Power Management

BD60HC0WEFJ-E2

Rohm

1A Fixed Output LDO Regulators

Manufacturer: Rohm

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BD15HC0WEFJ ROHM | Alldatasheet

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○Product structure：Silicon monolithic integrated circuit ○ This product is not designed protection against radioactive rays. 1/18 TSZ02201-0R6R0A600330-1-2© 2012 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111･14･001 28.Dec.2012 Rev.002 Datasheet 1A Fixed Output LDO Regulators BDxxHC0WEFJ

General Description BDxxHC0WEFJ series devices are LDO regulators with an output current of 1.0A. The output accuracy is ±1% of the output voltage. Various fixed output voltage devices that do not use external resistors ar e available. It can be used for a wide devices have built in over current protection to protect the device when output is shorted, 0µA shutdown mode and thermal shutdown circuit to protect the device during over load conditions. These LDO regulators are usable with ceramic capacitors that enable a smaller layout and longer life.
Features +/-1% output voltage accuracy Built-in Over Current Protection circuit (OCP) Built-in Thermal Shut Down circuit (TSD) Zero μA shutdown mode
Key Specifications Input Power Supply Voltage range: 4.5V to 8.0V Output current: 1.0A(Max.) Shutdown current: 0 μA(Typ.) Operating temperature range: -25 ℃ to +85 ℃
Package ( T y p . ) ( T y p . ) ( M a x . ) HTSOP-J8 4.90mm x 6.00 mm x 1.00mm
Typical Application Circuit HTSOP-J8 VO VCC EN GND FIN VO_S COUT CIN CIN,COUT : Ceramic Capacitor

Ordering Information B D x x H C 0 W E F J - E 2 Part Number Output voltage 15:1.5V 18:1.8V 25:2.5V 30:3.0V 33:3.3V 50:5.0V 60:6.0V 70:7.0V Input voltage range H:10V Output current C0:1.0A Shutdown mode “W”:Included Package EFJ:HTSOP-J8 Packaging and forming specification E2:Emboss tape reel

Block Diagram BDxxHC0WEFJ
Pin Configuration
Pin Description Pin No. Pin name Pin Function

1 V O Output pin

2 V O_S Output voltage monitor pin

3 GND GND pin

4 N.C. No Connect (Connect to GND or leave OPEN)

5 EN Enable pin

6 N.C. No Connect (Connect to GND or leave OPEN) 7 N.C. No Connect (Connect to GND or leave OPEN)

8 V CC Input pin

Reverse FIN Substrate(Connect to GND) TOP VIEW VO VO_S GND N.C. N.C. N.C. EN VCC GND EN TSD OCP SOFT START VO VCC VO_S Fig.1 Block Diagram

Absolute Maximum Ratings (Ta=25℃) Parameter Symbol Ratings Unit Power supply voltage VCC 10.0 *1 V EN voltage VEN 10.0 V Power dissipation HTSOP-J8 Pd *2 2110 *2 mW Operating Temperature Range Topr -25 to +85 ℃ Storage Temperature Range Tstg -55 to +150 ℃ Junction Temperature Tjmax +150 ℃ *1 Not to exceed Pd *2 Reduced by 16.9mW/℃ for each increase in Ta of 1℃ over 25 ℃. (when mounted on a board 70mm×70mm×1.6mm glass-epoxy board, two layer)
Recommended Operating Ratings (Ta=25℃) Ratings Parameter Symbol Min. Max. Unit Input power supply voltage VCC 4.5 8.0 V EN voltage VEN 0.0 8.0 V Output current IO 0.0 1.0 A
Electrical Characteristics (Unless otherwise noted, Ta=25℃, EN=3V, VCC=6V) Limits Parameter Symbol Min. Typ. Max. Unit Conditions Circuit current at shutdown mode ISD - 0 5 µA V EN=0V, OFF mode Bias current ICC - 600 900 µA Line regulation Reg.I -1 - 1 % V CC=( VO+0.92V )→8.0V Load regulation Reg IO -1.5 - 1.5 % I O=0→1.0A Minimum dropout voltage1 VCO1 - 0.15 0.23 V V CC=5V, IO =250mA Minimum dropout voltage2 VCO2 - 0.30 0.46 V V CC=5V, IO =500mA Minimum dropout voltage3 VCO3 - 0.45 0.69 V V CC=5V, IO =750mA Minimum dropout voltage4 VCO4 - 0.60 0.92 V V CC=5V, IO =1.0A Output voltage VO V O×0.99 V O V O×1.01 V I O=0A EN Low voltage VEN (Low) 0 - 0.8 V EN High voltage VEN (High) 2.4 - 8.0 V EN Bias current IEN 1 3 9 µA

Typical Performance Curves (Unless otherwise noted, Ta=25℃, EN=3V, VCC=6V) Fig.3 Transient Response (1.0→0A) Co=1µF Fig.5 OFF sequence 1 Co=1µF Fig.2 Transient Response (0→1.0A) Co=1µF VO VO IO IO VEN VEN VCCVCC VO VO

TSZ02201-0R6R0A600330-1-2© 2012 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111･15･001 28.Dec.2012 Rev.002 Fig.8 Ta-VO (IO=0mA) Fig.9 Ta-ICC Fig.6 Input sequence 2 Co=1µF Fig.7 OFF sequence 2 Co=1µF VO VO VCC VCC VEN VEN VO[V] ICC[µA] Ta[℃] Ta[℃]

TSZ02201-0R6R0A600330-1-2© 2012 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111･15･001 28.Dec.2012 Rev.002 Fig.10 Ta-Isd (VEN=0V) Fig.12 IO-VO Fig.13 VCC-ISD (VEN=0V) ISD [µA] IEN[µA] Fig.11 Ta-IEN ISD [µA] VCC[V] IO[A] Ta[℃] Ta[℃] VO[V]

TSZ02201-0R6R0A600330-1-2© 2012 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111･15･001 28.Dec.2012 Rev.002 Fig.14 VCC-VO (IO=0mA) Fig.17 Minimum dropout Voltage 1 （VCC=5V、IO=-1.0A） Fig.15 TSD (IO=0mA) Fig.16 OCP Vo[V] IO[A] VO[V] VO[V] Ta[℃] Ta[℃]

TSZ02201-0R6R0A600330-1-2© 2012 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111･15･001 28.Dec.2012 Rev.002 Fig.21 Minimum dropout Voltage 2 （VCC=4.5V、Ta=25℃） Fig.18 ESR condencer Fig.19 IO-ICC Fig.20 PSRR (IO=0mA) IO[A] Icc[µA] IO[A] Vdrop [V] PSRR[dB] IO[A]

TSZ02201-0R6R0A600330-1-2© 2012 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111･15･001 28.Dec.2012 Rev.002 Vdrop [V] Vdrop [V] IO[A] IO[A] Fig.23 Minimum dropout Voltage 4 （VCC=8V、Ta=25℃） Fig.22 Minimum dropout Voltage 3 （VCC=6V、Ta=25℃）

Power Dissipation ◎HTSOP-J8 Thermal design should ensure operation within the following co nditions. Note that the temper atures listed are the allowed temperature limits and thermal design should allow sufficient margin beyond these limits. 1. Ambient temperature Ta can be no higher than 85℃. 2. Chip junction temperature (Tj) can be no higher than 150℃. Chip junction temperature can be determined as follows: Most of the heat loss that occurs in the BDxxHC0WEFJ series is generat ed from the output Pch FET. Power loss is determined by the total V CC-VO voltage and output current. Be sure to confirm the system input and output voltage as well as the output current condit ions in relation to the heat di ssipation characteristics of the V CC and V O in the design. Bearing in mind that heat dissipation may vary substantially depe nding on the substrate employed (due to the power package incorporated in the BDxxHC0WEFJ series) make certain to factor conditions such as substrate size into the thermal design. Power consumption [W] = Input voltage (V CC) - Output voltage (VO) ×IO(Ave) Example) Where VCC=5.0V, VO=3.3V, IO(Ave) = 0.1A, Power consumption [W] = 5.0 V - 3.3V ×0.1A =0.17[W] Calculation based on ambient temperature (Ta) Tj=Ta+θj-a×P ＜Reference values＞ 1-layer substrate (copper foil density 0mm×0mm) 2-layer substrate (copper foil density 15mm ×15mm) 2-layer substrate (copper foil density 70mm ×70mm) 4-layer substrate (copper foil density 70mm×70mm) Substrate size: 70mm×70mm×1.6mm (substrate with thermal via) θj-a: HTSOP-J8 153.2 ℃/W 113.6 ℃/W 59.2 ℃/W 33.3 ℃/W Measurement condition: mo unted on a ROHM board, and IC Substrate size: 70mm × 70mm × 1.6mm ( S u b s t r a t e w i t h t h e r m a l v i a ) ・Solder the thermal pad to Ground ① IC only θj-a=249.5 ℃/W ② 1-layer （copper foil are :0mm×0mm） θj-a=153.2 ℃/W ③ 2-layer （copper foil are :15mm×15mm） θj-a=113.6 ℃/W ④ 2-layer （copper foil are :70mm×70mm） θj-a=59.2 ℃/W ⑤ 4-layer （copper foil are :70mm×70mm） θj-a=33.3 ℃/W Power Dissipation :Pd [W] 0 25 50 75 100 125 150 2.0 3.0 4.0 ①0.50W 周囲温度:Ta [℃] 1.0 ②0.82W ③1.10W ④2.11W ⑤3.76W Ambient Temperature :Ta [℃]

Input-to-Output Capacitor It is recommended that a capacitor (over 1uF) is placed near pins between the input pin and GND as well as the output pin and GND. A capacitor, between input pin and GND, is valid when the power supply impedance is high or trace is long. Also, as for the capacitor between the output pin and GND, the greater the capacitance, the more sustainable the line regulation will be and the capacitor will make improvements of characteristics depending on the load. However, please check the actual functionality of this part by mounting it on a board for the actual application. Ceramic capacitors usually have different, thermal and equivalent series resistance characteristics, and moreover capacitance decreases gradually in use. For additional details, please check with the manufacturer, and select the best ceramic capacitor for your application.
Equivalent Series Resistance ESR (Output capacitor) To prevent oscillations, please attach a capacitor between V O and GND. Capacitors usually have ESR (Equivalent Series Resistance). Operation will be stable in the ESR-I O range shown to the right. Ceramic, tantalum and electrolytic Capacitors have different ESR values, so please ensure that you are using a capacitor that operates in the stable operating region shown on the right. Finally, please evaluate in the actual application. ESR – I O characteristics 0.01 0.10 1.00 10.00 0 0.2 0.4 0.6 0.8 1 Io [A] ESR [Ω] Safety Area DC Bias Voltage [V] Ceramic capacitor capacity – DC bias characteristics (Characteristics example) -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 1 2 3 4 Rated Voltage：10V B1 characteristics Rated Voltage：4V X6S characteristics Capacitance Change [%] Rated Voltage:10V F characteristics Rated Voltage：6.3V B characteristics B characteristics Rated Voltage：10V CO=1μF

Evaluation Board Circuit
Evaluation Board Parts List
Board Layout PCB layout considerations: ・Input capacitor C IN connected to VCC (VIN) should be placed as close to VCC(VIN) pin as possible. Output capacitor C OUT also should be placed close to IC pin as possible. In case connected to inner layer GND plane, please use several through hole. ・VO_S pin has comparatively high impedance, and can be affected by noise, so stray capacitance should be as small as possible. Please take care of this during layout. ・Please make GND pattern wide enough to handle thermal dissipation. Designation Value Part No. Company Designation Value Part No. Company C1 1μ F CM105B105K16A KYOCERA C5 1 μF CM105B105K16A KYOCERA C2 ‐ ‐ - C6 C4 - - - U1 ‐ BDxxHC0WEFJ ROHM N.CGND VO_S N.C N.C. VO VO

1 VCC

VCC (VIN) CIN COUT

I/O Equivalent Circuits 8pin (VCC) / 1pin (VO) 2pin (VO_S) 5pin (EN) 2pin (VO_S) 8pin (VCC) 1pin (VO) 5pin (EN) 1MΩ 2MΩ

Operational Notes (1) Absolute maximum ratings An excess in the absolute maximum ratings, such as supply vo ltage, temperature range of operating conditions, etc., can break down the device, thus making it im possible to identify the damage mode, such as a short circuit or an open circuit. If there is any possibility of exposure over the rated values, please consider addi ng circuit protection devices such as fuses. (2) Connecting the power supply connector backward Connecting of the power supply in reverse polarity c an damage the IC. Take precautio ns when connecting the power supply lines. An external direction diode can be added. (3) Power supply lines Design the PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line, separate the grou nd section and supply lines of t he digital and analog blocks. Furt hermore, for all power supply terminals to ICs, connect a capacitor between the power suppl y and GND terminal. When using electrolytic capacitors in a circuit, note that capacitance values are reduced at low temperatures and over time. (4) GND voltage The potential of the GND pin must be minimum potential under all operating conditions. (5) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. (6). Inter-pin shorts and mounting errors Use caution when positioning the IC fo r mounting on printed circuit boards. T he IC may be damaged if there is any connection error or if pins are shorted together. (7). Actions in strong electromagnetic field Use caution when using the IC in the presence of a strong electr omagnetic field as doing so may cause the IC to malfunction. (8). ASO When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO. (9). Thermal shutdown circuit The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit is assumed. (10). Testing on application boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Always turn the IC’s power supply off before connecting it to or removing it from a jig or fixture during the inspection pr ocess. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC. TSD ON Temperature[℃] (typ.) Hysteresis Temperature [ ℃] (typ.) BDxxHC0WEFJ 175 15

TSZ02201-0R6R0A600330-1-2© 2012 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111･15･001 28.Dec.2012 Rev.002 (11). Regarding input pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersecti on of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, the relation between each potential is as follows: When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual interf erence among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used. (12). Ground Wiring Pattern. When using both small signal and large current GND pattern s, it is recommended to isolate the two ground patterns, placing a single ground point at the gr ound potential of applicatio n so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. Resistor Transistor (NPN) Parasitic element N N N P+ P + P P substrate GND Pin A N N P+ P+ P P substrate GND Parasitic element Pin B C B E N GND Pin A Parasitic element Pin B Other adjacent elements E B C GND Parasitic element

Physical Dimension Tape and Reel Information
Marking Diagram xx Product Name

15 BD15HC0WEFJ

18 BD18HC0WEFJ

25 BD25HC0WEFJ

30 BD30HC0WEFJ

33 BD33HC0WEFJ

50 BD50HC0WEFJ

60 BD60HC0WEFJ

70 BD70HC0WEFJ

(Unit : mm) HTSOP-J8 0.08 S 0.08 M S 1.0MAX 0.85±0.05 1.27 0.08±0.08 0.42 +0.05 -0.04 1.05±0.2 0.65±0.15 4°+6° −4° 0.17 +0.05 -0.03 234 5 6 8 (MAX 5.25 include BURR) 0.545 (3.2) 4.9±0.1 6.0±0.2 (2.4) 3.9±0.1 1PIN MARK ∗ Order quantity needs to be multiple of the minimum quantity. <Tape and Reel information> Embossed carrier tapeTape Quantity Direction of feed The direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs Direction of feed Reel 1pin HTSOP-J8 (TOP VIEW) xxHC0W Part Number Marking LOT Number 1PIN MARK

Revision History Date Revision Changes 24.Aug.2012 001 New Release 28.Dec.2012 002 The description was modified.

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Precaution on using ROHM Products 1) Our Products are designed and manufactured for applicat ion in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremel y high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sale s representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. 2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. Accordin gly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products ar e exposed to sea wind or corrosive gases, including Cl H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4) The Products are not subjec t to radiation-proof design. 5) Please verify and confirm characteristics of the final or mounted products in using the Products. 6) In particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7) De-rate Power Dissipation (Pd) depending on Ambient temper ature (Ta). When used in sealed area, confirm the actual ambient temperature. 8) Confirm that operation temperature is within the specified range described in the product specification. 9) ROHM shall not be in any way responsible or liable for failure induced under deviant condi tion from what is defined in this document.

Precaution for Mounting / Circuit board design 1) When a highly active halogenous (chlori ne, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification
Precautions Regarding Application Examples and External Circuits 1) If change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteri stics, as well as static characteristics. 2) You agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for Products use. Theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding t he Products maximum rating will not be applied to Products. Please take special care under dry condit ion (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation 1) Product performance and soldered connections may deteriora te if the Products are stored in the places where: [a] the Products are exposed to sea winds or corros ive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to di rect sunshine or condensation [d] the Products are exposed to high Electrostatic 2) Even under ROHM recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm sol derability before using Products of which storage time is exceeding the recommended storage time period. 3) Store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period.
Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only.
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Other Precaution 1) The information contained in this document is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) This document may not be reprinted or reproduced, in whol e or in part, without prior written consent of ROHM. 3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 4) In no event shall you use in any way whatsoever the Pr oducts and the related technical information contained in the Products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5) The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties.

Product Information

BD60HC0WEFJ-E2 specifications and overview.

Summary

1A Fixed Output LDO Regulators

Description

1A Fixed Output LDO Regulators

Source title BD60HC0WEFJ-E2 Datasheet(PDF) - Rohm

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