Power Management

BD750L05G-C

Rohm

For Automotive 45 V Input 50 mA Fixed Output LDO Regulators 18.Nov.2022 Rev.002

Manufacturer: Rohm

Document: 42 Pages / 3Mb

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BD7XXL05G-C_V01 ROHM | Alldatasheet

Document overview

Manufacturer or author: ROHM CO., LTD.
PDF pages: 42

Technical content

Features

◼ AEC-Q100 Qualified(Note 1) ◼ Functional Safety Supportive Automotive Products ◼ Qualification Planned for Automotive Application ◼ Over Current Protection (OCP) ◼ Thermal Shutdown Protection (TSD) (Note 1) Grade 1

Applications

◼ Power Train ◼ Body ◼ Car Infotainment etc. Key Specifications ◼ Wide Temperature Range (Tj): -40 °C to +150 °C ◼ Wide Operating Input Voltage Range: 3 V to 45 V ◼ Low Current Consumption: 6 μA (Typ) ◼ Output Current: 50 mA (Max) ◼ Output Voltage: 2.5 V / 3 V / 3.3 V / 5.0 V (Typ) ◼ High Output Voltage Accuracy: ±2 % Package W (Typ) x D (Typ) x H (Max) ◼ SSOP5: 2.9 mm x 2.8 mm x 1.25 mm Typical Application Circuit ◼ Components Externally Connected Capacitor(Note 2): 0.1 µF ≤ CIN (Min), 0.5 µF ≤ COUT (Min) (Note 2) Electrolytic, tantalum, and ceramic capacitors can be used. VOUTVIN GND BD7xxL05G-CCIN COUT Input Output Datasheet

4/39 © 2022 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111 • 15 • 001 TSZ02201-0BJB0A600090-1-2 18.Nov.2022 Rev.002 BD7xxL05G-C Series Pin Configuration Pin Descriptions Pin No. Pin Name Function Descriptions 1 N.C. Not Connected This pin is not connected to the chip. It can kept open or it’s also possible to connect to GND. 2 GND Ground Pin This is the Ground pin. It should be connected to the lowest potential. 3 N.C. Not Connected This pin is not connected to the chip. It can kept open or it’s also possible to connect to GND.

4 VIN Supply Voltage Input Pin

This pin supplies the input voltage. It is necessary to connect a capacitor which is 0.1 μF (Min) or higher between VIN pin and GND. The detailed selecting guide is described in Selection of External Components.

5 VOUT Output Pin

This pin outputs the voltage setting. It is necessary to connect a capacitor which is 0.5 μF (Min) or higher between the VOUT pin and GND. The detailed selecting guide is described in Selection of External Components. SSOP5 (Top View)

5 VOUT

4 VIN

1 N.C. 3 N.C.

2 GND

5/39 © 2022 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111 • 15 • 001 TSZ02201-0BJB0A600090-1-2 18.Nov.2022 Rev.002 BD7xxL05G-C Series Block Diagram Description of Blocks Block Name Function Description of Blocks PREREG Internal Power Supply Provides Power Supply for the Internal Circuit. TSD Thermal Shutdown In case maximum power dissipation is exceeded or the ambient temperature is higher than the Maximum Junction Temperature, overheating causes the chip temperature (Tj) to rise. The TSD protection circuit detects this and forces the output to turn off in order to protect the device from overheating. When the junction temperature decreases, the output turns on automatically. Output pin is discharged when the TSD protection circuit is operating. VREF Reference Voltage Generates the Reference Voltage. AMP Error Amplifier The Error Amplifier amplifies the difference between the divided feedback voltage and the reference voltage, and then it regulates Output Power Tr. via the DRIVER. DRIVER Output MOSFET Driver Drives the Output MOSFET (Power Tr.). OCP Over Current Protection If the output current increases higher than the maximum Output Current, it will be limited by the Over Current Protection in order to protect the device from damage that will be caused by over current. At this operating condition, the output voltage may decrease because the output current is limited. If an abnormal state is removed, and the output current value returns normally, the output voltage will also return to normal state. VREF DRIVER OCP PREREG TSD AMP VIN ( 4Pin ) VOUT ( 5Pin ) N.C. ( 1Pin ) GND ( 2Pin ) N.C. ( 3Pin )

6/39 © 2022 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111 • 15 • 001 TSZ02201-0BJB0A600090-1-2 18.Nov.2022 Rev.002 BD7xxL05G-C Series Absolute Maximum Ratings Parameter Symbol Ratings Unit Input Supply Voltage(Note 1) VIN -0.3 to +45 V Output Voltage(Note 2) VOUT -0.3 to +18 V Junction Temperature Range Tj -40 to +150 °C Storage Temperature Range Tstg -55 to +150 °C Maximum Junction Temperature Tjmax 150 °C ESD Withstand Voltage (HBM) (Note 3) VESD_HBM ± 2000 V ESD Withstand Voltage (CDM) (Note 4) VESD_CDM ± 750 V Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in de terioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance and power dissipation taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. (Note 1) Do not exceed Tjmax. (Note 2) Do not exceed VIN + 0.3 V. (Note 3) ESD susceptibility Human Body Model “HBM”; base on ANSI/ESDA/JEDEC JS001 (1.5 kΩ, 100 pF). (Note 4) ESD susceptibility Charged Device Model “CDM”; base on JEDEC JESD22-C101. Thermal Resistance(Note 6) Parameter Symbol Thermal Resistance (Typ) Unit 1s(Note 8) 2s2p(Note 9) SSOP5 Junction to Ambient θJA 247.3 155.5 °C/W Junction to Top Characterization Parameter(Note 7) ΨJT 43 33 °C/W (Note 6) Based on JESD51-2A (Still-Air). Using BD750L05G-C Chips. (Note 7) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 8) Using a PCB board based on JESD51-3. (Note 9) Using a PCB board based on JESD51-7. Layer Number of Measurement Board Material Board Size Single FR-4 114.3 mm x 76.2 mm x 1.57 mmt Top Copper Pattern Thickness Footprints and Traces 70 μm Layer Number of Measurement Board Material Board Size 4 Layers FR-4 114.3 mm x 76.2 mm x 1.6 mmt Top 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 μm 74.2 mm x 74.2 mm 35 μm 74.2 mm x 74.2 mm 70 μm

7/39 © 2022 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111 • 15 • 001 TSZ02201-0BJB0A600090-1-2 18.Nov.2022 Rev.002 BD7xxL05G-C Series Operating Conditions Parameter Symbol Min Max Unit Input Supply Voltage(Note 1) ( IOUT ≤ 50 mA ) BD725L05G-C / BD730L05G-C VIN 3.5 42.0 V BD733L05G-C VIN 3.8 42.0 V BD750L05G-C VIN 5.6 42.0 V Start-up Voltage(Note 2) VIN Start-up 3 - V Output Current IOUT 0 50 mA Input Capacitor(Note 3) CIN 0.1 - µF Output Capacitor(Note 4) COUT 0.5 1000 µF Output Capacitor Equivalent Series Resistance(Note 5) ESR (COUT) - 100 Ω Operating Temperature Ta -40 +125 °C (Note 1) Minimum Input Supply Voltage must be VIN Start-up = 3 V or more. Consider that the output voltage would be reduced (Dropout Voltage) by the output current. (Note 2) When IOUT = 0 mA (Note 3) If the inductance of power supply line is high, adjust input capacitor value. (Note 4) Set the value of the capacitor so that it does not fall below the minimum value. Take into consideration the temperature char acteristics and DC device characteristics. (Note 5) Refer to Selection of External Components and select the parts.

Electrical Characteristics

Unless otherwise specified, Tj = -40 °C to +150 °C, VIN = 13.5 V, IOUT = 0 mA Typical values are defined at Tj = 25 °C, VIN = 13.5 V, IOUT = 0 mA. Parameter Symbol Limits Unit Conditions Min Typ Max Circuit Current ICC - 6 9 μA IOUT = 0 mA Tj ≤ +25 °C - 6 12 μA IOUT = 0 mA Tj ≤ +105 °C - 6 13 μA IOUT = 0 mA Tj ≤ +125 °C - 6 15 μA IOUT ≤ 50 mA Tj ≤ +150 °C Output Voltage Accuracy ΔVOUT -2 - +2 % VOUT + 1 V ≤ VIN ≤ 42 V 100 μA ≤ IOUT ≤ 50 mA -2 - +2 % VOUT + 1 V ≤ VIN ≤ 42 V IOUT ≤ 100 μA Tj ≤ +125 °C Dropout Voltage(Note 1) (BD730L05G-C / BD733L05G-C) ΔVd - 100 200 mV VIN = VOUT × 0.95 (= 2.85 V / 3.135 V) IOUT = 0.1 mA - 180 280 mV VIN = VOUT × 0.95 (= 2.85 V / 3.135 V) IOUT = 20 mA - 300 400 mV VIN = VOUT × 0.95 (= 2.85 V / 3.135 V) IOUT = 50 mA Dropout Voltage (BD750L05G-C) ΔVd - 200 350 mV VIN = VOUT × 0.95 (= 4.75 V) IOUT = 0.1 mA - 260 410 mV VIN = VOUT × 0.95 (= 4.75 V) IOUT = 20 mA - 350 500 mV VIN = VOUT × 0.95 (= 4.75 V) IOUT = 50 mA Ripple Rejection R.R. 55 60 - dB f = 120 Hz Vripple = 1 Vrms IOUT = 50 mA Line Regulation Reg.I - 0.1 0.6 % × VOUT VOUT + 1 V ≤ VIN ≤ 42 V Load Regulation Reg.L - 0.1 0.6 % × VOUT 100 μA ≤ IOUT ≤ 50 mA Thermal Shutdown TSD 151 175 - °C Tj at TSD ON Over Current Protection IOCP 51 120 - mA (Note 1) Minimum Input Supply Voltage of BD725L05G-C must be VIN Start-up = 3 V or more.

25/39 © 2022 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111 • 15 • 001 TSZ02201-0BJB0A600090-1-2 18.Nov.2022 Rev.002 BD7xxL05G-C Series Measurement Circuit for Typical Performance Curves VIN CIN COUT V VIN GND VOUT IOUT VIN GND VOUT A VIN CIN COUT IOUT VIN GND VOUT V VIN CIN COUT IOUT VIN CIN COUT VIN GND VOUT A IOUT V VIN GND VOUT VIN CIN COUT IOUT VIN GND VOUT VIN CIN COUT IOUT

1 Vrms

M Measurement Setup for Figure 1, 2, 3, 4, 13, Figure 15, 16, 17, 18, 28, Figure 30, 31, 32, 33, 43, Figure 45, 46, 47, 48, 58 Measurement Setup for Figure 5, 6, 7, 8, 9, Figure 19, 20, 21, 22, 23, Figure 34, 35, 36, 37, 38, Figure 49, 50, 51, 52, 53 Measurement Setup for Figure 11, 12, 25, 26, Figure 40, 41, 55, 56 Measurement Setup for Figure 14, 29, 44, 59 Measurement Setup for Figure 10, 24, 39, 54 Measurement Setup for Figure 27, 42, 57

26/39 © 2022 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111 • 15 • 001 TSZ02201-0BJB0A600090-1-2 18.Nov.2022 Rev.002 BD7xxL05G-C Series Application and Implementation Notice: The following information is given as a reference or hint for the application and the implementation. Therefore, it does not guarantee its operation on the specific function , accuracy or external components in the application. In the application, it shall be designed with sufficient margin by enough understanding about characteristics of the external components, e.g. capacitor, and also by appropriate verification in the actual operating conditions. Selection of External Components Input Pin Capacitor If the battery is placed far from the regulator or the impedance of the input-side is high, higher capacitance is required for the input capacitor in order to prevent the voltage-drop at the input line. The input capacitor and its capacitance should be selected depending on the line impedance which is between the input pin and the smoothing filter circ uit of the power supply. At this time, the capacitance value setting is different each application. Generally, the capacitor with capacitance value of 0.1 µF (Min) or more with good high frequency characteristic is recommended for this regulator. In addit ion, to prevent an influence to the regulator ’s characteristic from the deviation or the variation of the external capacitor’s characteristic. All input capacitors mentioned above are recommended to have a good DC bias characteristic and a temperature char acteristic (approximately ±15 %, e.g. X7R, X8R) with being satisfied high absolute maximum voltage rating based on EIA standard. These capacitors should be placed close to the input pin and mounted on the same board side of the regulator not to be influenced by implementation impedance. Output Pin Capacitor The output capacitor is mandatory that stop oscillation for the regulator i n order to realize stable operation. The output capacitor with effective capacitance value ≥ 0.5 µF (Min) and ESR up to 100 Ω (Max) must be required between the output pin and the GND pin. By using a ceramic capacitor, enables to expect smaller set and long-life. A proper selection of appropriate both the capacitance value and ESR for the output capacitor can improve the transient response of the regulator and can also keep the stability with better regulation loop. The correlation of the output capacitance value and ESR is shown in the graph (Figure 60 Output Capacitance COUT, ESR Stable Available Area) on the next page as the output capacitor’s capacitance value and the s tability region for ESR. As described in this graph, this regulator is designed to be stable with ceramic capacitors as of MLCC, with the capacitance value from 0.5 µF to 1000 µF and with ESR value within almost 0 Ω to 100 Ω. The frequency range of ESR can be generally considered as within about 10 kHz to 100 kHz. Note that the provided the stable area of the capacitance value and ESR in the graph is obtained under a specific set of conditions which is based on the measurement result in single IC on our board with a resistive load. I n the actual environment, the sta bility is affected by wire impedance on the board, input power supply impedance and also loads impedance. T herefore, note that a careful evaluation of the actual application, the actual usage environment and the actual conditions should be done to confirm the actual stability of the system. Generally, in the transient event which is caused by the input voltage fluctuation or the load fluctuation beyond the gain bandwidth of the regulation loop, the transient response ability of the regulator depends on the capacitance value of the output capacitor. Basically the capacitance value of ≥ 1.0 µF (Typ) for the output capacitor is recommended. Using bigger capacitance value can be expected to improve better the output voltage fluctuation in a high frequency. Various types of capacitors can be used for the output capacitor with high capacity which includes electrolytic capacitor, electro-conductive polymer capacitor and tantalum capacitor. Noted that, depending on the type of capacitors, its characteristics such as ESR (≤ 100 Ω) absolute value range, a temperature dependency of capacitance value and increased ESR at cold temperature needs to be taken into consideration . Especially when the ESR is large, the voltage generated by charge current and discharge current to capacitor and ESR are large. When transient response such that charge current and discharge current flow, noted that output voltage fluctuation. In addition, the same consideration should be taken as the input pin capacitor, to prevent an influence to the regulator ’s characteristic from the deviation or the variation of the external capacitor ’s characteristic. All output capacitors mentioned above are recommended to have a good DC bias characteristic and a temperature characteristic (approximately ±15 %, e.g. X7R, X8R) with being satisfie d high absolute maximum voltage rating based on EIA standard. These capacitors should be placed close to the output pin and mounted on the same board side of the regulator not to be influenced by implementation impedance.

28/39 © 2022 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111 • 15 • 001 TSZ02201-0BJB0A600090-1-2 18.Nov.2022 Rev.002 BD7xxL05G-C Series Typical Application and Layout Example 4:VIN 1:N.C. 3:N.C.2:GND Input Voltage CIN Output Voltage COUT Ground VOUT VINGround 5:VOUT BD7xxL05G-C Parameter Symbol Recommended Value Output Current Range IOUT IOUT ≤ 50 mA Output Capacitor COUT 1 μF ≤ COUT ≤ 1000 μF Output Capacitor ESR for stability(Note 1) ESR (COUT) ESR ≤ 100 Ω Input Voltage Range(Note 2) BD725L05G-C / BD730L05G-C VIN 3.5 V ≤ VIN ≤ 42.0 V BD733L05G-C VIN 3.8 V ≤ VIN ≤ 42.0 V BD750L05G-C VIN 5.6 V ≤ VIN ≤ 42.0 V Input Capacitor(Note 3) CIN 0.1 µF ≤ CIN (Note 1) Refer to Selection of External Components and select the parts. (Note 2) Minimum Input Supply Voltage must be VIN Start-up = 3 V or more. Consider that the output voltage would be reduced (Dropout Voltage) by the output current. (Note 3) If the inductance of power supply line is high, adjust input capacitor value.

32/39 © 2022 ROHM Co., Ltd. All rights reserved. Top copper foil: Footprints and Traces, 70 μm copper. Top copper foil: Footprints and Traces, 70 μm copper. Figure 71. Power Dissipation Graph (SSOP5)

33/39 © 2022 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111 • 15 • 001 TSZ02201-0BJB0A600090-1-2 18.Nov.2022 Rev.002 BD7xxL05G-C Series Thermal Design The power consumption of the IC is decided by the dropout voltage condition, the load current and the current consumption. Refer to power dissipation curves illustrated in Figure 71 when using the IC in an environment of Ta ≥ +25 °C. Even if the ambient temperature Ta is at +25 °C, chip junction temperature (Tj) can be very high depending on the input voltage and the load current. Consider the design to be Tj ≤ Tjmax = +150 °C in whole operating temperature range. Should by any condition the m aximum junction temperature Tjmax = +150 °C rating be exceeded by the temperature increase of the chip, it may result in deterioration of the properties of the chip. The thermal resistance in this specification is based on recommended PCB and measurement condition by JEDEC standard. Therefore, need to be careful because it might be different from the actual use condition. Verify the application and allow sufficient margins in the thermal design by the following method to calculate the junction temperature Tj. Tj can be calculated by either of the two following methods. 1. The following method is used to calculate the junction temperature Tj with ambient temperature Ta. 𝑇𝑗 = 𝑇𝑎 + 𝑃𝐶 × 𝜃𝐽𝐴 [°C] Where: 𝑇𝑗 is the Junction Temperature 𝑇𝑎 is the Ambient Temperature 𝑃𝐶 is the Power Consumption 𝜃𝐽𝐴 is the Thermal Resistance (Junction to Ambient) 2. The following method is also used to calculate the junction temperature Tj with top center of case’s (mold) temperature TT. 𝑇𝑗 = 𝑇𝑇 + 𝑃𝐶 × 𝛹𝐽𝑇 [°C] Where: 𝑇𝑗 is the Junction Temperature 𝑇𝑇 is the Top Center of Case’s (mold) Temperature 𝑃𝐶 is the Power consumption 𝛹𝐽𝑇 is the Thermal Resistance (Junction to Top Center of Case) 3. The following method is used to calculate the power consumption PC (W). 𝑃𝑐 = (𝑉𝐼𝑁 − 𝑉𝑂𝑈𝑇) × 𝐼𝑂𝑈𝑇 + 𝑉𝐼𝑁 × 𝐼𝐶𝐶 [W] Where: 𝑃𝑐 is the Power Consumption 𝑉𝐼𝑁 is the Input Voltage 𝑉𝑂𝑈𝑇 is the Output Voltage 𝐼𝑂𝑈𝑇 is the Load Current 𝐼𝐶𝐶 is the Current Consumption Calculation Example If VIN = 13.5 V, VOUT = 3.0 V, IOUT = 10 mA, ICC = 6 μA, the power consumption PC can be calculated as follows: 𝑃𝐶 = (𝑉𝐼𝑁 − 𝑉𝑂𝑈𝑇) × 𝐼𝑂𝑈𝑇 + 𝑉𝐼𝑁 × 𝐼𝐶𝐶 = (13.5 𝑉 – 3.0 𝑉) × 10 𝑚𝐴 + 13.5 𝑉 × 6 𝜇𝐴 ≂ 0.11 𝑊 At the maximum ambient temperature Tamax = 85 °C, the thermal resistance (Junction to Ambient) θJA = 155.5 °C/W (4-layer PCB) 𝑇𝑗 = 𝑇𝑎𝑚𝑎𝑥 + 𝑃𝐶 × 𝜃𝐽𝐴 ≂ 102.1 °𝐶 When operating the IC, the top center of case’s (mold) temperature TT = 100 °C, ΨJT = 43 °C/W (1-layer PCB) 𝑇𝑗 = 𝑇𝑇 + 𝑃𝐶 × 𝛹𝐽𝑇 = 104.7 °𝐶 If it is difficult to ensure the margin by the calculations above, it is recommended to expand the copper foil area of the board, increasing the layer and thermal via between thermal land pad for optimum thermal performance.

34/39 © 2022 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111 • 15 • 001 TSZ02201-0BJB0A600090-1-2 18.Nov.2022 Rev.002 BD7xxL05G-C Series I/O Equivalence Circuit(Note 1) VIN Pin VOUT Pin VIN VOUT 2.5 V: 10.3 MΩ 3.0 V: 13.0 MΩ 3.3 V: 14.8 MΩ 5.0 V: 24.1 MΩ 3.6 MΩ VIN VOUT (Note 1) Resistance value is Typical.

35/39 © 2022 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111 • 15 • 001 TSZ02201-0BJB0A600090-1-2 18.Nov.2022 Rev.002 BD7xxL05G-C Series Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply , such as mounting an external diode between the power supply and the IC ’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small -signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low -impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground , power supply and output pin . Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.

Regarding the Input Pin of the IC

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Figure 72. Example of Monolithic IC Structure temperature and the decrease in nominal capacitance due to DC bias and others.

Thermal Shutdown Circuit (TSD)

falls below the TSD threshold, the circuits are automatically restored to normal operation.

Over Current Protection Circuit (OCP)

not be used in applications characterized by continuous operation or transitioning of the protection circuit. recommended in JEDEC. Ensure that heat resistance in specification is different from actual environment. A product that has implemented safety mechanism to meet ASIL level requirements described in the datasheet. Note: “ASIL-*” is stands for the ratings of “ASIL-A”, “-B”, “-C” or “-D” specified by each product's datasheet.

Ordering Information

Part Number Output Voltage 25: 2.5 V 30: 3.0 V 33: 3.3 V 50: 5.0 V Package G: SSOP5 Product Rank C: for Automotive Packaging and forming specification TR: Embossed tape and reel Marking Diagram Lineup Part Number Marking Output Voltage Orderable Part Number dq 2.5 V BD725L05G-CTR du 3.0 V BD730L05G-CTR dr 3.3 V BD733L05G-CTR dy 5.0 V BD750L05G-CTR Part Number Marking SSOP5 (TOP VIEW) LOT Number

Revision History

29.Mar.2022 001 New Release 18.Nov.2022 002 Added about functional safety

Notice-PAA-E Rev.004 © 2015 ROHM Co., Ltd. All rights reserved. Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( “Specific Applications ”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below . Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independen t verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse , is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsibl e or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. I f the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification

Notice-PAA-E Rev.004 © 2015 ROHM Co., Ltd. All rights reserved. Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties.

Notice – WE Rev.001 © 2015 ROHM Co., Ltd. All rights reserved. General Precaution 1. Before you use our Products, you are requested to caref ully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of an y ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this documen t is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccura cy or errors of or concerning such information.

Product Information

BD750L05G-C specifications and overview.

Summary

For Automotive 45 V Input 50 mA Fixed Output LDO Regulators 18.Nov.2022 Rev.002

Description

For Automotive 45 V Input 50 mA Fixed Output LDO Regulators 18.Nov.2022 Rev.002

Source title BD750L05G-C Datasheet(PDF) - Rohm

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