BD88030FV | DigiCamel IC Datasheet

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Document overview

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PDF pages: 29

Technical content

Features

◼ Built-in 2 Channels of 4-bit D/A Converter ◼ Built-in Pseudo-sine Wave Output Circuit (Divided by 1/16 of the External Clock) ◼ External Analog Signal Detection Circuit ◼ Built-in Analog Switch 2 Channels ◼ Built-in Electrostatic Protection Circuit

Applications

◼ Water Heater Key Specifications ◼ Operating Power Supply Voltage Range: 4.5 V to 5.5 V ◼ Circuit Current: 2.5 mA (Typ) ◼ Detection Frequency: 250 kHz (Typ) ◼ Operating Temperature Range: -20 °C to +80 °C Package W (Typ) x D (Typ) x H (Max) SSOP-B16 5.0 mm x 6.4 mm x 1.35 mm Pin Configuration Pin Description Pin No. Pin Name Function

1 OSCIN Resonator connection pin

2 OSCOUT Resonator connection pin

3 FOUT OSC buffer output

4 SCTLB Modulation control signal

5 RESETB Reset signal input

Normally set to "H"

6 AMPOUT

Use it open.

7 AMPIN Amplifier signal input

8 VSS GND pin

9 DOUTB Amplifier input signal

10 SW2OUT Analog switch 2 output

11 SW2IN Analog switch 2 input

12 SOUT-

(anti-phase outputting of SOUT+)

13 SOUT+ Pseudo-sinusoidal output

14 SW1IN Analog switch 1 input

15 SW1OUT Analog switch 1 output

16 VDD Power supply pin

(TOP VIEW) OSCOUT AMPOUT AMPIN FOUT RESETB SCTLB OSCIN SW1IN SW1OUT SOUT- SOUT+ SW2IN SW2OUT VDD

8 VSS 9

© 2022 ROHM Co., Ltd. All rights reserved. 16.Feb.2022 Rev.001 www.rohm.com (Link) TSZ22111 • 15 • 001 BD88030FV Block Diagram Pseudo-Sine Wave Gen Block 4Bit R2R DAC 4Bit R2R DAC Period measurement counter 180° Det/Undet Judge Block Q S R Q OSCIN OSCOUT FOUT SCTLB RESETB AMPOUT AMPIN VSS VDD SW1OUT SW1IN SOUT+ SOUT- SW2IN SW2OUT DOUTB

© 2022 ROHM Co., Ltd. All rights reserved. 16.Feb.2022 Rev.001 www.rohm.com (Link) TSZ22111 • 15 • 001 BD88030FV Absolute Maximum Ratings (Ta = 25 °C) Parameter Symbol Rating Unit Power Supply Voltage VDD -0.3 to +7.0 V Input Voltage VIN -0.3 to VDD + 0.3 V Input Current II ±1 mA Storage Temperature Range Tstg -55 to +125 °C Maximum Junction Temperature Tjmax 125 °C Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in de terioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. Thermal Resistance(Note 1) Parameter Symbol Thermal Resistance (Typ) Unit 1s(Note 3) 2s2p(Note 4) SSOP-B16 Junction to Ambient θJA 140.9 77.2 °C/W Junction to Top Characterization Parameter(Note 2) ΨJT 6 5 °C/W (Note 1) Based on JESD51-2A(Still-Air). (Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3) Using a PCB board based on JESD51-3. (Note 4) Using a PCB board based on JESD51-7. Layer Number of Measurement Board Material Board Size Single FR-4 114.3 mm x 76.2 mm x 1.57 mmt Top Copper Pattern Thickness Footprints and Traces 70 μm Layer Number of Measurement Board Material Board Size 4 Layers FR-4 114.3 mm x 76.2 mm x 1.6 mmt Top 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 μm 74.2 mm x 74.2 mm 35 μm 74.2 mm x 74.2 mm 70 μm Recommended Operating Conditions Parameter Symbol Min Typ Max Unit Operating Supply Voltage Vopr 4.5 5.0 5.5 V Operating Temperature Topr -20 - +80 °C

© 2022 ROHM Co., Ltd. All rights reserved. 16.Feb.2022 Rev.001 www.rohm.com (Link) TSZ22111 • 15 • 001 BD88030FV Electrical Characteristic (VDD = 5 V, VSS = 0 V, Ta = 25 °C unless otherwise specified) (Note 1) Not 100 % Tested Parameter Symbol Limit Unit Conditions Min Typ Max Oscillation-frequency(Note 1) fOSC 1 4 10 MHz Supply Current IDD - 2.5 10.0 mA fOSC = 4 MHz, no load OSCIN "H" Input-voltage VIHOSCIN 0.7VDD - VDD V OSCIN "L" Input-voltage VILOSCIN VSS - 0.3VDD V OSCIN "H" Input Current IIHOSCIN 2 - 12 µA VIN = VDD OSCIN "L" Input Current IILOSCIN -12 - -2 µA VIN = 0 V OSCIN Feedback Resistor(Note 1) ROSCIN 525 700 875 kΩ "H" Input Current IIH1 - - 0.5 µA VIN = VDD, (SCTLB) "L" Input Current IIL1 -0.5 - - µA VIN = 0 V, (SCTLB) "H" Input Voltage VIH1 0.65VDD - VDD V (RESETB, SCTLB) "L" Input Voltage VIL1 VSS - 0.35VDD V (RESETB, SCTLB) RESETB "H" Input Current IIHRESETB - - 0.5 µA VIN = VDD RESETB "L" Input Current IILRESETB -455 - -200 µA VDD = 5 V, VIN = 0 V "H" Output Voltage VOH VDD-0.5 - VDD V IOH = -1 mA, (FOUT, DOUTB) "L" Output Voltage VOL VSS - VSS + 0.6 V IOL = 1 mA, (FOUT, DOUTB) AMPIN "H" Input Current IIHAMPIN 185 - 555 µA VIN = VDD AMPIN "L" Input Current IILAMPIN -240 - -100 µA VIN = 0 V AMP Input Biased Voltage(Note 1) VB - 1.63 - V No load AMP Input Sensitivity VPPIN 0.30 - 0.45 V 250 kHz, no load

0.3 Input voltage below V is not

detected.

0.45 The input voltage of V or higher

is detected. Detection Frequency Range fDETON 236 250 266 kHz fOSC = 4 MHz Non-Detection Frequency Range (Low Frequency) fDETOFF1 - - 216 kHz fOSC = 4 MHz Non-Detection Frequency Range (High Frequency) fDETOFF2 290 - - kHz fOSC = 4 MHz Analog Switch-off Leakage Current IOFFSW - - 1 µA SWxIN = VDD, SWxOUT = 0 V x = 1, 2 Analog Switch-on Resistance RONSW 35 60 105 Ω SWxIN = VDD, SWxOUT = 0 V x = 1, 2 SOUT Maximum Output Amplitude VPPSOUT 0.85VDD - VDD V No load Pseudo-Sine Wave Output Frequency fSOUT - 250 - kHz fOSC = 4 MHz Equivalent Output Impedance ZSOUT 2.8 - 5.2 kΩ No load Pseudo-Sine Wave Output-phase-variation(Note 1) pSOUT -5 - +5 Deg

© 2022 ROHM Co., Ltd. All rights reserved. 16.Feb.2022 Rev.001 www.rohm.com (Link) TSZ22111 • 15 • 001 BD88030FV C E E F F C 1 0 fSOUT @fOSC = 4 MHz 250 kHz Function Description 1. Pseudo-Sine Wave Generation Circuit 4-Bit D/A Converter Block (Transmit Block) The pseudo-sine wave output pins (SOUT+ and SOUT-) output a pseudo-sine wave with a frequency of fOSC/16. The SOUT+ and SOUT- pins are in the opposite phase. The pseudo-sine wave generator and 4-bit D/A converter are shown in the figure below (SOUT+ pin side). The data of the pseudo-sine wave generator is output in the sequence shown in the figure below. Therefore, the pseudo-sine waveform of the positive-phase output and negative-phase output at no load is stepped. An analog switch is incorporated to connect the driver output buffer to the transmission line only when transmitting. However, the driver output buffer connects an emitter follower circuit externally. The phase difference between positive -phase output and negative -phase output is within 180 degrees ±5 degrees. (Pseudo-Sine Wave Output Phase Fluctuation) VSS R R R R LSB MSB R R R R SOUT+2R RR R fosc RST Pseudo-Sine Wave Gen Block SOUT+ SOUT-

© 2022 ROHM Co., Ltd. All rights reserved. 16.Feb.2022 Rev.001 www.rohm.com (Link) TSZ22111 • 15 • 001 BD88030FV Function Description - continued 2. Amplifier Input Circuit, Detection/Non-Detection Circuit (Receiver) The modulation signal input section incorporates a high -low two-level comparator so that an external sine wave can detect only a specified amplitude or more, preventing false detection of signals (e.g., noise signals) with a specified amplitude or less. The detection frequency range (frequency window) is determined by fOSC from 1/18 to 1/14. Detection/non-detection decision conditions control the signal when signals in the frequency window are detected (or not detected) continuously. In this case, fOSC/16 frequency is used as the reference (single wave) and the duration is 9 to 13 waves. Low Detection Comparator APU VDD R1R2 AMPIN APU VSS VSS R4 R3 Reference Voltage VL Reference Voltage VH VBIAS VB High Detection Comparator S Q Period Counter RESET AMPOUT Det/ Undet Judge Block DOUTB Q VA VDD AMPIN Input SineWave Form VH AMP input sensitivity VPP VL Detect Not Detect Not Detect Not Detect AMPOUT Output Timing (RESETB ＝ L) VH VL AMPOUT H Keep L Keep VBIAS<VL VBIAS>VH VH>VBIAS>VL H L L H VA VB AMPOUT VH>VBIAS>VL VBIAS<VL L H H Keep H AMPOUT Output Table VBIAS>VH VBIAS VH>VBIAS>VL

© 2022 ROHM Co., Ltd. All rights reserved. 16.Feb.2022 Rev.001 www.rohm.com (Link) TSZ22111 • 15 • 001 BD88030FV Function Description - continued 3. Transmitter Function Description and Timing Chart When the modulation control inputs (SCTLB) are "H" level, the pseudo -sine wave outputs retain the level of the pseudo-sine wave at phase 0 degrees. When the modulation control input is changed from "H" to "L" level, the output (SOUT+) of the pseudo -sine wave starts from -90 degrees (SOUT- starts from +90 degrees). The time to turn ON at this time is td (ON) < 500 ns. In addition, when the modulation control input is set from "L" to "H" level, the phase is forced regardless of where the phase of the pseudo-sine wave output is. Hold at 0 degrees (pseudo-sine wave output stopped). The time to turn OFF at this time is td (OFF) < 1 μs 4. Receiver Function Description Timing Chart Receive OK. DOUTB pin changes from "H" to "L". tDET is 16CLK minutes of fOSC. It is defined as one wave, and it is within the time of 13 waves from 9 waves when it is considered as a reference. As set by the frequency window. This condition is valid only when the input signal of the period of the range is detected (or not detected) continuously. Note 1: Although the communication protocol is free, provide a time of at least 15 carrier waves for both no signal times.

© 2022 ROHM Co., Ltd. All rights reserved. 16.Feb.2022 Rev.001 www.rohm.com (Link) TSZ22111 • 15 • 001 BD88030FV I/O Equivalence Circuits Pin No. Pin Name Equivalent Circuit Diagram 1, 2 OSCIN OSCOUT 1 2 3,6,9 FOUT AMPOUT DOUTB 3,6,9

4 SCTLB

5 RESETB

7 AMPIN

11, 14 10, 15 SW2IN, SW1IN SW2OUT, SW1OUT 11,14 10,15 12, 13 SOUT- SOUT+ 12,13

© 2022 ROHM Co., Ltd. All rights reserved. 16.Feb.2022 Rev.001 www.rohm.com (Link) TSZ22111 • 15 • 001 BD88030FV Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at t he reference point of the application board to avoid fluctuations in the small -signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal po wering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Testing on Application Boards When test ing the IC on an application board, connecting a capacitor directly to a low -impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due t o many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 9. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conductio n through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line.

Regarding the Input Pin of the IC

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Figure 40. Example of Monolithic IC Structure temperature and the decrease in nominal capacitance due to DC bias and others.

Ordering Information

FV: SSOP-B16 Packaging and forming specifications E2: Reel-like embossed taping Marking Diagram SSOP-B16 (TOP VIEW) 88030 Part Number Marking LOT Number Pin 1 Mark

Revision History

Date Revision Details of revision 16.Feb.2022 001 New Release

Notice-PGA-E Rev.004 © 2015 ROHM Co., Ltd. All rights reserved. Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. I f the flow soldering method is preferred on a surface-mount products , please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification

Notice-PGA-E Rev.004 © 2015 ROHM Co., Ltd. All rights reserved. Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensati on [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Pr ecaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper name s of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties.

Notice – WE Rev.001 © 2015 ROHM Co., Ltd. All rights reserved. General Precaution 1. Before you use our Products, you are requested to caref ully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of an y ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this documen t is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccura cy or errors of or concerning such information.

Product Information

BD88030FV specifications and overview.

Summary

For Gas Water Heaters Interface IC 16.Feb.2022 Rev.001

Description

For Gas Water Heaters Interface IC 16.Feb.2022 Rev.001

Source title BD88030FV Datasheet(PDF) - Rohm

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