25 0.50 Ω PVCC=5V Output Voltage VOUT 1.215 1.24 1.265 V ITH Sink Current ITHSI 10 20 - μA VOUT=H ITH Source Current ITHSO 10 20 - μA VOUT=L UVLO Threshold Voltage VUVLOTh 2.6 2.7 2.8 V VCC=H To L UVLO Hysteresis Voltage VUVLOHys 50 100 200 mV Soft-Start Time tSS 0.5 1 2 ms Timer Latch Time tLATCH 0.5 1 2 ms (Note 5) Design Guarantee (Outgoing inspection is not done on all products )

www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 TSZ02201-0J3J0AJ00340-1-2 24.Oct.2013 Rev.003 Electrical Characteristics - continued BD9104FVM(Ta=25°C,VCC=5V,VEN=VCC unless otherwise specified.) Parameter Symbol Min Typ Max Unit Conditions Standby Current ISTB - 0 10 μA EN=GND Bias Current ICC - 250 400 μA EN Low Voltage VENL - GND 0.8 V Standby Mode EN High Voltage VENH 2.0 VCC - V Active Mode EN Input Current IEN - 1 10 μA VEN=5V Oscillation Frequency fOSC 0.8 1 1.2 MHz Pch FET ON-Resistance (Note 5) RONP - 0.35 0.60 Ω PVCC=5V Nch FET ON-Resistance (Note 5) RONN - 0.25 0.50 Ω PVCC=5V Output Voltage VOUT 3.234 3.300 3.366 V ITH Sink Current ITHSI 10 20 - μA VOUT=H ITH Source Current ITHSO 10 20 - μA VOUT=L UVLO Threshold Voltage VUVLOTh 3.9 4.1 4.3 V VCC=H To L UVLO Hysteresis Voltage VUVLOHys 50 100 200 mV Soft-Start Time tSS 0.5 1 2 ms Timer Latch Time tLATCH 0.5 1 2 ms (Note 5) Design Guarantee (Outgoing inspection is not done on all products )

www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 TSZ02201-0J3J0AJ00340-1-2 24.Oct.2013 Rev.003 4. Switching Regulator Efficiency Efficiency (η) may be expressed by the equation shown below: Efficiency may be improved by reducing the switching regulator power dissipation factors Pdα as follows: Dissipation factors: 1) ON-Resistance dissipation of inductor and FET： Pd(I2R) Where: RCOIL is the DC resistance of inductor. RON is the ON-Resistance of FET . IOUT is the output current. 2) Gate charge/discharge dissipation： Pd(Gate) Where: Cgs is the gate capacitance of FET. f is the switching frequency. V is the gate driving voltage of FET. 3) Switching dissipation： Pd(SW) Where: CRSS is the reverse transfer capacitance of FET . IDRIVE is the peak current of gate. 4) ESR dissipation of capacitor：Pd(ESR) Where: IRMS is the Ripple current of capacitor. ESR is the Equivalent series resistance. 5) Operating current dissipation of IC：Pd(IC) Where: ICC is the Circuit current.     ONCOILOUT R R I R IPd      V f C GatePd gs      DRIVE OUTRSSIN I f I C VSWPd      ESR I ESRPd RMS     CCIN I VICPd     PdP P P P I V I V OUT OUT IN OUT IN IN OUTOUT

© 2012 ROHM Co., Ltd. All rights reserved.

1. BD9102FVM and BD9104FVM Cautions on PC Board Layout

Figure 45. Layout Diagram (1) For the sections drawn with heavy line, use thick conductor pattern as short as possible. (2) Layout the input ceramic capacitor CIN near the PVCC and PGND pins, and the output capacitor CO near PGND pin. (3) Layout CITH and RITH between the pins ITH and GND as close as possible with least necessary wiring.

© 2012 ROHM Co., Ltd. All rights reserved. Figure 46. I/O Equivalent Circuit

www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 TSZ02201-0J3J0AJ00340-1-2 24.Oct.2013 Rev.003 Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply terminals. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small- signal and large-current GND traces, the two ground tr aces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small -signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitor s completely after each process or step. The IC’s power supply should always be turned OFF completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-Pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Terminals Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to the power supply or ground line.

www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 TSZ02201-0J3J0AJ00340-1-2 24.Oct.2013 Rev.003 12. Regarding Input Pins of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic d iodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. 13. Thermal Shutdown Circuit (TSD) The IC incorporates a built-in thermal shutdown circuit, which is designed to turn OFF the IC when the internal temperature of the IC reaches a specified value. It is not designed to protect the IC from damage or guarantee its operation. Do not continue to operate the IC after this function is activated. Do not use the IC in conditions where this function will always be activated. Resistor Transistor (NPN) N N N P P substrate GND Parasitic element Pin A N N P P substrate GND Parasitic element Pin B C B E N GND Pin A Pin B Other adjacent elements E B C GND Parasitic element Parasitic element Example of monolithic IC structure

www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 TSZ02201-0J3J0AJ00340-1-2 24.Oct.2013 Rev.003

Ordering Information

Input Voltage Range Output Voltage Range UVLO Threshold Voltage (Typ) Package Orderable Part Number 4.0V to 5.5V 1.24V±2% 2.7V MSOP8 Reel of 3000 BD9102FVM-TR 4.5V to 5.5V 3.30V±2% 4.1V MSOP8 Reel of 3000 BD9104FVM-TR Marking Diagram (TOP VIEW) (TOP VIEW) BD9102FVM BD9104FVM B D 9 1 0 x F V M - T R Part Number BD9102FVM BD9104FVM Package FVM: MSOP8 Packaging and forming specification TR: Embossed tape and reel MSOP8 D 9 1 Part Number Marking LOT Number 1PIN MARK MSOP8 D 9 1 Part Number Marking LOT Number 1PIN MARK

www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 TSZ02201-0J3J0AJ00340-1-2 24.Oct.2013 Rev.003 Physical Dimension, Tape and Reel information

www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 TSZ02201-0J3J0AJ00340-1-2 24.Oct.2013 Rev.003

Revision History

2.Mar.2012 001 New release 5.Apr.2012 002 Modify Typical Application Circuit 24.Oct.2013 003 • Applied new style and improved understandability.

• Deleted the descriptions of BD9106FVM from this datasheet and summarized it to the datasheet of [BD9106FVM, BD9107FVM, BD9109FVM, BD9110NV,BD9120HFN].
• Add Revision History

Notice - GE Rev.002 © 2014 ROHM Co., Ltd. All rights reserved. Notice Precaution on using ROHM Products 1. Our Products are designed and manufac tured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring ex tremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sale s representative in advance. Unless otherwise agreed in writing by ROHM in advance, RO HM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅣ CLASS Ⅲ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. Accordin gly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products ar e exposed to sea wind or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subjec t to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temper ature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperat ure is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlori ne, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification

Notice - GE Rev.002 © 2014 ROHM Co., Ltd. All rights reserved. Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the Products and external components, including transient characteri stics, as well as static characteristics. 2. You agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for Products use. Theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding t he Products maximum rating will not be applied to Products. Please take special care under dry condit ion (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriora te if the Products are stored in the places where: [a] the Products are exposed to sea winds or corros ive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to di rect sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm sol derability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a hum idity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contain ed in this document is for reference only. ROHM does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whol e or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any wa y whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties.

Notice – WE Rev.001 © 2014 ROHM Co., Ltd. All rights reserved. General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for failure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information.

Minimum Package Quantity 3000 Packing Type Taping Constitution Materials List inquiry RoHS Yes BD9102FVM - Web Page Distribution Inventory