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1/29 www.rohm.com 2011.01 - Rev.C © 2011 ROHM Co., Ltd. All rights reserved. LED Drivers for LCD Backlights White Backlight LED Drivers for Small to Medium LCD Panels (Switching Regulator Type) BD6067GU, BD6069GUT, BD6071HFN, BD6072HFN

  • Description Switching Regulator type LED Driver Series for small LCD backlight are boost DC/DC converters possible to drive the white LEDs at constant. It is possible that turning on white LED steadily by a series connection which has no current variation, and by a fast transient response with current mode. And, BD 6069GUT/BD6071HFN/BD6072HFN are white LED driver ICs with synchronous rectification. With synchronous rectification (no external schottky diode required) and small package, they can save mount space. BD6071HFN suited over voltage and over current limit from BD6069GUT/BD6072HFN.
  • Features 1) Boost DC/DC converter 2) Adjustment of brightness by external PWM pulse 3) Possible to driving 3 LEDs (BD6071HFN ) 4) Possible to driving 4 LEDs (BD6069GUT, BD6072HFN) 5) Possible to driving 8 LEDs (BD6067GU) 6) Soft start function (BD6067G U, BD6069GUT, BD6071HFN, BD6072HFN) 7) Synchronous rectification Boost DC/DC converter (BD6069GUT, BD6071HFN, BD6072HFN) 8) No external schottky diode required (BD6069GUT, BD6071HFN, BD6072HFN) 9) Output Open • Short protect (BD6069GUT, BD6071HFN, BD6072HFN)
  • Applications These drivers are applicable for various fields such as mobile phones, portable game machines, Inter-phone camera, audio player, portable DVD player, back light for printer displa y etc… and support light of the camera for the mobile phone, simple flash. And, these can use power supply for OEL.
  • Line up matrix Parameter Input voltage range Switching frequency White LED number Operating temperature range Package BD6067GU 2.7 ~ 5.5V 0.8 ~ 1. 2MHz 5 ~ 8 -30 ~ +85 ℃ VCSP85H1 BD6069GUT 2.7 ~ 5.5V 0. 8 ~ 1.2MHz 4 -30 ~ +85 ℃ VCSP60N1 BD6071HFN 2.7 ~ 5.5V 0. 8 ~ 1.2MHz 3 -30 ~ +85 ℃ HSON8 BD6072HFN 2.7 ~ 5.5V 0. 8 ~ 1.2MHz 4 -30 ~ +85 ℃ HSON8 No.11040ECT19

2/29 www.rohm.com 2011.01 - Rev.C © 2011 ROHM Co., Ltd. All rights reserved. BD6067GU, BD6069GUT, BD6071HFN, BD6072HFN ►BD6067GU

  • Absolute maximum ratings (Ta=25℃) Parameter Symbol Ratings Unit Conditions Power supply voltage 1 VMAX1 7 *1 V Applicable to Vin, EN, Vfb and VDAC pins Power supply voltage 2 VMAX2 40 *1 V Applicable to SW and Vout pins Operating temperature range Topr -30 ~ +85 ℃ Storage temperature range Tstg -55 ~ +150 ℃ Power dissipation Pd 800 *2 mW 50mm×58mm×1.75mm Glass epoxy PCB mounting *1 This value is based on GND. *2 This loss decreases approximate 6.4mW/ ℃ when Ta is 25℃ or more.
  • Recommended Operation Range (Ta=-30℃ to +85 ℃) Parameter Symbol Ratings Unit Conditions Operating supply voltage VCC 2.7 ~ 5.5 V Vin pin
  • Electrical characteristics (Unless otherwise stated, Ta is 25℃ and Vin is 3.6V.) Parameter Symbol Limits Unit Conditions Min. Min. Min. <EN pin> ‘L’ level input voltage VthL - - 0.4 V ‘H level input voltage VthH 1.4 - - V ‘H’ level input current IIH - 18.3 30.0 μA EN=5.5V ‘L’ level input current IIL -2.0 -0.1 - μA EN=0V <DAC control pin> VDAC-Vfb resistance V DAR 56 112 168 k Ω <Switching regulator> Input voltage range Vin 3.1 - 5.5 V Quiescent current Iq - 0.1 2.0 μA EN=0V Operating current Idd - 0.9 1.4 mA EN=3.6V, Vfb=1.0V VFB pin control voltage Vfb 0.18 0.20 0.22 V Over current limit Icoil 450 600 750 mA *1 SW transistor ON resistance Ronn - 0.5 1.4 Ω Isw=200mA Switching frequency fSW 0.8 1.0 1.2 MHz Maximum duty Duty 92.5 95.0 - % Vfb=0V Output voltage range Vo - - 30.0 V Over voltage protection Ov p 30.0 31.0 32.0 V Vfb=0V Output open protection Ovl - 0.7 1.4 V Startup time Ts - 0.5 1.0 ms Vout=24V *1 The DC current is measured in this item.

3/29 www.rohm.com 2011.01 - Rev.C © 2011 ROHM Co., Ltd. All rights reserved. BD6067GU, BD6069GUT, BD6071HFN, BD6072HFN ►BD6067GU

  • Electrical characteristic curves (Reference data) Fig.1 Operating current vs. Power Supply Voltage Fig.2 Quiescent current vs. Power Supply Voltage Fig.3 Oscillation Frequency vs. Power Supply Voltage Fig.5 Efficiency vs. LED Current (7LED) (Ta=25℃) Fig.6 Efficiency vs. LED Current (8LED) (Ta=25℃) Fig.7 Output Voltage vs. Power Supply Voltage (8LED) Fig.8 VFB Pin Control Voltage vs. Power Supply Voltage (8LED) (ILED=20mA) Fig.9 EN Pin PWM Brightness Control Characteristic (f=100Hz, Ta=25℃) Fig.4 Efficiency vs. LED Current (6LED) (Ta=25℃) Fig.10 DAC Brightness Control Characteristic 0.0 1.0 2.0 3.0 4.0 5.0 2 . 533 . 544 . 555 . 5 Vin [V] Idd [mA] Ta=25℃ Ta=-30℃ Ta=85℃ 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 2 . 533 . 544 . 555 . 5 Vin [V] Iq [µA] Ta=25℃ Ta=-30℃ Ta=85℃ 100 5 1 52 53 54 5 ILED [mA] Efficiency [%] Vin=3.6V Vin=5.5V Vin=3.1V 0.6 0.7 0.8 0.9 1.1 1.2 1.3 1.4 2 . 533 . 544 . 555 . 5 Vin [V] Switching freqency [MHz] Ta=25℃ Ta=-30℃ Ta=85℃ 100 5 1 52 53 54 5 ILED [mA] Efficiency [%] Vin=3.6V Vin=3.1V Vin=5.5V 100 5 1 52 53 54 5 ILED [mA] Efficiency [%] Vin=3.6V Vin=3.1V Vin=5.5V 500 1000 1500 2000 2500 3000 3500 2 . 533 . 544 . 555 . 5 Vin [V] Output power [mW] Ta=25℃ Ta=-30℃ Ta=85℃ 170 180 190 200 210 220 230 2 . 533 . 544 . 555 . 5 Vin [V] Vfb [mV] Ta=25℃ Ta=-30℃ Ta=85℃ 0 2 04 06 08 0 1 0 0 EN Duty [%] ILED [mA] Vin=2.7V Vin=3.1V Vin=3.6V VDAC [V] ILED [mA] Vin=3.6V Vin=2.7V Vin=3.1V

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  • Block Diagram and Recommended Circuit Example Fig.11 Block Diagram and Recommended Circuit Example Fig.12 Pin location diagram VCSP85H1 (Bottom view)
  • Pin assignment table Pin number Pin name In/Out Function A1 GNDA - Analog GND A2 EN In Enable control (pull-down by internal resistance) A3 VDAC In Analog signal input for current adjustment B1 Vin - Supply voltage input B3 VFB In Feedback voltage input C1 VOUT In Over voltage protection input SBD open protection input C2 SW In Switching pin C3 GND - Power GND OSC Control + S Q R TSD SW ENGND 300kΩ PWMcomp ERRAMP Vout VFB Vin GNDA Thermal Shutdown 14kΩ VDAC 98kΩ Current Sence 22µH Cin 1µF 10Ω Cout 1µF Output open protect Over voltage protect Vin OFF ON 20mA A1 A2 A3 C3C2

5/29 www.rohm.com 2011.01 - Rev.C © 2011 ROHM Co., Ltd. All rights reserved. BD6067GU, BD6069GUT, BD6071HFN, BD6072HFN ►BD6067GU

  • Release Circuit Protection 1) Operation BD6067GU is a constant frequency PWM current mode DC/DC converter. It is shown in the block diagram of Fig.11. In a PWM comparator forming one of the PWM current mode featur es, one is an error element from the error amplifier and another is an element produced by superimposing the inductor current on a slope waveform that prevents sub-harmonic oscillation. This output controls Q1 via the RS latch. Energy is stored in an external inductor whileQ1 is ON and then it is moved to the COUT capacitor via D1 while Q1 is OFF. In this way, voltage Vout higher than input voltage Vin can be obtained. Because the above operation is perf ormed in a way that the VFB pin volt age equals the Vfb vo ltage, the boost voltage is dominantly determined by the expression “Vf × number of LEDs.” Vout voltage = (Vf × number of LEDs) + Vfb 2) LED current control The LED current is determined depending on the VFB pin voltage “Vfb” and the resistance connected to VFB. ILED is given below. ILED =200mV/ R1 ILED [mA] BD6067GU R1 [ Ω] 5 39 10 20 12 16 15 13 20 10 3) Dimming control ▪ Control by PWM signal The startup condition of BD6067GU is controlled via the SHDNB/EN pin. It is powered OFF at 0.4V or less and powered ON at 1.4V or more. As shown in Fig.13, brightness is controlled in the BD6067GU via the PWM signal input the SHDNB/EN pin. In this way, the LED current is controlled in a range from 0 to the maximum current. The average LED current increases in proportion to the Duty cycle of the PWM signal. In the PWM off cycle, no current dissipation takes place in IC and LEDs, resulting in high efficiency. Duties below 5% and abov e 95% must no be used for brightness control because they significantly affects the leading and trailing edges. BD6067GU standard PWM frequency ranges from 100Hz to 300Hz. Fig.13 Example of Brightness Control by PWM signal at the EN Pin PWM 100Hz~300Hz Vin SW ENGND VFB 22μH 1μF 10Ω Vin ILED GNDA Vout BD6067GU VDAC

6/29 www.rohm.com 2011.01 - Rev.C © 2011 ROHM Co., Ltd. All rights reserved. BD6067GU, BD6069GUT, BD6071HFN, BD6072HFN ►BD6067GU ▪ Control by DC Voltage BD067GU has a built-in function for LED current control by DC voltage and can control the current by VDAC pin control voltage.

  • Over voltage Protection BD6067GU has an over voltage protection f eature. When a fault occurs, for exampl e, IC is disconnected from LED, an excessive voltage rise may cause the SW pin and VOUT pin to exceed the absolute maximum ratings respectively, resulting in IC damage. For this reason, when VOUT is 30V or more, over voltage protection is activated to turn Q1 off so that the SW pin and VOUT pin don’t exceed the absolute maximum ratings. At this time, the IC state changes from active to inactive and the output voltage drops slowly. Then, when the output voltage falls below the over voltage protection hysteresis level, the output voltage continues to rise up to 30V again. This protection circuit is shown in Fig.16. Fig.16 Block Diagram for Short-circuit Protection and over voltage Protection 1μF 10Ω DAC Vin SW EN GND VFB GNDA Vout BD6067GU VDAC 22μH Vin ILED Vfb Fig.14 Brightness Control by BD6067GU DAC Vout OVER Detector Control OVER VOLTAGE REF Driver SW CoutD1 Fig.15 DAC Constant Current Characteristics by DAC Control 0 0.5 1 1.5 2 2.5 DAC [V] (Vfb=200mV) ILED [mA]

7/29 www.rohm.com 2011.01 - Rev.C © 2011 ROHM Co., Ltd. All rights reserved. BD6067GU, BD6069GUT, BD6071HFN, BD6072HFN ►BD6067GU

  • Startup and Rush Current BD6067GU has a built-in soft start function. This function prevents the rush current from being generated at startup time. Fig.17 Soft Start Circuit
  • Application Circuit Example The output maximum voltage range of BD6067GU is 30V. *** When LED has 8 lights, special care should be taken to prevent output voltage (VOUT) from exceeding 30V. VOUT = (LED vf × number of LED lights) + Vfb Fig.18 Example of Dimming Circuit Subject to PWM Control at the VDAC Pin OSC Control + Q R TSD SW GND 300kΩ PWMcomp ERRAMP Vout VFB Vin GNDA Thermal Shutdown 14kΩ VDAC 98kΩ Current Sence 10Ω 1µF 1kHz 10kΩ Cout 1µF EN Output open protect Over voltage protect 22µH Cin 1µF Vin OFF ON ILED TSD SW Vout Vin Thermal Shutdown Cout 1µF Output open protect Over voltage protect 22µH Cin 1µF Vin OSC Control + Q R ENGND 300kΩ PWMcomp ERRAMP VFB GNDA 14kΩ VDAC 98kΩ Current Sence 10Ω VDAC 0~1.8V OFF ON Soft start circuit ILED

8/29 www.rohm.com 2011.01 - Rev.C © 2011 ROHM Co., Ltd. All rights reserved. BD6067GU, BD6069GUT, BD6071HFN, BD6072HFN ►BD6067GU

  • External components Selection Method <<Constants in the standard circuit example>> R1: Determines the LED current ILED at power ON. <Recommended parts> ILED (mA) R1[Ω] 5 39 15 13 20 10 L1: Coil for boost. The recommended value is 22µH. be sure to use a sufficient DC current permissible value and a sufficient low DC resistance coil. <Recommended parts> Inductance value Model number/manufacturer 22µH NR3015T220M / TAIYO YUDEN Cin: Power supplie bypass capacitor. This capacitor must be provided to remove an instantaneous power supply noise for stable voltage supply to this IC. To obtain good characterist ics, the low ESR parts like the ceramics capacitor must be used. The recommended capacitance is 1µF or more. <Recommended parts> Capacitance value Model number/manufacturer 1.0µF GRM188B11A105KA61B / MURATA C0: Output smoothing capacitor. The capacitance recommended for BD6067GU is 1.0µF. <Recommended parts> Capacitance value Model number/manufacturer 1.0µF UMK107C105KA-B / TAIYO YUDEN When selecting capacitors for Cin and C0, special care should be taken for rated voltage. The desirable rated voltage is about double the voltage actually applied to the capacitor. When the margin for rated voltage is not sufficient, the capacitance may be a half or less of the nominal value. D1: Schottky barrier diode (SBD) for output rectification. To achieve high conversion efficiency, use a diode characterized by of low Vf, low reverse leak and high current capacity. <Recommended parts> Model number/manufacturer RB160M-40 / ROHM
  • Recommended PCB layout When a PCB designed, the power supply line should be wir ed in a way that the board im pedance can be minimized. If necessary, the bypass capacitor must be connected. In particular, pins around the DC/DC converter must be wired in such a way that the wiring impedance can be minimized. In addition, when a DC/DC converter using a coil is used, it is necessary to place the output capacitor Cout, coil L1, rectification diode D1 and bypass capa citor CIN near this IC and keep the GND impedance low. Fig.19 PCB Layout Image GNDA EN VDAC VIN VFB VOUT SW GND CIN COUT To battery GND To cell voltage source

9/29 www.rohm.com 2011.01 - Rev.C © 2011 ROHM Co., Ltd. All rights reserved. BD6067GU, BD6069GUT, BD6071HFN, BD6072HFN ►BD6067GU Top surface (Top view) Bottom surface (Top view) Fig. 20 PCB Layout ***Bypass capacitor and GND It is necessary to place bypass capacitor CIN, coil L1 and power ground GND near this IC (CIN2 of Fig.20). To obtain good characteristics, as t he need arises power supply, bypass capacitor CIN between analog GNDA must be added. (at LED8 lights). When LED has 8 lights, full assessment is required for characteristics prior to usage.

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  • Absolute maximum ratings (Ta=25℃) Parameter Symbol Ratings Unit Conditions Power supply voltage 1 VMAX1 7 * 1 V Applicable to Vin,EN,VFB, TEST pins Power supply voltage 2 VMAX2 20 * 1 V Applicable to SW,Vout pins Power dissipation Pd 630 * 2 mW 70mm×70mm×1.6mm at glass epoxy board mounting Operating temperature range Topr -30 ~ +85 ℃ Storage temperature rang Tstg -55 ~ +150 ℃ *1 These values are based on GND and GNDA pins. *2 When it’s used by more than Ta=25 ℃, it’s reduced by 5.04mW/℃.
  • Recommended operating range (Ta=-30℃ ~+85 ℃) Parameter Symbol Ratings Unit Conditions Min. Typ. Max. Operating supply voltage Vin 2.7 3.6 5.5 V
  • Electrical characteristic (Unless otherwise specified Ta = +25℃, Vin=3.6V) Parameter Symbol Limits Unit Conditions Min. Typ. Max. <EN Terminal> EN threshold voltage (Low) VthL - - 0.4 V EN threshold voltage (High) VthH 1.4 - - V EN terminal input current Iin - 18.3 30.0 μA EN=5.5V EN terminal output current Iout -2.0 -0.1 - μA EN=0 <Switching regulator> Input voltage range Vin 3.1 - 5.5 V Quiescent Current Iq - 0.1 2.0 μA EN=0V Feedback voltage Vfb 0.47 0.50 0.53 V Inductor current limit Icoil 200 265 330 mA Vin=3.6V *1 SW saturation voltage Vsat - 0.14 0.28 V Isw=200mA, Vout=13V SW on resistance P Ronp - 2.1 3.2 Ω Ipch=200mA,Vout=13V Switching frequency fSW 0.8 1.0 1.2 MHz Duty cycle limit Duty 82.7 85.0 - % VFB=0V Output voltage range Vo - - 14.0 V Over voltage limit Ovl 14.0 14.5 15.0 V VFB=0V Start up time Ts - 0.5 1.0 ms *1 This parameter is tested with dc measurement.
  • Electrical characteristic curves (Reference data) Fig.21 Current Consumption vs. power source voltage Fig.22 Quiescent current vs. power source voltage Fig.23 Oscillation frequency vs. power source voltage 0.0 1.0 2.0 3.0 4.0 5.0 2 . 533 . 544 . 555 . 5 Vin [V] IIN [mA] Ta=25℃ Ta=-30℃ Ta=85℃ 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 2 . 533 . 544 . 555 . 5 Vin [V] Iin [µA] Ta=-30, 25, 85℃ 0.6 0.7 0.8 0.9 1.1 1.2 1.3 1.4 2 . 533 . 544 . 555 . 5 Vin [V] Switching freqency [MHz] Ta=25℃Ta=-30℃ Ta=85℃

11/29 www.rohm.com 2011.01 - Rev.C © 2011 ROHM Co., Ltd. All rights reserved. BD6067GU, BD6069GUT, BD6071HFN, BD6072HFN ►BD6071HFN

  • Electrical characteristic curves (Reference data) ( 4ms/div ) IIN 200mA/div ILED 20mA/div VOUT 5V/div EN 2V/div Fig.31 Soft Start ( VIN = 3.6V, Ta = 25℃, 3LED, 20mA Load ) Fig.32 LED Open output voltage Fig.33 LED luminance adjustment ( VIN = 3.6V, Ta = 25℃, 3LED, 20mA Load ) Fig.26 Efficiency vs. LED current < 2LED > (VOUT=7.5V, Ta=25℃) Fig.25 Efficiency vs. LED current in each coil < 3LED > (VOUT=10.5V, VIN=3.6V, Ta=25℃) Fig.24 Efficiency vs. LED current in each coil < 2LED > (VOUT=7.5V, VIN=3.6V, Ta=25℃) Fig.27 Efficiency vs. LED current < 3LED > (VOUT=10.5V, VIN=3.6V, Ta=25℃) Fig.29 Output power vs. power source voltage Fig.28 Inductor current limits vs. Temperature Fig.30 Feedback voltage vs. Power source voltage ( 100µs/div ) IIN 100mA/dev VOUT 10V/div VFB 0.5V/div EN 5V/div 10ms Ave IIN =1.5mA ⊿V=1.57V ( 4ms/div ) IIN 200mA/div VOUT 1V/div 10 15 20 25 30 35 40 ILED [mA] Efficiency [%] CoilCraft : DO1608C-223 TDK:VLCF4020T-220MR56 MURATA:LQH32CN220K53 TDK:VLF3012AT-220MR33 10 15 20 25 30 35 40 ILED [mA] Efficiency [%] CoilCraft : DO1608C-223 TDK:VLCF4020T-220MR56 MURATA:LQH32CN220K53 TDK:VLF3012AT-220MR33 10 15 20 25 30 35 40 ILED [mA] Efficiency [%] VIN=5.5V VIN=3.1V VIN=4.5V VIN=3.6V 200 220 240 260 280 300 320 340 -30 -10 10 30 50 70 90 Temparature [℃] IIN [mA] VIN=5.5V VIN=3.1V VIN=3.6V 10 15 20 25 30 35 40 ILED [mA] Efficiency [%] VIN=5.5V VIN=3.1V VIN=4.5V VIN=3.6V 500 1000 1500 2000 2.5 3 3.5 4 4.5 VIN [V] Output Power [mW] Ta=85℃ Ta=25℃ Ta=-30℃ 0.47 0.48 0.49 0.5 0.51 0.52 0.53 2 . 533 . 544 . 555 . 5 VIN [V] VFB [V] Ta=85℃ Ta=25℃ Ta=-30℃

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  • Block diagram, recommended circuit example, pin location diagram Fig.34 Block diagram and recommended circuit diagram Fig.35 Pin location diagram HSON8 (Top view)
  • Pin assignment table PIN Name In/Out Pin number Function GNDA - 1 Analog GND EN In 2 Enable control(pull down is integrated on resistance) TEST In 3 TEST input (pull down is integrated on resistance) VIN In 8 Power supply input VFB In 4 Feedback input voltage VOUT Out 7 Output SW In 6 Switching terminal GND - 5 Power GND
  • Operation BD6071HFN is a fixed frequency PWM current mode DC/DC conver ter, and adopts synchronous rectification architecture. As for the inputs of the PWM comparator as the feature of the PWM current mode, one is overlapped with error components from the error amplifier, and the other is overlapped with a current sense signal that controls the inductor current into Slope waveform for sub harmonic oscillation prevention. This output controls Q1 and Q2 via the RS latch. Timing of Q1 and Q2 is precisely adjusted so that they will not turn ON at the same time, thus putting them into non-overlapped relation. In the period where Q1 is ON, energy is accumulated in the exte rnal inductor, and in the period where Q1 is OFF, energy is transferred to the capacitor of VOUT via Q2. Further, BD6071HFN has many safety functions, and their detection signals stop switching operation at once. 8 765 1234 OSC Control Current Sence Q 24Ω S Q R TSD VIN CIN SW VOUT VFB TESTENGNDA GND 300kΩ 1μF L 22μH COUT 1μF RFB white LED over voltage protect short protect PWMcomp ERRAMP

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  • Description of Functions 1) Soft starts and off status BD6071HFN has soft start function and off status function. The soft start function and the off status function prevent large current from flowing to the IC via coil. Occurrence of rush current at turning on is prevented by the soft start function, and occurrence of invalid current at turning off is prevented by the off status function. 2) Isolation control BD6071HFN has isolation control to prevent LED wrong lighting at power off. The cause of the LED wrong lighting is leak current from VIN to the white LED. Therefore, when BD6071HFN gets in power off (EN = L), the isolation control cuts the DC path between SW and Vout, thereby the leak current from VIN to LED is prevented. Fig.36 Isolation control 3) Short-circuit protection and over voltage protection BD6071HFN has short-circuit protection and over voltage protection. These detect the voltage of VOUT, and at error, they stop the output Tr. Details are as shown below. ・Short-circuit protection In the case of short-circuit of the DC/DC output (VOUT) to GND, the coil or the IC may be destructed. Therefore, at such an error as VOUT becoming 0.7V or below, the Under Detector shown in the figure works, and turns off the output Tr, and prevents the coil and the IC from being destructed. And the IC changes from its action condition into its non-action condition, and current does not flow to the coil (0mA). ・Over voltage protection At such an error as the IC and the LED being cut off, over voltage causes the SW terminal and the VOUT terminal exceed the absolute maximum ratings, and may destruct the IC. Therefore, when VOUT becomes 14.5V or higher, the over voltage limit works, and turns off the output Tr , and prevents the SW terminal and the VOUT terminal from exceeding the absolute maximum ratings. At this moment, the IC changes from its action condition into its non action condition, and the output voltage goes down slowly. And, when the output voltage becomes the hysteresis of the over voltage limit or below, the output voltage goes on up to 14.5V once again. This protection action is shown in Fig.37. Fig.37 Block diagram of short-circuit protection and over voltage 4) Thermal shut down BD6071HFN has thermal shut down function. The thermal shut down works at 175 ℃ or higher, and while holding the setting of EN control from the outside, the IC changes from its action condition into its non action condition. And at 175℃ or below, the IC gets back to its normal action. VIN SW Vout VFB White LED Vout OVER Detector Control UNDER Detector OVER VOLTAGE REF UNDER VOLTAGE REF driver SW Cout

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  • Start control and brightness control BD6071HFN can control the start conditions by its EN terminal, and power off at 0.4V or below, and power on at 1.4V or higher. And by changing the duty of power on and off by PWM control, the LED brightness can be adjusted. Two techniques are available for the brightness adjustmen t. One is discrete time (PWM) adjustment, and the other is continuous time adjustment. 1) PWM brightness adjustment is made by giving PWM signal to EN as shown in Fig.38. The BD6068GU/BD6071HFN T power on/off are according to the PWM signal. By this method, LED current is controlled from 0 to the maximum current. The average LED current increases in proportion with the duty cycle of PWM signal. While in PWM off-cycle mode, the IC and LED both consume no currents, thus providing a high-efficiency operation. And please don’t use duty less than 5% or more than 95% of current setting for the brightness adjustment because of the influence of turning on and off operating is large. The recommended PWM frequency is 100Hz ~ 300Hz. Fig.38 The brightness adjustment example of EN terminal by PWM (f PWM = 100Hz ~ 300Hz) 2-1) The continuous time the brightne ss adjustment is made by giving DC contro l voltage to VFB pin of BD6068GUT / BD6071HFN via a series resistor as shown in Fig.39. LE D luminance (current) changed by giving DC voltage to VFB directly. DC voltage is given from filter ed one of DAC signal, or PWM signal sh own in Fig.41. The advantage of this approach is that the PWM signal to be used to control the LED brightness can be set to a high frequency (1kHz or higher). And please don’t use duty less than 5% or more than 95% of current setting for the brightness adjustment. LED current (ILED) is approximated by the following equation. ILED = [{(VFB-DAC) / R1} × R2 + VFB ] / RFB VIN SW VOUT EN GNDA TEST GND VFB 22μH 1μF 24Ω 4.7kΩ 22kΩ VIN DAC R1 RFB ILED Fig.39 The brightness adjustment example by DAC VIN SW VOUT EN GNDA TEST GND VFB 22μH 1μF 30Ω 33kΩ 47kΩ 47nF 100kΩ VIN PWM ILED 10kHz 0~2.85V Fig.41 The brightness adjustment example of VFB terminal by PWM (fPWM=10kHz) 0 1 02 03 04 05 0 6 07 08 09 0 1 0 0 HI Duty [%] ILED [mA] Fig.42 VFB PWM Control Fig.40 DAC adjustment 00 . 511 . 522 . 533 . 54 1 1.5 2 2.5 3 3.5 4 0 0.5 ILED [mA] DAC [V] (VFB=500mV) VIN SW VOUT EN GNDA TEST GND VFB 22µH 1µF 24Ω VIN PWM

15/29 www.rohm.com 2011.01 - Rev.C © 2011 ROHM Co., Ltd. All rights reserved. BD6067GU, BD6069GUT, BD6071HFN, BD6072HFN ►BD6071HFN 2-2) The brightness adjustment of below is done in adjusting of R2 ON time by R1 and Duty cycle of PWM. The minimum value of the LED current is decided by VFB / R1 at the PWM 0%, the maximum value of the LED current is decided by VFB / R2 at the PWM 100%. ILED is given as shown below. ILED=VFB / R1 + VFB / R2 × HI Duty Standard PWM frequency is 100Hz~1kHz. And please don’t use duty less than 5% or more than 95% of current setting for the brightness adjustment. Fig.43 The brightness adjustment example of VFB terminal by PWM (fPWM=100Hz ~ 1kHz)

  • Setting range of LED current LED current is determined by the voltage of VFB and the resistor connected to VFB terminal. ILED is given as shown below. ILED=VFB/RFB The current in the standard application is as shown below. V FB=0.5V, RFB=24Ω I LED=20.8mA The shaded portion in the figure below is the setting range of LED current to become the standar d. In case of using 2LED, LED current might increase due to over boosting when VOUT is less than 5.5V. Therefore some ICs may not be used at desired currents. Consequently, for the proper setting of LE D current, thoroughly check it for the suitability under use conditions including applicable power supply voltage and temperature. Fig.45 Recommended circuit diagram Fig.46 LED Setting range of LED current VIN SW VOUT EN GNDA TEST GND VFB 22μH 1μF 47Ω VIN 47Ω PWM 1kHz R2 R1 0 1 02 03 04 0 5 06 07 08 09 0 1 0 0 HI Duty [%] ILE D [mA] Fig.44 VFB PWM Control VIN=3.1V ~ 4.2V 3LED 2LED VIN=5.5V 789 1 0 1 1 1 2 1 3 1 4 VOUT [V] ILE D [mA] 2LED 3LED 5.5 7 8.5 10 11.5 13 VOUT [V] ILED [mA] VIN SW VOUT EN GNDA TEST GND VFB 22μH 1μF 24Ω VIN PWM 1μF RFB ILED

16/29 www.rohm.com 2011.01 - Rev.C © 2011 ROHM Co., Ltd. All rights reserved. BD6067GU, BD6069GUT, BD6071HFN, BD6072HFN Fig.47 PCB Layout Image CIN RFB EN TEST VFB GNDA VIN VOUT SW GND COUT To battery power source To battery GND ►BD6071HFN

  • Selection of external parts Recommended external parts are as shown below. When to use other parts than these, select the following equivalent parts. ・Coil Value Tolerance Manufacturer Product number Size (mm) DCR(Ω) W L H 22μH ±10% MURATA LQH32CN220 K53 2.5 3.2 1.55 0.71 22μH ±20% TDK VLF3012AT220MR33 2.6 2.8 1.2 0.66 22μH ±20% Coil Craft DO1608 4.45 6.6 2.92 0.37 22μH ±20% TDK VLF3010AT220MR33 2.6 2.8 1.0 1.30 Please refer to the reference data of p.11 for the change in the efficiency when the coil is changed. ・Capacitor Value Manufacturer Product number Size (mm) Temperature range L W H <CIN> 1µF MURATA GRM188B11A105K 1.6 0.8 0.8 -25deg~+85deg <COUT> 1µF MURATA GRM188B31E105K 1.6 0.8 0.8 -25deg~+85deg ・Resistor Value Tolerance Manufacturer Product number Size (mm) L W H <RFB> 24Ω ±1% ROHM MCR006YZPF24R0 0.6 0.3 0.23 The coil is the part that is mo st influential to efficiency. Select the coil wh ose direct current resist or (DCR) and current - inductance characteristic is excellent. The BD6068GUT/BD6071H FN is designed for the inductance value of 22µH. Do not use other inductance value. Select a capacitor of ceramic ty pe with excellent frequency and temperature characteristics. Further, select Capacitor to be used for CIN/COUT with small di rect current resistance, and pay sufficient attention to the PCB layout shown in the next page.
  • PCB Layout In order to make the most of the perfo rmance of this IC, its PCB layout is very important. Characteristics such as efficiency and ripple and the likes change greatly with layout, which please note carefully. Connect the input bypath capacitor CIN nearest to between VIN and GNDA pin, as shown in the upper diagram. Thereby, the input voltage ripple of the IC can be reduced. And, connect the output capacitor COUT nearest to between VOUT and GND pin. Thereby, the output voltage ripple of the IC can be reduced. Connect the current setting RFB nearest to VFB pin. Connect the GND connection side of RFB directly to GND pin. Connect the GNDA pin directly to GND pin. When those pins are not connected directly near the chip, infl uence is given to the performance of BD6068/BD6071HFN and may limit the current drive performance. As for the wire to the inductor, make its resistance component small so as to reduce electric power consumption and increase the entire efficiency. And keep the pins that are subject to the influence like VFB pin away from the wire to SW. The PCB layout in consideration of these is shown in the Fig.49.

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  • Recommended PCB layout Front surface (Top view) Bottom surface (Top view) Fig.49 PCB Layout (VBAT=3.6V, Ta=25℃, VOUT=14V, 20mA Load) Fig.48 Output noise

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  • Absolute maximum ratings (Ta=25℃) Parameter Symbol Ratings Unit Conditions Power supply voltage 1 VMAX1 7 *1 V Vin,EN,VFB,TEST Power supply voltage 2 VMAX2 20 *1 V SW,Vout Power dissipation BD6069GUT Pd 800 *2 mW 50mm×58mm×1.75mm At glass epoxy board mounting. BD6072HFN 630 *3 mW 70mm×70mm×1.6mm At glass epoxy board mounting. Operating temperature range Topr -30 ~ +85 ℃ Storage temperature range Tstg -55 ~ +150 ℃ *1 These values are based on GND and GNDA pins. *2 When it’s used by more than Ta=25 ℃, it’s reduced by 6.4mW/℃. *3 When it’s used by more than Ta=25 ℃, it’s reduced by 5.04mW/℃.
  • Recommended operating range (Ta=-30℃ ~ +85 ℃) Parameter Symbol Ratings Unit Conditions Min. Typ. Max. Operating supply voltage BD6069GUT Vin 2.7 3.6 5.5 V BD6072HFN
  • Electrical characteristics (Unless otherwise specified Ta = +25℃, Vin=3.6V) Parameter Symbol Limits Unit Conditions Min. Typ. Max. <EN terminal> EN threshold voltage (Low) VthL - - 0.4 V EN threshold voltage (High) VthH 1.4 - - V EN terminal input current Iin - 18.3 30.0 μA EN=5.5V EN terminal output current Iout -2.0 -0.1 - μA EN=0 <Switching regulator> Input voltage range Vin 3.1 - 5.5 V Quiescent Current Iq - 0.1 2.0 μA EN=0V Feedback voltage Vfb 0.47 0.50 0.53 V Inductor current limit Icoil 270 350 430 mA Vin=3.6V *1 SW saturation voltage Vsat - 0.14 0.28 V Isw=200mA, Vout=13V SW on resistance P Ronp - 2.1 3.2 Ω Ipch=200mA,Vout=13V Switching frequency fSW 0.8 1.0 1.2 MHz Duty cycle limit Duty 82.7 85.0 - % VFB=0V Output voltage range Vo - - 18.0 V Over voltage limit Ovl 18.0 18.5 19.0 V VFB=0V Start up time Ts - 0.5 1.0 ms *1 This parameter is tested with dc measurement.

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  • Electrical characteristic curves (Reference data) 10 15 20 25 30 35 40 ILED [mA] Efficiency [%] VIN=5.5V VIN=3.1V VIN=4.2V VIN=3.6V Fig.60 LED Open output voltage Fig.55 Efficiency vs. LED current in each coil < 3LED > (VOUT=10.5V, VIN=3.6V, Ta=25℃) Fig.50 Current Consumption vs Power source voltage Fig.51 Quiescent current vs power source voltage Fig.53 Efficiency vs. LED current in each coil < 3LED > (VOUT=10.5V, VIN=3.6V, Ta=25℃) Fig.54 Efficiency vs. LED current in each coil < 4LED > (VOUT=14V, VIN=3.6V, Ta=25℃) Fig.52 Oscillation frequency vs. power source voltage Fig.57 Inductor current limits vs. Temperature Fig.58 Output power vs. Power source voltage Fig.59 Feedback voltage vs. Power source voltage (ILED=20mA) Fig.61 LED luminance adjustment ( VIN = 3.6V, Ta = 25℃, 3LED, 20mA Load ) Fig.56 Efficiency vs. LED current in each coil < 4LED > (VOUT=14V, VIN=3.6V, Ta=25℃) 10ms Ave IIN =1.5mA ⊿V=1.57V ( 4ms/div ) IIN 200mA/div VOUT 1V/di v ( 4ms/div ) IIN 200mA/di v ILED 20mA/div VOUT 5V/div EN 2V/div 0.0 1.0 2.0 3.0 4.0 5.0 2 . 533 . 544 . 555 . 5 Vin [V] IIN [mA] Ta=25℃ Ta=-30℃ Ta=85℃ 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 2 . 533 . 544 . 555 . 5 VIN [V] IIN [µA] Ta=-30, 25, 85℃ 0.6 0.7 0.8 0.9 1.1 1.2 1.3 1.4 2 . 533 . 544 . 555 . 5 VIN [V] Switching freqency [MHz] Ta=25℃Ta=-30℃ Ta=85℃ 10 15 20 25 30 35 40 ILED [mA] Efficiency [%] CoilCraft : DO1608C-223 TDK:VLCF4020T-220MR56 MURATA:LQH32CN220K53 TDK:VLF3012AT-220MR33 10 15 20 25 30 35 40 ILED [mA] Efficiency [%] CoilCraft : DO1608C-223 TDK:VLCF4020T-220MR56 MURATA:LQH32CN220K53 TDK:VLF3012AT-220MR33 10 15 20 25 30 35 40 ILED [mA] Efficiency [%] VIN=5.5V VIN=3.1V VIN=4.5V VIN=3.6V 270 290 310 330 350 370 390 410 430 -30 -10 10 30 50 70 Temparature [ IIN [mA] VIN=5.5V VIN=3.1V VIN=3.6V 500 1000 1500 2000 2.5 3 3.5 4 4.5 VIN [V] Output Power [mW] Ta=85℃ Ta=25℃ Ta=-30℃ 0.47 0.48 0.49 0.5 0.51 0.52 0.53 2 . 533 . 544 . 555 . 5 VIN [V] VFB [V] Ta=85℃ Ta=25℃ Ta=-30℃

20/29 www.rohm.com 2011.01 - Rev.C © 2011 ROHM Co., Ltd. All rights reserved. BD6067GU, BD6069GUT, BD6071HFN, BD6072HFN 8 76 5 1234 ►BD6069GUT, BD6072HFN

  • Block diagram, recommended circuit example, pin location diagram Fig.62 Block diagram and recommended circuit diagram < B D 6 0 6 9 G U T > < B D 6 0 7 2 H F N > Fig.63 Pin location diagram VCSP60N1 (Bottom view) Fig.64 Pin location diagram HSON8 (Top view)
  • Pin assignment table PIN Name In/Out Ball number Function BD6069GUT BD6072HFN GNDA - A1 1 Analog GND EN In A2 2 Enable control (pull down is integrated on resistance) TEST In A3 3 TEST input (pull down is integrated on resistance) VIN In B1 8 Power supply input VFB In B3 4 Feedback input voltage VOUT Out C1 7 Output SW In C2 6 Switching terminal GND - C3 5 Power GND
  • Operation BD6069GUT is a fixed frequency PWM current mode DC/DC conv erter, and adopts synchronous rectification architecture. As for the inputs of the PWM comparator as the feature of the PWM current mode, one is overlapped with error components from the error amplifier, and the other is overlapped with a current sense signal that controls the inductor current into Slope waveform for sub harmonic oscillation prevention. This output controls Q1 and Q2 via the RS latch. Timing of Q1 and Q2 is precisely adjusted so that they will not turn ON at the same time, thus putting them into non-overlapped relation. In the period where Q1 is ON, energy is accumulated in the external inductor, and in the period where Q1 is OFF, energy is transferred to the capacitor of VOUT via Q2. Further, BD6069GUT/BD6072HFN has many safety functions, and their detection signals stop switching operation at once. OSC Control Current Sence Q 24Ω S Q R TSD VIN CIN SW VOUT VFB TESTENGNDA GND 300kΩ 1µF L 22µH COUT 1µF RFB white LED over voltage protect short protect PWMcomp ERRAMP A1 A2 A3 C3 C2

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  • Description of Functions 1) Soft starts and off status BD6069GUT/BD6072HFN has soft start function and off status function. The soft start function and the off status function prevent large current from flowing to the IC via coil. Occurrence of rush current at turning on is prevented by the soft start function, and occurrence of invalid current at turning off is prevented by the off status function. 2) Isolation control BD6069GU/BD6072HFN T has isolation control to prevent LED wrong lighting at power off. The cause of the LED wrong lighting is leak current from VIN to the white LED. Therefore, when BD6069GUT/BD6072HFN gets in power off (EN = L), the isolation control cuts the DC path between SW and Vout, thereby the leak current from VIN to LED is prevented. Fig.65 Isolation control 3) Short-circuit protection and over voltage protection BD6069GUT/BD6072HFN has short-circuit protection and over voltage protection. These detect the voltage of VOUT, and at error, they stop the output Tr. Details are as shown below. ・Short-circuit protection In the case of short-circuit of the DC/DC output (VOUT) to GND, the coil or the IC may be destructed. Therefore, at such an error as VOUT becoming 0.7V or below, the Under Detector shown in the figure works, and turns off the output Tr, and prevents the coil and the IC from being destructed. And the IC changes from its action condition into its non action condition, and current does not flow to the coil (0mA). ・Over voltage protection At such an error as the IC and the LED being cut off, over voltage causes the SW terminal and the VOUT terminal exceed the absolute maximum ratings, and may destruct the IC. Therefore, when VOUT becomes 18.5V or higher, the over voltage limit works, and turns off the output Tr , and prevents the SW terminal and the VOUT terminal from exceeding the absolute maximum ratings. At this moment, the IC changes from its action condition into its non action condition, and the output voltage goes down slowly. And, when the output voltage becomes the hysteresis of the over voltage limit or below, the output voltage goes on up to 18.5V once again. This protection action is shown in Fig.66. Fig.66 Block diagram of short-circuit protection and over voltage 4) Thermal shut down BD6069GUT/BD6072HFN has thermal shut down function. The thermal shut down works at 175℃ or higher, and while holding the setting of EN control from the outside, the IC changes from its action condition into its non action condition. And at 175℃ or below, the IC gets back to its normal action. VIN SW Vout VFB White LED Vout OVER Detector Control UNDER Detector OVER VOLTAGE REF UNDER VOLTAGE REF driver SW Cout

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  • Start control and brightness control BD6069GUT/BD6072HFN can control the start conditions by its EN terminal, and power off at 0.4V or below, and power on at 1.4V or higher. And by changing the duty of power on and off by PWM control, the LED brightness can be adjusted. Two techniques are available for the brightness adjustmen t. One is discrete time (PWM) adjustment, and the other is continuous time adjustment. 1) PWM brightness adjustment is made by giving PWM signal to EN as shown in Fig.67. The BD6069GUT/BD6072HFN power on/off is according to the PW M signal. By this method, LED current is controlled from 0 to the maximum current. The average LED current increases in proportion with the duty cycle of PWM signal. While in PWM off-cycle mode, the IC and LED both consume no currents, thus providing a high-efficiency operation. And please don’t use duty less than 5% or more than 95% of current setting for the brightness adjustment because of the influence of turning on and off operating is large. The recommended PWM frequency is 100Hz ~ 300Hz. Fig.67 The brightness adjustment example of EN terminal by PWM (fPWM = 100Hz ~ 300Hz) 2-1) The continuous time the brightne ss adjustment is made by giving DC contro l voltage to VFB pin of BD6069GUT / BD6072HFN via a series resistor as shown in Fig.68. LE D luminance (current) changed by giving DC voltage to VFB directly. DC voltage is given from filter ed one of DAC signal, or PWM signal sh own in Fig.70. The advantage of this approach is that the PWM signal to be used to control the LED brightness can be set to a high frequency (1kHz or higher). And please don’t use duty less than 5% or more than 95% of current setting for the brightness adjustment. LED current (ILED) is approximated by the following equation. ILED = [{(VFB-DAC) / R1} × R2 + VFB ] / RFB VIN SW VOUT EN GNDA TEST GND VFB 22µH 1µF 24Ω VIN PWM Fig.68 The brightness adjustment example by DAC VIN SW VOUT EN GNDA TEST GND VFB 22µH 1µF 30Ω 33kΩ 47kΩ 47nF 100kΩ VIN PWM ILED 10kHz 0~2.85V Fig.70 The brightness adjustment example of VFB terminal by PWM (fPWM=10kHz) 0 1 02 0 3 04 05 06 0 7 08 09 0 1 0 0 HI Duty [%] I LED [mA] Fig.71 VFB PWM Control Fig.69 DAC adjustment 00 . 511 . 522 . 533 . 54 1 1.5 2 2.5 3 3.5 4 0 0.5 ILED [mA] DAC [V] (VFB=500mV) VIN SW VOUT EN GNDA TEST GND VFB 22µH 1µF 24Ω 4.7kΩ 22kΩ VIN DAC R1 RFB ILED

23/29 www.rohm.com 2011.01 - Rev.C © 2011 ROHM Co., Ltd. All rights reserved. BD6067GU, BD6069GUT, BD6071HFN, BD6072HFN ►BD6069GUT, BD6072HFN 2-2) The brightness adjustment of below is done in adjusting of R2 ON time by R1 and Duty cycle of PWM. The minimum value of the LED current is decided by VFB / R1 at the PWM 0%, the maximum value of the LED current is decided by VFB / R2 at the PWM 100%. ILED is given as shown below. ILED=VFB / R1 + VFB / R2 × HI Duty Standard PWM frequency is 100Hz~1kHz. And please don’t use duty less than 5% or more than 95% of current setting for the brightness adjustment. Fig.72 he brightness adjustment example of VFB terminal by PWM (f PWM=100Hz~1kHz)

  • Setting range of LED current LED current is determined by the voltage of VFB and the resistor connected to VFB terminal. ILED is given as shown below. ILED=VFB/RFB The current in the standard application is as shown below. V FB=0.5V, RFB=24Ω I LED=20.8mA The shaded portion in the figure below is the setting range of LED current to become the standard. Depending on coils and white LEDs to be used, however, some ICs may not be used at desired currents. Consequently, for the proper setting of LED current, thoroughly check it for the suitability under us e conditions including applicable power supply voltage and temperature. VIN SW VOUT EN GNDA TEST GND VFB 22µH 1µF 24Ω VIN PWM 1µF RFB ILED Fig.74 Recommended circuit diagram VIN SW VOUT EN GNDA TEST GND VFB 22µH 1µF 47Ω VIN 47Ω PWM 1kHz R2 R1 Fig.75 Setting range of LED current Fig.73 VFB PWM Control 0 1 0 2 03 0 4 05 0 6 07 0 8 09 0 1 0 0 HI Duty [%] ILED [mA] 7 8 91 01 11 21 31 41 51 61 71 8 VOUT[V] ILED[mA]

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  • Selection of external parts Recommended external parts are as shown below. When to use other parts than these, select the following equivalent parts. ・Coil Value Tolerance Manufacturer Product number Size (mm) DCR (Ω) W L H 22μH ±10% MURATA LQH32CN220 K53 2.5 3.2 1.55 0.71 22μH ±20% TDK VLF3012AT220MR33 2.6 2.8 1.2 0.66 22μH ±20% Coil Craft DO1608 4.45 6.6 2.92 0.37 22μH ±20% TDK VLF3010AT220MR33 2.6 2.8 1.0 1.30 Please refer to the reference data of p.20 for the change in the efficiency when the coil is changed. ・Capacitor Value Manufacturer Product number Size (mm) Temperature range L W H <CIN> 1µF MURATA GRM188B11A105K 1.6 0.8 0.8 -25deg~+85deg <COUT> 1µF MURATA GRM188B31E105K 1.6 0.8 0.8 -25deg~+85deg ・Resistor Value Tolerance Manufacturer Product number Size (mm) L W H <RFB> 24Ω ±1% ROHM MCR006YZPF24R0 0.6 0.3 0.23 The coil is the part that is mo st influential to efficiency. Select the coil wh ose direct current resist or (DCR) and current - inductance characteristic is excellent. The BD6069GUTT/BD6072HFN is designed for the inductance value of 22µH. Do not use other inductance value. Select a capacitor of ceramic ty pe with excellent frequency and temperature characteristics. Further, select Capacitor to be used for CIN/COUT with small di rect current resistance, and pay sufficient attention to the PCB layout shown in the next page.
  • PCB Layout In order to make the most of the performanc e of this IC, its PCB layout is very im portant. Characteristics such as efficiency and ripple and the likes change greatly with PCB layout, which please note carefully. Fig.76 BD6069GUT PCB Layout Image Fig.77 BD6072HFN PCB Layout Image GNDA EN TEST VIN VFB VOUT SW GND CIN COUT To battery GND RFB To battery power source CIN RFB EN TEST VFB GNDA VIN VOUT SW GND COUT To battery power source To battery GND

25/29 www.rohm.com 2011.01 - Rev.C © 2011 ROHM Co., Ltd. All rights reserved. BD6067GU, BD6069GUT, BD6071HFN, BD6072HFN 1 2V 1 1G VOUT VOUT GND SW ►BD6069GUT, BD6072HFN Connect the input bypath capacitor CIN nearest to between VIN and GNDA pin, as shown in the upper diagram. Thereby, the input voltage ripple of the IC can be reduced. And, connect the output capacitor COUT nearest to between VOUT and GND pin. Thereby, the output voltage ripple of the IC can be reduced. Connect the cu rrent setting RFB nearest to VFB pin. Connect the GND connection side of RFB directly to GND pin. Connect the GNDA pin directly to GND pin. When those pins are not connected directly near the chip, influence is giv en to the performance of BD6069GUT /BD6072HFN, and may limit the current drive performance. As for the wi re to the inductor, make its resistance component small so as to reduce electric power consumption and increase the entire efficiency. And keep the pins that are subject to the influence like VFB pin away from the wire to SW. The PCB layout in consideration of these is shown in the Fig.79 to 82.

  • Recommended PCB layout Fig.79 BD6069GUT Fig.80 BD6069GUT Front surface (Top view) Bottom surface (Top view) 1 2V 1 1G VB AT GND EN FB VOUT RFB Cout VOUT LE D LED Ci n GNDA LED SW 112mVpp VOUT (VBAT=3.6V, Ta=25℃, VOUT=14V, 20mA Load) Fig.78 Output noise

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  • Recommended PCB layout
  • Attention point of PCB layout In PCB design, the wiring of power supply line should be low Impedance, and put the bypass capacitor if necessary. Especially the wiring impedance must be lower around the DC/DC converter.
  • About heat loss In heat design, operate the DC/DC converter in the following condition. (The following temperature is a guarantee temperature, so consider the margin.) 1. Periphery temperature Ta must be less than 85℃. 2. The loss of IC must be less than dissipation Pd. Fig.81 BD6072HFN Front surface (Top view) Fig.82 BD6072HFN Bottom surface (Top view)

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  • Notes for use 1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify break ing mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. 2) Operating conditions These conditions represent a range within which characte ristics can be provided approximately as expected. The electrical characteristics are guaranteed under the conditions of each parameter. 3) Reverse connection of power supply connector The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal. 4) Power supply line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for t he analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For the GND line, give consideration to design the patterns in a similar manner. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the ch aracteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. 5) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. 6) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. 7) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. 8) Inspection with set PCB On the inspection with the set PCB, if a capacitor is connec ted to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge from the set PCB by each proc ess. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a ground for the assembly pr ocess and pay thorough attention to the transportation and the storage of the set PCB. 9) Input terminals In terms of the construction of IC, parasitic elements are inev itably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a volt age lower than the power supply voltag e or within the guaranteed value of electrical characteristics. 10) Ground wiring pattern If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a si ngle ground at the reference poi nt of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well. 11) External capacitor In order to use a ceramic capacitor as the external capaci tor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. 12) Thermal shutdown circuit (TSD) When junction temperatures become 175℃ (typ) or higher, the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming its operation. 13) Thermal design Perform thermal design in which there ar e adequate margins by taking into account the permissible dissipation (Pd) in actual states of use. 14) Selection of coil Select the low DCR inductors to decrease power loss for DC/DC converter.

28/29 www.rohm.com 2011.01 - Rev.C © 2011 ROHM Co., Ltd. All rights reserved. BD6067GU, BD6069GUT, BD6071HFN, BD6072HFN

  • Ordering part number B D 6 0 6 7 G U - E 2 Part No. Part No. Package GU : VCSP85H1 Packaging and forming specification E2: Embossed tape and reel B D 6 0 6 9 G U T - E 2 Part No. Part No. Package GUT : VCSP60N1 Packaging and forming specification E2: Embossed tape and reel ∗ Order quantity needs to be multiple of the minimum quantity. <Tape and Reel information> Embossed carrier tapeTape Quantity Direction of feed The direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs Direction of feed Reel 1pin (Unit : mm) VCSP85H1 (BD6067GU) S 0.08 S A B BA0.05 1PIN MARK 0.34±0.1 8-φ0.3±0.05 1.68±0.1 (φ0.15)INDEX POST C 0.34±0.1 B 1.0MAX 1.68±0.1 A 0.25±0.1P=0.5×2 P=0.5×2 (Unit : mm) VCSP60N1 (BD6069GUT) 1.68±0.05 1.68±0.05 1PIN MARK S 0.08 S 0.21±0.05 0.6±0.08 A B P=0.5×2 8-φ0.3±0.05 C (φ0.15)INDEX POST P=0.5×2 B 0.34±0.05 A 0.34±0.05

0.05 A B

∗ Order quantity needs to be multiple of the minimum quantity. <Tape and Reel information> Embossed carrier tapeTape Quantity Direction of feed The direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs Direction of feed Reel 1pin

29/29 www.rohm.com 2011.01 - Rev.C © 2011 ROHM Co., Ltd. All rights reserved. BD6067GU, BD6069GUT, BD6071HFN, BD6072HFN B D 6 0 7 1 H F N - T R Part No. Part No. 6071 6072 Package HFN : HSON8 Packaging and forming specification TR: Embossed tape and reel Direction of feed Reel ∗ Order quantity needs to be multiple of the minimum quantity. <Tape and Reel information> Embossed carrier tapeTape Quantity Direction of feed The direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs TR 1pin (Unit : mm) HSON8 8 765 2.8±0.1 0.13 +0.1 –0.05 (0.2) (1.8) 0.6MAX (0.15) (2.2) (0.3) (0.45) 2.9±0.1 0.32±0.1 (0.2) 3.0±0.2 (MAX 3.1 include. BURR) 0.475 (0.05) 0.65 1PIN MARK 0.02 +0.03 –0.02 4312 0.08 M S 0.1 S 4321 5678

R1120Awww.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. Notice ROHM Customer Support System http://www.rohm.com/contact/ Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Produc ts. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, commu- nication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. T h e P r o d u c t s a r e n o t d e s i g n e d o r m a n u f a c t u r e d t o b e u s e d w i t h a n y e q u i p m e n t , d e v i c e o r system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel- controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.