Power Management

BD750L5FP-CE2

Rohm

Ultra Low Quiescent Current LDO Regulator 01.May.2014 Rev.004

Manufacturer: Rohm

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BD7XXL5FP-C ROHM | Alldatasheet

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Ordering Information B D 7 x x L 5 F P - C E 2
Lineup Output current ability Output voltage (Typ.) Package type Orderable Part Number 500 mA 3.3 V TO252-3 BD733L5FP-CE2 5.0V BD750L5FP-CE2 Package FP: TO252-3 Taping E2: reel-wound embossed tamping Output Voltage 33: 3.3V 50: 5.0V

Pin Configuration

FIgure 3. Pin Configuration

Pin Description
Block Diagram

Figure 4. Block Diagram

1 VCC Supply voltage input pin

3 VOUT Output pin

Absolute Maximum Ratings（Ta=25°C） Parameter Symbol Ratings Unit Supply Voltage *1 VCC -0.3 to +50.0 V Power Dissipation TO252-3 *2 Pd 1.3 W Operating Temperature Range Topr -40 to +125 °C Storage Temperature Range Tstg -55 to +150 °C Maximum Junction Temperature Tjmax 150 °C *1 Pd should not be exceeded. (1-layer PCB: Copper foil area on the reverse side of PCB: 0 mm x 0 mm)
Operating Conditions（-40 < Ta < +125°C） ■BD733L5FP-C Parameter Symbol Min. Max. Unit Supply Voltage *3 VCC 4.17 45.0 V Startup Voltage *4 VCC 3.0 - V Output Current IOUT 0 500 mA ■BD750L5FP-C Parameter Symbol Min. Max. Unit Supply Voltage *3 VCC 5.6 45.0 V Startup Voltage *4 VCC 3.0 - V Output Current IOUT 0 500 mA *3 For output voltage, refer to the dropout voltage corresponding to the output current. This condition is 200mA load. *4 When IOUT=0mA.
Thermal Resistance *5 TO252-3 mounted on 114.3 mm x 76.2 mm x 1.6 mmt Glass-Epoxy PCB based on JEDEC. (4-layer PCB: Copper foil on the reverse side of PCB: 74.2 mm x 74.2 mm) Parameter Symbol Min. Max. Unit Junction to Ambient *5 θja 24.5 - °C/W Junction to Case (bottom) *5 θjc 3 - °C/W

Electrical Characteristics (BD733L5FP-C) (Unless otherwise specified, -40 < Ta < +125°C, VCC=13.5V, IOUT=0mA, Reference value: Ta=25°C) Parameter Symbol Limit Unit Conditions Min. Typ. Max. Bias current Ib - 6 15 μA Output voltage VOUT 3.23 3.30 3.37 V 8V < VCC < 16V 0mA < IOUT < 500mA Dropout voltage ΔVd - 0.4 0.8 V VCC=VOUT×0.95, IOUT=200mA Ripple rejection R.R. 50 63 - dB f=120Hz, ein=1Vrms, IOUT=100mA Line regulation Reg I - 5 20 mV 8V < VCC < 16V Load regulation Reg L - 5 20 mV 10mA < IOUT < 250mA
Electrical Characteristics (BD750L5FP-C) (Unless otherwise specified, -40 < Ta < +125°C, VCC=13.5V, IOUT=0mA, Reference value: Ta=25°C) Parameter Symbol Limit Unit Conditions Min. Typ. Max. Bias current Ib - 6 15 μA Output voltage VOUT 4.9 5.0 5.1 V 8V < VCC < 16V 0mA < IOUT < 500mA Dropout voltage ΔVd - 0.25 0.5 V VCC=VOUT×0.95, IOUT=200mA Ripple rejection R.R. 50 60 - dB f=120Hz, ein=1Vrms, IOUT=100mA Line regulation Reg I - 5 20 mV 8V < VCC < 16V Load regulation Reg L - 5 20 mV 10mA < IOUT < 250mA

Reference data (BD7xxL5FP-C Series) TO252-3 Measurement setup for Figure 5, 14, 15, 24 Measurement setup for Figure 6, 7, 12, 13, 16, 17, 22, 23 Measurement setup for Figure 8, 18 Measurement setup for Figure 9, 19 Measurement setup for Figure 10, 20 Measurement setup for Figure 11, 21

Selection of Components Externally Connected ・VCC pin Insert capacitors with a capacitance of 0.1 μF or higher between the VCC and GND pin. Choose the capacitance according to the line between the power smoothing circuit and the VCC pin. Selection of the capacitance also depends on the application. Verify the application and allow for sufficient margins in the design. We recommend using a capacitor with excellent voltage and temperature characteristics. ・Output pin capacitor In order to prevent oscillation, a capacitor needs to be placed between the output pin and GND pin. We recommend using a capacitor with a capacitance of 4.7 μF or higher. Electrolytic, tantalum and ceramic capacitors can be used. When selecting the capacitor ensur e that the capacitance of 4.7 μF or higher is maintained at the intended applied voltage and temperature range. Due to changes in temper ature the capacitor’s capacitance can fluctuate possibly resulting in oscillation. For selection of the capacitor refer to the IOUT vs. ESR data. The stable operation range given in the reference data is based on the standalone IC and resistive load. For act ual applications the stable operating range is influenced by the PCB impedance, input supply impedance and load impedance. Therefore verification of the final operating environment is needed. When selecting a ceramic type capacitor, we recommend usi ng X5R, X7R or better with excellent temperature and DC-biasing characteristics and high voltage tolerance. Also, in case of rapidly changing input voltage and load current, select the capacitance in accordance with verifying that the actual application meets with the required specification.
Measurement setup ○Condition VCC=13.5V CIN=0.1µF 4.7µF<COUT<100µF -40°C <Ta<+125°C ○Condition VCC=13.5V CIN=0.1µF 4.7µF<COUT<100µF -40°C <Ta<+125°C TO252-3

Power Dissipation ■TO252-3 IC mounted on ROHM standard board based on JEDEC. Board material: FR4 Board size: 114.3 mm x 76.2 mm x 1.6 mmt (with thermal via on the board) Mount condition: PCB and exposed pad are soldered. Top copper foil: The footprint ROHM recommend. + wiring to measure. ①: 1-layer PCB (Copper foil area on the reverse side of PCB: 0 mm x 0 mm) ②: 4-layer PCB (2 inner layers and copper foil area on the reverse side of PCB: 74.2mm x 74.2 mm) Condition①: θja = 96.2 °C/W, θjc(top) = 22 °C/W Condition②: θja = 24.5 °C/W, θjc(top) = 5 °C/W, θjc(bottom) = 3 °C/W

Figure 25. Package Data

TSZ02201-0G1G0AN00020-1-2© 2013 ROHM Co., Ltd. All rights reserved. 01.May.2014 Rev.004 www.rohm.com TSZ22111・15・001 BD7xxL5FP-C Refer to the heat mitigation characte ristics illustrated in Figure 25 when using the IC in an environment of T a≧25°C. The characteristics of the IC are greatly influe nced by the operating temperature, and it is necessary to operate under the maximum junction temperature Timax. Figure 25 show the power dissipation and heat mitigation characteristics of the TO252-3 package. Even if the ambient temperature Ta is at 25°C it is possible that the junction temperature Tj reaches high temperatures. Therefore, the IC should b e operated within the power dissipation range. The following method is used to calculate the power consumption Pc (W) Pc＝(VCC－VOUT)×IOUT＋VCC×Ib Power dissipation Pd≧Pc The load current Lo is obtained by operating the IC within the power dissipation range. ( R e f e r t o F i g u r e 1 1 a n d F i g u r e 2 1 f o r t h e I b ) Thus, the maximum load current IOUTmax for the applied voltage VCC can be calculated during the thermal design process.

TO252-3 ■Calculation example 1) with Ta=125°C, VCC=13.5V, VOUT=3.3V At Ta=125°C with Figure 25 ② condition, the calculation show s that ca 100mA of output current is possible at 10.2V potential difference across input and output. ■Calculation example 2) with Ta=125°C, VCC=13.5V, VOUT=5.0V (TO252-3) At Ta＝125°C with Figure 25 ② condition, the calculation show s that ca 120mA of output current is possible at 8.5V potential difference across input and output. The thermal calculation shown above should be taken into consid eration during the thermal design in order to keep the whole operating temperature range within the power dissipation range. In the event of shorting (i.e. VOUT and GND pins are shorted) the power consumption Pc of the IC can be calculated as follows: Pc＝VCC×(Ib＋Ishort) (Refer to Figure 8 and Figure 18 for the Ishort) VCC : Input voltage VOUT : Output voltage IOUT : Load current Ib : Bias current Ishort : Shorted current IOUT≦ Pd－VCC×Ib VCC－VOUT θja =24.5°C /W → -40.8mW/°C IOUT≦100mA (Ib:6μA) IOUT≦ 1.02－13.5×Ib 10.2 IOUT≦120mA (Ib:6μA) IOUT≦ 1.02－13.5×Ib 8.5 θja =24.5°C /W → -40.8mW/°C

Application Examples ・Applying positive surge to the VCC pin If the possibility exists that surges higher than 50V will be applied to the VCC pin, a zenar diode should be placed between the VCC pin and GND pin as shown in the figure below. ・Applying negative surge to the VCC pin If the possibility exists that negative surges lower than the GND are applied to the VCC pin, a Shottky diode should be place between the VCC pin and GND pin as shown in the figure below. ・Implementing a protection diode If the possibility exists that a large inducti ve load is connected to the output pin re sulting in back-EMF at time of startup and shutdown, a protection diode should be placed as shown in the figure below.
I/O equivalence circuits TO252-3 TO252-3 ○Output terminal *inside of () shows 5V○Input terminal VOUT 1:VCC 2:N.C. 3:VOUT FIN BD7xxL5FP-C CIN COUT IOUT

Operational Notes 1) Absolute maximum ratings Exceeding the absolute maximum rating for supply voltage, operating te mperature or other parameters can result in damages to or destruction of the chip. In this event it also becomes impossible to det ermine the cause of the damage (e.g. short circuit, open circuit, etc.). Therefore, if any specia l mode is being considered with values expected to exceed the absolute maximum ratings, implementing physical safety measures, such as adding fuses, should be considered. 2) The electrical characteristics given in this specification may be influenced by conditions such as temperature, supply voltage and external components. Transient characteristics should be sufficiently verified. 3) GND electric potential Keep the GND pin potentia l at the lowest (minimum) level under any oper ating condition. Furthermore, ensure that, including the transient, none of the pin’s voltages are less than the GND pin voltage. 4) GND wiring pattern When both a small-signal GND and a high curr ent GND are present, single-point gr ounding (at the set standard point) is recommended. This in order to separate the small-signal and high current patterns and to ensure that voltage changes stemming from the wiring resistance and high current do not cause any voltage change in the small-signal GND. Similarly, care must be taken to avoid wiring pattern fluctuations in any connected external component GND. 5) Inter-pin shorting and mounting errors Ensure that when mounting the IC on the PCB the direction and position are correct. Incorrect mounting may result in damaging the IC. Also, shorts caused by dust entering betw een the output, input and GND pin may result in damaging the IC. 6) Inspection using the set board The IC needs to be discharged after each inspection process as, while using the set board for inspection, connecting a capacitor to a low-impedance pin may cause stress to the IC. As a protection from static electricity, ensure that the assembly setup is grounded and take sufficient caution with tr ansportation and storage. Also, make sure to turn off the power supply when connecting and disconnecting the inspection equipment. 7) Power dissipation (Pd) Should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properties of the ch ip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm X 70mm X 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 8) Thermal design The power dissipation under actual oper ating conditions should be taken into consideration and a sufficient margin should be allowed for in the thermal design. On the reverse side of the package this product has an exposed heat pad for improving the heat dissipation. Use both the front and reverse side of the PCB to increase the heat dissipation pattern as far as possible. The amount of heat generated depends on the voltage difference across the input and output, load current, and bias current. Therefore, when actually using the chip, ensure that the gener ated heat does not exceed the Pd rating. Tjmax: maximum junction temperature=150°C, Ta: ambient temperature (°C), θja: junction-to-ambient thermal resistance (°C /W), Pd: power dissipation rating (W), Pc: power consumption (W), VCC: input voltage, VOUT: output voltage, IOUT: load current, Ib: bias current Power dissipation rating Pd (W)=(Tjmax －Ta) / θja Power consumption Pc (W)=(VCC-VOUT)×IOUT ＋VCC×Ib 9) Rapid variation in VCC voltage and load current In case of a rapidly changing input voltage, transients in the output voltage might occur due to the use of a MOSFET as output transistor. Although the actual application might be the cause of the transients, the IC input voltage, output current and temperature are also possible causes. In case problems arise within the actual operating range, use countermeasures such as adjusting the output capacitance. 10) Minute variation in output voltage In case of using an application susceptib le to minute changes to the output vo ltage due to noise, changes in input and load current, etc., use countermeasures such as implementing filters. 11) Overcurrent protection circuit This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit.

TSZ02201-0G1G0AN00020-1-2© 2013 ROHM Co., Ltd. All rights reserved. the circuits are automatically restored to normal operation. bypass between all pins and the VCC pin. variety of parasitic elements. ○ The P/N junction functions as a parasitic diode when GND > pin A for the resistor, or GND > pin B for the transistor. other adjacent elements to operate as a parasitic NPN transistor. Figure 26. Example of the Parasitic Device Structures

Physical Dimension, Tape and Reel Information Direction of feed1pin Reel ∗ Order quantity needs to be multiple of the minimum quantity. <Tape and Reel information> Embossed carrier tapeTape Quantity Direction of feed The direction is the 1pin of product is at the lower left when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs ( )

Marking Diagram (TOP VIEW)
Revision History Part Number Marking Output Voltage (V) BD733L5 3.3 BD750L5 5.0 Date Revision Changes 02.Oct.2012 001 New Release 14.Mar.2013 002 Page 1.Series name is changed. Page 4. Power Dissipation is changed to be compliant with JEDEC standard. Page 4. Append Thermal Resistance θja, θjc. Page 6. Figure 5, Page 7. Figure 11 All Quiescent current are integrated into Bias Current. Page 8. Figure 14, Page 9. Figure 15 All Quiescent current are integrated into Bias Current. Page 10. Figure 21, Page 11. Figure 24 All Quiescent current are integrated into Bias Current. Page 14. Figure 25, 26 Power Dissipation is changed to be compliant with JEDEC standard. Page 15, 16. Calculation examples are changed. Page 19. “Application example” is deleted. Figure 29 “ Example of the Pa rasitic Device Structures” is renewed. 30.Sep.2013 003 AEC-Q100 Qualified. Page 21. Physical Quantity is changed. 01.May.2014 004 TO263-3F is changed to the individual registration. TO252-3 TO252-3 (TOP VIEW) Part Number Marking LOT Number

Notice - SS Rev.002 © 2014 ROHM Co., Ltd. All rights reserved. Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writ ing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products ar e exposed to sea wind or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temper ature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperat ure is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlori ne, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification

Notice - SS Rev.002 © 2014 ROHM Co., Ltd. All rights reserved. Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteri stics, as well as static characteristics. 2. You agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for Products use. Theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding t he Products maximum rating will not be applied to Products. Please take special care under dry condit ion (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriora te if the Products are stored in the places where: [a] the Products are exposed to sea winds or corros ive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to di rect sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm sol derability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whol e or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any wa y whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties.

Notice – WE Rev.001 © 2014 ROHM Co., Ltd. All rights reserved. General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for failure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information.

Product Information

BD750L5FP-CE2 specifications and overview.

Summary

Ultra Low Quiescent Current LDO Regulator 01.May.2014 Rev.004

Description

Ultra Low Quiescent Current LDO Regulator 01.May.2014 Rev.004

Source title BD750L5FP-CE2 Datasheet(PDF) - Rohm

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