BD6517F

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www.rohm.com 2009.05 - Rev.A © 2009 ROHM Co., Ltd. All rights reserved. Power Management Switch IC Series for PCs and Digital Consumer Product 2ch Large Current Output USB High Side Switch ICs BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ Description High side switch for USB is a high side switch having over current protection used in power supply line of universal serial bus (USB). Its switch unit has two channels of N-channel power MOSFET, and current of 500mA as USB standard can be flown to the respective channels. And, over current detection circuit, thermal shutdown circuit, under voltage lockout and soft start circuit are built in. Features 1) Dual N-MOS high side switch 2) Continuous current load 0.5A 3) Control input logic Active-Low Active-High 4) Soft start circuit 5) Over current detection 6) Thermal shutdown 7) Under voltage lockout 8) Open drain error flag output 9) Reverse-current protection when switch off 10) Flag output delay filter built in Applications USB hub in consumer appliances, Car accessory, PC, PC peripheral equipment, and so forth Lineup Parameter BD6512F BD6513F BD6516F BD6517F BD2052AFJ BD2042AFJ Unit Over current detection 1.65 1.65 - - - - A Output current at short - - 1.65 1.65 1.0 1.0 A On resistance 100 100 110 110 100 100 m Ω Control input logic High Low High Low High Low - Reverse current flow blockingat switch off - - ○ ○ ○ ○ - Flag output delay filter - - ○ ○ ○ ○ - No.09029EAT11

BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ Technical Note www.rohm.com 2009.05 - Rev.A © 2009 ROHM Co., Ltd. All rights reserved. Absolute Maximum Ratings ◎BD6512F/BD6513F/BD6516F/BD6517F Parameter Symbol Limits Unit Supply voltage VDD -0.3 to 6.0 V CTRL voltage VCTRL -0.3 to V DD+0.3 V Flag voltage VFLAG -0.3 to 6.0 V Output voltage VOUT -0.3 to V DD+0.3 (BD6512F/ BD6513F) V -0.3 to 6.0 (BD6516F/ BD6517F) V Storage temperature TSTG -55 to 150 ºC Power dissipation *1 Pd 560 *1 mW ◎BD2042AFJ/ BD2052AFJ Parameter Symbol Limits Unit Supply voltage VIN -0.3 to 6.0 V EN,/EN voltage VEN, V/EN -0.3 to 6.0 V /OC voltage V/OC -0.3 to 6.0 V /OC current IS/OC 10 mA OUT voltage VOUT -0.3 to 6.0 V Storage temperature TSTG -55 to 150 ºC Power dissipation *1 Pd 560*1 mW *1 This value decreases 4.48mW/℃ above Ta=25℃. * Resistance radiation design is not doing. Operating conditions ◎BD6512F/BD6513F/BD6516F/BD6517F Parameter Symbol Limits Unit Supply voltage VDD 3.0 to 5.5 V Operation temperature TOPR -25 to 85 °C Continuous output current I LO 0 t o 5 0 0 m A ◎BD2042AFJ/ BD2052AFJ Parameter Symbol Limits Unit Supply voltage VIN 2.7 to 5.5 V Operation temperature TOPR -40 to 85 ºC Continuous output current I LO 0 t o 5 0 0 m A

BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ Technical Note www.rohm.com 2009.05 - Rev.A © 2009 ROHM Co., Ltd. All rights reserved. Electrical characteristics ◎BD6512F/BD6513F(VDD =5V, Ta=25℃, unless otherwise specified.) Parameter Symbol Limits Unit Condition Min. Typ. Max. Operating current IDD - 85 120 μA VCTRL=5V(BD6512F), 0V(BD6513F) OUT=OPEN - 0.01 2 μA VCTRL=0V(BD6512F), 5V(BD6513F) OUT=OPEN Control input voltage VCTRL - - 0.7 V CTRL Low Level Input 2.5 - - V CTRL High Level Input Control input current ICTRL -1 0.01 1 μA V CTRL=0V or 5V On resistance RON - 100 130 m Ω V DD=5V,IOUT=500mA - 120 160 m Ω V DD=3.3V,IOUT=500mA Turn on delay TRD 100 600 2000 μs RL=10 Ω Turn on rise time TR 200 1500 6000 μs RL=10 Ω Turn off delay TFD - 3 20 μs RL=10 Ω Turn off fall time TF - １ 20 μs RL=10 Ω UVLO threshold voltage VUVLOH 2.3 2.5 2.7 V V DD increasing VUVLOL 2.1 2.3 2.5 V V DD decreasing Thermal shutdown threshold T TS - 135 - ºC Flag output resistance R FLAG - 16 40 Ω I FLAG=5mA Flag off current IFLAG - 0.01 1 μA Current limit threshold ITH LIM 1.25 1.65 2.20 A Over current limit level ILIM 0.6 1.1 1.6 A ◎BD6516F/BD6517F (VDD =5V, Ta=25℃, unless otherwise specified.) Parameter Symbol Limits Unit Condition Min. Typ. Max. Current consumption IDD - 100 140 μA VCTRL=5V(BD6516F), 0V(BD6517F) OUT=OPEN - 0.01 2 μA VCTRL=0V(BD6516F), 5V(BD6517F) OUT=OPEN CTRL input voltage VCTRL - - 0.7 V Low level input voltage 2.5 - - V High level input voltage CTRL input current ICTRL -1 0.01 1 μA V CTRL=0V or 5V FLAG output resistance R FLAG - 250 450 Ω I FLAG=1mA FLAG output leak current I FLAG - 0.01 1 μA V FLAG=5V FLAG output delay TDFL - 1 4 ms ON resistance RON - 110 150 m Ω V DD=5V,IOUT=500mA - 140 180 m Ω V DD=3.3V,IOUT=500mA Short circuit output current I SC 1.2 1.65 2.2 A V OUT=0V Output leak current ILEAK - - 10 μA V CTRL=0V(BD6516F), 5V(BD6517F) Thermal shutdown threshold T TS - 135 - ºC At Tj increase Output rise time TON1 100 1300 4000 μs RL=10 Ω Output turn on delay time T ON2 200 1500 6000 μs RL=10 Ω Output fall time TOFF1 - 1 20 μs RL=10 Ω Output turn off delay time T OFF2 - 3 20 μs RL=10 Ω

BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ Technical Note www.rohm.com 2009.05 - Rev.A © 2009 ROHM Co., Ltd. All rights reserved. ◎BD2042AFJ/BD2052AFJ (VDD =5V, Ta=25℃, unless otherwise specified.) Parameter Symbol Limits Unit Condition Min. Typ. Max. Operating Current IDD - 110 140 μA V/EN = 0V, OUT = OPEN (BD2042AFJ) VEN = 5V, OUT = OPEN (BD2052AFJ) Standby Current ISTB - 0.01 1 μA V/EN = 5V, OUT = OPEN (BD2042AFJ) VEN = 0V, OUT = OPEN (BD2052AFJ) /EN input voltage V/EN,EN 2.0 - - V High input - - 0.8 V Low input - - 0.4 V Low input2.7V ≤ VIN ≤4.5V /EN input current I/EN,EN -1.0 0.01 1.0 μA V /EN,EN = 0V or V/EN,EN = 5V /OC output LOW voltage V /OC - - 0.5 V I /OC = 5mA /OC output leak current IL /OC - 0.01 1 μA V /OC = 5V ON resistance RON - 100 130 m Ω I OUT = 500mA Output current at short I SC 0.7 1.0 1.3 A VIN = 5V, VOUT = 0V, CL = 100μF (RMS) Output rise time TON1 - 1.8 10 ms RL = 10Ω , CL = OPEN Output turn on time TON2 - 2.1 20 ms Output fall time TOFF1 - 1 20 μs Output turn off time TOFF2 - 3 40 μs UVLO threshold VTUVH 2.1 2.3 2.5 V Increasing V IN VTUVL 2.0 2.2 2.4 V Decreasing V IN

BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ Technical Note www.rohm.com 2009.05 - Rev.A © 2009 ROHM Co., Ltd. All rights reserved. Measurement circuit ◎BD6512F/ BD6513F/ BD6516F/ BD6517F CTRLA FLAGA FLAGB CTRLB OUTA VDD GND OUTB VDD 1µF VCTRL VCTRL A CTRLA FLAGA FLAGB CTRLB OUTA VDD GND OUTB VDD 1µF VCTRL VCTRL RL CL RL CL Operating current CTRL input voltage, Output rise, fall time CTRLA FLAGA FLAGB CTRLB OUTA VDD GND OUTB VDD 1µF VCTRL CL CL VDD VCTRL 10k 10k IOUT IOUT CTRLA FLAGA FLAGB CTRLB OUTA VDD GND OUTB VDD 1µF VCTRL VCTRL IFLAG IFLAG ON resistance, Over current detection FLAG output resistance ◎BD2042AFJ/ BD2052AFJ GND IN EN1 EN2 /OC1 OUT1 OUT2 /OC2 VDD VEN A 1µF VEN GND IN EN1 EN2 /OC1 OUT1 OUT2 /OC2 VDD VEN 1µF VEN RL CL RL CL Operating current EN, /EN input voltage, Output rise, fall time GND IN EN1 EN2 /OC1 OUT1 OUT2 /OC2 VDD VEN 1µF VEN IOUT 10k 10k VDD IOUT GND IN EN1 EN2 /OC1 OUT1 OUT2 /OC2 VDD VEN 1µF VEN IOUTIOUT ON resistance, Over current detection /OC output LOW voltage Fig.1 Measurement circuit

BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ Technical Note www.rohm.com 2009.05 - Rev.A © 2009 ROHM Co., Ltd. All rights reserved. Timing diagram ◎BD6513F ◎BD6512F TRD 50% TR 10% 50% 90% 50% TFD 90% 50% 10% TF VOUT VCTRL TRD 50% TR 10% 50% 90% 50% TFD 90% 50% 10% TF VOUT VCTRL ◎BD6515F/BD2042AFJ ◎BD6516F/BD2052AFJ TON2 50% TON1 10% 90% 50% 90% 10% TOFF1 VOUT VCTRL V/EN TOFF2 TON2 50% TON1 10% 90% 50% 90% 10% TOFF1 VOUT VCTRL VEN TOFF2 Fig.2 Timing diagram

BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ Technical Note www.rohm.com 2009.05 - Rev.A © 2009 ROHM Co., Ltd. All rights reserved. Reference data ◎BD6512F/ BD6513F Fig.3 Operating current Fig.4 Operating current 100 120 23456 SUPPLY VOLTAGE : VDD [V] OPERATING CURRENT : IDD [uA] Ta=25ºC 100 120 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] OPERATING CURRENT : IDD [uA] VDD=5.0V Fig.5 CTRL input voltage 0.0 0.5 1.0 1.5 2.0 2.5 3.0 23456 SUPPLY VOLTAGE : V DD [V] CONTROL INPUT VOLTAGE : VCTRL [V] Low to High High to Low Ta=25ºC Fig.6 CTRL input voltage 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] CONTROL INPUT VOLTAGE : VCTRL [V] VDD=5.0V High to Low Low to High Fig.7 ON resistance Fig.8 ON resistance 100 150 200 23456 SUPPLY VOLTAGE : V DD [V] ON RESISTANCE : RON[mΩ] Ta=25ºC 100 150 200 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] ON RESISTANCE : RON[mΩ] VDD=3.3V VDD=5.0V Fig.9 Output rise time 1000 2000 3000 4000 23456 SUPPLY VOLTAGE : V DD [V] TURN ON RISE TIME : TR[us] Ta=25ºC Fig.10 Output rise time Fig.11 Output rise delay time 1000 2000 3000 4000 -50 0 50 100 AMBIENT TEMPERATURE : Ta[ TURN ON RISE TIME : TR[us] VDD=5.0V 1000 2000 3000 4000 23456 SUPPLY VOLTAGE : VDD [V] TURN ON DELAY : TRD [us] Ta=25ºC Fig.12 Output rise delay time 1000 2000 3000 4000 -50 0 50 100 AMBIENT TEMPERATURE : Ta[ ℃] TURN ON DELAY : TRD [us] VDD=5.0V Fig.13 Output fall time Fig.14 Output fall time 0.0 1.0 2.0 3.0 4.0 5.0 23 456 SUPPLY VOLTAGE : VDD[V] TURN OFF FALL TIME : T F[us] Ta=25ºC 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 AM BIENT TEM PERATURE : Ta[℃] TURN OFF FALL TIME : T F[us] VDD=5.0V

BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ Technical Note www.rohm.com 2009.05 - Rev.A © 2009 ROHM Co., Ltd. All rights reserved. Fig.15 Output fall delay time Fig.16 Output fall delay time 0.0 1.0 2.0 3.0 4.0 5.0 234 56 SUPPLY VOLTAGE : VDD [V] TURN OFF DELAY : TFD[us] Ta=25ºC 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] TURN OFF DELAY : TFD[us] VDD=5.0V Fig.17 UVLO threshold voltage Fig.18 UVLO hysteresis voltage 2.0 2.2 2.4 2.6 2.8 3.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] UVLO THRESHOLD VOLTAGE VUVLOH , VUVLOL[V] VUVLOH VUVLOL 0.0 0.2 0.4 0.6 0.8 1.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] UVLO HYSTERESIS VOLTAGE : VHYS[V] Fig.19 Over current threshold Fig.20 Over current threshold 0.0 1.0 2.0 3.0 234 56 SUPPLY VOLTAGE : VDD [V] CURRENT LIMIT THRESHOLD : ITHLIM[A] Ta=25ºC Fig.21 Flag output resistance Fig.22 Flag output resistance -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] FLAG OUTPUT RESISTANCE : RFLAG[Ω] VDD=5.0V Fig.23 Operating current CTRL Disable 0.0 0.2 0.4 0.6 0.8 1.0 23456 SUPPLY VOLTAGE : V DD [V] OPERATING CURRENT : IDD [uA] Ta=25ºC Fig.24 Operating current CTRL Disable 0.0 0.2 0.4 0.6 0.8 1.0 23456 SUPPLY VOLTAGE : VDD [V] OPERATING CURRENT : IDD [uA] VDD=5.0V 23 456 Supply Voltage : V DD [V] FLAG OUTPUT RESISTANCE : RFLAG[Ω] Ta=25ºC 0.0 1.0 2.0 3.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] CURRENT LIMIT THRESHOLD : ITHLIM[A] VDD=5.0V

BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ Technical Note www.rohm.com 2009.05 - Rev.A © 2009 ROHM Co., Ltd. All rights reserved. 100 120 23456 SUPPLY VOLTAGE : V DD [V] OPERATING CURRENT : IDD [uA] Ta=25ºC Reference data ◎BD6516F/ BD6517F Fig.25 Operating current Fig.26 Operating current Fig.27 CTRL input voltage (BD6516F) Fig.28 CTRL input voltage (BD6516F) Fig.29 CTRL input voltage (BD6517F) Fig.30 CTRL input voltage (BD6517F) 100 120 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] OPERATING CURRENT : I DD [uA] VDD=5.0V 0.0 0.5 1.0 1.5 2.0 2.5 3.0 23456 SUPPLY VOLTAGE : VDD [V] CONTROL INPUT VOLTAGE : VCTRL [V] Ta=25ºC 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] CONTROL INPUT VOLTAGE : VCTRL [V] VDD=5.0V 0.0 0.5 1.0 1.5 2.0 2.5 3.0 23456 SUPPLY VOLTAGE : V DD [V] CONTROL INPUT VOLTAGE : VCTRL [V] Ta=25ºC Low to High High to Low 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[ CONTROL INPUT VOLTAGE : VCTRL [V] VDD=5.0V Low to High High to Low 100 150 200 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] ON RESISTANCE : RON[mΩ] Fig.31 ON resistance Fig.32 ON resistance 100 150 200 23456 SUPPLY VOLTAGE : VDD [V] ON RESISTANCE : RON[mΩ] Ta=25ºC VDD=3.3V VDD=5.0V Fig.33 Output rise time 1000 2000 3000 4000 23456 SUPPLY VOLTAGE : VDD [V] TURN ON RISE TIME : TON1 [us] Ta=25ºC 1000 2000 3000 4000 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] TURN ON DELAY : TON2[us] 1000 2000 3000 4000 23456 SUPPLY VOLTAGE : VDD[V] TURN ON DELAY : TON2[us] 1000 2000 3000 4000 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] TURN ON RISE TIME : TON1[us] Fig.34 Output rise time Fig.35 Output rise delay time Fig.36 Output rise delay time VDD=3.3V VDD=5.0V Ta=25ºC VDD=3.3V VDD=5.0V

BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ Technical Note www.rohm.com 2009.05 - Rev.A © 2009 ROHM Co., Ltd. All rights reserved. 0.0 1.0 2.0 3.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] SHORT CIRCUIT CURRENT : ISC[A] 0.0 1.0 2.0 3.0 23456 SUPPLY VOLTAGE : VDD[V] SHORT CIRCUIT CURRENT : ISC[A] 0.0 0.2 0.4 0.6 0.8 1.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] OPERATING CURRENT : IDD[uA] 0.0 0.2 0.4 0.6 0.8 1.0 23456 SUPPLY VOLTAGE : VDD[V] OPERATING CURRENT : IDD[uA] 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] TURN OFF DELAY : TOFF2[us] 0.0 1.0 2.0 3.0 4.0 5.0 23456 SUPPLY VOLTAGE : VDD[V] TURN OFF DELAY : TOFF2[us] 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] TURN OFF FALL TIME : TOFF1[us] Fig.38 Output fall time Fig.39 Output fall time Fig.40 Output fall delay time Fig.41 Output fall delay time Fig.42 Shortcircuit output current Fig.43 Shortcircuit output current Fig.47 Operating current CTRL Disable Fig.48 Operating current CTRL Disable 0.0 1.0 2.0 3.0 4.0 5.0 23456 SUPPLY VOLTAGE : V DD [V] TURN OFF FALL TIME : TOFF1[us] Ta=25ºC VDD=3.3V VDD=5.0V Ta=25ºC VDD=3.3V VDD=5.0V Ta=25ºC VDD=5.0V VDD=3.3V Ta=25ºC VDD=5.0V 100 200 300 400 500 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] FLAG OUTPUT RESISTANCE : RFLAG[Ω] Fig.37 Flag output resistance VDD=5.0V VDD=3.3V -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] FLAG OUTPUT DELAY : TDFL[ms] 23456 SUPPLY VOLTAGE : V DD[V] FLAG OUTPUT DELAY : TDFL[ms] 100 200 300 400 500 23456 SUPPLY VOLTAGE : V DD[V] FLAG OUTPUT RESISTANCE : RFLAG[Ω] Fig.44 Flag output resistance Fig.45 Flag output delay Fig.46 Flag output delay Ta=25ºC Ta=25ºC VDD=5.0V

BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ Technical Note www.rohm.com 2009.05 - Rev.A © 2009 ROHM Co., Ltd. All rights reserved. Reference data ◎BD2042AFJ/ BD2052AFJ Fig.51 Operating current EN,/EN Disable Fig.52 Operating current EN,/EN Disable Fig.49 Operating current EN,/EN Enable 100 120 140 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] OPERATING CURRENT : IDD[uA] VIN=5.0V 0.0 0.2 0.4 0.6 0.8 1.0 23456 SUPPLY VOLTAGE : V IN[V] OPERATING CURRENT : ISTB[uA] Ta=25ºC Fig.50 Operating current EN,/EN Enable 0.0 0.5 1.0 1.5 2.0 23456 SUPPLY VOLTAGE : VIN[V] ENABLE INPUT VOLTAGE : VEN, V/EN[V] 0 Low to High High to Low Ta=25ºC Fig.53 EN,/EN input voltage 0.0 0.5 1.0 1.5 2.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] ENABLE INPUT VOLTAGE : VEN, V/EN[V] VIN=5.0V High to Low Low to High Fig.54 EN,/EN input voltage 0.0 0.1 0.2 0.3 0.4 0.5 23456 SUPPLY VOLTAGE : V DD[V] /OC OUTPUT LOW VOLTAGE : V/OC[V] Ta=25ºC Fig.55 /OC output LOW voltage 0.0 0.1 0.2 0.3 0.4 0.5 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] /OC OUTPUT LOW VOLTAGE : V/OC[V] VIN=5.0V Fig.56 /OC output LOW voltage Fig.57 ON resistance 100 150 200 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] ON RESISTANCE : RON[mΩ] VIN=5.0V Fig.58 ON resistance 100 120 140 23456 SUPPLY VOLTAGE : V IN[V] OPERATING CURRENT : IDD[uA] Ta=25ºC 0.0 0.2 0.4 0.6 0.8 1.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[ OPERATING CURRENT : ISTB[uA] VIN=5.0V 100 150 200 23456 SUPPLY VOLTAGE : VDD[V] ON RESISTANCE : RON[mΩ] Ta=25ºC 0.0 0.5 1.0 1.5 2.0 23456 SUPPLY VOLTAGE : V IN[V] SHORT CIRCUIT CURRENT : ISC[A] Ta=25ºC Fig.59 Output current at shortcircuit 0.0 0.5 1.0 1.5 2.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] SHORT CIRCUIT CURRENT : ISC[A] VIN=5.0V Fig.60 Output current at shortcircuit

BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ Technical Note www.rohm.com 2009.05 - Rev.A © 2009 ROHM Co., Ltd. All rights reserved. Fig.63 Output turn on time Fig.64 Output turn on time Fig.67 Output turn off time 0.0 1.0 2.0 3.0 4.0 5.0 23456 SUPPLY VOLTAGE : V IN[V] TURN ON TIME : TON2[ms] Ta=25ºC 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] TURN ON TIME : TON2[ms] VIN=5.0V 0.0 1.0 2.0 3.0 4.0 5.0 23456 SUPPLY VOLTAGE : VIN[V] FALL TIME : TOFF1[us] Ta=25ºC Fig.65 Output fall time 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[ FALL TIME : TOFF1[us] VIN=5.0V Fig.66 Output fall time 0.0 1.0 2.0 3.0 4.0 5.0 6.0 23456 SUPPLY VOLTAGE : V IN[V] TURN OFF TIME : TOFF2[us] Ta=25°C 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[ TURN OFF TIME : TOFF2[us] VIN=5.0V Fig.68 Output turn off time 2.0 2.1 2.2 2.3 2.4 2.5 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] UVLO THRESHOLD VOLTAGE : VUVLOH, VUVLOL[V] VUVLOH VUVLOL Fig.69 UVLO threshold voltage 0.0 0.2 0.4 0.6 0.8 1.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[ UVLO HYSTERESIS VOLTAGE : VHYS[V] Fig.70 UVLO hysteresis voltage Fig.61 Output rise time 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] RISE TIME : TON1[ms] VIN=5.0V Fig.62 Output rise time 0.0 1.0 2.0 3.0 4.0 5.0 23456 SUPPLY VOLTAGE : VIN[V] RISE TIME : TON1[ms] Ta=25ºC

BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ Technical Note www.rohm.com 2009.05 - Rev.A © 2009 ROHM Co., Ltd. All rights reserved. Waveform data Regarding the output rise/fall and over current detection characteristics of BD6513F, BD6517F, BD2042AFJ refer to the characteristic of BD6512F, BD6516F, BD2052AFJ. VCTRL (5V/div.) VCTRL (5V/div.) VDD=5V RL=47Ω CL=47uF VDD=5V RL=47Ω CL=47uF VFLAG (5V/div.) VOUT (5V/div.) IOUT (0.2A/div.) VFLAG (5V/div.) VOUT (5V/div.) IOUT (0.2A/div.) TIME(200ms/div.) Fig.71 Output rise, fall characteristic (BD6512F) TIME(200ms/div.) Fig.72 Output rise, fall characteristic (BD6516F) TIME(200ms/div.) Fig.73 Output rise, fall characteristic (BD2052AFJ) VDD=5V CL=47uF TIME (2ms/div.) Fig.74 Over current response Ramped load (BD6512F) TIME (2ms/div.) Fig.75 Over current response Ramped load (BD6516F) VCTRL (5V/div.) VFLAG (5V/div.) VOUT (5V/div.) IOUT (0.5A/div.) TIME (2ms/div.) Fig.77 Over current response Enable to shortcircuit (BD6512F) TIME (2ms/div.) Fig.78 Over current response Enable to shortcircuit (BD6516F) VFLAG (5V/div.) VOUT (5V/div.) IOUT (2A/div.) VFLAG (5V/div.) VOUT (5V/div.) IOUT (2A/div.) TIME (100ms/div.) Fig.80 Over current response Output shortcircuit at Enable (BD6512F) TIME (100ms/div.) Fig.81 Over current response Output shortcircuit at Enable (BD6516F) VFLAG (5V/div.) VOUT (5V/div.) IOUT (0.5A/div.) VDD=5V CL=47uF VFLAG (5V/div.) VOUT (5V/div.) IOUT (0.5A/div.) VDD=5V CL=47uF VCTRL (5V/div.) VFLAG (5V/div.) VOUT (5V/div.) IOUT (0.5A/div.) VDD=5V CL=47uF 1ms Delay Thermal Shutdown VDD=5V CL=47uF Thermal Shutdown VDD=5V CL=47uF VEN (5V/div.) V/OC (5V/div.) VOUT (5V/div.) IOUT (0.2A/div.) VDD=5V RL=10Ω CL=100uF V/OC (5V/div.) VOUT (5V/div.) IOUT (0.5A/div.) VDD=5V VEN (5V/div.) V/OC (5V/div.) VOUT (5V/div.) IOUT (0.5A/div.) VDD=5V CL=100uF 1.3ms Delay V/OC (5V/div.) VOUT (5V/div.) IOUT (2A/div.) VDD=5V CL=100uF Thermal Shutdown TIME (200ms/div.) Fig.82 Over current response Output shortcircuit at Enable (BD2052AFJ) TIME (2ms/div.) Fig.79 Over current response Enable to shortcircuit (BD2052AFJ) TIME (2ms/div.) Fig.76 Over current response Ramped load (BD2052AFJ)

BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ Technical Note www.rohm.com 2009.05 - Rev.A © 2009 ROHM Co., Ltd. All rights reserved. Block diagram ◎BD6512F/ BD6513F/ BD6516F/ BD6517F Gate Logic1 OCD1 Charge Pump1 UVLO Charge Pump2 OCD2 Gate Logic2 TSD CTRLA VDD CTRLB GND FLAGA OUTA OUTB FLAGB Delay Delay (BD6516F/17F) (BD6516F/17F) CTRLA FLAGA OUTA VDD 3FLAGB 4CTRLB GND OUTB Top View Fig.83 Block diagram Fig.84 Pin Configuration Pin description ◎BD6512F/ BD6513F/ BD6516F/ BD6517F Pin No. Symbol I / O Pin function 1, 4 CTRLA CTRLB I Enable input. Switch on at Low level. (BD6513F/BD6517F) Switch on at High level. (BD6512F/BD6516F) High level input > 2.5V, Low level input < 0.7V. 2, 3 FLAGA FLAGB O Error flag output. Low at over current, thermal shutdown. Open drain output. 5, 8 OUTB OUTA O Switch output. 6 GND I Ground. 7 VDD I Power supply input. Input terminal to the switch and power supply input terminal of the internal circuit. I/O circuit ◎BD6512F/ BD6513F/ BD6516F/ BD6517F Symbol Pin No. Equivalent circuit (BD6512F/ BD6513F) Equivalent circuit (BD6516F/ BD6517F) CTRLA CTRLB 1, 4 CTRLA CTRLB CTRLA CTRLB FLAGA FLAGB 2, 3 FLAGA FLAGB FLAGA FLAGB OUTA OUTB 5, 8 OUTA OUTB OUTA OUTB

BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ Technical Note www.rohm.com 2009.05 - Rev.A © 2009 ROHM Co., Ltd. All rights reserved. Block diagram ◎BD2042AFJ/BD2052AFJ Gate Logic1 OCD1 Charge Pump1 TSD1 UVLO Charge Pump2 OCD2 Gate Logic2 TSD2 /EN1 EN1 IN /EN2 EN2 GND /OC1 OUT1 OUT2 /OC2 Delay Delay GND IN /OC1 OUT1 3/EN1 (EN1) OUT2 /OC2 Top View /EN2 (EN2) Fig.85 Block diagram Fig.86 Pin Configuration Pin description ◎BD2042AFJ/BD2052AFJ Pin No. Symbol I / O Pin function 1 GND I Ground.

2 IN I

Power supply input. Input terminal to the switch and power supply input terminal of the internal circuit. 3, 4 /EN, EN I Enable input. Switch on at Low level. (BD2042AFJ) Switch on at High level. (BD2052AFJ) High level input > 2.0V, Low level input < 0.8V. 5, 8 /OC O Error flag output. Low at over current, thermal shutdown. Open drain output. 6, 7 OUT O Switch output. I/O circuit ◎BD2042AFJ/BD2052AFJ Symbol Pin No Equivalent circuit /EN1(EN1) /EN2(EN2) 3, 4 /EN1(EN1) /EN2(EN2) /OC1 /OC2 5, 8 /OC1 /OC2 OUT1 OUT2 6, 7 OUT1 OUT2

BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ Technical Note www.rohm.com 2009.05 - Rev.A © 2009 ROHM Co., Ltd. All rights reserved. Functional description 1. Switch operation VDD(IN) pin and OUT pin are connected to the drain and the source of switch MOSFET respectively. And the VDD(IN) pin is used also as power source input to internal control circuit. When the switch is turned on from CTRL(EN) control input, VDD(IN) and OUT is connected. In a normal condition, current flows from VDD to OUT. If voltage of OUT is higher than VDD, current flows from OUT to VDD, since the switch is bidirectional. ◎BD6512F/ BD6513F There is a parasitic diode between the drain and the source of switch MOSFET. Therefore, even when the switch is off, if the voltage of OUT is higher than that of VDD, current flows from OUT to VDD. ◎BD6516F/BD6517F/BD2042AFJ/BD2052AFJ There is not parasitic diode, it is possible to prevent current from flowing reversely from OUT to VDD. 2. Thermal shutdown (TSD) Thermal shut down circuit turns off the switch and outputs an error flag when the junction temperature in chip exceeds a threshold temperature. The thermal shut down circuit works when either of two control signals is active. In BD6512F/BD6513F/BD6516F/BD6517F, the switches of both OUTA and OUTB become off and error flags are output to the both. BD2042AFJ/ BD2052AFJ have dual thermal shutdown threshold. Since thermal shutdown works at a lower junction temperature when an overcurrent occurs, only the switch of an overcurrent state become off and error flag is output. ◎BD6512F/BD6513F The switch off status of the thermal shut down is latched. Therefore, even when the junction temperature goes down, switch off and error flag output status are maintained. To release the latch, it is necessary to input a signal to switch off to CTRL pin or make UVLO status. When the switch on signal is input or UVLO is released, the switch on and error flag output are recovered. ◎BD6516F/BD6517F/BD2042AFJ/BD2052AFJ Thermal shut down action has hysteresis. Therefore, when the junction temperature goes down, switch on and error flag output automatically recover. However, until cause of junction temperature increase such as output shortcircuit is removed or the switch is turned off, thermal shut down detection and recovery are repeated. 3. Over current detection, limit circuit The over current detection circuit limits current and outputs error flag when current flowing in each switch MOSFET exceeds a specified value. There are three types of response against over current. The over current detection, limit circuit works when the switch is on (CTRL・EN signal is active). 3-1 When the switch is turned on while the output is in shortcircuit status When the switch is turned on while the output is in shortcircuit status, the switch become current limit mode soon. 3-2 When the output shortcircuits while the switch is on When the output shortcircuits or large capacity is connected while the switch is on, very large current flows until the over current limit circuit responds. When the current detection, limit circuit works, current limitation is carried out. 3-3 When the output current increases gradually When the output current increases gradually, current limitation does not work until the output current exceeds the over current detection value. When it exceeds the detection value, current limitation is carried out. 4. Under voltage lockout(UVLO) When the supply voltage is below UVLO threshold level, UVLO circuit turns off switch to prevent malfunction. The UVLO circuit works when either of two control signals is active. ◎BD6512F/BD6513F UVLO circuit prevents the switch from turning on until the V while the switch turns on, then UVLO shuts off the switch. ◎BD2042AFJ/BD2052AFJ while the switch turns on, then UVLO shuts off the switch. UVLO has hysteresis of a 100mV(Typ). 5. Error flag output Error flag output is N-MOS open drain output. ◎BD6512F/BD6513F At detection of over current detection, thermal shutdown, UVLO, Low level is output. ◎BD6516F/BD6517F/BD2042AFJ/BD2052AFJ At detection of over current detection, thermal shutdown, Low level is output. Error flag output at over current detection has delay filter. This delay filter prevents instantaneous current detection such as inrush current at switch on, hot plug from being informed to outside.

BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ Technical Note www.rohm.com 2009.05 - Rev.A © 2009 ROHM Co., Ltd. All rights reserved. Output shortcircuit Thermal shut down Latch release VCTRL VOUT IOUT VFLAG Latch Fig.87 BD6512F/ BD6513F over current detection, thermal shutdown timing (VCTRL of BD6513F active Low) Output shortcircuit Thermal shut down VCTRL VEN VOUT IOUT VFLAG V/OC delay Fig.88 BD6516F/ BD6517F/BD2042AFJ/ BD2052AFJ over current detection, thermal shutdown timing (VCTRL, V/EN of BD6517F/BD2042AFJ active Low) Typical application circuit ON/OFF OC OC ON/OFF CTRLA (EN) FLAGA (/OC) OUTA VDD GND OUTB 100k 100k 5V(Typ) OUTIN VBUS GND Data Regulator USB Controller CIN CL Ferrite Beads Data CL Data CTRLB (EN) FLAGA (/OC) Fig.89 Typical application circuit

BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ Technical Note www.rohm.com 2009.05 - Rev.A © 2009 ROHM Co., Ltd. All rights reserved. 100 200 300 400 500 600 0 25 50 75 100 125 150 AMBIENT TEMPERATURE: Ta [℃] POWER DISSIPATION: Pd[mW] Application information When excessive current flows owing to output shortcircuit or so, ringing occurs by inductance of power source line to IC, and may cause bad influences upon IC operations. In order to avoid this case, connect a bypass capacitor by VDD pin and GND pin of IC. 1uF or higher is recommended. Pull up flag output by resistance 10kΩ ~ 100kΩ. Set up value which satisfies the application as C L and Ferrite Beads. This system connection diagram doesn’t guarantee operating as the application. The external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account external parts or dispersion of IC including not only static characteristics but also transient characteristics. In BD6512F/BD6513F, there are cases where over current detection error flag is output to inrush current at switch on or at insertion of active line of peripheral devices. In the case of erroneous detection inBD6512F/BD6513F, use RC filter shown in Fig. 90 for FLAG output. OC CTRLA FLAGA FLAGB CTRLB OUTA VDD GND OUTB USB Controller BD6512F/13F VDD Fig.90 FLAG output RC filter Thermal derating characteristic (SOP8, SOP-J8) Fig.92 Power dissipation curve

BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ Technical Note www.rohm.com 2009.05 - Rev.A © 2009 ROHM Co., Ltd. All rights reserved. Notes for use (1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify break ing mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Operating conditions These conditions represent a range within which characte ristics can be provided approximately as expected. The electrical characteristics are guaranteed under the conditions of each parameter. (3) Reverse connection of power supply connector The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal. (4) Power supply line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For the GND line, give consideration to design the patterns in a similar manner. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (5) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. (6) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. (7) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (8) Inspection with set PCB On the inspection with the set PCB, if a capacitor is connec ted to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge from the set PCB by each proc ess. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a ground for the assembly pr ocess and pay thorough attention to the transportation and the storage of the set PCB. (9) Input terminals In terms of the construction of IC, parasitic elements are inev itably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunct ion and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a volt age lower than the power supply voltag e or within the guaranteed value of electrical characteristics. (10) Ground wiring pattern If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a si ngle ground at the reference poi nt of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well. (11) External capacitor In order to use a ceramic capacitor as the external capaci tor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. (12) Thermal shutdown circuit (TSD) When junction temperatures become 135°C (typ) or higher, the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not c ontinuously use the LSI with this circuit operating or use the LSI assuming its operation. (13) Thermal design Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual states of use.

BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ Technical Note www.rohm.com 2009.05 - Rev.A © 2009 ROHM Co., Ltd. All rights reserved.  Ordering part number B D 6 5 1 2 F - E 2 Part No. Part No. 6512 6513 6516 6517 2042A 2052A Package F: SOP8 FJ:SOP-J8 Packaging and forming specification E2: Embossed tape and reel ( S O P 8 , S O P - J 8 ) (Unit : mm) SOP8 0.9±0.15 0.3MIN 4°+6° −4° 0.17 +0.1 -0.05 0.595 4 3 5.0±0.2 6.2±0.3 4.4±0.2 (MAX 5.35 include BURR) 1.27 0.11 0.42±0.1 1.5±0.1 S ∗ Order quantity needs to be multiple of the minimum quantity. <Tape and Reel information> Embossed carrier tapeTape Quantity Direction of feed The direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs Direction of feed Reel 1pin ∗ Order quantity needs to be multiple of the minimum quantity. <Tape and Reel information> Embossed carrier tapeTape Quantity Direction of feed The direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs Direction of feed Reel 1pin (Unit : mm) SOP-J8 4° +6° −4° 0.2±0.1 0.45MIN 234 5 6 7 8 4.9±0.2 0.545 3.9±0.2 6.0±0.3 (MAX 5.25 include BURR) 0.42±0.1 1.27 0.175 1.375±0.1 0.1 S S

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Summary

High-Side Switch

Description

High side switch for USB is a high side switch having over current protection used in power supply line of universal serial bus (USB). Its switch unit has two channels of N-channel power MOSFET, and current of 500mA as USB standard can be flown to the respective channels. And, over current detection circuit, thermal shutdown circuit, under voltage lockout and soft start circuit are built in.

Source title BD6517F Datasheet(PDF) - Rohm

Read BD6517F online.