BD82A16MUF-M ROHM | Alldatasheet
Document overview
- Manufacturer or author: ROHM CO., LTD.
- PDF pages: 47
Technical content
Features
◼ Nano CapTM Integrated(Note 1) ◼ AEC-Q100 Qualified(Note 2) ◼ Functional Safety Supportive Automotive Products ◼ Current Driver for LED Drive 6ch ◼ Current Mode BuckBoost DC/DC Converters ◼ Load Switch (M1) Control Pin ◼ PWM Dimming (20,000: 1@100 Hz, 100 Hz to 25 kHz) ◼ Analog + PWM Mix Dimming Available ◼ Spread Spectrum Function ◼ DC/DC Converter Oscillat ion Frequency External Synchronization Function ◼ LSI Protect Functions (UVLO, OVP, TSD, OCPL) ◼ LED Anode/Cathode Short Circuit Protection Function ◼ LED Open/Short Protection Function Key Specifications ◼ Input Operating Voltage Range: 3.0 V to 48 V ◼ Output LED Current Absolute Accuracy: ±5.0 %@80 mA ◼ DC/DC Oscillation Frequency: 200 kHz to 2420 kHz ◼ Operating Temperature: -40 °C to +125 °C ◼ LED Maximum Current: 150 mA/ch ◼ LED Maximum Dimming Ratio: 20,000: 1@100 Hz ◼ LED1 to LED6 Pin Maximum Voltage: 50 V Package W (Typ) x D (Typ) x H (Max) VQFN32FBV050 5.0 mm x 5.0 mm x 1.0 mm
Applications
◼ Automotive CID (Center Information Display) Panel ◼ Navigation ◼ Cluster Panel ◼ HUD (Head Up Display) ◼ Other Small and Medium Sized LCD Panels for Automotive Typical Application Circuit Figure 1. BuckBoost Application Circuit Diagram
TSZ02201-0T2T0B200320-1-2 © 2022 ROHM Co., Ltd. All rights reserved. BD82A16MUF-M www.rohm.com TSZ22111 • 15 • 001 05.Jul.2022 Rev.001
Contents
TSZ02201-0T2T0B200320-1-2 © 2022 ROHM Co., Ltd. All rights reserved. BD82A16MUF-M www.rohm.com TSZ22111 • 15 • 001 05.Jul.2022 Rev.001 Pin Configuration (TOP VIEW) Pin Descriptions Pin No. Pin Name Signal type (Note 1) Function 1 REG25 A Internal reference voltage 1: Used as the reference voltage for the internal circuit and charge pump. 2 REG50 A Internal reference voltage 2: Used as the reference voltage for the internal circuit. 5 V is generated and output by setting the EN pin to High. Connect a capacitance of 2.2 μF for phase compensation.
3 RT A Resistor connection for oscillation frequency setting: The oscillation frequency (fOSC) of DC/DC
converter can be set by connecting a resistor (RRT) between the RT pin and the GND pin.
4 SYNC I
External synchronization frequency input / SSCG setting: The internal oscillation frequency can be externally synchronized by inputting an external clock signal to the SYNC pin before the Self Diagnosis is completed. When using spread spectrum mode (SSCG), short the SYNC pin and the REG50 pin beforehand.
5 PWM I PWM dimming signal: The LED current can be controlled according to On Duty of the input PWM
signal.
6 PLSET A
Switching pulse number setting: Addition pulse function is provided to stabilize DC/DC converter output voltage even when PWM Duty is low. The number of switching pulses to be added can be set by the resistance value connected to the PLSET pin.
7 COMP A
Phase compensation capacitor connection: The reference voltage and LED pin voltage generated by REF Voltage block are compared and output by Error AMP. Connect a filter for phase compensation.
8 GND A Small Signal Ground: Use to ground for the external components connected to the REG25,
REG50, RT, PLSET, COMP, ISET, DIMSEL, and OVP pins.
9 ISET A Resistor connection for LED current setting: LED current (ILED) can be set by connecting a
resistor (RISET) between the ISET pin and the GND pin.
10 DIMSEL A
DC dimming setting: The point at which PWM dimming and DC dimming are switched can be set by the resistor connected between the DIMSEL pin and the GND pin. When using only PWM dimming, short the DIMSEL pin with the GND pin. 11 LED1 P LED cathode connection 1: Open drain output of the current driver ch1 for LED drive. Connect to the LED cathode. 12 LED2 P LED cathode connection 2: Open drain output of the current driver ch2 for LED drive. Connect to the LED cathode. 13 LED3 P LED cathode connection 3: Open drain output of the current driver ch3 for LED drive. Connect to the LED cathode. (Note 1) A: Sensitive signal such as detect and reference, I: Input signal from other units P: High current signal susceptible to impedance, including transient current . 9 10 11 12 13 14 1615 32 31 30 29 27 26 2528 EXP-PAD ISET LED1 LED2 LED3 LED4 LED5 LED6 DIMSEL REG25 EN CSH LDSW VCC FAIL CP CPM CPP RT PWM COMP PLSET SYNC REG50 GND EXP-PAD EXP-PAD VDISC BOOT SW OUTL PGND OUTH OVP CSL EXP-PAD EXP-PAD
TSZ02201-0T2T0B200320-1-2 © 2022 ROHM Co., Ltd. All rights reserved. BD82A16MUF-M www.rohm.com TSZ22111 • 15 • 001 05.Jul.2022 Rev.001 Pin Descriptions – continued Pin No. Pin Name Signal type (Note 1) Function 14 LED4 P LED cathode connection 4: Open drain output of the current driver ch4 for LED drive. Connect to the LED cathode. 15 LED5 P LED cathode connection 5: Open drain output of the current driver ch5 for LED drive. Connect to the LED cathode. 16 LED6 P LED cathode connection 6: Open drain output of the current driver ch6 for LED drive. Connect to the LED cathode.
17 CSL A
Overcurrent protection detection input: The current flowing through Low side FET (M2) is converted to voltage by the low side current detection resistor (RCSL) and detected by the CSL pin. When the overcurrent protection (OCPL) is activated, DC/DC converters are switched OFF. 18 OUTL P Low side FET gate signal: Switching signal output of DC/DC converter. The OUTL pin should be connected to Low side FET (M3) gate.
19 PGND P Large current ground: Use for ground for external components connected to the CSL and OUTL
pins. 20 SW P High side FET source signal: Switching signal output of DC/DC converter. The SW pin should be connected to High side FET (M2) source. 21 OUTH P High side FET gate signal: Switching signal output of DC/DC converter. The OUTH pin should be connected to High side FET (M2) gate. 22 BOOT P High side FET gate Power Supply: A power supply that drives the gate of the High side FET (M2). Connect the capacitance between the BOOT pin and the SW pin.
23 OVP A
Overvoltage protection and short circuit protection detection input: When OVP pin voltage rises to 1.0 V or more, overvoltage protection (OVP) is activated, and DC/DC converters are switched OFF. If OVP pin voltage is 0.3 V or less for 13.1 ms, Short Circuit Protection (SCP) is activated, and both DC/DC converter and the current driver are turned OFF.
24 VDISC P
VOUT discharge: Connects to the output of DC/DC converters. When UVLO, TSD, or SCP protective operation is performed, or when PWM Low section is monitored and the operation OFF status is detected, DC/DC output voltage is discharged from the VDISC pin. 25 FAIL O Error output flag: Outputs the status of protective operation from the FAIL pin. Since this pin is open drain outputs, we recommend pulling them up to the REG50 pin.
26 LDSW P
Output for driving the load switch gate: This is the signal output for driving the gate of the load switch. When the input overcurrent protection (OCPH) is activated, the load switch is turned OFF as LDSW pin voltage = VCC voltage.
27 CSH A
Input current detection input: The input current is converted to voltage by the input current detection resistor (RCSH) connected between the VCC-CSH pin, and detected by the CSH pin. Turns the load switch OFF when the input overcurrent protection is activated.
28 VCC P
Power supply voltage input: The input operating voltage range is 3.0 V to 48 V, but when the IC is started, VCC ≥ 5.0 V should be used. The decoupling capacitor (CVCC) between the VCC pin and the GND pin should be close to the IC pin.
29 EN I
Enable input: The EN pin is turned High to activate the internal circuit. The EN pin is judged as Low level at 0.5 V or less, and judged as High level at 2.3 V or more. Avoid using a constant two state input (0.5 V ≤ VEN ≤ 2.3 V). 30 CP P Charge pump output: Connect a capacitance (CCP1) between the CP pin and the PGND pin.
31 CPP P Flying capacitor connection + side: Connect a capacitance (CCP2) between the CPP pin and the
CPM pin.
32 CPM P Flying capacitor connection - side: Connect a capacitance (CCP2) between the CPP pin and the
CPM pin. - EXP- PAD - The center EXP-PAD should be connected to the board ground. The center EXP-PAD and corner EXP-PAD are shorted inside the packaging. (Note 1) A: Sensitive signal such as detect and reference, I: Input signal from other units, O: Output signal to other units, P: High current signal susceptible to impedance, including transient current.
TSZ02201-0T2T0B200320-1-2 © 2022 ROHM Co., Ltd. All rights reserved. BD82A16MUF-M www.rohm.com TSZ22111 • 15 • 001 05.Jul.2022 Rev.001 Block Diagram Soft Start Current Driver PWM COMP GND VCC RT SYNC DC/DC Control LOGIC REG50 Minimum Channel Selector COMP CSH LDSW Internal CLK SSCG OSC SLOPE LDSW Driver PLSET CSL PGND OCPL OVP PROTECT FAIL OPEN Det SHORT Det UVLO TSD SCP OCPH ISET SCP REF Voltage Current Driver DC/DC Control LOGIC LDSW Driver Error AMP PROTECT PROTECT Additional Pulse CH1 CH2 CH3 CH4 CH5 CH6 CP DIMSEL ISET Dimming Control ISET Charge Pump PWM CP CPP CPM FAIL TW LED1 LED2 LED3 LED4 LED5 LED6 OVP EN REG50 REG25 OUTL VDISC VOUT Discharge VREF BOOT OUTH SW
TSZ02201-0T2T0B200320-1-2 © 2022 ROHM Co., Ltd. All rights reserved. BD82A16MUF-M www.rohm.com TSZ22111 • 15 • 001 05.Jul.2022 Rev.001 Description of Blocks Unless otherwise stated, the value in the sentence is the typical value.
1 VREF
Internal reference voltage circuit. By setting the EN pin to High, 5 V is generated and output to the REG50 pin. REG50 voltage is used as the power supply for the internal circui t. Also, this is used to fix each input pin to High voltage outside the IC. Connect CREG50 = 2.2 μF to the REG50 pin as the capacitance for the phase compensation . Note that if CREG50 is not connected, unstable operation such as oscillation will occur.
2 LDSW Driver
Input overcurrent protection circuit. If the voltage between the VCC-CSH pin is 0.2 V or more and continues for 10 μs or more, the input overcurrent protection is activated, and the load switch (M1) is turned OFF as LDSW pin voltage = VCC voltage. Then, after 13.1 ms elapses, the load switch is turned ON. At this time, if the voltage between VCC -CSH is 0.2 V or more, the load switch is turned OFF again. If the voltage between VCC-CSH is 0.2 V or less, Self Diagnosis is performed and restarted. For Self Diagnosis, refer to " 3 Startup Characteristics and Effective Section of Each Protection Function ". The FAIL pin goes Low when the input overcurrent protection is detected.
3 VOUT Discharge
Output voltage discharge circuit. The LEDs may flicker if activated with charges remaining on VOUT. Therefore, VOUT must be discharged at startup. Discharge times may be prolonged only by discharge paths such as the resistor for OVP setting, so an output voltage discharge circuit ( VOUT discharge function) is provided. Residual charges in the output are discharged when DC/DC converters are turned OFF (when the EN falls or the protective function is activated).
4 OSC (Oscillator)
Oscillation frequency generator. The oscillation frequency (f OSC) of DC/DC converter can be set by connecting a resistor for oscillation frequency setting (RRT) between the RT pin and ground. In addition, the oscillation frequency of DC/DC converter can be externally synchronized by inputting the external synchronization frequency (fSYNC) to the SYNC pin. Input the clock signal to be input from the SYNC pin before the Self Diagnosis is completed. For Self Diagnosis, refer to "3 Startup Characteristics and Effective Section of Each Protection Function".
5 SSCG (Spread Spectrum Clock Generator)
Spread spectrum circuit. The spread spectrum function (SSCG) is activated by shorting the SYNC pin and the REG50 pin. Noise peaks can be reduced by periodically changing the oscillation frequency by SSCG. The fluctuation range of the frequency due to SSCG is from 100 % to 92 % of the set oscillation frequency. The oscillation frequency fluctuation cycle is 128/set oscillation frequency.
6 SLOPE
This circuit generates a saw wave that serves as the source of the switching pulse of DC/DC converter. SLOPE output signal and COMP pin voltage are compared and a switching pulse is generated.
7 Minimum Channel Selector
Selector circuit for detecting LED pin voltages. Selects the lowest pin voltage among LED1 to LED6 pin voltages and input it in Error AMP.
8 Error AMP (Error Amplifier)
This is an error amplifier that takes the smallest values of the LED1 to LED6 pin voltage and LED control voltage as inputs. Phase compensation can be set by connecting a resistor and a capacitor to the COMP pin.
9 Soft Start
Soft start circuit for DC/DC converters. This function is used to suppress a steep increase in the coil current at startup and an overshoot in the output voltage. Controls the change in switching Duty by limiting the rising edge of the output of Error AMP (COMP pin voltage).
10 PWM COMP (PWM Comparator)
This comparator compares COMP pin voltage, which is the output of Error AMP, with SLOPE output signal. Controls the duty of the switching pulse of DC/DC converter.
11 Additional Pulse
This circuit adds switching pulses for DC/DC converters. With the Additional pulse function, the LED current can be supplied stably even when the PWM dimming ratio decreases.
12 DC/DC Control LOGIC
This circuit generates the final logic of Low side FET gate signal output from the OUTL pin.
TSZ02201-0T2T0B200320-1-2 © 2022 ROHM Co., Ltd. All rights reserved. BD82A16MUF-M www.rohm.com TSZ22111 • 15 • 001 05.Jul.2022 Rev.001 Description of Blocks - continued
13 Internal CLK
This circuit generates the internal reference clock. It is a clock of 20 MHz and used as a counter or sampling frequency.
14 Dimming Control
This circuit controls the dimming ratio during PWM dimming. PWM dimming and DC dimming can be automatically switched PWM dimming and DC dimming can be automatically switched and controlled by applying a voltage (resist or division of REG50) to the DIMSEL pin. This provides both minute dimming (PWM dimming) at low brightness levels and support for high brightness ranges (DC dimming).
15 Charge Pump
Charge pump circuit. The charge pump output voltage is used for the output drive voltage of the current driver, and can output a stable LED current even when the VCC input voltage is low. By connecting the capacit ance (CCP1) between the CP pin and ground and the capacitance (CCP2) between the CPP-CPM pin, a voltage twice the REG25 pin voltage can be output from the CP pin. 10 μF is recommended for C CP1 and 2.2 μF is recommended for C CP2. When the charge pump function is not used, do not connect capacitance between the CPP-CPM pin and short-circuit the CP pin with the REG50 pin.
16 Current Driver / ISET
Current driver circuit for lighting the LED. The LED current can be set by connecting a resistor to the ISET pin.
17 PROTECT
Outputs the status of protective operation from the FAIL pin. Since this pin are open drain outputs, connect them to the REG50 pin with resistors. If the protection status is not monitored, turn the FAIL pin to OPEN or connect to the GND pin.
17.1 UVLO (Under Voltage Lockout)
Under Voltage Lockout . When the VCC is 2.8 V or less or the REG50 pin voltage is 2.7 V or less, Under Voltage Lockout (UVLO) is activated, and the load switch (M1), DC/DC converter, and current driver turn OFF. When VCC becomes 3.2 V or more and the REG50 pin voltage becomes 3.1 V or more, UVLO is released and the IC restarts from Self Diagnosis. When a UVLO is detected, the outputs of the FAIL pin do not change. When the FAIL pin is pulled up to REG50, FAIL pin voltage will also drop as REG50 decreases.
17.2 TSDLED (Thermal Shutdown for Current Driver)
This is a temperature protection circuit that monitors the vicinity of the current driver on the chip. Prevents chip temperature from rising due to abnormal output current. When the chip temperature rises to 175 °C or more, the temperature protection circuit (TSDLED) is activated, the load switch (M1), DC/DC converter, and current driver are turned OFF, and the FAIL pin is turned Low. When the chip temperature falls 150 °C or less, TSDLED is released, the IC restarts from Self Diagnosis, and the FAIL pin returns to High.
17.3 TSDREG (Thermal Shutdown for REG50)
This is a temperature protection circuit that monitors the vicinity of the REG50 pin on the chip. Prevents chip temperature rising due to the REG50 pin failure. When the chip temperature rises to 175 °C or more, the temperature protection circuit (TSDREG) is activated, and REG50 pin voltage, load switch (M1), DC/DC converter, and current driver turn OFF. When the FAIL pin is pulled up to the REG50 pin, FAIL pin voltage drop as REG50 pin voltage is turned OFF, and the FAIL pin is output to the Low level. When the FAIL pin is pulled up to an external power supply, the FAIL pin is output to High . When the chip temperature falls 150 °C or less, TSDREG is released and the IC restarts from Self Diagnosis.
17.4 TW (Thermal Warning)
Thermal Warning Circuit . When the chip temperature rises to 140 °C or more, the Thermal Warning Circuit (TW) activates and the FAIL pin goes Low. When the chip temperature falls 130 °C or less, the TW is released and the FAIL pin returns to High.
TSZ02201-0T2T0B200320-1-2 © 2022 ROHM Co., Ltd. All rights reserved. BD82A16MUF-M www.rohm.com TSZ22111 • 15 • 001 05.Jul.2022 Rev.001 17. PROTECT – continued
17.5 OCPL (Over Current Protection for Low side)
The voltage is detected by the low side current detection resistor (RCSL) for the current flowing through Low side FET (M2). When CSL pin voltage rises to 0.3 V or more, the overcurrent protection (OCPL) is activated and only the switching of DC/DC converter is stopped. If CSL pin voltage falls less tha n 0.3 V, the overcurrent protection is released and switching resumes. When the OCPL is detected, the outputs of the FAIL pin do not change.
17.6 OVP (Over Voltage Protection)
Output overvoltage protection circuit. When OVP pin voltage (resistor division of DC /DC converter output voltage) becomes 1.0 V or more, the output overvoltage protection circuit (OVP) activates and only the switching of DC/DC converter is stopped. When OVP pin voltage falls 0.95 V or less, OVP is released. The FAIL pin goes Low when OVP is detected.
17.7 OPEN Det (LED Open Detection)
LED open protection circuit. When any of LED1 to LED6 pin voltages is 0.3 V or less and OVP pin voltage is 1.0 V or more, the LED open protection (OPEN Det) is activated and the current driver is latched OFF only for the corresponding LED column. LED open protection is released when VEN = Low or UVLO is detected. When LED open is detected, the FAIL pin goes Low.
17.8 SHORT Det (LED Short Detection)
LED short protection circuit. When LED pin voltage is higher than the threshold for 13.1 ms, the LED short protection (SHORT Det) is activated and the current driver is latched OFF only for the corresponding LED column. The counter is reset when LED pin voltage does not satisfy the detection condition prior to the LED short protection being activated. The short detection threshold is 4.5 V. LED short protection is released when V EN = Low or a UVLO is detected. Counters of 13.1 ms are counted up only when Du ty of LED current is ON. Therefore, the duration until LED short protection is detected varies depending on the input PWM Duty and PWM-DC dimming switching point . The FAIL pin goes Low when LED short is detected. LED short protection is detectable when ON pulse width of the LED current is 20 μs or more.
17.9 SCP (Short Circuit Protection)
Short Circuit Protection circuit. If any of the LED1 to LED6 pin is 0.3 V or less or OVP pin voltage is 0.3 V or less for 13.1 ms, the Short Circuit Protection (SCP) is activated, and the load switch (M1), DC/DC converter, and current driver turn OFF. However, the counters are reset when each pin voltage no longer satisfies the requirement prior to the SCP is activating. The SCP is released when VEN = Low or a UVLO is detected. When SCP is detected, the FAIL pin goes Low. DC/DC converters also attempt to output a higher voltage because the grounded LED pin voltage (lowest LE D pin voltage) is controlled to be V LEDCTL. Depending on the power supply voltage and load conditions, the OVP pin may become 1.0 V or more prior to the SCP being activated, and the LED open protection may be activated first. In this case, the current driver will be turned OFF only in the grounded LED pin, but the LEDs will remain lighting with the current control lost because of a short circuit as well. Even when LED open protection is detected, the FAIL pin goes Low. Abnormality can be detected by monitoring this.
17.10 OCPH (Over Current Protection for High side) / LDSW Driver
Input overcurrent protection circuit. If a condition in which the voltage between the VCC-CSH pin is 0.2 V or more continues for 10 μs or more, the input overcurrent protection (OCPH) is activated, and the load switch (M1), DC/DC converter, and current driver turn OFF. Then, after 13.1 ms elapses, the load switch is turned ON. At this time, if the voltage between VCC-CSH is 0.2 V or more, the load switch, DC/DC converter, and current driv er are turned OFF again. If the voltage between VCC -CSH is less than 0.2 V, Self Diagnosis is performed and restarted. For Self Diagnosis, refer to " 3 Startup Characteristics and Effective Section of Each Protection Function". When the input overcurrent protection is detected, the FAIL pin goes Low.
TSZ02201-0T2T0B200320-1-2 © 2022 ROHM Co., Ltd. All rights reserved. BD82A16MUF-M www.rohm.com TSZ22111 • 15 • 001 05.Jul.2022 Rev.001
17 PROTECT – continued
17.11 ISET Pin Fault Protection (ISET-GND Short Circuit Protection)
ISET pin fault protection circuit. When the resistance value connected to the ISET pin becomes 1 kΩ or less, ISET error protection is activated, and the load switch (M1), DC/DC converter, and current driver are turned OFF. When the resistor connected to the ISET pin becomes 15 kΩ or more, ISET error protection is released, and the load switch (M1), DC/DC converter, and current driver turn ON. When ISET-GND short protection is detected, the FAIL pin goes Low.
17.12 OVP Pin Fault Protection
OVP pin fault protection circuit. If OVP pin voltage is 2.3 V or more or 0.2 V or less or VDISC pin voltage is 47.5 V or more in the Self Diagnosis status after the EN pin starts, OPEN/SHORT error of the resistor connected to OVP is detected and OVP pin fault protection is activated. At this time, the load switch (M1), DC/DC converter, and current driver turn OFF. When VEN = Low or a UVLO is detected, OVP pin fault prot ection is released. When OVP pin fault protection is detected, the FAIL pin is set to Low.
TSZ02201-0T2T0B200320-1-2 © 2022 ROHM Co., Ltd. All rights reserved. BD82A16MUF-M www.rohm.com TSZ22111 • 15 • 001 05.Jul.2022 Rev.001 Description of Blocks - continued Detect Conditions and Operation at Detection of Each Protection Function (All values in the table are typical values) No. Function Detect Condition Detect Operation [Detect] [Release] Load Switch DC/DC Switching Current Driver FAIL (Note 1) Under Voltage Lockout (UVLO) VCC ≤ 2.8 V or VREG50 ≤ 2.7 V VCC ≥ 3.2 V and VREG50 ≥ 3.1 V OFF OFF OFF High Thermal Shutdown (TSDLED) Tj ≥ 175 °C Tj ≤ 150 °C OFF OFF OFF Low Thermal Shutdown(Note 2) (TSDREG) Tj ≥ 175 °C Tj ≤ 150 °C OFF OFF OFF Low (Note 2) Thermal Warning (TW) Tj ≥ 140 °C Tj ≤ 130 °C ON ON ON Low Overcurrent Protection (OCPL) VCSL ≥ 0.3 V VCSL < 0.3 V ON OFF ON High Overvoltage Protection (OVP) VOVP ≥ 1.0 V VOVP ≤ 0.95 V ON OFF ON Low LED Open Protection (OPEN Det) VLEDn ≤ 0.3 V and VOVP ≥ 1.0 V(Note 6) Detects VEN = Low or UVLO ON ON Detect LED Pin OFF Latch Low LED Short Protection (SHORT Det) Detects VLEDn ≥ 4.5 V for 13.1 ms or more(Note 3)(Note 6) Detects VEN = Low or UVLO ON ON Detect LED Pin OFF Latch Low Short Circuit Protection (SCP)(Note 4) Detects VLEDn ≤ 0.3 V or VOVP ≤ 0.3 V for 13.1 ms or more(Note 6) Detects VEN = Low or UVLO OFF OFF OFF Latch Low Input Overcurrent Protection (OCPH)(Note 4) Detects VCC-VCSH ≥ 0.2 V for 10 μs or more VCC-VCSH < 0.2 V OFF OFF (Note 5) OFF (Note 5) Low ISET Pin Fault Protection (ISET SCP) RISET ≤ 1.0 kΩ RISET ≥ 15 kΩ OFF OFF OFF Low
12 OVP Pin
VOVP ≥ 2.3 V or VOVP ≤ 0.2 V or VVDISC ≥ 47.5 V Detects VEN = Low or UVLO OFF OFF OFF Latch Low (Note 1) When the EN pin is Low, if FAIL is pulled up to the REG50 pin, FAIL = Low. When FAIL is pulled up to an external power supply, FAIL = High. (Note 2) Thermal shutdown (TSDREG) detects heat generation in the event of the REG50 pin failure and turns all circuit OFF, including the REG50 pin. When FAIL is pulled up to the REG50 pin, FAIL = Low. When FAIL is pulled up to an external power supply, FAIL = High. (Note 3) LED pin voltage of at least 1ch shall be less than VLEDCTL(Min) x 1.1. When LED pin voltages of all channels are 1.4 V or more, the LED short protection does not operate. In addition, since the 13.1 ms counter is counted up only when Duty of the LED current is ON, the time until SHORT Det is detected varies depending on PWM Duty. (Note 4) When Short Circuit Protection (SCP) and input overcurrent protection (OCPH) are detected at the same time, the operation of i nput overcurrent protection takes precedence. (Note 5) When 13.1 ms elapses after the load switch is turned OFF, the load switch turns ON. At this time, when the voltage between VC C-CSH ≥ 0.2 V, the load switch is turned OFF again. When the voltage between VCC-CSH < 0.2 V, Self Diagnosis is performed and restarted. For Self Diagnosis, refer to "3 Startup Characteristics and Effective Section of Each Protection Function". (Note 6) n = 1 to 6
TSZ02201-0T2T0B200320-1-2 © 2022 ROHM Co., Ltd. All rights reserved. BD82A16MUF-M www.rohm.com TSZ22111 • 15 • 001 05.Jul.2022 Rev.001 Absolute Maximum Rating (Ta = 25 °C) Parameter Symbol Rating Unit OVP, VDISC, LDSW, CSH, VCC Pin Voltage VOVP, VVDISC, VLDSW, VCSH, VCC -0.3 to +50 V BOOT, OUTH pin voltage VBOOT, VOUTH -0.3 to +55 V Voltage Between VCC-LDSW Pin VCC - VLDSW -0.3 to +7.0 V LED1, LED2, LED3, LED4, LED5, LED6 Pin Voltage VLED1, VLED2, VLED3, VLED4, VLED5, VLED6 -0.3 to +50 V RT, PLSET, COMP, ISET, DIMSEL, CSL, OUTL Pin Voltage VRT, VPLSET, VCOMP, VISET, VDIMSEL, VCSL, VOUTL -0.3 to VREG50 V REG25, REG50 Pin Voltage VREG25, VREG50 -0.3 to +7.0 V SYNC, PWM, FAIL, EN, CP, CPP, CPM Pin Voltage VSYNC, VPWM, VFAIL, VEN, VCP, VCPP, VCPM -0.3 to +7.0 V Storage Temperature Range Tstg -55 to +150 °C Maximum Junction Temperature Tjmax 150 °C Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins o r an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. Thermal Resistance(Note 1) Parameter Symbol Thermal Resistance (Typ) Unit 1s(Note 3) 2s2p(Note 4) VQFN32FBV050 Junction to Ambient θJA 97.3 30.7 °C/W Junction to Top Characterization Parameter(Note 2) ΨJT 10.0 7.0 °C/W (Note 1) Based on JESD51-2A (Still-Air). The BD82A16MUF-M chip is used. (Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3) Using a PCB board based on JESD51-3. (Note 4) Using a PCB board based on JESD51-5, 7. Layer Number of Measurement Board Material Board Size Single FR-4 114.3 mm x 76.2 mm x 1.57 mmt Top Copper Pattern Thickness Footprints and Traces 70 μm Layer Number of Measurement Board Material Board Size Thermal Via(Note 5) Pitch Diameter Top 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 μm 74.2 mm x 74.2 mm 35 μm 74.2 mm x 74.2 mm 70 μm (Note 5) This thermal via connect with the copper pattern of layers 1,2, and 4. The placement and dimensions obey a land pattern.
TSZ02201-0T2T0B200320-1-2 © 2022 ROHM Co., Ltd. All rights reserved. BD82A16MUF-M www.rohm.com TSZ22111 • 15 • 001 05.Jul.2022 Rev.001 Recommended Operating Conditions Parameter Symbol Operating Range Unit Min Max Power Supply Voltage(Note 1) VCC 3.0 48 V DC/DC Oscillation Frequency Range fOSC 200 2420 kHz PWM Frequency Range(Note 2) fPWM 0.1 25 kHz External Synchronized Frequency Range(Note 3) fSYNC Higher of 200 or fOSC x 0.8 Lower of 2420 or fOSC kHz External Synchronized Pulse Duty Range(Note 4) fSDUTY 40 60 % LED Current Setting Range(Note 5) ILED 50 150 mA Operating Temperature Topr -40 +125 °C (Note 1) When IC are started, VCC ≥ 5.0 V should be set. VCC (Min) = 3.0 V is the minimum value of VCC that can operate the IC alone. The minimum value of power supply voltage that can be set varies depending on the connected LED load and external components. (Note 2) Generally, flickering of LEDs is easier to see when the dimming frequency is set lower than 100 Hz. Check with the actual application evaluation. (Note 3) When the external synchronization function is not used, connect the SYNC pin to the REG50 pin (SSCG = ON) or connect to the GND pin (SSCG = OFF) or OPEN (SSCG = OFF). (Note 4) When using the external synchronous function, switching from the external synchronous state to the internal oscillation frequ ency is not possible during stable operation. (Note 5) The amount of current per channel. Set the LED current so that the maximum junction temp erature (Tjmax) is not exceeded. Operating Conditions (External Constant Range) Parameter Symbol Operating Range Unit Min Typ Max REG25 Capacitance CREG25 0.10 0.22 0.47 μF REG50 Capacitance CREG50 1.0 2.2 4.7 μF LED Current Setting Resistor RISET 18.0 31.2 50.0 kΩ Oscillation Frequency Setting Resistor RRT 4.0 33.3 45.0 kΩ Input Capacitance 1 CVCC 1(Note 6) - - μF Input Capacitance 2 CINVCC(Note 7) 10(Note 6) - - μF Output Capacitance CVOUT 20(Note 6) - 100 μF Charge Pump Capacitance 1 CCP1 4.7 10.0 20.0 μF Charge Pump Capacitance 2 CCP2 1.0 2.2 4.7 μF Resistor for the OVP Pin Setting (Low Side) ROVP1 10 - 20 kΩ Resistor for the OVP Pin Setting (High Side) ROVP2 300 - 800 kΩ Resistor for Unused Channels Setting (Low Side)(Note 8) RLED1 10 20 30 kΩ Resistor for Unused Channels Setting (High Side)(Note 8) RLED2 40 100 180 kΩ (Note 6) Set the capacitance so that it does not fall below the minimum value in consideration of temperature characteristics, DC bias characteristics, etc. (Note 7) CINVCC means the sum of CIN and CVCC. If a capacity of 10 μF or more is connected to CVCC, the capacity of CIN is not required. (Note 8) The ratio of RLED1 to RLED2 should be between 1:4 and 1:6.
TSZ02201-0T2T0B200320-1-2 © 2022 ROHM Co., Ltd. All rights reserved. BD82A16MUF-M www.rohm.com TSZ22111 • 15 • 001 05.Jul.2022 Rev.001
Electrical Characteristics
(Unless otherwise specified, VCC = 12 V, Ta = -40 °C to +125 °C) Parameter Symbol Standard Value Unit Conditions Min Typ Max VCC Voltage at Startup VCC_start 5.0 12.0 48.0 V Operating VCC Voltage(Note 1) VCC_active 3.0 12.0 48.0 V Circuit Current ICC - - 20 mA VEN = 5 V, VSYNC = 0 V, VPWM = 0 V, CVCC = 10 μF, RRT = OPEN, RISET = OPEN Standby Current IST - 0 20 μA VEN = Low [REGURATOR] Reference Voltage VREG50 4.5 5.0 5.5 V IREG50 = 5 mA load, CREG50 = 2.2 μF [DC/DC Converter] OUTH Pin High Side ON Resistor RONHH 2.5 5.0 10.0 Ω IOUTH = 10 mA load OUTH Pin Low Side ON Resistor RONHL 0.8 2.5 5.5 Ω IOUTH = 10 mA input OUTL Pin High Side ON Resistor RONLH 3.7 7.5 15.0 Ω IOUTL = 10 mA load OUTL Pin Low Side ON Resistor RONLL 1.2 2.5 5.0 Ω IOUTL = 10 mA input LED Control Voltage 1 VLEDCTL1 0.4 0.5 0.6 V RISET = 50 kΩ LED Control Voltage 2 VLEDCTL2 0.68 0.83 0.98 V RISET = 18 kΩ COMP Sink Current ICOMPSINK 170 250 330 μA RISET = 18 kΩ, VCOMP = 1.0 V, VLEDn = 1.5 V (n = 1 to 6) COMP Source Current ICOMPSOURCE -330 -250 -170 μA RISET = 18 kΩ, VCOMP = 1.0 V, VLEDn = 0.0 V (n = 1 to 6) Oscillation Frequency 1 fOSC1 270 300 330 kHz RRT = 33.3 kΩ Oscillation Frequency 2 fOSC2 1980 2200 2420 kHz RRT = 4.0 kΩ Max Duty(Note 2)(Note 3) DUTY_MAX 96.5 98.0 - % RRT = 33.3 kΩ Switching OFF Time(Note 3) tSWOFF - 67 130 ns RRT = 33.3 kΩ [Charge Pump] Charge Pump Frequency fCP 250.0 312.5 375.0 kHz CCP2 = 2.2 μF Charge Pump Output Voltage VCP 4.5 5.0 5.5 V CCP1 = 10 μF, CCP2 = 2.2 μF, VREG50 = 3.0 V (Note 1) The minimum value of 3.0 V for VCC is the minimum value of VCC that can operate the IC alone. The minimum value of power supply voltage that can be set varies depending on the connected LED load and external components. (Note 2) For the switching Duty required for applications, refer to the 2.13 Switching Duty Required for Applications. (Note 3) Max Duty can be calculated using (1-tSWOFF) x fOSC.
TSZ02201-0T2T0B200320-1-2 © 2022 ROHM Co., Ltd. All rights reserved. BD82A16MUF-M www.rohm.com TSZ22111 • 15 • 001 05.Jul.2022 Rev.001 Electrical Characteristics – continued (Unless otherwise specified, VCC = 12 V, Ta = -40 °C to +125 °C) Parameter Symbol Standard Value Unit Conditions Min Typ Max [PROTECT] UVLO Release Voltage (VCC) VUVLOVCC1 3.00 3.20 3.40 V VCC: Sweep up UVLO Detect Voltage (VCC) VUVLOVCC2 2.65 2.80 2.95 V VCC: Sweep down UVLO Release Voltage (REG50) VUVLOREG1 2.90 3.10 3.30 V VREG50: Sweep up UVLO Detect Voltage (REG50) VUVLOREG2 2.55 2.70 2.85 V VREG50: Sweep down OCP Detect Voltage VOCPL 0.27 0.30 0.33 V VCSL: Sweep up Input OCP Detect Voltage VOCPH 0.17 0.20 0.23 V VCC-VCSH: Sweep down LDSW Operation Voltage at Input OCP Release VLDSW 4.4 5.4 6.4 V VCSH = VCC VCC-VLDSW OVP Detect Voltage 1 VOVP1 0.95 1.00 1.05 V VOVP = Sweep up OVP Detect Voltage 1 Hysteresis Width VOVP1HYS 0.03 0.05 0.07 V VOVP = Sweep down OVP Detect Voltage 2 (VDISC Pin) VOVP2 45 47 49 V VVDISC = Sweep up LED Open Protection Detect Voltage VOPEN 0.2 0.3 0.4 V VLEDn = Sweep down (n = 1 to 6), VOVP > 2.0 V LED Anode SCP Detect Voltage VSCP1 0.2 0.3 0.4 V VOVP = Sweep down LED Cathode SCP Detect Voltage VSCP2 0.2 0.3 0.4 V VLEDn = Sweep down (n = 1 to 6) LED Anode SCP Detect Delay Time tSCP1 10.5 13.1 15.7 ms LED Cathode SCP Detect Delay Time tSCP2 10.5 13.1 15.7 ms LED Short Protection Detect Voltage VSHORT 4.2 4.5 4.8 V VLEDn = Sweep up (n = 1 to 6) LED Short Protection Detect Delay Time tSHORT 10.5 13.1 15.7 ms PWM = 100 % DIMSEL = GND FAIL Pin ON Resistor RFAIL - - 2.0 kΩ
TSZ02201-0T2T0B200320-1-2 © 2022 ROHM Co., Ltd. All rights reserved. BD82A16MUF-M www.rohm.com TSZ22111 • 15 • 001 05.Jul.2022 Rev.001 Electrical Characteristics – continued (Unless otherwise specified, VCC = 12 V, Ta = -40 °C to +125 °C) Parameter Symbol Standard Value Unit Conditions Min Typ Max [Current Driver] LED Current Absolute Variation 1 ILEDn(Note 3) 76.0 80.0 84.0 mA RISET = 31.2 kΩ, PWM = 100 %(Note 2) LED Current Relative Variation 1(Note 1) ILEDREL 0 - 3.0 % RISET = 31.2 kΩ, PWM = 100 %(Note 2) ISET-GND Short Protection Resistor RISETLIM - 1.0 - kΩ DIMSEL = GND PWM Dimming Minimum Pulse Width tPWMMIN 0.5 - - μs fPWM = 100 Hz to 25 kHz, ILEDn = 50 mA to 150 mA (n = 1 to 6) PWM Dimming Frequency fPWM 0.1 - 25.0 kHz PWM Low Section Detect Time tPWML 10.5 13.1 15.7 ms [PLSET Pin] No Additional Pulse Setting Voltage VPLSET0 GND VREG50 x 0.10 VREG50 x 0.15 V Additional 2 Pulse Setting Voltage VPLSET2 VREG50 x 0.25 VREG50 x 0.30 VREG50 x 0.35 V Additional 4 Pulse Setting Voltage VPLSET4 VREG50 x 0.45 VREG50 x 0.50 VREG50 x 0.55 V Additional 8 Pulse Setting Voltage VPLSET8 VREG50 x 0.65 VREG50 x 0.70 VREG50 x 0.75 V Additional 12 Pulse Setting Voltage VPLSET12 VREG50 x 0.85 VREG50 x 0.90 VREG50 V PLSET Pin Inrush Current IPLSET -1 0 +1 µA [DIMSEL Pin] Setting Voltage for PWM Dimming only VDIMSEL1 GND VREG50 x 0.10 VREG50 x 0.15 V PWM-DC Switching 12.5 % Setting Voltage VDIMSEL2 VREG50 x 0.25 VREG50 x 0.30 VREG50 x 0.35 V PWM-DC Switching 25 % Setting Voltage VDIMSEL3 VREG50 x 0.65 VREG50 x 0.70 VREG50 x 0.75 V PWM-DC Switching 50 % Setting Voltage VDIMSEL4 VREG50 x 0.85 VREG50 x 0.90 VREG50 V DIMSEL Pin Inrush Current IDIMSEL -1 0 +1 µA (Note 1) ILEDREL = (Maximum value of ILED1 to ILED6 - Minimum value of ILED1 to ILED6) / (Maximum value of ILED1 to ILED6 + Minimum value of ILED1 to ILED6) x 100 (Note 2) When PWM Duty is lower than 100 %, it is larger than the variation described. (Note 3) n = 1 to 6
TSZ02201-0T2T0B200320-1-2 © 2022 ROHM Co., Ltd. All rights reserved. BD82A16MUF-M www.rohm.com TSZ22111 • 15 • 001 05.Jul.2022 Rev.001 Electrical Characteristics – continued (Unless otherwise specified, VCC = 12 V, Ta = -40 °C to +125 °C) Parameter Symbol Standard Value Unit Conditions Min Typ Max [EN Pin] Input High Voltage (EN) VINH1 2.3 - - V Input Low Voltage (EN) VINL1 - - 0.5 V Input Resistor (EN) RIN1 50 100 150 kΩ VEN = 5 V [PWM, SYNC Pin] Input High Voltage (PWM, SYNC) VINH2 2.3 - - V Input Low Voltage (PWM, SYNC) VINL2 - - 0.5 V Input Resistor (PWM, SYNC) RIN2 50 100 150 kΩ VPWM = 5 V, VSYNC = 5 V
TSZ02201-0T2T0B200320-1-2 © 2022 ROHM Co., Ltd. All rights reserved.
1 Current Driver
current can be adjusted by the resistance value between the ISET pin and GND.
1.1 How to Set LED Current
1.2 Dimming Control of LED Current
1.2.1 When Using only PWM Dimming
1.2.2 When Switching Between PWM Dimming and
1.3 LED Pin Handling of Unused Channels
1.4 PWM Low Section Detect Function
1.5 When Setting the LED Current Above 150 mA
The LED current ILED can be calculated using the following equation. kΩ is recommended for RISET. When RISET ≤ 1.0 kΩ, ISET pin short protection is activated and the output of the LED current is stopped. Figure 10. ILED vs RISET
TSZ02201-0T2T0B200320-1-2 © 2022 ROHM Co., Ltd. All rights reserved.
1 Current Driver – continued
dimming, the input PWM signal is sampled synchronously with the IC Internal CLK = 20 MHz (Typ). since the sampled input PWM signal changes within ±2 CLK, the change is not reflected. Figure 11. Section That Does Not Accept Changes in Input PWM Width The current dimming control can be selected from the following two methods. is less than 0.5 μs, the pulse time is shorter than the PWM dimming minimum pulse width, so it cannot be used regularly. PWM Duty should be 0.25 μs or more. If the step width of the input PWM Duty is less than 0.25 μs, the LEDs may flicker.
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1.2 Dimming Control of LED Current – continued
1.2.2 When Switching Between PWM Dimming and DC Dimming Automatically
which PWM dimming and DC dimming are switched can be set using DIMSEL pin voltages as shown in the table below. times for 25 %, and 2 times for 50 %. no problem with using this area transiently. Figure 12. How to Set PWM-DC Dimming Switching Point Figure 13. PWM-DC Dimming Switching Points 50 %, 25 %, and 12.5 %
TSZ02201-0T2T0B200320-1-2 © 2022 ROHM Co., Ltd. All rights reserved. This model has six built-in constant current circuits. REG50 with 100 kΩ and pull down to GND with 20 kΩ. connected to the LED pin should be 470 pF or less. Figure 14. To Set LED6 to Unused switching operation is restarted. LED1 to LED6 pins can be used in bundles. by the ISET pin can be passed. Figure 15. Application Example When the LED Pin Is Shorted
TSZ02201-0T2T0B200320-1-2 © 2022 ROHM Co., Ltd. All rights reserved.
2 DC/DC Converters
PWM COMP block. A switching signal is output to the OUTL pin through DC/DC Control LOGIC.
2.1 LED Pin Control Voltage VLEDCTL
2.2 VCC Input Voltage and Series Number of LED
2.3 LED Variation and Series Number
2.4 Overvoltage Protection Function OVP
2.5 DC/DC Converter Oscillation Frequency fOSC
2.6 Setting the low side current detection resistor (RCSL)
2.7 Setting the Coil Constant
2.8 Setting the high side current detection resistor
2.9 Additional Pulse Function
2.10 External Synchronization / Spread Spectrum
2.11 LSDET Function
2.12 VOUT Discharge Function
2.13 Switching Duty Rquired for Applications
2.14 Fluctuation of LED urrent due to ripple voltage
The relation between LED pin control voltage (VLEDCTL) and RISET resistance is shown in the table below. Figure 16. Relation Between LED Pin Control Voltage (VLEDCTL) and RISET
2.2 VCC Input Voltage and Series Number of LED Elements
TSZ02201-0T2T0B200320-1-2 © 2022 ROHM Co., Ltd. All rights reserved.
2 DC/DC Converters – continued
the number of LED series and Vf characteristics so that the LED short protection does not malfunction. The short detection threshold becomes 4.5 V. Refer to 17.8 SHORT Det (LED Short Detection) for details. protection detect voltage 2 (VDISC pin). Figure 17. OVP Peripheral Circuit Diagram
TSZ02201-0T2T0B200320-1-2 © 2022 ROHM Co., Ltd. All rights reserved. value exceeds the recommended range of 200 kHz to 2420 kHz. Figure 18. fOSC vs RRT
TSZ02201-0T2T0B200320-1-2 © 2022 ROHM Co., Ltd. All rights reserved. BD82A16MUF-M www.rohm.com TSZ22111 • 15 • 001 05.Jul.2022 Rev.001 The low side current detection resistor (RCSL) allows to set the overcurrent protection detection current. Set to satisfy the following formula. 𝐼𝑂𝐶𝑃𝐿(𝑀𝐼𝑁) = 𝑉𝑂𝐶𝑃𝐿(𝑀𝐼𝑁) 𝑅𝐶𝑆𝐿⁄ > 𝐼𝐿(𝑀𝐴𝑋) 𝐼𝑂𝐶𝑃𝐿(𝑀𝐼𝑁) : Overcurrent protection detection current minimum value 𝑉𝑂𝐶𝑃𝐿(𝑀𝐼𝑁) : Overcurrent protection detection voltage minimum value (0.27 V) 𝑅𝐶𝑆𝐿 : CSL pin connection resistance 𝐼𝐿(𝑀𝐴𝑋) : Coil peak current maxmum value To ensure stable operation of DC/DC converters, the following conditions are recommended for the coil inductance value. 𝑅𝑅𝑇 × 𝑅𝐶𝑆𝐿 × (𝑉𝑂𝑈𝑇(𝑀𝐴𝑋) − 𝑉𝐶𝐶(𝑀𝐼𝑁)) 𝐿⁄ ≤ 5.16 × 109 𝑅𝑅𝑇 : RT pin connecting resistor 𝑅𝐶𝑆𝐿 : CSL pin connecting resistor 𝑉𝑂𝑈𝑇 : DC/DC converter output voltage 𝑉𝐶𝐶 : Input voltage 𝐿 : Inductance value Lowering the value on the left side increases stability, but decreases responsiveness. Take the dispersion of inductance value into consideration and set it with sufficient margin.
2.8 Setting the high side current detection resistor (RCSH)
The high side current detection resistor (RCSH) allows to set the input overcurrent protection detection current. Set to satisfy the following formula. 𝐼𝑂𝐶𝑃𝐻(𝑀𝐼𝑁) = 𝑉𝑂𝐶𝑃𝐻(𝑀𝐼𝑁) 𝑅𝐶𝑆𝐻⁄ > 𝐼𝑂𝐶𝑃𝐿(𝑀𝐴𝑋) = 𝑉𝑂𝐶𝑃𝐿(𝑀𝐴𝑋) 𝑅𝐶𝑆𝐿⁄ 𝐼𝑂𝐶𝑃𝐻(𝑀𝐼𝑁) : Input overcurrent protection detection current minimum value 𝑉𝑂𝐶𝑃𝐻(𝑀𝐼𝑁) : Input overcurrent protection detection voltage minimum value (0.17 V) 𝑅𝐶𝑆𝐻 : CSH pin connection resistance 𝐼𝑂𝐶𝑃𝐿(𝑀𝐴𝑋) : Overcurrent protection detection current maxmum value 𝑉𝑂𝐶𝑃𝐿(𝑀𝐴𝑋) : Overcurrent protection detection voltage maxmum value (0.33 V) 𝑅𝐶𝑆𝐿 : CSL pin connection resistance
TSZ02201-0T2T0B200320-1-2 © 2022 ROHM Co., Ltd. All rights reserved. PWM input signal, and the LED can be turned on normally. Figure 19. Pulse Addition Function figure below, it can connect R PLSET1, RPLSET2 and set the number of switching pulses to be added by the resistance ratio. Examples of resistance values are shown in the table below. Figure 20. Additional Pulse Number Setting Method and prior to starting. It is not possible to change the setting of the number of switching pulses to be added after startup.
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2.10 External Synchronization / Spread Spectrum Function (SSCG)
precede the input to the EN pin. Mode 1: When the SYNC pin is GND or OPEN, the DC/DC converter switches at a fixed frequency determined by the RRT. Figure 21. Spread Spectrum Function Timing Chart The amount of noise reduction during SSCG S [dB] can be roughly estimated by the following equation. When not using SSCG function, short the SYNC pin and the GND pin. SSCG function cannot be turned ON/OFF during operation. Figure 22. Spread Spectrum Function
1 GND or OPEN Fixed Frequency Mode Determined by RRT
2 VREG50 Spread Spectrum Mode of the Frequency
3 Pulse Input Mode to Synchronize with the Frequency Input to
TSZ02201-0T2T0B200320-1-2 © 2022 ROHM Co., Ltd. All rights reserved.
0.3 V (Typ)
1.5 V (Typ)
2.10 External Synchronization / Spread Spectrum Function (SSCG) – continued
using external synchronization, SSCG cannot be used.
1.5 V (Typ), the DC/DC converter is turned OFF and the COMP
voltage drops VLEDCTL x 1.1 or less. example when LED6 becomes open. further. In conjunction with this, OVP pin voltage also rises. of DC/DC converter, the LED open protection is activated. Figure 23. LSDET Function When LEDs Are Open The LEDs may flicker if activated with charges remaining on VOUT. Therefore, discharging of VOUT is required at startup. However, discharging of the charge may take a long time only by the discharge path such as the resistor for OVP setting. discharge time tDISC is expressed by the following equation.
TSZ02201-0T2T0B200320-1-2 © 2022 ROHM Co., Ltd. All rights reserved.
2.13 Switching Duty Required for Applications
operating conditions of the application components. Finally, check the actual operation.
2.14 Fluctuation of LED current due to ripple voltage during PWM dimming
not appear to flicker. Be sure to evaluate on the actual board and check from a visual point of view. Figure 24. VLED and ILED timing chart during PWM dimming
TSZ02201-0T2T0B200320-1-2 © 2022 ROHM Co., Ltd. All rights reserved. BD82A16MUF-M www.rohm.com TSZ22111 • 15 • 001 05.Jul.2022 Rev.001 Functional Descriptions - continued
3 Startup Characteristics and Effective Section of Each Protection Function
3.1 When PWM Duty Is 100 %
The timing chart at startup and the effective section of each protection function are shown in the figure below. ① Power ON: Input EN voltage after the VCC voltage is input. ② Self Diagnosis: Determines the channels to be used, sets the number of additional pulses, and sets PWM/DC dimming, etc. Self Diagnosis is completed after 13.1 ms (Typ), and the diagnostic status is latched. ③ PWM signal detection: When PWM = High has elapsed 13.1 ms, it recognizes that PWM = 100 % and begins the startup. ④ Pre-boost(Note 1): Outputs switching until the OVP pin voltage reaches 1.0 V and boosting is performed. ⑤ Stable operation transition section: DC/DC switching is turned OFF. The output voltage of DC/DC converter drops according to the LED current. ⑥ Stable state: When LED voltage (the lowest voltage in LED1 to LED6) drops to LED control voltage x 1.1, DC/DC converter switches again. (Note 1) Because a higher switching Duty is required than stable state, Pre -boost may not be completed depending on operating conditions and c omponent conditions. Contact us for details. ② Self Diagnosis 13.1 ms (Typ) ・Determination of CH to use ・Setting the number of additional pulse ・PWM/DC dimming setting ・OVP pin fault detection VCC 1.0 V VPWM VOVP ILED VOUTH VOUTL VLED LED Control Voltage × 1.1 Under Voltage Lockout (UVLO) Effective when EN = High Overcurrent Protection (OCPL) Effective when UVLO is released LED Open Protection / FAIL Flag Effective when pre-boost is complete Short Circuit Protection (SCP) / FAIL Flag Effective when pre-boost is complete LED Short Protection / FAIL Flag Effective when pre-boost is complete Overvoltage Protection (OVP) Effective when UVLO is released Thermal ShutDown (TSD) Effective when EN = High Thermal Warning (TW) Effective when EN = High ISET-GND Short Protection / FAIL Flag Effective when pre-boost starts DC/DC Converter Operating Section Current Driver Operating Section VEN VREG50
3.1 V (Typ)
(UVLO Release) VDIMSEL 0 V (PWM DImming Only) ④ Pre-boost Input Overcurrent Protection (OCPH) / FAIL Flag Effective when UVLO is released ③ PWM Signal Detection 13.1 ms VFAIL During Self Diagnosis FAIL is Low LED Control Voltage ⑥ Stable State LED Setting Current Output Section Overvoltage Protection (OVP) / FAIL Flag Effective when LSDET is released ⑤ Stable Operation Transition Section
TSZ02201-0T2T0B200320-1-2 © 2022 ROHM Co., Ltd. All rights reserved. BD82A16MUF-M www.rohm.com TSZ22111 • 15 • 001 05.Jul.2022 Rev.001
3 Startup Characteristics and Effective Section of Each Protection Function – continued
3.2 When Using only PWM Dimming
The timing chart at startup and the effective section of each protection function when only PWM dimming is used are shown in the figure below. ① Power ON: Input EN voltage after the VCC voltage is input. ② Self Diagnosis: Determines the channels to be used, sets the number of additional pulses, and sets PWM/DC dimming, etc. Self Diagnosis is completed after 13.1 ms (Typ), and the diagnostic status is latched. ③ PWM signal detection: Begins the startup at the first rising edge of PWM. ④ Pre-boost(Note 1): Regardless of On Duty of PWM, switching is output until OVP pin voltage reaches 1.0 V, and boosting is performed. ⑤ Stable operation transition section: DC/DC switching is turned OFF. The output voltage of DC/DC converter drops according to the LED current. ⑥ Stable state: When LED voltage (the lowest voltage in LED1 to LED6) drops to LED co ntrol voltage x 1.1, DC/DC converter switches again. (Note 1) Because a higher switching Duty is required than stable state, Pre -boost may not be completed depending on operating conditions and component conditions. Contact us for details. ② Self Diagnosis 13.1 ms (Typ) ・Determination of CH to use ・Setting the number of additional pulse ・PWM/DC dimming setting ・OVP pin fault detection VCC 1.0 V VPWM VOVP ILED VOUTH VOUTL VLED LED Control Voltage × 1.1 Under Voltage Lockout (UVLO) Effective when EN = High Overcurrent Protection (OCPL) Effective when UVLO is released LED Open Protection / FAIL Flag Effective when pre-boost is complete Short Circuit Protection (SCP) / FAIL Flag Effective when pre-boost is complete LED Short Protection / FAIL Flag Effective when pre-boost is complete Overvoltage Protection (OVP) Effective when UVLO is released Thermal ShutDown (TSD) Effective when EN = High Thermal Warning (TW) Effective when EN = High ISET-GND Short Protection / FAIL Flag Effective when pre-boost starts DC/DC Converter Operating Section Current Driver Operating Section VEN VREG50 (UVLO Release) VDIMSEL 0 V (PWM Dimming Only) ④ Pre-boost Input Overcurrent Protection (OCPH) / FAIL Flag Effective when UVLO is released ③ PWM Signal Detection VFAIL During Self Diagnosis FAIL is Low LED Control Voltage ⑥ Stable State LED Setting Current Output Section Overvoltage Protection (OVP) / FAIL Flag Effective when LSDET is released ⑤ Stable Operation Transition Section
TSZ02201-0T2T0B200320-1-2 © 2022 ROHM Co., Ltd. All rights reserved. BD82A16MUF-M www.rohm.com TSZ22111 • 15 • 001 05.Jul.2022 Rev.001
3.3 When Switching Between PWM Dimming and DC Dimming
The timing chart at startup and the effective section of each protection function when switching between PWM dimm ing and DC dimming are shown in the figure below. ① Power ON: Input EN voltage after the VCC voltage is input. ② Self Diagnosis: Determines the channels to be used, sets the number of additional pulses, and sets PWM/DC dimming, etc. Self Diagnosis is completed after 13.1 ms (Typ), and the diagnostic status is latched. ③ PWM signal detection: Begins the startup at the fourth rising edge of PWM after Self Diagnosis. ④ Pre-boost(Note 1): Regardless of On Duty of PWM, switching is output until OVP pin voltage reaches 1.0 V, and boosting is performed. ⑤ Stable operation transition section: DC/DC switching is turned OFF. The output voltage of DC/DC converter drops according to the LED current. ⑥ Stable state: When LED voltage (the lowest voltag e in LED1 to LED6) drops to LED control voltage x 1.1, DC/DC converter switches again. (Note 1) Because a higher switching Duty is required than stable state, Pre -boost may not be completed depending on operating conditions and component conditions. Contact us for details. ② Self Diagnosis 13.1 ms (Typ) ・Determination of CH to use ・Setting the number of additional pulse ・PWM/DC dimming setting ・OVP pin fault detection VCC 1.0 V VPWM VOVP ILED VOUTH VOUTL VLED LED Control Voltage × 1.1 Under Voltage Lockout (UVLO) Effective when EN = High Overcurrent Protection (OCPL) Effective when UVLO is released LED Open Protection / FAIL Flag Effective when pre-boost is complete Short Circuit Protection (SCP) / FAIL Flag Effective when pre-boost is complete LED Short Protection / FAIL Flag Effective when pre-boost is complete Overvoltage Protection (OVP) Effective when UVLO is released Thermal ShutDown (TSD) Effective when EN = High Thermal Warning (TW) Effective when EN = High ISET-GND Short Protection / FAIL Flag Effective when pre-boost starts DC/DC Converter Operating Section Current Driver Operating Section VEN VREG50 (UVLO Release) VDIMSEL REG50*RDIMSEL1/(RDIMSEL1+RDIMSEL2) (PWM+DC Dimming) ④ Pre-boost Input Overcurrent Protection (OCPH) / FAIL Flag Effective when UVLO is released ③ PWM Signal Detection After Self Diagnosis, pre-boost starts at the fourth rising edge of PWM VFAIL During Self Diagnosis FAIL is Low (1) (2) (3) (4) LED Control Voltage ⑥ Stable State LED Setting Current Output Section Overvoltage Protection (OVP) FAIL Flag Effective when LSDET is released ⑤ Stable Operation Transition Section
TSZ02201-0T2T0B200320-1-2 © 2022 ROHM Co., Ltd. All rights reserved. BD82A16MUF-M www.rohm.com TSZ22111 • 15 • 001 05.Jul.2022 Rev.001 VCC VEN VREG50 VFAIL When REG50 deacreases to a voltage at which the internal circuit does not operate, FAIL becomes High and decreases as REG50 decreases After EN = Low, VREG50 gradually decreases The time to decrease is determined by the external capacitance (CREG50) FAIL is Low while REG50 is decreasing VCC VEN VREG50 VFAIL FAIL is Low while REG50 is decreasing When REG50 deacreases to a voltage at which the internal circuit does not operate, FAIL becomes High After EN = Low, VREG50 gradually decreases The time to decrease is determined by the external capacitance (CREG50)
3.4 Timing Chart When Stopped (When Pulling Up FAIL to REG50)
The figure below shows the timing chart when stopped (EN = Low) when FAIL is pulled up to REG50. After VEN = Low, the VREG50 will gradually decrease. The time to decrease depends on the value of the capacitance (CREG50) connected to REG50. Immediately after VEN = Low, the operation inside the IC is turned OFF and VFAIL = Low are output. While the VREG50 is still high enough, VFAIL = Low will continue to be output, but when VREG50 decreases to a level where Low of VFAIL cannot be output, VFAIL = High. After that, VFAIL decreases as VREG50 decreases
3.5 Timing Chart When Stopped (When Pulling Up FAIL to an External Power Supply)
The figure below shows the timing chart when stopped (EN = Low) when FAIL is pulled up to an external power supply. After VEN = Low, the VREG50 will gradually decrease. The time to decrease depends on the value of the capacitance (CREG50) connected to REG50. Immediately after VEN = Low, the operation inside the IC is turned OFF and VFAIL = Low are output. While the VREG50 is still high enough, VFAIL = Low will continue to be output, but when VREG50 decreases to a level where Low of VFAIL cannot be output, VFAIL = High.
TSZ02201-0T2T0B200320-1-2 © 2022 ROHM Co., Ltd. All rights reserved. BD82A16MUF-M www.rohm.com TSZ22111 • 15 • 001 05.Jul.2022 Rev.001 REG25 CREG25 PWM SYNC RPLSET2 RPLSET1 CPC1 RPC CPC2 RRT EXP-PAD 9 10 11 12 13 14 1615 32 31 30 29 27 26 2528 EXP-PAD EXP-PAD EXP-PADEXP-PAD OVP CSL PGND OUTL VDISC ISET LED1 LED2 LED3 LED4 LED5 LED6 DIMSEL REG25 OUTH EN CSH LDSW VCC FAIL SW CP CPM CPP BOOTRT PWM COMP PLSET SYNC REG50 GND REG50 CREG50 RISET RDIMSEL2 RDIMSEL1 PLSET DIMSEL VOUT CLED1D CLED2D CLED3D CLED4D CLED5D CLED6D CLED1U CLED2U CLED3U CLED4U CLED5U CLED6U LED4 LED3 LED2 LED1 LED5 LED6 RG COUT2 RCSL COUT1 ROVP1 ROVP2 RCS CCS RSNB1 CSNB1 RSNB2 CSNB2 COVP COUT4 COUT3 COUT5 CCP2 CCP1 CP RFAIL VREG FAIL CIN1 CIN2 M1RCSH CVCC3 REN1 REN2 VCC CVCC2CVCC1L1CB2CB1 VOUTM2 CBT RBT Place RRT closest to the RT pin and do not add capacitance. Place RISET closest to the ISET pin and do not add capacitance. Place CVCC3, CREG50, CREG25 decoupling capacitors as close as possible to the IC pin. A large current may flow through PGND, so lower the impedance. Be careful that the ISET pin, the RT pin and the COMP pin do not get noisy. The PWM pin, the OUTL pin, the SYNC pin and the LED1 pin to the LED6 pin are switched. Be careful not to affect the peripheral patterns. The wires from the OUTH pin, OUTL pin and the CSL pin to the components should be the shortest and minimum impedance. There is a heat dissipation PAD on the back side of the package. Solder the heat dissipation PAD to the ground of the board. For noise reduction, consider the shortest and minimum impedance board layout for the buck loop (VCC → RCSH → M1 → M2 → D1 → PGND → GND → CVCC3 → VCC) and the boost loop (D2 → COUT → PGND → RCSL → M3 → D2). Inserting RG can reduce ringing, but larger RG may be less efficient. When using it, carefully evaluate it and determine the resistance value. Both ends of RCSH and RCSL should be wired as short as possible. Longer wires may lead to false detection of input overcurrent protection (OCPH) or overcurrent protection (OCPL) due to inductance components. Connect VOUT to the anode of the LED panel as short as possible. Depending on the parasitic inductance component, the LED current may become unstable. The connection from the LED1 pin to the LED6 pin to the cathode of the LED panel should be as short as possible. Depending on the parasitic inductance component, the LED current may become unstable.
TSZ02201-0T2T0B200320-1-2 © 2022 ROHM Co., Ltd. All rights reserved. BD82A16MUF-M www.rohm.com TSZ22111 • 15 • 001 05.Jul.2022 Rev.001 List of External Components Serial No. Component Name Component Value Product Name Manufacturer
1 CB1 - - -
2 CB2 - - -
3 L1 - - -
4 CVCC1 - - -
5 CVCC2 - - -
6 CVCC3 0.1 μF GCM155R71H104KE37 murata
7 REN1 - - -
8 REN2 - - -
9 RCSH 33 mΩ LTR18 Series Rohm
10 M1 - RD3L140SPFRA Rohm
11 C IN1 10 μF GCM32EC71H106KA03 murata
12 C IN2 - - -
13 M2 - RD3L080SNFRA Rohm
14 D1 - RB088LAM-60TF Rohm
15 RBT SHORT - -
16 CBT 0.1 μF GCM155R71H104KE02 murata
17 L2 10 μH CLF10060NIT-100M-D TDK
18 M3 - RD3L080SNFRA Rohm
19 RCSL 68 mΩ LTR18 Series Rohm
20 D2 - RB088LAM-60TF Rohm
21 COUT1 0.01 μF GCM155R71H103KA55 murata 22 COUT2 0.1 μF GCM155R71H104KE02 murata
23 COUT3 - - -
24 COUT4 - - -
25 COUT5 22 µF GYA1H220MCQ1GS nichicon
26 CREG25 0.22 μF GCM155R71C224KE02 murata 27 CREG50 2.2 μF GCM188C71A225KE01 murata
28 RRT 33 kΩ MCR01 Series Rohm
29 RPLSET1 100 kΩ MCR01 Series Rohm
30 RPLSET2 100 kΩ MCR01 Series Rohm
31 RPC 51 Ω MCR01 Series Rohm
32 CPC1 1 μF GCM188R71C105KA49 murata
33 CPC2 - - -
34 RISET 33 kΩ MCR01 Series Rohm
35 RDIMSEL1 SHORT - -
36 RDIMSEL2 OPEN - -
37 CLED1D 470 pF GCM155R11H471KA01 murata
38 CLED2D 470 pF GCM155R11H471KA01 murata
39 CLED3D 470 pF GCM155R11H471KA01 murata
40 CLED4D 470 pF GCM155R11H471KA01 murata
41 CLED5D 470 pF GCM155R11H471KA01 murata
42 CLED6D 470 pF GCM155R11H471KA01 murata
TSZ02201-0T2T0B200320-1-2 © 2022 ROHM Co., Ltd. All rights reserved. BD82A16MUF-M www.rohm.com TSZ22111 • 15 • 001 05.Jul.2022 Rev.001 List of External Components – continued Serial No. Component Name Component Value Product Name Manufacturer
43 CLED1U - - -
44 CLED2U - - -
45 CLED3U - - -
46 CLED4U - - -
47 CLED5U - - -
48 CLED6U - - -
49 RCS Short - -
50 CCS - - -
51 RG 10 Ω MCR01 Series Rohm
52 ROVP1 10 kΩ MCR01 Series Rohm
53 ROVP2 360 kΩ MCR01 Series Rohm
54 COVP - - -
55 RFAIL 100 kΩ MCR01 Series Rohm
56 CCP1 10 μF GCM32EC71H106KA03 murata
57 CCP2 2.2 μF GCM188C71A225KE01 murata
58 RSNB1 - - -
59 CSNB1 - - -
60 RSNB2 - - -
61 CSNB2 - - -
Note: The component constants vary depending on the operating conditions and the load used.
TSZ02201-0T2T0B200320-1-2 © 2022 ROHM Co., Ltd. All rights reserved. BD82A16MUF-M www.rohm.com TSZ22111 • 15 • 001 05.Jul.2022 Rev.001 Power Consumption Calculation Example 𝑃𝐶 = 𝐼𝐶𝐶 × 𝑉𝐶𝐶 (1) Circuit power +𝐶𝐼𝑆𝑆1 × 𝑉𝑅𝐸𝐺50 × 𝑓𝑂𝑆𝐶 × 𝑉𝑅𝐸𝐺50 (2) High side FET drive stage power +𝐶𝐼𝑆𝑆2 × 𝑉𝑅𝐸𝐺50 × 𝑓𝑂𝑆𝐶 × 𝑉𝑅𝐸𝐺50 (3) Low side FET drive stage power +{𝑉𝐿𝐸𝐷 × 𝑀 + ∆𝑉𝑓 × (𝑀 − 1)} × 𝐼𝐿𝐸𝐷 (4) Current driver power 𝑃𝐶 : IC power consumption 𝐼𝐶𝐶 : Circuit current 𝑉𝐶𝐶 : Power supply voltage 𝐶𝐼𝑆𝑆1 : High side FET gate capacitance 𝐶𝐼𝑆𝑆2 : Low side FET gate capacitance 𝑉𝑅𝐸𝐺50: REG50 Voltage 𝑓𝑂𝑆𝐶 : Oscillation Frequency 𝑉𝐿𝐸𝐷 : LED control voltage 𝑀 : Number of LED Parallels ∆𝑉𝑓 : LED Vf variation per row 𝐼𝐿𝐸𝐷 : LED output current <Calculation Example> Assuming ICC = 10 mA, VCC = 12 V, CISS1 = 2000 pF, CISS2 = 2000 pF, VREG50 = 5 V, fOSC = 2200 kHz, VLED = 0.83 V, ILED = 150 mA, M = 6 columns and ΔVf = 0.2 V, 𝑃𝑐 = 10 𝑚𝐴 × 12 𝑉 +2000 𝑝𝐹 × 5 𝑉 × 2200 𝑘𝐻𝑧 × 5 𝑉 +2000 𝑝𝐹 × 5 𝑉 × 2200 𝑘𝐻𝑧 × 5 𝑉 From thermal resistance θja = 30.7 °C/W, the maximum calorific value ΔtMAX can be estimated by the following equation. 𝛥𝑡𝑀𝐴𝑋 = 𝑃𝑐 × 𝜃𝑗𝑎 = 1.237 𝑊 × 30.7 = 38.0 [°C] When the ambient temperature is 85 °C, the maximum chip temperature tCMAX is: Make sure that tCMAX calculated here is less than Tjmax = 150 °C. The above is a simple calculation example only. The value of thermal resistance varies depending on the actual board conditions and layout. Please check it as a guide for thermal design.
TSZ02201-0T2T0B200320-1-2 © 2022 ROHM Co., Ltd. All rights reserved. BD82A16MUF-M www.rohm.com TSZ22111 • 15 • 001 05.Jul.2022 Rev.001 7.COMP 3.RT 11 - 16.LED1 - LED6 23.OVP 9.ISET 18.OUTL LED1 LED2 LED3 LED4 LED5 LED6 8.GND, 19.PGND OUTL OVP COMP 2 Ω 20 kΩ 50 kΩ 10 kΩ 10 kΩ ISET 10 kΩ GND PGND 100 kΩ 10 kΩ PGND GND 1.REG25 REG25 GND 2.REG50 REG50 GND 4.SYNC SYNC 100 kΩ 10 kΩ GND 400 Ω GND GND REG50 RT 10 kΩ GND REG50 5.PWM PWM 100 kΩ 10 kΩ GND 6.PLSET PLSET 10 kΩ GND REG50 10.DIMSEL DIMSEL 10 kΩ GND REG50 REG50 24.VDISC VDISC 2 MΩ 2 MΩ GND REG50 GND 26.LDSW LDSW GND 2 MΩ VCC 27.CSH CSH 25 kΩ 1 pF GND VCC REG50 10 kΩ VCCVCC 29.EN EN 100 kΩ 7 kΩ GND VCC 17.CSL CSL 10 kΩ GND REG50 12 kΩ 30.CP, 31.CPP CPP REG25 CP GND 32.CPM CPM GND REG25 1.2 MΩ 31.9 kΩ 20.SW SW PGND 21.OUTH, 22.BOOT OUTH SW 1 kΩ 100 kΩ BOOT REG50 25.FAIL FAIL 1 kΩ GND I/O Equivalence Circuit Note: All values are Typ values.
TSZ02201-0T2T0B200320-1-2 © 2022 ROHM Co., Ltd. All rights reserved. BD82A16MUF-M www.rohm.com TSZ22111 • 15 • 001 05.Jul.2022 Rev.001 Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small -signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC ’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground , power supply and output pin . Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 9. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this w ay is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line.
TSZ02201-0T2T0B200320-1-2 © 2022 ROHM Co., Ltd. All rights reserved.
- Regarding the Input Pin of the IC
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Figure 25. Example of Monolithic IC Structure temperature and the decrease in nominal capacitance due to DC bias and others.
- Thermal Shutdown Circuit (TSD)
falls below the TSD threshold, the circuits are automatically restored to normal operation.
- Over Current Protection Circuit (OCP)
not be used in applications characterized by continuous operation or transitioning of the protection circuit. A product that has implemented safety mechanism to meet ASIL level requirements described in the datasheet. Note: “ASIL-*” is stands for the ratings of “ASIL-A”, “-B”, “-C” or “-D” specified by each product's datasheet.
TSZ02201-0T2T0B200320-1-2 © 2022 ROHM Co., Ltd. All rights reserved. BD82A16MUF-M www.rohm.com TSZ22111 • 15 • 001 05.Jul.2022 Rev.001
Ordering Information
B D 8 2 A 1 6 M U F - M E 2 Package MUF: VQFN32FBV050 Product rank M: for Automotive Packaging and forming specifications E2: Embossed tape and reel Marking Diagram VQFN32FBV050 (TOP VIEW) 1 6 M U F Part Number Marking LOT Number Pin 1 Mark B D 8 2 A
TSZ02201-0T2T0B200320-1-2© 2022 ROHM Co., Ltd. All rights reserved. BD82A16MUF-M www.rohm.com TSZ22111 • 15 • 001 05.Jul.2022 Rev.001 Physical Dimension and Packing Information
TSZ02201-0T2T0B200320-1-2 © 2022 ROHM Co., Ltd. All rights reserved. BD82A16MUF-M www.rohm.com TSZ22111 • 15 • 001 05.Jul.2022 Rev.001
Revision History
05.Jul.2022 001 New Release
Notice-PAA-E Rev.004 © 2015 ROHM Co., Ltd. All rights reserved. Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( “Specific Applications ”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below . Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independen t verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse , is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsibl e or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. I f the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification
Notice-PAA-E Rev.004 © 2015 ROHM Co., Ltd. All rights reserved. Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties.
Notice – WE Rev.001 © 2015 ROHM Co., Ltd. All rights reserved. General Precaution 1. Before you use our Products, you are requested to caref ully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of an y ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this documen t is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccura cy or errors of or concerning such information.